CN211019438U

CN211019438U - Printed board combining rigidity and flexibility in spring

Info

Publication number: CN211019438U
Application number: CN201921547587.2U
Authority: CN
Inventors: 徐宏江; 钱伟; 闫江周; 杨银川
Original assignee: Guizhou Aerospace Control Technology Co Ltd
Current assignee: Guizhou Aerospace Control Technology Co Ltd
Priority date: 2019-09-18
Filing date: 2019-09-18
Publication date: 2020-07-14
Anticipated expiration: 2029-09-18

Abstract

The utility model relates to a rigid-flex printed board on bullet has rigid-flex PCB picture layer, rigid-flex PCB picture layer adopts 10 layers of PCB rigid-flex printed board, and with signal processing unit and bullet communication interface integration for a rigid-flex board, rigid-flex PCB picture layer includes from last to down in proper order: the flexible antenna comprises a surface layer, a first electrical ground plane, a middle signal layer, a second electrical ground plane, a first flexible lead-out layer, a second flexible lead-out layer, a third electrical ground plane, a first power supply layer, a second power supply layer and a bottom layer. The utility model has the advantages that: the device has a simple structure, integrates the signal processing unit and the missile-borne communication interface into a rigid-flex board, and has the functions of missile-borne computer and inertia measurement combination. The space of the bullet body is greatly reduced by 50%, the assembly is simple, the reliability is high, and compared with the traditional printed board, the total weight and the volume are reduced by more than 70% compared with the traditional wire harness method.

Description

Printed board combining rigidity and flexibility in spring

Technical Field

The utility model relates to a rigid-flex printed board on bullet.

Background

The XXX control combined information processing circuit is an important component of a bomb control system, is small in size and high in integration degree, generally requires a 170X200mm space to be designed with a central signal processing unit and external communication interfaces such as an inertial measurement unit, remote measurement, remote control, launch control, electric control and fuze, and is very high in integration degree and high in difficulty. In the traditional model design, missile guidance control is mainly realized by mutually communicating and matching two parts of two information processing circuit boards (an inertial measurement circuit board and a missile-borne computer circuit board) to finish missile flight control, a connector and wire cable mode is adopted, namely connectors are arranged on two connected printed boards, and then board-level interconnection is realized between every two printed boards by adopting a crimping cable or a welding mode; the problems of complex structure, large volume, more electronic components, low reliability, low space utilization rate, low reusability of hardware and software and the like exist. The assembling and connecting mode is time-consuming, labor-consuming, low in efficiency, high in cost of the additional connector, complex in assembly and poor in reliability, and meanwhile, insufficient soldering or wrong soldering phenomena are easily generated between the leads.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a rigid-flex printed board on bullet is provided, its assembly is simple, and the reliability is high.

In order to solve the technical problem, the utility model discloses a technical scheme is: a printed board with rigid-flexible combination on the bullet, characterized by comprising: the flexible-rigid PCB has a rigid-flexible PCB layer which adopts 10 layers of PCB rigid-flexible printed boards, integrates a signal processing unit and an elastic communication interface into a rigid-flexible printed board,

the rigid-flex PCB picture layer includes from last to down in proper order: the flexible antenna comprises a surface layer, a first electrical ground plane, a middle signal layer, a second electrical ground plane, a first flexible lead-out layer, a second flexible lead-out layer, a third electrical ground plane, a first power supply layer, a second power supply layer and a bottom layer.

Compared with the prior art, the utility model discloses following profitable technological effect has:

the device has a simple structure, integrates the signal processing unit and the missile-borne communication interface into a rigid-flex board, and has the functions of missile-borne computer and inertia measurement combination. With this high density, high integration design, the control assembly and pop-up device is implemented with the smallest printed board scale: the remote measurement, remote control, launch control, electric control and fuze system interconnection, the technology greatly saves the product space structure and has stronger reliability. The space of the bullet body is greatly reduced by 50%, the assembly is simple, the reliability is high, and compared with the traditional printed board, the total weight and the volume are reduced by more than 70% compared with the traditional wire harness method. The rigid-flex combined plate technology has great significance in military application and can be popularized to weapon systems of other models.

Drawings

Fig. 1 is a schematic diagram of a layer structure of the printed board with rigid-flex combination on the spring of the present invention;

fig. 2 is the layout schematic diagram of the printed board with rigid-flex combination on the spring of the utility model.

Detailed Description

The present invention will be described in further detail with reference to specific embodiments, but these examples are only illustrative and do not limit the scope of the present invention.

Please refer to fig. 1 to 2, the utility model discloses a rigid-flex printed board on bullet adopts 10 layers of PCB rigid-flex printed board, and the communication interface integration is a rigid-flex board on signal processing unit and the bullet.

In one embodiment, the rigid-flex PCB layer sequentially includes, from top to bottom: the flexible antenna comprises a surface layer, a first electrical ground plane, a middle signal layer, a second electrical ground plane, a first flexible lead-out layer, a second flexible lead-out layer, a third electrical ground plane, a first power supply layer, a second power supply layer and a bottom layer.

In one embodiment, the surface layer mounted device comprises: DSP digital processor, FPGA logic processing unit, external connector, high-speed sampling A/D, high-precision D/A and relevant digital circuit chip.

In one embodiment, the surface layer is designed with a minimum printed conductor line width of 10 mils, a minimum line spacing of 12 mils, and a minimum hole size of 10 mils.

In one embodiment, the first electrical ground plane is divided into 3 different electrical characteristic planes: high precision A/D digital ground, high precision A/D analog ground, digital signal plane ground.

In one embodiment, the intermediate signal layer is designed to be parallel address lines and data lines of a DSP and an FPGA.

In one embodiment, the intermediate signal layer is designed with a minimum printed conductor line width of 6 mils, a minimum line spacing of 9 mils, and a minimum hole size of 10 mils.

In one embodiment, the bottom-mounted devices include high-speed F L ASH, high-speed optocouplers, magnetic isolators, decoupling capacitors, L DO power supplies.

As a specific example, when designing the layer of the rigid-flex PCB, the shape and size, thickness and number of layers of the rigid-flex PCB, the size and shape of the connection pad, the line width and the space, the size and tolerance of the hole, the hole position and the pattern position are mainly considered.

As a specific example, from the viewpoint of production process, for convenience of batch production and cost reduction, the shape should be as simple as possible, and generally be a rectangle with a length-width ratio not very different.

As a specific example, the number of layers of the flex-rigid PCB is determined in consideration of the influence of the number of layers on the production cost and reliability, and the layers are preferably kept symmetrical, preferably even number of copper layers.

Referring to fig. 2, in the rigid-flex printed circuit board: the first layer is the superficial layer, the line is walked in main surface device installation and surface printing, the device of installation has DSP digital processor, FPGA logical processing unit, to outer connector, high-speed sampling AD, high accuracy DA and relevant digital circuit chip, design printed wire minimum line width 10mil, minimum line spacing 12mil, minimum hole size 10mil, the installation of rigid-flex printed board is realized through 10M 2 (tolerance 6H) installation set screw holes to whole printed board.

The second layer stratum is an electrical ground plane, and the whole layer is divided into 3 different electrical characteristic ground planes according to the functional requirements: high precision A/D digital ground, high precision A/D analog ground, digital signal plane ground.

The third layer is a middle signal layer used for high-speed signal transmission and mainly designed into parallel address lines and data lines of a DSP and an FPGA, and the minimum line width of a printed wire is 6 mils, the minimum line spacing is 9 mils, and the minimum hole size is 10 mils.

A fourth earth formation; the high-speed digital signal plane ground is mainly used as an electric ground plane.

The fifth layer and the sixth layer are flexible lead-out layers, and key important signals are led out;

and the seventh layer of stratum is an electrical ground plane and is mainly used as a high-speed digital signal ground plane.

The eighth layer and the ninth layer are power supply layers, power supplies of +27V, +15V, -15V, digital +5V, digital-5V, analog +5V, analog-5V, 3.3V, 1.8V, 1.5V and the like are mainly designed, and the power supply of the whole system is directly led to power supply input pins of related devices from the power supply layers through via hole design.

The tenth layer is a bottom layer and mainly comprises bottom surface device installation and bottom surface printed wiring, the installed devices comprise high-speed F L ASH, high-speed optical couplers, magnetic isolators, decoupling capacitors, L DO power supplies and the like, then ten printed boards with the thickness of 12.6mil are processed into a printed board through a pressing process, the whole printed board is an integrated high-speed high-density signal processing system, the minimum line width is 6mil, the line spacing is 9mil, the minimum hole size is 10mil, blind holes, buried holes and through holes are formed among the layers to achieve signal interconnection, and finally signal input, signal output and signal central control processing are achieved.

As a specific example, the heat dissipation area, the wiring exclusion area, the location of the key element, and the connection relationship with other substrates should be considered in the layout. Generally, in the case of wiring on the outer layer, it is required to have a large number of wirings on the bonding surface, a small number of wirings on the element surface, and a large area of copper foil to be relatively uniformly distributed on the inner and outer layers. In order to prevent the printed wires from being damaged by contour machining, the distance between the conductive pattern of the outer-layer wiring area and the edge of the substrate and the distance between the conductive pattern of the inner-layer wiring area and the edge of the substrate are kept at a certain distance, and the distance is proper and is 2-3 mm. Meanwhile, in order to meet the requirements of the assembly and welding process of components, the process edges and stamp holes need to be considered in the design of the PCB.

As a specific example, the shape design of the land directly affects the peel strength and bending strength of the flex-rigid PCB. In order to improve the peeling strength and the bending strength of the rigid-flexible PCB, the maximum value of the connecting disc is required on the premise of meeting the requirement of an electrical gap, the ratio of the connecting disc to a hole is not less than 2: l, the diameter and the aperture of the through hole bonding pad are recommended in series, and the large connecting disc is used for preventing the connecting disc from being pulled off and also for effectively counteracting the shrinkage of materials. All the connection parts of the connecting discs and the leads are in fillet transition, and the design of 'tear drop' is adopted, so that the stress concentration is reduced to the minimum.

Test of

1. The space of the projectile body is greatly reduced by 50%, the assembly is simple, and the reliability is high.

2. Compared with the traditional printed board, the total weight and volume are reduced by more than 70 percent compared with the traditional wire harness method.

The utility model discloses a following profitable technological effect:

the method is simple to realize, integrates the signal processing unit and the missile-borne communication interface into a rigid-flex board, and has the functions of combining the missile-borne computer and the inertia measurement. With this high density, high integration design, the control assembly and pop-up device is implemented with the smallest printed board scale: the remote measurement, remote control, launch control, electric control and fuze system interconnection, the technology greatly saves the product space structure and has stronger reliability. The space of the bullet body is greatly reduced by 50%, the assembly is simple, the reliability is high, and compared with the traditional printed board, the total weight and the volume are reduced by more than 70% compared with the traditional wire harness method. The rigid-flex combined plate technology has great significance in military application and can be popularized to weapon systems of other models.

Although the preferred embodiments of the present invention have been disclosed above, the present invention is not limited thereto. It is obvious that not all embodiments need be, nor cannot be exhaustive here. Any person skilled in the art can change and modify the research scheme of the present invention by adopting the design and content of the above disclosed embodiments without departing from the spirit and scope of the present invention, and therefore, any simple modification, parameter change and modification of the above embodiments by the research entity of the present invention all belong to the protection scope of the scheme of the present invention.

Claims

1. A printed board with rigid-flexible combination on the missile is characterized by comprising a PCB layer with rigid-flexible combination, wherein the PCB layer with rigid-flexible combination adopts 10 layers of PCB rigid-flexible combination printed boards, a signal processing unit and a communication interface on the missile are integrated into a rigid-flexible combination board,

2. The printed board of claim 1, wherein the means mounted on the surface layer comprises: DSP digital processor, FPGA logic processing unit, external connector, high-speed sampling A/D, high-precision D/A and relevant digital circuit chip.

3. The flexible-rigid printed board on the bullet of claim 2, wherein the surface layer is designed with a minimum line width of 10mil, a minimum line spacing of 12mil and a minimum hole size of 10 mil.

4. The printed board of claim 3, wherein the first electrical ground plane is divided into 3 different electrical characteristic planes: high precision A/D digital ground, high precision A/D analog ground, digital signal plane ground.

5. The printed board of claim 4, wherein the intermediate signal layer is designed as parallel address lines and data lines of a DSP and an FPGA.

6. The printed board of claim 3, wherein the intermediate signal layer is designed with a minimum line width of 6mil, a minimum line spacing of 9mil and a minimum hole size of 10 mil.

7. The printed board of claim 4, wherein the bottom mounted devices comprise a high speed F L ASH, a high speed optocoupler, a magnetic isolator, a decoupling capacitor, L DO power supply.

8. The flexible-rigid printed board on the bullet of claim 7, wherein said bottom layer of printed conductors has a minimum line width of 10 mils, a minimum line spacing of 12 mils, and a minimum hole size of 10 mils.

9. The printed board of claim 3, wherein the first power layer or the second power layer is designed with +27V, +15V, -15V, digital +5V, digital-5V, analog +5V, analog-5V, 3.3V, 1.8V, 1.5V.

10. The printed board of claim 1, wherein the ten-layer PCB rigid-flexible printed board has a thickness of 12.6 mil.