WO2006133429A3 - Ensemble de refroidissement haute performance pour composants electroniques - Google Patents

Ensemble de refroidissement haute performance pour composants electroniques Download PDF

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Publication number
WO2006133429A3
WO2006133429A3 PCT/US2006/022602 US2006022602W WO2006133429A3 WO 2006133429 A3 WO2006133429 A3 WO 2006133429A3 US 2006022602 W US2006022602 W US 2006022602W WO 2006133429 A3 WO2006133429 A3 WO 2006133429A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronics
container
high performance
liquid
performance cooling
Prior art date
Application number
PCT/US2006/022602
Other languages
English (en)
Other versions
WO2006133429A2 (fr
Inventor
Jack Phillip Hall
Original Assignee
Jack Phillip Hall
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jack Phillip Hall filed Critical Jack Phillip Hall
Publication of WO2006133429A2 publication Critical patent/WO2006133429A2/fr
Publication of WO2006133429A3 publication Critical patent/WO2006133429A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Cette invention concerne un ensemble conçu pour permettre le refroidissement haute performance de composants électroniques, lequel ensemble comprend un contenant pour un liquide de transfert thermique dans lequel des ensembles de composants électroniques complexes sont immergés. Les composants électroniques sont scellés à l'intérieur du contenant de liquide de telle sorte qu'un connecteur électrique soit en saillie à l'extérieur du contenant. Une plaque thermoconductrice est associée à l'ensemble contenant rempli de liquide de telle sorte qu'une partie de la plaque entre en contact avec le liquide et une partie de la plaque soit en saillie à l'extérieur du contenant ou qu'elle face partie intégrante de ce contenant.
PCT/US2006/022602 2005-06-08 2006-06-08 Ensemble de refroidissement haute performance pour composants electroniques WO2006133429A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68864105P 2005-06-08 2005-06-08
US60/688,641 2005-06-08

Publications (2)

Publication Number Publication Date
WO2006133429A2 WO2006133429A2 (fr) 2006-12-14
WO2006133429A3 true WO2006133429A3 (fr) 2007-02-01

Family

ID=37499161

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/022602 WO2006133429A2 (fr) 2005-06-08 2006-06-08 Ensemble de refroidissement haute performance pour composants electroniques

Country Status (2)

Country Link
US (1) US20070034360A1 (fr)
WO (1) WO2006133429A2 (fr)

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Also Published As

Publication number Publication date
WO2006133429A2 (fr) 2006-12-14
US20070034360A1 (en) 2007-02-15

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