TW200806114A - System and method for modular electronics design - Google Patents

Abstract

A system for designing electronic hardware devices includes a system interface accepting electronic design parameters as input, a library storing a plurality of modules where each module is an electronic subassembly and the modules have standardized common interfaces. The system retrieves compatible modules from the library in response to design parameters and joins modules in order to create a complete electronic design for an electronic component such as a printed circuit board, a microchip or a wafer-stacked device.

Description

200806114 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates generally to electronics, and more particularly to electronic design. [Prior Art] A printed circuit board (PCB), also known as a printed wiring board (PWB), is commonly used to provide the necessary tight and complex circuit connections for current electronic components. Use a PCB under the I line to connect electronic parts. Basic printed circuit boards • * There is a layer of printed wiring, also known as traces, mounted on a layer of insulating material. The traces are generally made of copper and the insulating material is roughly plastic. Often, =CB has a multilayer circuit that is insulated and separated. (10) having a plurality of layers is also called a slab. The layers are joined by drill holes and plated holes called channels. Printed circuit board design is a complex process that involves not only electronic considerations but also formal factor requirements, many standards (such as safety, military and environmental standards), and materials and manufacturing considerations. For example, electronics consider including the width and spacing of the traces to maintain adequate signal transmission, and the power and ground planes in the board to de-tune the unexpected antenna and provide some thermal spillover. The trace layout is also considered to be considered because the traces that are too close will be shorted by the solder in the process of mounting the part. During the integration of the slab, the trace layout also affects the flow of the plastic in the insulating layer. The alignment of the different layers is such that the channel can be drilled positively. If the layers are not correct, the channel will not pass through the circuit points to be connected. The number of channels is typically minimized to reduce drilling costs and to maximize the circuit area on each layer. Moreover, the channel can interrupt the circuit layout on multiple layers without the need for channels to connect. The circuit is formed by etching copper from a copper plate that is accumulated in an insulating layer. 115846.doc 200806114 It is generally desirable to leave as much steel as possible on the insulating layer because removing a large amount of copper can deplete the etchant and create contaminants that still require reprocessing. In addition, if the area to be etched has a similar average ratio of circuits to non-circuit surface areas, the circuit will be etched more consistently. There are more P C B design considerations than the above. There are other types of electronic designs such as ultra-large integrated circuits (vlsi), such as microchips and two-dimensional microsystems (3D microsystems), where the microchip includes a plurality of conventional side layers that are stacked vertically to produce a three-dimensional integrated body. Circuit. The design of the vlsi circuit and the 3D microsystem involves similar considerations to the pCB design described above. Under the above considerations, the conventional PCB design and layout (and other electronic design) is a kind of technically demanding, labor-intensive Mang-Gan is also too old-fashioned, and often needs a long-time electronic engineer. work. Once the PCB design is completed, it is difficult to add or modify features. In many cases, the cloud re-engineering process is almost as labor intensive as the original design requirements. This is especially true for compact, high space optimized designs such as those used in modern portable or wearable electronic devices. Mountain ^ For the above reasons, a system and method are needed for faster design. SUMMARY OF THE INVENTION The present invention is directed to a system and method for single mode electronic design that provides an efficiencies in the design process and the resulting design. A system according to the description includes a library of design modules. The 兮 x 4 juice module library includes a plurality of modular modules that have a well-designed 旎 function interface. For example, the group is a functional sub-assembly of a complete PCB design, 4丄* mode 1 thousand power adjustment module, wireless 115846.doc 200806114 module, and sensor module. In response to design parameters, the system tiles the modules to meet a special design specification. The assembled module forms a complete, continuous, functional electronic design, such as a PCB, which incorporates the functions of the secondary components. The interface of the module is designed to provide flexibility in the process of making a tile. In general, no additional design work is required to provide a complete design.

The single-mode electronic design of the method # operates in the low-level operation of the integrated circuit (1C) or separate parts' or operates at the higher order of a larger system, such as a larger combination of separate PCB and mechanical interconnections. The single mode of ICs or discrete parts does not mention high-order Wei design (4), and the use of separate coffee with mechanical interconnections increases the size, and for many electronic applications, including portable or wearable electronic devices, It will produce reliability and packaging. Under the 'PCB design process, the system and method of the present invention can provide the advantages of connecting separate coffee and mechanical interconnections without increasing the size, without increasing the packaging problem, and without reducing Operational reliability, etc. The various embodiments of the invention include a system for designing an electronic hardware device that has a second system interface that takes electrical design parameters into view. The μ device stores a library of a plurality of modules, and each module includes an electrical component μ. At least the module is compatible with the plurality of modules. In the embodiment, the system has a single library "there is a low-order combination and interface compatibility of the shared phase ns/early library and all modules." The configuration is determined by the functional boundary group. In the other example, the module is defined by a feature function group, such as a wireless module, a power module, and The sensor 115846.doc 200806114 杈,, and °H system further includes a controller that is in communication with the system interface and is connected to the library. The controller accesses the library to retrieve a plurality of compatible modules to The number of slaps received is particularly high. The modules that are captured form at least part of an electronic hardware device. The advantage of this system is that only the electronic sub-assembly is designed one time, and then stored in The design library is used as a module. These modules can be reused in subsequent electronic designs. By selecting an extensive library, by selecting and shaping the appropriate mold 2 into a tile shape and working with a small amount of additional engineering, new electronics can be generated. •, set 5 as a new PCB. In addition, once the library is available The module in the module and then select it for a particular PCB application, the system designs and layouts the PCB design based on simple design rules. In one configuration, the captured module has a compatible interface. In an alternate embodiment, The interface is electronically compatible. In another alternative embodiment, the interface is form factor compatible. For those involved in design and layout functions, which have not been provided in the existing set of libraries, these common interfaces reduce the design of new electronic components. The design work can be independently updated, modified or taken in the existing pcB design. This can achieve parallel development of the module, simplify the design of the debugging, and easily update the function in the electronic design. In another embodiment of the invention, the library stores a set of design rules to be applied by the controller to verify the design of an electronic hardware device. In one configuration, the design rules are design level rules, the representations of which are to be applied integrally Design, and in another configuration, the design rules are associated with individual modules. In still another configuration, application design level rules and individual module rules are applied. In another embodiment, the system interface accepts electronic design parameters for a plurality of electronic hardware devices, and the system layout is a single manufacturing group 115846.doc 200806114, which includes a plurality of electronic hardware devices. In a first configuration The plurality of electronic hardware devices are the same second configuration, and the plurality of electronic hardware devices are not the same design. For example, the single manufacturing component is a multi-layer printed circuit board having a plurality of % of sub-policies, which will be manufactured after manufacture. Divided into a plurality of separate printed circuit board devices.

In another embodiment of the present invention, a method for designing an electronic hardware device includes providing a library for storing a plurality of modules, each of which includes: an electronic component. At least two of the plurality of modules are mutually compatible. The system performing the method (4) receives electronic design parameters and selects at least two modules from the library to respond to (iv) electronic design parameters. The system then forms at least a portion of the electronic hardware device from the selected module. In one configuration, the system selects the module based on the feature. In a second configuration, the system selects modules based on module functionality. The standardized sub-assembly of the present invention is subdivided, and 忏 禚 禚 禚 禚 禚 , , , , , , , , , , , , , , , 。 。 。 。 。 。 The combination of modular design system and rapid PCB manufacturing can accelerate the development of prototypes while reducing the engineering cost. The advantages of the above and JL tails of the present invention can be implemented by the following multiple inventions. The detailed description of the examples is fully understood with reference to the accompanying drawings, wherein: [Embodiment] An electronic design system, which is a module of a human component, is also called a module. The system lays out the modules in a process of forming a tile shape in the process of forming a tile shape to form a complete design group, and the upper < σ P brush circuit board. These modules are in line with the specifications for providing a compatible interface and signal and power. The electronic design system can be applied 115846.doc 200806114 on VLSI design and 3D microsystem design, as well as on the PCB. Embodiments of the present invention provide for the automatic generation of electronic designs and significant advantages in the rapid prototyping of electronic components. 1 is a block diagram of a single mode electronic design system in accordance with the principles of the present invention. The design system 100 includes a controller 1 〇 5 that interfaces with a layout and design system. In the present invention, the layout and design process is external to the design system 100. In an alternate embodiment, the layout and design system is integrated with the design system 100. For example, controller 1 〇 5 is a microprocessor. For example, the layout and system is a computer system that performs one of several design and layout programs available, which are suitable for use in the present invention. For example, the layout and design system 110 is an eagle layout editor developed by CadSoft Computer, Inc., located in Delray Beach, Florida. In an alternate embodiment of the present invention, the design system 100 of the present invention incorporates a layout and design system. The design system 100 also includes a library 115. The library 115 includes a plurality of modules 120'' 125' 130' 135. Each module is an electronic sub-assembly design. For example, the secondary component is a component having a special function such as power module 125. Other examples of secondary components are wireless modules 120, 135 or sensor modules 13A. Modules 12, 125, 13 〇, us in this embodiment are generated based on functionality, however, it is also possible to define electronic sub-components such as by means of parts or features. The invention is not limited to the module definitions listed herein. The modules 12, 125, 130' 135 have compatible physical and electronic interfaces, as well as compatible signal and power requirements. The library can maintain multiple spares and it meets multiple interfaces and the letter-to-force rate. The library 115 also includes design rules. Use design rules 115846.doc 200806114 140 to test 'for example, relative to & The library 115 in one embodiment includes design details & Λ, 彔 160. The design catalog 1 60 is used to design the components and will be detailed below. The μ -ο» α ^ port count catalog 160 includes a design for the component that uses the modules stored in the library 115.

The tenth system and the charging unit 100 have a system interface 145 through which the design system 100 can receive input without counting 丨5 〇. The design parameter 1 $ 〇 is the data, and it is waiting for the system, and the electronic components such as pcB are designed. For example, design parameters 150 include a computing device. The system interface 145 is any interface through which the computing device can receive data. For example, a user can enter design parameters 150 through the keyboard. Alternatively, the design parameters 150 may be received over the network, or as an archive on an electronic medium such as a CD-R. In various embodiments, the design parameters 150 are generated by a computer program. In operation, the design system 100 receives design parameters 15 that specify electronic components such as pCB located at the system interface 145. The controller 1〇5 draws the module from the library 115 based on the design parameters 15〇. Controller 105 provides the captured module to layout and design system 110 for assembly in an electronic design. The controller 105 then applies the design rules 140 to check the layout and design system 〇 generated design 155, and to provide information about the violation rules to the layout and design system. If necessary, system 100 and layout and design system 110 will modify design 155 in response to design rules 140 application ◊ system 1 〇〇 output electronics or components such as PCB completed design. In various alternative embodiments, the above described design system is for VLSI design and for 3D microsystem design. In yet another alternative embodiment, controller 1 接收5 receives modules from library 5 in response to design parameters 150, and uses design catalog 115846.doc -11 - 200806114 1 60. Moreover, in various alternative embodiments, user input is acceptable at all steps of the design process. Design processes that work with single-mode design systems designed for low-level modules, involving interface and form factors, and circuit design. In order to create a new module, the designer first studies the design specifications and design constraints, and the layout is used for electronic design of electronic components such as PCBs, which meet the limited specifications. This process differs from the well-known design process in design constraints, which typically include design rules imposed during the process, including additional constraints on the modular system and interface specifications. The above modules are only typical. For example, in addition to the wireless module 12〇, 135, the sensing module 1 30, and the power module i 25, the "meeting module", the two-way audio module, and the interface module are also feasible for different types of devices. The invention is not limited to the types of modules listed herein. Figure 2 is a block diagram of a storage module 12〇, 125, 13〇, 135 and a library 115 of design rules 14〇. Modules 12〇, 125, 13 〇, & includes design data 200, 205, 210, 215 which describes the layout of the module circuit. Each module 120 125 ' 130 ' 135 has a specific signal interface 240, 245, 250 ' 255 and other modules 120, 125, 130, 135 are shared. The special interface in this example is called the signal interface β. The signal interface p provides a specific signal 'which has, for example, a compatible voltage level and impedance for no additional signal conditions. The first module, for example, the wireless module a 120, can be connected to a second module, such as the power module B 125. Each module 120, 125, 13 〇, 135 ^ 疋 体 interface 260, 26S, 270, 275, in this case referred to as solid bile; 1 side is provided by a specific entity interface 260, 265, 270, 275 The standard for common inter-body connections between groups 115846.doc •12· 200806114. The physical interfaces 260, 265, 270, 275 also include formal factor specifications. The physical interface in the first embodiment, the reference features of 265 270 '275 The position is compatible. In the second embodiment, the intersecting interfaces 260, 265, 270, 275 are compatible with the channel locations. These features are only examples of fc. Other features that are physically compatible within the scope of the present invention are also Although only one type of signal interface and one type of physical interface are described herein, the skilled artisan will appreciate that the library 115 can store modules having other interface types. The modules 120, 125 in this embodiment, 130, 135 includes a particular set of design rules 22, 225, 23, 235 of the module. These group design rules 220, 225, 230, 235 are applied in a manner similar to the application of the design rule 140 application. 〇 Stored in a library unrelated to modules 12〇, ι25, 13〇. Module-specific design rules 220, 225, 230, 235 ^ include rules related to other module connections. An alternative implementation of the present invention Example 1 00 does not have design-level design rules 〇 4〇, and module-specific design rules 220, 225, 230, 235 are only applied to design 155. In another alternative embodiment, modules 120, 125, 130, 135 do not have design Rules 220, 225, 230, 235, and design rules 14 apply only to the modules that are designed 155 from the library 11 to form at least a portion of the design for the electronic hardware device. The advantage of this system is that only the electronic sub-components are designed once and then stored in the library. These modules can be reused in subsequent electronic designs. With an extensive library, new electronic devices such as new PCBs can be created by selecting and tiling appropriate modules without additional engineering work. In addition, 115846.doc -13 - 200806114 Once the modules in the library can be used and then selected for a special peg application, the system designs and layouts the PCB design according to the design rules. In some embodiments of the invention, the design is stored in a library and used in subsequent design operations in the design directory. The standardized sub-assembly of the present invention allows for standardized packaging, and thus reduces associated mechanical design and manufacturing costs of electronic devices. For example, in PCB manufacturing, the combination of modular design systems and rapid pcB manufacturing accelerates the development of prototypes while minimizing engineering costs. • Figure 3 is a cross-sectional view of a portion of a typical multilayer printed circuit board 300 that is the type that can be produced by designs made in accordance with embodiments of the present invention. A simple version of the PCB design is a single layer board in which all signals are transmitted to the top surface of the board. More commonly, the PCB has at least two signal layers (a top layer 305 and a bottom layer 310), and in time has a plurality of internal signal layers 315, 320, 325, 330 as shown in FIG. The signal layers 3〇5, 31〇, 315, 32〇, 325 3 3 0 are separated by an insulating material layer 335 and connected at specific points by plating channels. In this case, the PCB 3 has two surface mount parts 345. The system and method of the invention can quickly and efficiently design components as shown herein. • Figure 4 is a block diagram of a tile module in accordance with the principles of the present invention. For clarity • Use a single laminate and a horizontal tile design to explain the tile shape under the spoon. A knives example module having a sample module 355, 36 〇, 365 includes a wireless module 355, a power module 360 and a sensory module 365. Each module has a plurality of connection points at a specific location. The connection points such as 是 are the power connection point 37〇, the ground connection point, the clock connection point 380, and the bedding connection point 385. Module Μ,, gw is designed to be 115846.doc -14- 200806114. It conforms to the module, which can be tiled with any other adjacent modules to create a functional connection design. The junctions 3 70 ' 3 75, 3 80, 385 of adjacent modules 355, 36 〇, 365 are joined together to form a larger pCB assembly. Each module 355, 360, 365 also has a reference mark mo, also referred to as a reference, for aligning the modules to each other. The reference 39〇 can also be used to align the layers in the multilayer pCB.

The example modules 355, 36A, 365 of Figure 4 are formed as a single layer, horizontal tile, wherein the turns 355, 360, 365 are themselves rectangular sub-assemblies, each having a four-signal interface. This module design uses a single power and two-wire shared serial bus to communicate across the module. The busbar is, for example, a busbar produced by Royal Phihps Electr〇nics. By assembling the pre-designed modules together to form an electronic design, the work done in part design and configuration can be eliminated. The systems and methods of the present invention are not limited to single layer panels or horizontal tiles. In a number of alternative embodiments, any number of plies are feasible and support two and three dimensional tiles. In an alternate embodiment of the present invention, library 115 also includes module specifications to be included in a particular design level. In yet another alternative embodiment of the present invention, the system 100 provides design specifications for the catalog 160 to define a particular design level. In the implementation of the design catalog (10), the PCB design level is defined, for example, by specifying the number of subassemblies used and the general type. For example, a catalog that can be loaded with a biosensor can be a combination of three modules, each of which is of a specific type: a wireless (module type A), a power supply (module type B), and a sensor system (mode) Group type C). Under a known design library, any combination of Type A: Type B Type c will result in a functional PCB design for the loadable biosensing ΐ 15846.doc -15 - 200806114. In an alternative embodiment of the invention, the multilayer board is tiled in a manner similar to that described above. For example, in a two-layer board, the intervening interface signals are placed (or transferred) to the bottom and top of the board. The use of the - side of the board for routing (and for parts) has the advantage of allowing for a tighter board design, and the problem of substantially simplifying the board routing is achieved by allowing the signals to traverse each other in space while maintaining electrical insulation. . By using a double layer for interface routing, the resulting sub-components are tighter and easier to route. ° The above horizontal tile (4) can be extended to a design with more than two layers by continuously transmitting the interface signal at the top or bottom, or by transmitting the interface signal to the internal layer. For example, in the middle two layers of the conventional four or six-layer pcB layout, the layout shown in the PCB of Fig. 3 is often reserved for supply signals (PWR and GND). This makes it easier to transfer the supply signal and leaves room for component packaging and other signals on the top and bottom layers. With the internal layer of the amount:, more signals can be transmitted internally, and more space can be left at the top and bottom for part setup. By using such a system, more layers of PCB can be stacked as much as possible into a functional pcB interlayer, and each PCB layer includes a group of tile-shaped pCB modules. Although it is layered, it is roughly two-dimensional. Parts are usually placed in the (four) or bottom. The inner layer of the PCB is generally only used for routing. In conventional monogastric electronic designs, a single horizontal or vertical back is often used to provide parallel: the interconnection between the board or expansion card p C B . Various embodiments of the present invention provide two-dimensional functionality to meet the needs of 3-D electronic design. A pattern of a three-dimensional tile-like module according to a consistent embodiment of the present invention is recalled. 115846.doc -16- 200806114 The module 400 includes connections 405, 410 for horizontal tile. Module 4 also includes a vertical interconnect interface 415. The vertical interconnect interface 415 is a connector that conforms to a particular design and location. The vertical interconnect interface 415 provides a connection to multiple layers or to components located above or below the module. For example - the vertical interconnect interface 41 5 is a board to board connector. Module 400 also includes a reference mark 420 for alignment. The vertical interconnect interface expands the functionality of the system for more complex tile designs, such as vertical tile designs or horizontal and vertical tile φ designs. Figure 6 is a top plan view of a tile-shaped PCB 450 having a vertical and horizontal tile shape. The PCB 450 includes four modules 455, 460, 465, 470 that are connected together via a horizontal connector 475. Each module 455, 46A, 465 includes a vertical connector 480 that can be used to connect to other components (not shown) located above or below the pcB 45A. Design System 〇〇 The process of forming this design involves selecting a module in response to the received design parameters. The modules in this example are a multi-layer design. However, regardless of the internal complexity of the individual modules, only adjacent modules can be set up because the modules are compatible in terms of interface and form factor. Figure 7 is a side elevational view of a three-dimensional microsystem 5〇〇, in which a vertical tile shape is applied, in accordance with an embodiment of the present invention. The three-dimensional microsystem (3D microsystem) 500 is an integrated electrical-path (1C) comprising a conventionally etched semiconductor 1 (: 505, 51 〇 vertical stack, bonding layer. The 3D microsystem shown in Figure 7 includes a package Layer 515, which provides ... 5 05, 5 10 protection and electrical insulation. Two-dimensional single-mode design method, which has been described in the PCB design, is also suitable for functional modules in sVLSI (very large integrated circuit) design. Each IC 5〇5, 51〇 is modularized in a manner similar to the above-described PCB. In addition, each 1C 505 includes a vertical connector 52. Using two 115846.doc -17-200806114 dimensional modules, which are used for The standard vertical interconnection of the VLSI design enables the VLSI modules to be stacked to form a component, which is a microsystem. Figure 8 is a top view of the PCB 550 having a modular interior in accordance with an embodiment of the present invention. Structure. In this illustration, the different layers that make up the internal structure are indicated by dashed lines, and each layer has a different fill pattern. In a conventional multilayer design method, a special signal is transmitted through one or more PCB layers. Drilled by electroplating, which passes through all layers (channels) or After a group of layers (microchannels), the signal conversion between the layers is made. This transfer design provides flexibility, but the manufacture of multilayer PCBs requires a lot of expensive specials, making it difficult for most organizations to produce multi-layer PCBs indoors. Under the etched top and bottom layers of the PCB and the equipment and processing for drilling the channels, it is relatively inexpensive, so that even a small mechanism can produce a two-layer board indoors. Therefore, the single-mode design system and method of the present invention The embodiment relates to providing a board module, as shown in FIG. 8 having a modular internal structure, pc]B 5 50. The board module is provided with an internal circuit and a top 555 and a bottom of the embryo (not shown in this figure) For example, the top and bottom layers of unetched copper. PCB 550 is a multi-layered embryo with an effective internal structure, circuit layers 560, 565, 570, 575. Special circuits can be placed on top layer 550 and bottom layer. Circuit layers 560, 565, 570 575 has at least one connection point 580 in which the channels are drilled to form a vertical connection with other layers. A two layer etching and drilling process can be applied to these modular boards to easily fabricate the multilayer board. The known multi-layer board design is roughly complex, and its complexity grows significantly with each layer of the design. Therefore, the design of the 8-layer board is far more complicated than the design of the 4-layer board, and the design of the 14-layer board. Far more complex than the design of the 8-layer board 115846.doc 200806114. Various embodiments of the present invention provide a compatible pre-designed module that can be, and is designed to form, a design for a multi-layer board. Pre-designed panels can be assembled with multi-layer panels, allowing designers to avoid many of the complexities encountered in conventional board designs. The use of single-mode designs allows for a hybrid approach where a multi-layer board has a pre-manufactured interior layer. The top and bottom layers are left to be customized for a particular design and room etch. The inner layer can be designed to systematically transmit seven: and the nickname so that these signals can be used in specific locations or areas of the multi-layer board, such as connection point 580 of FIG. These inner layers are then prefabricated with the top and bottom layers of solid copper. These supply and data signals are then additionally issued by channels that are drilled at specific locations. In addition, the design used to pre-manufacture the internal structure in some embodiments leaves open space for the drilled channels to pass other signals from the top of the board to the bottom of the board. The use of two layers (top and bottom) provides significant advantages in PCB design because it allows for internal signal transfer, thus tighter use of the top and bottom layers for part placement. The main disadvantage of the conventional multilayer design is that the process is more complicated and many organizations package the manufacture of the multi-layer board to a special facility, which is complicated and poses extremely serious challenges and high expenditure. In contrast, the less expensive equipment can be used to perform the top and bottom etch of the PCB panel indoors, and the time required is hours rather than days. Accordingly, various embodiments of the present invention provide modifiable building blocks that can be easily and quickly assembled into a unitary device. A pre-manufactured multilayer layer having a top layer and a bottom layer of an embryo (unetched copper) can be produced in large quantities in advance. In one embodiment, a module is selected from a design library 16 115846.doc -19- 200806114. The selected modulo I and the 徂f Λ are used for the replacement of the internal structure for the PCB embryo. Although the names of the middle layers of these PCB modules are fixed, the top and bottom layers, as well as the locations of the channels and drill holes, can be customized according to the specific functions of the e-policy. The pre-manufactured multi-layer board design includes a 斟 T匕栝 alignment that allows the top, bottom layer, and channel to be aligned with the bore to form a connection to the pre-fabricated internal structure. Using the f-mask and chemical (4) or numerical control (4) grinding, and drilling, the final design can be quickly and inexpensively manufactured. Drill

9 is a flow diagram of a method of designing a system (10) in accordance with an embodiment of the present invention. At step 600, the design system 1 provides a module library 115. As mentioned above, the modules include designs for electronic components. In one embodiment, the single molds are formed in a horizontal tile shape. In the case of multi-residue π 1 1U曰, 铋, including the single-mode as a vertical tile. In a number of occasions, the 1U method is applied again, including making the module into a tile that is vertically and horizontally combined. The module forming the core of the PCB embryo is set in the library 115. The design system 1 receives the electronic design parameters at step 605'. When at least two modules are selected, the design parameters (10) specify the electronic components to be designed. As noted above, the design parameters 150 are derived from one or more of a number of sources, including the input and output of a computer program. In step 6 H), the design system i 〇 selects at least two modules in response to the received design parameters, and the selected modules have compatible interfaces so that the modules can be tiled in accordance with the principles of the present invention. At step 615' the modules are laid out as a design. Conventional layout and design systems such as the eagle system can be used to lay out the modules. At step 615, the compatible modules are combined to produce a design for an electronic component such as 115846.doc • 20-200806114 PCB. The compatible interface of the module ultimately simplifies setup and routing. At gamma step 620, the stun system i(8) applies the design rules in the design obtained from step 61$. In an alternate embodiment, the system 1 applies a system level design specification. In a second alternative embodiment, system 100 applies module level design rules. As shown in Figure 2, design rules 220, 225, 230, 235. For example, these design rules are electronic standards. At Step 625, System 1 completes the design. At this step, respond • any changes in step 620 and format the design for output. Figure 10 is a block diagram of a manufacturing assembly including a plurality of electronic devices in accordance with a consistent embodiment of the present invention. The manufacturing assembly 650 in this example is a multilayer printed wiring board (PWB). The manufacturing assembly 65 includes a plurality of individual multilayer electronic devices, a multilayer device 65, a multilayer device 66, a multilayer device C665, a multilayer device 67, a multilayer device 675, and a multilayer device μ (9). The design system 100 of the present invention receives the design for each of the different multi-layer devices 655, 660, 665, 670, 675, 680 in order to design the manufacturing assembly 65: • The number is not on the board, the device is not counted, the design system! (10) Pointing to the design of a plurality of devices on the single-layer board. The compatibility of individual modules can be extended to multiple electronic devices on the board. In the first configuration, the multilayer device 66〇' 665' 67〇' 675' 68〇 is the same design. In a second configuration, the 695, 660, 665, 670, 675, 680 are manufactured in different ways as a PWB (four), and then Divided into individual multi-layer devices. Capacity 1: The ability to factor in this type of manufacturing component provides the opportunity to reduce production costs. The cost of manufacturing a multi-layer board is much lower than, for example, the manufacture of six multi-layer boards to 115846.doc -21 - 200806114. Although the above system and method are mainly described in terms of a PCB, the present invention is also applicable to VLSI design and 3D micro system design. It is to be understood that the above-described embodiments are merely illustrative of the principles of the invention. It is obvious to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of a design system in accordance with the principles of the present invention; Figure 2 is a block diagram of the library of Figure 1, including further details of a module in accordance with the principles of the present invention; Figure 3 is a conventional six-layer printing Figure 4 is a block diagram of a tile-like module in accordance with the principles of the present invention; Figure 5 is a block diagram of the module - the module is used for root three-dimensional tile, · 0 "Figure 6 has a mode (d) a top view of a horizontal tile-like printed circuit board having vertical connectors in accordance with the principles of the present invention; and Figure 7 is a side view of a vertical tile-shaped D three-dimensional microsystem 8 in accordance with the principles of the present invention. The modularized internal printed circuit board of the inventive principle has a flow chart according to the present invention, which is based on the original diagram of the present invention, which is a manufacturing component of Fang Shigang 9 ο ^ φ ^ Ghost diagram, the assembly includes a plurality of electronic devices in accordance with the principles of the present invention. Ten's Day 115846.doc -22- 200806114 [Description of Main Components] 100 105 110 115 120, 135, 355 125, 360

130, 365 140 145 150 155 160 200 , 205 , 210 , 215 220 , 225 , 230 , 235 φ 240 , 245 , 250 , 255 260 , 265 , 270 , 275 300 305 310 Design System Controller Layout and Design System Library Wireless Module Power Module Sensor Module Design Rule System Interface Design Parameter Design Design Catalog Design Data Design Rule Signal Interface Physical Interface Multilayer Printed Circuit Board Top Layer 315, 320, 325, 330 335 340 345 Internal Signal Layer Insulation Material Channel Surface Mount Parts 115846.doc -23 200806114

350, 450, 550 PCB 370 Power Connection Point 375 Ground Connection Point 380 Clock Connection Point 385 Data Connection Point 390 > 420 Reference Mark 400, 455, 460, 465, 470 Module 405, 410 Connection 415 Vertical Interconnect Interface 480 520 vertical connector 500 three-dimensional microsystem 505, 510 1C 5 15 encapsulation layer 555 top 560, 565, 570, 575 circuit layer 600 ' 605 , 610 , 615 , 620 , 625 step 650 manufacturing component 65 5 multi-layer device A 660 multi-layer Device B 665 Multi-layer device C 670 Multi-layer device D 675 Multi-layer device E 680 Multi-layer device F 115846.doc -24-

Claims (1)

200806114 X. Patent application scope: 1 · A system for designing an electronic hardware device, comprising: a system interface that receives a plurality of electronic design parameters as inputs; a library that stores a plurality of modules, each of which The group includes a design of one of the electronic components, wherein the plurality of modules 7 are compatible with the other modules of the modules; . (4) Descendants, # communicate with the system interface and communicate with the library, the control and benefit access to the library to retrieve a plurality of compatible modules, in order to return to the design parameters, wherein the operation modules are formed - At least part of the design - for an electronic hardware device. 2. The system of claim 2, wherein at least one of the modules and at least one of the modules has a plurality of compatible interfaces. 3 · The system of Shiming 2, wherein the compatible interfaces are electronically compatible. 4. A system according to π, wherein the compatible interface is a system of factor θ θ long term 4 wherein the compatible interfaces are compatible with the reference mark positions. The system of claim 4, wherein the compatible interfaces are channel-compatible. 7 The system of Shikou Jinming/Item 1, wherein the library further comprises storing a set of design rules and wherein the controller applies the set of design rules to verify the design of the electronic hardware device. 8 士口^月二项1的系统, in which each module still includes a set of design rules, the 5H controller application belongs to the set of design rules 115846.doc 200806114 of the selected modules to verify the electronic hard The design of the body device. 9. If requested! A system in which each of the modules is defined by at least one feature. 1 〇 _ As in the system of claim 1, the 中 ώ 从 从 从 M M M M M M M M M M M M M M M M M M M M M M M M 1 1 · If request J Ί β , ”, 、, ′′, the system interface accepts multiple electronic design parameters for a plurality of electronic body more shame, and the controller takes multiple moduli and responds The electronic design parameters are used to form a plurality of electronic hardware devices in a single manufacturing component. The system of the long term 11 wherein the single manufacturing component is a plurality of printed circuit devices. 13 · The system of Shiming Item 12, wherein The plurality of electronic hardware devices are the same system of 14. The invention of the item 12, wherein the plurality of electronic hardware devices are not the same design. 15. The system of claiming the electronic device is a power module The system of the item 1 of the month 1 wherein the electronic component is a wireless module. 17. The system of claim i, wherein the electronic hardware device is a printed circuit board. ' 18. System, wherein the electronic hardware device is a microchip. The device 19. The system of claim 1, wherein the electronic hardware device is a wafer stacked internal structure 20, such as the system of claim 1, wherein the module Group one electron One of the 1's system of the present invention, wherein the electronic device is a printed circuit board 115846.doc 200806114 22 - a design for designing an electronic hardware device, comprising: providing a plurality of modules for storing The library, Du Xiyi grabs, each side of the Ganshan module includes an electronic component and σ, wherein at least one of the plurality of die turtle groups is compatible; at least - the module and the modules Receiving a plurality of electronic design parameters of the sister; selecting at least: the module to return to the electronic design parameters; and forming from the modules - at least a part of the design of the electronic hardware device. 2 3. If the solution is 2 2 The method, the resetting of the month & /, T 3, the selecting step comprises selecting the at least two modules from the library based on the module function. 24. The method of claim 22, the complexing, the t, the middle The discarding step includes selecting the at least two modules from the library based on the at least one feature. The method of claim 22, wherein the method of applying the item 22 applies a set of design rules to check the design of the electronic hardware device. Steps. 2 6. If the eye is 2 2 The method of forming, resolving, and forming a plurality of electronic hardware devices comprises forming a plurality of electronic hardware devices in a single manufacturing component. 27. The method of claim 26 is repeated by 咕... Included in the formation of a plurality of electronic hardware devices in a single fabricated component. 28. As claimed in claim 27, wherein the electronic hardware devices in the single fabricated component are of the same design. The method wherein the electronic hardware devices are not of the same design. 30. A computer readable medium comprising a code for designing a plurality of electronic devices, the code being usable by: 115846.doc 200806114 providing a plurality of storage a library of modules, each of the modules comprising a design of one of the plurality of modules, wherein at least one module of the plurality of modules is compatible with at least one of the other groups; the plurality of electronic design parameters are received differently The library selects at least two modules to return to the electronic design parameters; and forms at least a portion of the design of the electronic hardware device from the modules. 115846.doc