WO2006137215A1

WO2006137215A1 - Device board

Info

Publication number: WO2006137215A1
Application number: PCT/JP2006/308610
Authority: WO
Inventors: Yohsuke Fujikawa; Noboru Matsuda
Original assignee: Sharp Kabushiki Kaisha
Priority date: 2005-06-24
Filing date: 2006-04-25
Publication date: 2006-12-28

Abstract

A dummy electrode (9) is provided in an area of a first board (1) between connection terminals (200) corresponding to the output terminals of a driver IC (3) and the position (10) at which two roundabout lines (100(n)), 100(n+1)) from the connection terminals (200) meet. As a result, the dummy electrode (9) suffers from electrostatic discharge in place of the two roundabout lines (100(n), 100(n+1)), and thus electrostatic destruction which may occur to the circuit and elements provided on the two roundabout lines (100(n), 100(n+1)) is prevented.

Description

Specification

Device board

Technical field

TECHNICAL FIELD [0001] The present invention relates to a device substrate for mounting a driver IC and use thereof, and more specifically, using a so-called COG type device substrate in which a driver IC is mounted on a glass substrate and the substrate. The present invention relates to a liquid crystal display device manufactured.

Background art

In recent years, a device substrate (for example, a liquid crystal display device having a COG (Chip On Glass) type loading form) in which a driver IC based on a Si wafer is loaded on a substrate has been put into practical use.

[0003] For a COG type liquid crystal display device, in order to supply a signal to each of the wiring groups constituting the screen, the area force on which the driver IC is loaded is also arranged on the substrate. Yes.

[0004] There may be a single driver IC or a plurality of driver ICs mounted on a substrate. In general, since the size of the driver IC is small with respect to the screen, the routing wiring on the board is formed in a fan shape by directing the load area of the driver IC on the screen area.

In such a device substrate, it is well known that internal elements are destroyed by static electricity generated during the manufacturing process. It is well known that electrostatic discharge (ESD) and ESD-induced device breakdown are likely to occur in the following locations: (1) Around the screen; (2) 1 of the routing wiring And (3) Bow I wiring and other driver ICs to be connected to one driver when multiple IC drivers are stacked The part to be connected to or adjacent to the bow I winding wire to be connected to.

[0006] (1) or (2) is often caused by static electricity generated in the rubbing process. Also

(3) often occurs before or when the driver IC is loaded. Loading multiple driver ICs at different times can also cause electrostatic discharge. A difference in position is likely to occur on the device substrate! / ヽ.

[0007] In order to prevent such electrostatic discharge, a dummy electrode (see, for example, Patent Documents 1 and 2) or a dummy pixel (for example, see Patent Document 3) is attached to a screen or a device substrate. Many methods for forming the periphery have been proposed. Further, a technique for grounding the short-circuited wiring after the disconnection for preventing the element from being destroyed by static electricity after the short-circuiting of the short-circuited wiring is disclosed (for example, see Patent Document 4).

Patent Document 1: Japanese Patent Publication “Japanese Patent Laid-Open No. 10-148840 (Publication Date: June 2, 1998)”

Patent Document 2: Japanese Patent Publication “JP-A-6-331997 (Publication date: December 2, 1994)”

Patent Document 3: Japanese Patent Publication “Japanese Patent Laid-Open No. 3-45934 (Publication Date: February 27, 1991)”

Patent Document 4: Japanese Published Patent Publication “Japanese Unexamined Patent Publication No. 2005-266111 (Publication Date: September 29, 2005)”.

[0008] However, the techniques described in Patent Documents 1 to 4 are easy to cause element destruction due to ESD, and are merely considering the above-mentioned (1) to (3) as a part. Considering the existence of various forms of electrostatic breakdown.

[0009] In the liquid crystal display device in which the driver IC having the output terminals divided into a plurality of groups is mounted on the main substrate, the present inventors have made it difficult to predict the electrostatic capacity that has conventionally been difficult to predict when mounting the driver IC. It has been found that breakdown occurs and the pressure resistance against static electricity becomes extremely weak. A new form of electrostatic breakdown discovered by the present inventors will be described with reference to FIGS.

[0010] It should be noted that, as used in this specification, "element destruction (in the Xth routing wiring)

“Electrostatic breakdown” is intended to mean “the insulation part of the circuit or switching element (existing on the Xth routing wiring) is short-circuited or the display electrode is abnormally lit”. Further, as used herein, “Xth” is intended to be Xth from the left side in the figure unless otherwise specified.

[0011] FIG. 6 has a so-called three-side free outline in which a driver IC is mounted on only one side. 1 is a perspective view schematically showing a configuration of a liquid crystal display device (device) 1000. FIG. As shown in FIG. 6, the liquid crystal display device 1000 is formed by bonding a first substrate 1 and a counter substrate 2, and a driver IC 3 is mounted on the first substrate 1. Further, in the liquid crystal display device 1000, a pixel region 4 is formed in a region where the first substrate 1 and the counter substrate 2 face each other. In FIG. 6, wirings and terminals necessary for the liquid crystal display device 1000 to function as a liquid crystal display device are omitted.

FIG. 7 and FIG. 8 are enlarged plan views showing the periphery of the driver IC 3 of the liquid crystal display device 1000 shown in FIG. A device 1004 shown in FIG. 7 shows a state where the counter substrate 2 is removed, and a device 1004 ′ shown in FIG. 8 shows a state where the driver IC is further removed. In the figure, the edge 2 of the opposite substrate 2 and the area on the first board on which the driver IC is to be loaded (that is, the driver IC loading area) 3 ′ are indicated by dotted lines.

In liquid crystal display device 1000, liquid crystal is filled in the space between first substrate 1 and counter substrate 2, so that liquid crystal does not leak by seal 7 shown in FIGS. 7 and 8. Is sealed.

In the pixel region 4, S gate electrodes from the scan driving circuit (gate driver) 5 monolithically formed on the first substrate 1 and RGB monolithically formed on the first substrate 1 M x 3 source electrodes from switch circuit 6, and each of SX m x 3 pixels has TFT, gate bus line (scanning wiring) and source nose line (signal wiring). Is provided.

[0015] The driving method using the RGB switch circuit is sometimes called a selector method or SSD (Source Shared Driving). A circuit according to this driving method is a circuit that distributes a signal supplied from an external cover to a plurality of signal lines in a time division manner. Here, how to distribute external signals is within the discretion of a person skilled in the art to determine in consideration of device specifications. Therefore, the number of signal lines shared by one external signal is not limited to three, and the colors controlled by the signal lines to which the signals are distributed are not limited to Red, Green, and Blue. In this specification, such a circuit is called an RGB switch circuit for convenience.

[0016] As shown in FIG. 7, m lead wires consisting of 100 (l) to 100 (m) 100 forces dry It is formed on the first substrate 1 from the IC 3 to the RGB switch circuit 6. Further, as shown in FIG. 8, a control circuit (not shown) for supplying various signals to the m connecting terminals 200 connected to the m output terminals (not shown) of the driver IC3 and the driver IC3. The external connection terminal 8 is formed on the first substrate 1.

[0017] The driver IC3 is divided into a first output terminal group a that also has the first to eleventh output terminal forces and a second output terminal group b that is the (n + 1) to m # th output terminal groups. It has m output terminals.

The connection terminal 200 is provided on the first substrate 1 so as to be connectable to the output terminal, and the routing wiring 100 is connected to the connection terminal 200. Therefore, as shown in FIG. 7, the routing wiring 100 includes first routing wiring groups 100a and (n + 1) to 111 consisting of l to nth routing wirings (100 (1) to 100 (11)). The second routing wiring (100 (n + 1) to: LOO (m)) is divided into the second routing wiring group 100b, and the connection terminal 200 is 1 to!, As shown in FIG. ! 1st connection terminal group 200a (200 (1) to 200 (n)) force and (n + 1) to m # connection terminal (200 (n + 1) to 200 (m)) force Into a second connection terminal group 200b.

[0019] The routing wiring 100 is arranged at a predetermined interval (pitch) on the RGB switch circuit 6 side. On the side of the force driver IC3, the first routing wiring group 100a and the second routing wiring group 100b are separated from each other. Yes.

In the device 1004 shown in FIG. 7 and the device 1004 ′ shown in FIG. 8, the scan driving circuit 5 is monolithically formed on the first substrate 1, and S gate buses are formed at a predetermined timing. The line is controlled so that pixels can be written row by row. In the drawing, wirings and terminals for supplying signals to the scanning drive circuit 5 are omitted.

The signal drive circuit is composed of an RGB switch circuit 6 monolithically formed on the first substrate 1 and an external driver IC 3. The RGB switch circuit 6 distributes the RGB data signals sequentially supplied from the driver IC 3 through the routing wiring 100 to m source bus lines for each of R, G, and B at a predetermined timing.

In the liquid crystal display device having the configuration as shown in FIG. 6, since there is one driver IC mounted on one device, the number of driver IC mounting processes is large (that is, discharge is received). Device destruction due to the large number of chances), and the device destruction due to static electricity should occur in the first routing wiring (100 (1)) and the mth routing wiring (100 (m)). Many should occur.

[0023] The present inventor conducted a withstand voltage experiment on the device 1004 having the configuration shown in FIG. Degree of withstand voltage at the examined parts A, B and C (A: Leading wiring 100 (n) or 100 (n + l), B: Leading wiring 100 (1) or 100 (m), C: Other routing wiring) Was predicted to be B <CA.

[0024] Further, in a strict comparison, the degree of density of the electrode pattern in the vicinity of the part B (the routing wiring 100 (1) or 100 (m)) and the part A (the routing wiring 100 (n) or 100 0) Since the density of the electrode pattern in the vicinity of (n + 1)) is slightly similar, it was considered that the element breakdown of the part B was almost the same as that of the part A.

[0025] However, contrary to expectations, A <B <C, and it was found that A was the most vulnerable to static electricity. In particular, the level of withstand voltage before mounting the driver IC was low. Such a result that A is remarkably susceptible to element destruction could not be expected at all from the technical level in the field (for example, the techniques described in Patent Documents 1 to 4, etc.).

[0026] The present invention has been made in view of the above-described problems, and its purpose is to prevent electrostatic breakdown that has conventionally been difficult to predict that may occur in a device substrate on which a driver IC having a specific output form is mounted. There is to do.

Disclosure of the invention

[0027] A device according to the present invention has a first substrate on which a driver IC is mounted,

A plurality of connection terminals divided into a plurality of connection terminal groups are formed in an area on the first substrate on which the driver IC is to be loaded, and each connection terminal group is connected to another adjacent connection terminal. Separated from the group,

Each connection terminal force has a lead wiring formed on the first substrate, and at least one separated part, two bows of two connection terminal forces adjacent to each other. Wiring lines are arranged to meet each other,

Position where the two routing wires meet from the position of the two adjacent connection terminals The first dummy electrode is disposed in the region on the first substrate up to the mounting position, and the driver IC includes a plurality of output terminals divided into a plurality of output terminal groups. Are separated from other adjacent output terminal groups, and at least two connection terminal groups adjacent to each other on the first substrate, and outputs corresponding to the two connection terminal groups. It is characterized by being mounted on the first board so as to connect the terminal group.

[0028] Outputs (output terminals) are divided into a plurality of groups and separated in a single driver IC, and each output group corresponds to a group of connection terminals on the board. It was found that electrostatic discharge occurs in a forceful part that has not been known in the past in a device board that is connected over a plurality of connection terminal groups and is used for device control. If the above configuration is adopted in such a device substrate, the dummy electrode receives the electrostatic discharge in place of the routing wiring of the portion, and as a result, it is possible to prevent destruction of circuits and elements provided in the display area. it can. Moreover, according to the said structure, the device substrate for liquid crystal display devices with little risk of electrostatic destruction can be manufactured.

[0029] In the device according to the present invention, the first dummy electrode is preferably connected to a ground electrode!

[0030] According to the configuration described above, it is possible to avoid the increase in the capacitive load caused by the connection with the regular electrode and the drive failure of the electrode due to the capacitive load.

[0031] The device according to the present invention is preferably disposed adjacent to the lead-out wiring from the connection terminal corresponding to the end output terminal in the second dummy electrode and the third dummy electrode force driver IC. .

[0032] According to the above configuration, it is possible to sufficiently avoid conventionally known electrostatic breakdown.

[0033] In the device according to the present invention, it is preferable that the second dummy electrode and the third dummy electrode are connected to a ground electrode.

[0034] According to the above configuration, it is possible to avoid the increase in the capacitive load caused by the connection with the conventional regular electrode and the drive failure of the electrode due to the capacitive load.

In the device according to the present invention, an RGB switch circuit is further provided on the first substrate, and the RGB switch circuit and the connection terminal are connected to each other through the routing wiring. It is preferable that it is continued.

[0036] According to the above configuration, image defects caused by electrostatic breakdown can be more effectively prevented by combining with the dummy pixel method.

[0037] In the device according to the present invention, it is preferable that a plurality of the driver ICs are stacked.

[0038] According to the above configuration, a plurality of functions of each driver IC can be combined and output.

[0039] The device according to the present invention is preferably formed by bonding the substrate to a counter substrate.

[0040] In the device according to the present invention, a spacer is preferably provided between the substrate and the counter substrate.

[0041] According to the above configuration, the liquid crystal can be held in the device according to the present invention.

[0042] In the device according to the present invention, it is preferable that the driver IC is mounted in a region not facing the counter substrate.

The routing wiring exposed without being covered by the counter substrate is likely to be discharged. Nevertheless, according to the above configuration, the dummy electrode is received in place of the lead-out wiring of the part, and as a result, it is possible to prevent the circuit and the element provided in the display area from being destroyed.

[0044] A liquid crystal display device according to the present invention includes the above-described device.

[0045] According to the above configuration, it is possible to manufacture a liquid crystal display device with less risk of electrostatic breakdown.

[0046] Still other objects, features, and advantages of the present invention will be sufficiently enhanced by the following description. The benefits of the present invention will become apparent from the following description with reference to the accompanying drawings.

Brief Description of Drawings

FIG. 1, showing an embodiment of the present invention, is a plan view showing a configuration of a main part of a driver IC mounting area on the first substrate and its periphery.

FIG. 2 illustrates an embodiment of the present invention, in which a driver IC is mounted on a first substrate It is a top view which shows the principal part structure of an area | region and its periphery.

FIG. 3 is a plan view showing a configuration of a main part of a driver IC mounting area on the first substrate and its periphery, showing an embodiment of the present invention.

FIG. 4 is a plan view showing the configuration of the main part of the driver IC mounting area on the first substrate and its periphery, showing an embodiment of the present invention.

FIG. 5 is a plan view showing a configuration of a main part of a driver IC mounting area on the first substrate and its periphery, showing an embodiment of the present invention.

FIG. 6 is a perspective view schematically showing a configuration of a liquid crystal display device having a three-side free outer shape in which a driver IC is mounted on only one side.

FIG. 7 is an enlarged plan view showing the periphery of the driver IC of the liquid crystal display device shown in FIG.

FIG. 8 is an enlarged plan view showing the periphery of the driver IC mounting area on the first substrate of the liquid crystal display device shown in FIG.

Explanation of symbols

1 substrate (first substrate)

2 Counter substrate

2, Edge of counter substrate

3 Driver IC

3, Driver IC loading area

4 pixel area

5 Scan driver circuit

6 RGB switch circuit

7 Seal

8 External connection terminal

9 Dummy electrode (1st electrode, 1 electrode)

9a Dummy electrode (first dummy electrode)

9a 'dummy electrode (first dummy electrode)

9a "dummy electrode (first dummy-electrode) 9b Second dummy electrode

9c Third dummy electrode

10 Position where two routing lines meet (meeting part)

11 Ground electrode (earth)

100 Lead wiring

100a First routing wiring group

100b Second routing wiring group

100 (1) First routing wiring

100 (n) nth routing wire

100 (n + 1) (n + 1) th routing

100 (m) mth routing

200 connection terminals

200a First connection terminal group

200b Second connection terminal group

200 (1) First connection terminal

200 (n) nth connection terminal

200 (n + 1) (n + 1) th connection terminal

200 (m) mth connection terminal

1000 LCD device

1001 device (device board)

BEST MODE FOR CARRYING OUT THE INVENTION

[0049] One embodiment of the present invention is described below with reference to Figs.

1 to 5 are enlarged plan views showing the periphery of the driver IC 3 of the liquid crystal display device in which the driver IC is mounted on only one side having the same configuration as that of FIG. Figures 1 to 5 show the state in which the counter substrate 2 and driver IC3 are removed (device 1001). In the figure, the edge 2 of the counter substrate 2 and the driver IC mounting area 3 are indicated by dotted lines.

[0051] As shown in FIG. 1, m routing wires of 100 (l) to 100 (m) 100 force driver From the IC mounting area 3, toward the RGB switch circuit 6, onto the first substrate 1 Formed, M connection terminals 200 connected to m output terminals (not shown) of driver IC3 and external connection terminals connected to a control circuit (not shown) for supplying various signals to driver IC3 8 is formed on the first substrate 1.

[0052] The driver IC3 is divided into a first output terminal group a that also has the first to eleventh output terminal forces and a second output terminal group b that is the (n + 1) to m # th output terminal groups. It has m output terminals. The connection terminal 200 is provided on the first substrate 1 so as to be connectable to the output terminal, and the lead wiring 100 is connected to the connection terminal 200. Therefore, the routing wiring 100 includes the first routing wiring group 100a and the (n + 1) to m-th routing wiring (100 (n + 1), which have l to nth routing wiring (100 (1) to 100 (n)) forces. ) To 100 (m)) The second routing wiring group 100b is also divided into force, and the connection terminal 200 is connected to the first to nth connection terminals (200 (1) to 200 (n)) force. It is divided into a first connection terminal group 200a and a second connection terminal group 200b of (n + 1) to m # th connection terminals (200 (n + 1) to 200 (m)).

[0053] The routing wires 100 are aligned at a predetermined interval (for example, about several tens of μm) on the RGB switch circuit 6 side, and the first routing wiring group 100a and the second routing wiring group are arranged on the driver IC3 side. 100b is separated by several hundreds / zm to several mm.

[0054] If the wiring lengths of two adjacent routing wires (100 (n) and 100 (n + 1)) differ greatly, they will be reflected on the screen display. It is preferable to use equidistant wiring. To make two adjacent routing wires equidistant, the (n + 1) th routing wire (100) compared to the nth routing wire (100 (n)), as shown in Figs. (n + 1)) bends many times and meets to form the meeting part 10 as shown in FIGS.

As shown in FIG. 1, the device 1001 according to the present embodiment has a position where the routing wiring (100 (n)) and the routing wiring (100 (n + 1)) meet from the driver IC stacking region 3 ′ ( That is, the dummy electrode 9 is provided on the first substrate 1 so as to extend along the routing wiring (100 (n)) and the routing wiring (100 (n + 1)) up to the routing wiring meeting portion) 10. .

[0056] In consideration of the fact that the discharge is easily applied to the routing wiring that is exposed without being covered by the counter substrate, the dummy electrode 9 includes the routing wiring (100 (n)) and the routing wiring (100 (n + 1)). ) And from the driver IC area 3 'to the opposite substrate edge 2', preferably shown in Figure 1 Thus, it is necessary to form the wiring up to the meeting portion 10 of the routing wiring (100 (n)) and the routing wiring (100 (n + 1)).

[0057] By arranging the dummy electrode 9 in such a part, in the device 1001 according to the present embodiment, the dummy electrode 9 is generated in the separation portion (between 100 (n) and 100 (n + 1)) of the routing wiring 100. Electrostatic breakdown can be prevented.

In addition, the dummy electrode 9 may be formed of a conductive thin film material that constitutes the wiring on the first substrate. Thereby, the manufacturing cost accompanying formation of a dummy electrode can be reduced.

In FIG. 1, a line having the same width and length as the lead wiring is shown as the dummy electrode, but a shape spreading in a planar shape may be used as the dummy electrode. As a result, the discharge generated before the driver IC is loaded is received by the dummy electrode 9 where the routing wiring 100 (n) and the routing wiring 100 (n + 1) do not receive, and as a result, the elements of the RGB switch circuit 6 Destruction can be prevented.

In the present embodiment, the dummy electrode 9 may be floating as shown in FIG. 1. However, the purpose is to prevent element destruction due to discharge that may occur in a process after the driver IC is mounted. As described above, it is preferable to ground the dummy electrode. As shown in FIG. 2, the ground can be easily realized by connecting the dummy electrode 9 to the ground electrode 11 formed in advance in the driver IC mounting area 3 on the first substrate 1.

When the dummy electrode is connected to the regular electrode as described in Patent Document 2, in the manufactured liquid crystal display device, the capacitive load is increased by the counter electrode, and the regular electrode is driven. A malfunction will occur. However, according to the present embodiment, it is possible to avoid an increase in capacitive load and electrode drive failure due to the capacitive load.

As described above, the dummy electrode is a force that needs to be formed from the driver IC region 3 ′ to the edge 2 ′ of the counter substrate. In the region from the driver IC region 3 ′ to the meeting part 10 Only need not be formed. It can be said that the portion where the dummy electrode is disposed should include at least the region on the first substrate from the position of the two adjacent connection terminals to the position where the two routing wirings meet. Therefore, if there is a margin in the layout, dummy electrodes may be inserted to a position closer to the screen than the position shown in Fig. 1 (see Fig. 3). The form of the dummy electrode 9 may be a form in which a plurality of dummy electrodes are inserted. (See Figure 4).

Furthermore, in the device according to the present embodiment, it is preferable that the second dummy electrode 9b and the third dummy electrode 9c are arranged adjacent to the routing wirings 100 (1) and 100 (m). More preferably, the second dummy electrode 9b and the third dummy electrode 9c are connected to the ground electrode 11! (See FIG. 5).

[0064] As a result, the electrostatic breakdown that occurs in the routing wirings 100 (1) and 100 (m), which is not only the electrostatic breakdown that occurs in the routing wirings 100 (n) and 100 (n + 1), can be suppressed. As a result, the yield of the device substrate can be improved so much.

Conventionally, in a COG mounting type liquid crystal display device in which a plurality of driver ICs are mounted, a dummy electrode force may be placed near a position where two lead wirings having separated starting points meet. is there.

[0066] This is intended to make the height of the components near the meeting portion (that is, on the substrate directly under the seal) uniform, and to make the thickness of the liquid crystal layer uniform, or between different driver ICs. The purpose of this is to prevent the electric discharge from reaching the regular wiring and electrodes.

That is, in the conventional configuration, dummy electrodes are arranged in a triangular empty area where there is no routing wiring group of one driver IC and no routing wiring group of the other driver IC.

[0068] Accordingly, the area covered by the counter substrate is the position of the nth output terminal and the (n + 1) th output terminal of the single driver IC (that is, the nth connection terminal and the nth connection terminal). In addition, a configuration in which a dummy electrode is arranged along each routing wiring from the (n + 1) th connection terminal) has not been disclosed so far. Also, it is known that there is a unique electrostatic breakdown mode associated with the output terminal being split in the driver IC.

[0069] As described above, the device (device board) according to the present invention is a device board on which a driver IC having an output terminal for controlling m wirings is mounted on the board. Output terminal force ^ ~ divided into nth terminal group and (n + 1) ~ m # th terminal group, and both terminal groups are separated, and on the board where driver IC is loaded M terminals and m routing wires are formed, and the routing wiring from the nth terminal and the routing wiring of the (n + 1) th terminal force meet in a predetermined area on the substrate. Arrangement From the position of the nth and (n + 1) th terminals, the nth routing wire and the (n + 1) th routing A dummy electrode is arranged in an area on the substrate up to the position where the wiring meets.

[0070] In addition, the device (device substrate) according to the present invention is provided with a terminal on which a driver IC is mounted in a region on one substrate and not facing the other substrate, while a set of substrates are bonded together. A device board on which a driver IC having an output terminal that controls m wirings is mounted on the other board, and m output terminals 1 to 11 in the driver IC. The first terminal group and the (n + 1) to m # th terminal groups are separated from each other, and there are m terminals and m on one board on which the driver IC is mounted. In the device substrate in which the routing wiring of the book is formed and arranged so that the routing wiring of the nth terminal force and the routing wiring of the (n + 1) th terminal force meet in a predetermined region on one substrate , While the nth terminal is formed on the substrate Place the dummy in the area from the (n + 1) th terminal position to the intersection between the (n + 1) th terminal and the other board edge. The electrode is disposed and is characterized by the following.

In the device according to the present invention, the RGB switch circuit 6 is further provided on the first substrate 1, and the RGB switch circuit 6 and the connection terminal 200 are connected via the routing wiring 100. The device 1001 having the configuration has been described above, but by adopting this configuration, the device according to the present invention is more effective in reducing image defects caused by electrostatic breakdown by combining with the dummy pixel method. Can be prevented.

[0072] In the device 1001 according to an embodiment of the present invention, the output function from the driver IC3 is different between the 1st to 11th and the (n + 1) th to 111th! ,. Examples of such a configuration include a configuration in which the first to nth outputs are data signals and the (n + 1) th to mth outputs are scanning signals.

[0073] In another embodiment of the device according to the present invention, a signal drive circuit may be configured without the RGB switch circuit 6. For example, the monolithic RGB switch circuit 6 is not arranged, and the R, G, B data signals are output directly from the driver IC 3. It is applicable even if it is made. In this case, it is possible to prevent the switching element included in the pixel from being destroyed and abnormal lighting from being caused by the destruction of the switch circuit.

Furthermore, although the device according to the present invention has been described using the device 1001 having a configuration in which one driver IC 3 is provided on the first substrate 1, a plurality of driver ICs may be stacked.

[0075] Still further, the device according to the present invention has been described using the device 1001 having a configuration in which the driver IC 3 is stacked in the region 3 'on the first substrate 1 that does not face the counter substrate 2. However, the driver IC stacking region 3 ′ may be provided between the first substrate 1 and the counter substrate 2 depending on the size of the counter substrate 2 as long as it is an area outside the seal 7.

The form to which the present invention can be applied may be a device substrate such as a flat panel detector as well as a flat display device such as a liquid crystal display device or an EL display device. Further, in this specification, the force switching element in which the details of the pixel region are omitted may be a TFT or a thin film diode such as a MIM element! / ヽ.

As described above, the device according to the present invention includes at least a driver IC, the driver IC has a plurality of output terminal groups, and a plurality of outputs are provided in a single driver IC. It can be said that the output group is divided and separated from each other and each output group is used for controlling the device. That is, it should be noted that a device having a substrate having a shape different from that of the present embodiment is also included in the technical scope of the present invention.

That is, an object of the present invention is to prevent element breakdown (electrostatic breakdown) that has been difficult to predict in the past in a device in which a dry IC having output terminals divided into a plurality of groups is mounted on a substrate. The technology is to provide a device having a substrate in which a dummy electrode of a specific form is provided in a specific part, and it depends on the material and shape of each member specifically described in this specification. Well then!

[0079] It should be noted that the specific embodiments or examples made in the section of the best mode for carrying out the invention are merely to clarify the technical contents of the present invention. Various modifications can be made within the spirit of the present invention and the following claims, which should not be construed as narrowly limited to only examples. [0080] In addition, all the academic literatures and patent literatures described in this specification are incorporated herein by reference in their entirety.

Industrial applicability

According to the present invention, it is possible to prevent electrostatic breakdown that has been difficult to predict in the past in a liquid crystal display device in which a driver IC having output terminals divided into a plurality of groups is mounted on a main substrate.

The device according to the present invention can be applied to a liquid crystal display device, and is particularly preferably applied to a liquid crystal display device having a substrate on which a driver IC having output terminals divided into a plurality of groups is mounted.

Claims

The scope of the claims

[1] A device having a first substrate on which a driver IC is mounted,

The first dummy electrode is arranged in the region on the first substrate from the position of the two adjacent connection terminals to the position where the two routing wirings meet.

The driver IC includes a plurality of output terminals divided into a plurality of output terminal groups, each output terminal group being separated from another adjacent output terminal group, and the driver IC on the first substrate. It is characterized in that it is mounted on the first board so as to connect at least two connection terminal groups adjacent to each other and an output terminal group corresponding to the two connection terminal groups. device.

[2] The device according to [1], wherein the first dummy electrode is connected to a ground electrode.

[3] Claims characterized in that the second dummy electrode and the third dummy electrode are arranged adjacent to the lead wiring of the connection terminal force corresponding to the end output terminal in the driver IC. The device according to 1.

[4] The device according to claim 3, wherein the second dummy electrode and the third dummy electrode are connected to a ground electrode.

[5] The RGB switch circuit is further provided on the first substrate, and the RGB switch circuit and the connection terminal are connected via the routing wiring. Devices.

6. The device according to claim 1, wherein a plurality of the driver ICs are stacked.

7. The device according to claim 1, wherein the substrate is bonded to a counter substrate. Su.

8. The device according to claim 7, wherein a spacer is provided between the substrate and the counter substrate.

9. The device according to claim 7, wherein the driver IC is mounted in a region that does not face the counter substrate.

[10] A liquid crystal display device comprising the device according to claim 1.