WO2006102846A1 - Couplage de lumiere tres efficace d'une source de lumiere a l'etat solide en un guide d'ondes/une fibre optique maintenant l'etendue - Google Patents

Couplage de lumiere tres efficace d'une source de lumiere a l'etat solide en un guide d'ondes/une fibre optique maintenant l'etendue Download PDF

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Publication number
WO2006102846A1
WO2006102846A1 PCT/CN2006/000552 CN2006000552W WO2006102846A1 WO 2006102846 A1 WO2006102846 A1 WO 2006102846A1 CN 2006000552 W CN2006000552 W CN 2006000552W WO 2006102846 A1 WO2006102846 A1 WO 2006102846A1
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WIPO (PCT)
Prior art keywords
light
fiber
optic
fiber bundle
array
Prior art date
Application number
PCT/CN2006/000552
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English (en)
Inventor
Yi Li
Li Xu
Original Assignee
Yi Li
Li Xu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yi Li, Li Xu filed Critical Yi Li
Publication of WO2006102846A1 publication Critical patent/WO2006102846A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4298—Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Definitions

  • This patent application relates to lighting devices, systems, and techniques.
  • One of the most import applications for light sources is to provide high brightness and high power output at the same time.
  • the light source for image projection such as a rear projection TV (RPTV) or front projector.
  • RPTV rear projection TV
  • the headlights or illumination lights for transportation vehicles such as automobiles, motorcycles, boats and airplanes.
  • arc lamps such as high-pressure mercury lamps, Xenon lamps or metal halide lamps.
  • many arc lamps exhibit certain technical limitations in applications, e.g., relatively short lifetimes, difficulty in control and maintenance of the light color, instablility.especially when operating in the pulsed mode.
  • the light coupling from the light source coupling into optical fiber or waveguide is required.
  • the coupling from the arc lamp into fiber can becostly, bulky, inefficient and unstable due to, e.g., the change of discharge arc itself from time to time.
  • the arc lamp also potentially interferes with other components in the system.
  • Solid state light sources especially light-emitting diodes (LEDs) exhibit the longer lifetimes, lower power consumption, manageable wavelengths and other benefits in comparison with the above and other traditional light sources.
  • LEDs light-emitting diodes
  • LED light sources increasingly, become the alternative or even preferred choice of light sources for a variety of applications.
  • LED perfo ⁇ nance parameters that need to be improved so that LEDs can further broaden their applications.
  • the LED light sources can offer two potential solutions for high brightness and high power applications.
  • the performance of an individual LED chip may be improved by increasing the chip dimension and improving it's the LED chip quality.
  • this approach is limited by the total output of one individual chip and many, currently available LED chips are limited in their output in tens of lumens in the visible wavelength region.
  • LEDs with high brightness and high power output are packaged many LED chips together in an array structure to obtain high total output, e.g., up to hundreds even thousands lumens in some LED array chips in existence today.
  • the brightness of light directly from LED array is significantly lower than that of a single LED since the array brightness is limited by the relatively low package density of LEDs in the array.
  • the major challenge of high-density LED packaging is the thermal management of the high power operation of LEDs since the LEDs interferes each other thermally when located too close to each other on a common chip.
  • many existing LED light sources are not suitable for applications demanding high brightness and high power at the same time, and traditional light sources such as high pressure mercury lamp or metal halide lamp are still the choice for such applications.
  • a device is described to include a solid-state light source to emit light; an optic fiber having an optic etendue smaller than or equal to an optic etendue of the light source; and a light collecting assembly engaged between the light source and the optic fiber and operable to collect and couple the emitted light into the optic fiber.
  • the light collecting assembly is formed of a material having a refractive index between refractive indices of the light source and the optic fiber.
  • a LED or multiple LEDs may be packaged into one single light output that offers the best combination of small etendue, high brightness, large flux, stability and reliability that is allowed by principles of optics.
  • the designs and techniques described here may be used to provide one single light output with low loss of brightness and flux from one or multiple light emitting devices by optically coupling of one or multiple light emitting devices such as LED(s) into single or multiple fiber or waveguide.
  • This high brightness light system includes light-emitting device such as but not limited to LED chip, LED chip mount assembly, light collecting and collimation assembly, structure integration assembly and optical waveguide or fiber.
  • the high brightness and high power light system includes multiple high brightness devices mentioned above and the fiber combiner which combines the multiple light output into single one with little loss in brightness and power.
  • the described designs and techniques may be used to provide a low cost, high efficient and brightness maintaining light source with easy beam delivering that can be mass produced by means of micro-replication or injection molding and standard fiber coupling.
  • the etendue of light emitting device and the etendue of the normal surface of fiber should be closely matched so that the brightness of light can be maintained.
  • the size and geometry of light emitting device are significantly different from fiber: rectangular vs. circular in most cases.
  • a light collecting and collimating assembly is required. One side of this assembly is attached to the light emitting device directly through index match epoxy or gel. Other side of the assembly is bonded directly to the etendue matched fiber or waveguide mentioned above or bonded through index match material such as epoxy or gel. Most of the light will be confined inside the assembly through reflection of high reflection surface coating or total internal reflection.
  • This assembly can be a solid transparent material on the wavelength of the light from light emitting device.
  • LED chip mount assembly can be provided for heat dissipation, electric wiring/contact and even electronics.
  • an integrating assembly can be used to structurally hold all above components together. The separation between adjacent LED chips can be kept sufficiently large to avoid thermal interaction between adjacent LED chips.
  • one single light output can be achieved by integrating the single light emitting device fiber output mentioned above together through the fiber combiner to combine output beams from different light emitting devices.
  • the individual light emitting devices can be separate so that they are thermally independent to each other.
  • the combiner can be a simple fiber bundle by directly packing the fiber together.
  • the output surface is a polished surface of condensed packed fibers. Due to the finite size of cladding layer of fiber, the etendue of the total output from fiber bundle increases comparing to the sum of each individual fiber output. To overcome this, the present invention suggests using fiber core bundle by removing individual fiber's cladding layer.
  • the lights propagating in each fiber from different LED is coupled to adjacent fibers since the cladding layers are removed.
  • optically transparent material with matched index of refraction can be used to fill the gaps among the fiber core.
  • An alternative method to achieve the similar result is to fuse all these fiber cores or fibers together so that no gaps exist.
  • the shape of the output fiber bundle, core bundle or fused core bundle can be shaped to the desired geometry such as but not limited to rectangular, triangle, oval, etc.
  • an optical component such as but not limited to solid compound parabolic concentrator (CPC) using an optical material that is optically transparent and index matching to fiber core can be used to increase intensity at output surface of single fiber or fiber core bundle by directly contacting fiber core to the lager aperture side of the CPC.
  • CPC solid compound parabolic concentrator
  • One implementation of the described designs and techniques provides coupling one light emitting device into the multiple fibers or waveguides through a coupling assembly that maintains the brightness with high coupling efficiency.
  • the etendue of light emitting device and the etendue of the normal surface of multiple fibers should be closely matched so that the brightness of light can be maintained.
  • One side of this coupling assembly is attached to the light emitting device directly through index match epoxy or gel.
  • Other side of the assembly is bonded directly to the etendue matched fiber bundle or its variations such as bundled fiber core, bundled fiber core filled with index matching epoxy or fused fiber cores that is mentioned above.
  • Most of the light will be confined inside the coupling assembly through reflection of high reflection surface coating or total internal reflection.
  • the material can be selected to have an optimized index of refraction which is between the index of the light emitting device and the index of the fiber or waveguide.
  • This coupling assembly can be a solid transparent material on the wavelength of the light from light emitting device.
  • LED chip mount assembly can be used for heat dissipation, electric wiring/contacts and even electronics.
  • it can be fiber bundle with cladding or its variations such as bundled fiber core, bundled fiber core filled with index matching epoxy or fused fiber cores fiber core bundle.
  • the multiple fiber bundles or it variations can be further combined through putting all these bundles together repeatedly through simple fiber bundle with claddings or its variations such as bundled fiber core, bundled fiber core filled with index matching epoxy or fused fiber cores.
  • FIG. 1 is a longitudinal section schematic view of the apparatus of a light emitting device coupled into an optic fiber
  • FIG. 2 is a longitudinal section schematic view of an alternate embodiment of the invention shown in with supporting structure
  • FIG. 3 is a longitudinal section schematic view of another alternate embodiment of the invention shown in with integrating structure where the light is collected by high reflective surface
  • FIG. 4 is a longitudinal section diagram of the apparatus of multiple light emitting devices coupled into multiple optic fiber
  • FIG. 5 is a longitudinal section diagram of an alternate embodiment of the apparatus of multiple light emitting devices coupled into multiple optic fiber with cooling tunnel
  • FIG. 6 The schematic of the light source with multiple light emitting devices
  • FIG. 7A is the cross section of densely packed optical fibers
  • FIG. 7B is the cross section of densely packed optical fiber cores
  • FIG. 8A is the cross section diagram of densely packed fiber cores with index matched transparent material filled in the gaps
  • FIG. 8B is the cross section diagram of fused fiber core bundle
  • FIG. 9 is a longitudinal section schematic view of an alternative embodiment of the invention showing the apparatus of a light emitting device coupled into multiple optic fibers
  • FIG. 10 is a schematic view of the light source shown in FIG. 9 with multiple light emitting devices
  • FIG. 11 is a longitudinal section schematic view of the light source with array of embodiment shown in FIG. 9
  • FIG. 12 is the schematic longitudinal section of waveguide bundle with low loss CPC to reduce the output aperture size and increase light intensity. Active material can be located at this high intensity area for light generation of different wavelengths.
  • FIG. 13 is the apparatus for light collimating or collection of the light generated from active material.
  • FIG 14 is the circuit schematics of LED light source
  • FIG. 15 is a schematic diagram of one embodiment of a projection system with single light modulator.
  • FIG. 16 is a schematic diagram of one embodiment of a projection system with multiple light modulators
  • FIG. 17 is a schematic diagram of one embodiment of headlights or illumination system for transportation vehicle.
  • Light emitting device such as LED chip
  • Fiber bundle 154 Input port of fiber bundle 154 205. Fiber bundle with claddings 210. Fiber core bundle 220. Fiber core bundle with index matching material 106 in the gap
  • the coupling assembly that collect and re-direct the light from one LED into multiple fibers or waveguides
  • the optical assembly that increase output light intensity from 154 by reducing the aperture size
  • Active material such as phosphor or quantum dots material
  • Optical filter that pass the light from the light emission devices but reflects the light generated by 262.
  • An optical assembly providing a light collection or collimated beam for the light generated from 262.
  • Light source with multiple light emitting devices such as
  • the driving circuit of LED arrays 310 The driving circuit of LED arrays 310. Signal feedback loop from light sensor 304 to driving circuit 308
  • the signal processor that receiving image signal, provide commands to light sources and micro-display devices
  • Optics assembly collecting and redirecting the light output from 154 into desired pattern
  • FIG. 1 illustrates an apparatus of a light emitting device coupled into an optic fiber.
  • the apparatus comprises a light emitting device such as LED 102, a base plate for light emitting device 100, lead wires for providing electric power to light emitting device 103, a light collecting assembly 104, an optic fiber 108, and index-matched and optically transparent material 106.
  • Light emitting device 102 is bonded to base plate 100.
  • Base Plate 100 serves as either anode or cathode to provide electric power to light emitting device 102 through electrical contact 105.
  • Lead wire 103 serving as cathode or anode, is connected to light emitting device 102 on one side. The other side of 103 is bonded to electrical contact 105.
  • Light emitting device 102 emits light when it is electrified by the current provided by base plate 100 and lead wire 103.
  • the light emitting device 102 directly converts electric energy into light energy, and, at the same, also generates heat energy.
  • Base plate 100 may be used as a primary source to dissipate the heat generated from light emitting device 102.
  • the base plate 100 may be a high thermal-conductive material to dissipate the generated heat, such as aluminum, copper, thermal conductive ceramics including alumina nitride.
  • the reflective property of base plate 100 should be considered.
  • a gold and silver plating can be applied to base plate 100.
  • base plate 100 can be made in array forms.
  • Index-matched media 106 can be used to efficiently reduce Fresnel loss occurring at joins with an air gap.
  • the index of index-matched media 106 should be closely matched to the index of optic fiber 108. The value of its index may range from 1.3 to 1.7 in some implementation.
  • Index-matched material can be made of an optic transparent material, such as optic plastic or glass.
  • a thermal curing or UV curing or thermal-UV combined curing adhesive can be chosen as the index-matched material 106 as well.
  • Light 162 emitted from light emitting device 102 can be directly coupled to optic fiber 108without the light collecting assembly 104.
  • Light collecting assembly 104 is designed to reduce or minimize the optical coupling loss and can be implemented in various configurations.
  • the surface shape has smooth curvature such as but not limited to compound parabolic.
  • Three examples of such configurations are : 1) a monolithic solid piece using index matched transparent material with polished surface; 2) a monolithic solid piece using index matched transparent material with polished surface and reflective coating such as silver, gold, or aluminum coating on the side surface; 3) a reflective cup, made of metal or plastic with the reflective coating such as silver, gold, or aluminum coating on the inner surface, while the cup is filled with index matched transparent material.
  • Light 162 is reflected by the reflective layer at the side surface of 104 (variations 2 and 3) or by the total internal reflection at the side surface of 104 (vairationl), and then coupled into optic fiber 108.
  • the light coupling assembly 104 is structured and designed to closely match the etendue of optic fiber 108 to the etendue of light emitting device 102 . This may be achieved by , e.g., selecting the suitable numerical aperture (NA) and core size of optic fiber 108 because the etendue for an optical device is the product of the numerical aperture and the aperture dimension or spot size of the optical device which is 108 or 102.
  • Optic fiber 108 can be made of optic glass such as quartz or optic plastics or polymer. Optic fiber 108 can have a cladding- surrounding core or simply just have core material without cladding.
  • the etendue of optic fiber 108 may be less than the etendue of light emitting device 102 to improve the brightness at the end surface of optic fiber 108. Since the light emission pattern of light emitting device 102 can be non-uniform and at certain emitting angle the radiation intensity is greater than at other angles, a smaller etendue optic fiber 108 can effectively collect the lights at the angle where the radiation intensity is greater. As a result, the brightness at the end surface of optic fiber 108 can be greater than the averaged brightness of light emitting device 102. The positions of optic fiber 108 and light collecting assembly 104 need to be adjusted to obtain the maximum light output of light emitting device 102 into optic fiber 108. In another embodiment illustrated in FIG.
  • a supporting structure 112 is bonded to base plate 100 with bonding material 114. Bonding material 114 adheres supporting structure 112 to base plate 100 and dissipates the heat from base plate 100 to supporting structure 112.
  • optic fiber 108 has a cladding layer 118 surrounding the core layer 116. As a result, optic fiber 108 can be in direct contact to supporting structure 112. To further hold optic fiber 108 more stable, additional adhesive can be applied between supporting structure 112 and 118.
  • a reflector connector 110 is inserted between light collecting assembly 104 and supporting structure 112 to hold light collecting assembly 104 with respect to supporting structure 112. The supporting structure 112 will serve as a register to light collecting assembly 104 and optic fiber 108. The out-diameters of light collecting assembly 104 and optic fiber 108 should match well to the inner-diameter of supporting structure 112. As a result, the assembly process of the whole package can be automated.
  • FIG. 3 shows another embodiment of the device illustrated in FIG. 2.
  • a reflector 120 can be made of metal or plastic with a high reflective surface 122 inside.
  • the high reflective surface 122 is shaped to reflect lights out of light emitting device 102 into optic fiber core 116.
  • the light emitting device 102 can be LED whose electrical connection is not through conducting wire but via a direct contact to the electrical contact 105 on the substrate.
  • the LED substrate is the printed circuit board with high heat dissipation or low thermal resistance.
  • the LED without wire-bonding is the thin-film type LED or OLED.
  • the registration step is constructed so that the end surface of 108 can be aligned to the end surface of 122.
  • Reflector 120 can be bonded to base plate 100 with a thermal-conductive material which facilitates the dissipation oflthe heat from base plate 100.
  • the reflector 120 functions as a light collecting assembly, a supporting structure, and a heat sink.
  • the reflector 120 may be designed part of the pre-assemble substrate PCB for volume production.
  • FIG. 4 shows another embodiment of the device illustrated in FIG. 3.
  • Multiple light emitting devices are bonded on base plate 100.
  • Reflector 120 has the corresponding number of multiple high-reflective surfaces 122 and optic fiber 108. Therefore an array of light emitting devices can be packaged with one reflector 120.
  • the spacing between two adjacent light emitting devices 102 can be large enough so that the heat generated from individual light emitting device 102 will effectively dissipate to base plate 100 and will not be transferred to the adjacent light emitting devices.
  • the packaging density of light emitting device should be small enough to avoid thermal interference.
  • FIG. 5 illustrates another embodiment of the device shown in FIG. 4.
  • a cavity or tunnel 124 is inserted in reflector body 120 between two reflective surfaces 122.
  • Tunnel 124 can be applied with a forced cooling flow such as air or a coolant.
  • a forced cooling flow such as air or a coolant.
  • FIG. 6 illustrates another embodiment of a light coupling device for coupling light from different LEDs.
  • the output end of multiple optic fibers 108 are closed packaged together into a fiber bundle 154 and to direct the light to the output port 170.
  • the various configurations of the output port 170 of fiber bundle 154 are illustrated in FIG. 7A, 7B, 8A, and 8B.
  • FIG. 7A shows a cross section of densely packed optical fibers 108 with core 116 and cladding layer 118.
  • FIG. 7B shows the cross section of densely packed optical fiber bundle 210. Within the bundle 210, cladding layers of optic fiber 108 are removed to reduce the size of the fiber bundle.
  • the shape of output port 210 can be any shape such as circle, rectangular, etc. FIG.
  • FIG. 8A shows the cross section diagram of densely packed fiber bundle 220.
  • fiber bundle 220 Within fiber bundle 220, cladding layers of optic fiber 108 are removed and index matched transparent material 106 are filled in the gaps among fiber cores 116. As a result the lights can transverse from one fiber to other fibers.
  • the output port of fiber bundle can function as a light integrator to provide a uniformed light output across the output surface.
  • shape of output port 230 can be any shape such as circle, rectangular, etc.
  • FIG. 8B shows the cross section diagram of fused fiber core bundle 230 by fusing multiple bare fiber cores 116 together. By fusing the fibers together, the fibers are maximum densely package together.
  • shape of output port 230 can be any shape such as circle, rectangular, etc.
  • FIG. 9 illustrates another embodiment of an LED device with one light emitting device coupled to multiple fibers or waveguides.
  • This device is similarly constructed as the devices described in FIG. 1, 2, 3, 4 and 5 except that the light is coupled into multiple fibers.
  • the coupling assembly 104 can be one of the coupling assemblies described in FIG. 1, 2, 3, 4 and 5. Coupling assembly 104 collects and re-directs the light into fiber bundle 154 through 171.
  • FIG. 10 is another embodiment for the light source which includes multiple devices described in FIG. 9. The fiber bundle from each LED is combined into a larger bundle. The output of this large bundle is in form of 170.
  • FIG. 11 is a longitudinal section schematic view of the light source with array of embodiment shown in FIG. 9.
  • FIG. 12 illustrates another example of a device.
  • the particular geometry of the light coupling assembly 260 is designed to further reduce the output aperture size.
  • the output port of fiber bundle 154 can be in a shape of spherical, aspherical and free form.
  • the material of the assembly 260 may be the same as fiber core or other optically transparent material with matched index of refraction as fiber core.
  • an active material 262 such as a phosphor and quantum dots can be filled in the output port 260.
  • the phosphor or quantum dots within output port 260 absorb the lights from the light emitting devices and emit lights in other wavelengths.
  • An optical filter 264 is place before the active material 262to transmit the light from light emission devices (e.g., blue or UV wavelength) and to reflect the light generated from active material 262. the filter 264 can prevent the generated light propagating back to the fiber and increase light generating efficiency.
  • light emission devices e.g., blue or UV wavelength
  • FIG. 13 is another embodiment.
  • An optic reflector 268 is attached to the active material 262.
  • Optic reflector 268 collects the lights generated from 262 and redirects the lights to a collimated beam or projected to a specified object.
  • FIG. 14 illustrates a light source assembly including one LED 102 or LED array 302 of multiple individual LEDs, light sensors 304 for monitoring lights emitted from LED 102 or LED array 302, and temperature sensor 306, electric driving circuit 308, and heat dissipation/cooling assembly 320.
  • the individual LED 102 is electrically connected in parallel or serial or parallel-serial configuration. When the separation among individual LED is large enough, the forced cooling is not required.
  • Light sensor 304 is placed inside the light source assembly to monitor the wavelength and intensity of the lights emitted from the LED. Multiple light sensors can be applied to monitor different wavelengths of lights emitted from LED array 302.
  • a typical light sensor can be silicon photodiodes with color filters such as Red, Green or Blue filter.
  • the photo diodes with color filters can monitor the light intensity of various color LED such Red, Green, or Blue LED.
  • the electrical driving circuit can adjust the input current to the corresponding color LEDs. Therefore the close-loop feed back system can adjust color temperature of the lights emitted from LED array.
  • Another function of the feed back system consisting of 302 and 310 is to maintain a constant light intensity of the emitted light.
  • electrical driving circuit 308 will increase the input current of 102 or 302 to compensate the light decrease.
  • Temperature sensor 306 is also placed on the LED base-plate, monitoring the temperature of the LED base-plate and providing driving circuit the feedback signal through the feed back loop 312. With the feedback, electrical deriving circuit 308 will change the setting of heat dissipation/cooling assembly 320. As a result, the temperature of 102 or 302 can be maintained as constant.
  • the electrical driving circuit can provide constant or pulsed electric output for specific applications.
  • FIG. 15 is a schematic view of a projection system using a LED light source.
  • the projection system can have three LED light sources 300 for Red, Green, and Blue. Lights emitted from 300 are directed to field lens 410 via fiber bundle 154. The flexibility of fiber bundle 154 offers an easy packaging layout for the projection system.
  • Dichoric cross-prism 420 directs the red, green, and blue light to light modulator 430.
  • Light modulator can be of a MEMS (micro electronic mechanical system) device (for example DLP from Texas Instrument) or liquid crystal device (LCD or LCoS). Signal process 400 will synchronize light source 300 and light modulator 430 through connect loop 406.
  • MEMS micro electronic mechanical system
  • LCD liquid crystal device
  • Signal process 400 will send the red image data to light modulator 430 when the red light source 300 is turned on and emitting red light.
  • signal process 400 will send the green and blue image data to light modulator 430 when the green and blue light source 300 is turned on and emitting green/blue light, respectively. If all red, green and blue light source 300 is turned on, a gray image data is sent to light modulator 430.
  • the feed back loop 402 and 404 can maintain the color and brightness stability and adjust the color temperature of projected images.
  • FIG. 16 is a schematic view of another projection system using a LED light source.
  • the projection system can have three LED light sources 300 for Red, Green, and Blue.
  • Lights emitted from 300 are directed to field lens 410 via fiber bundle 154.
  • the flexibility of fiber bundle 154 offers an easy packaging layout for the projection system.
  • Three light modulator 430 are place to the three input sides of dichoric cross prism 420.
  • Light modulator can be of a MEMS (micro electronic mechanical system) device (for example DLP from Texas Instrument) or liquid crystal device (LCD or LCoS). Red, green, and blue light emitted from fiber bundle 154 will be modulated by 430 will be either reflected by or transmit through 420 and be directed to projection lens 440.
  • the feed back loop 402 and 404 can maintain the color and brightness stability and adjust the color temperature of projected images.
  • FIG. 17 is a schematic view of another application of the invented LED light source.
  • An illumination system for transportation vehicle is based on the current light source invention.
  • This white light generated from invention 154 is collected and re-shaped by optics 460 to generate the desired illumination distributions.
  • the light control 450 receives and processes the command signal from external source, and then provides the driving electrical power to the light source 300.
  • a feedback signal from light source goes into light control for best performance and life-time of the system.
  • the packaging of LED offer efficient coupling of lights out of LED or LEDs into optic fiber or fibers while maintain the etendue.
  • a low cost and easy-scalable manufacturing process may be devised based on the described designs and techniques.
  • the described packaging of LED may be used to provide efficient thermal conductibility from LED chips to the base plate to dissipate the heat generated by the LED While this specification contains many specifics, these should not be construed as limitations on the scope of an invention or of what may be claimed, but rather as descriptions of features specific to particular embodiments of the invention. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment.

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Abstract

La présente invention décrit un système de lumière assurant une faible perte de fibres et maintenant la luminosité qui comprend un dispositif électroluminescent à l'état solide, comme par exemple, mais sans s'y limiter, une LED, un assemblage de base de fixation pour le dispositif électroluminescent, un assemblage de recueil de la lumière avec faible perte, un assemblage d'intégration de structure, un guide d'ondes optique tel qu'une fibre et un système de combinaison de fibres dans le système avec plusieurs dispositifs électroluminescents. Le dispositif électroluminescent, l'assemblage de recueil de la lumière et la fibre sont liés directement les uns aux autres ou bien par un matériau transparent à indice optique concordant. L'étendue du dispositif électroluminescent et la fibre sont sélectionnées de sorte que la luminosité dans le système soit maintenue voire augmentée. L'assemblage de recueil de lumière peut utiliser une surface de revêtement hautement réfléchissante ou l'ensemble de la réflexion interne sur une interface. Le système de plusieurs dispositifs électroluminescents à fibres comprend chaque unité de fourniture de lumière individuelle à faible perte de fibre et maintenant la luminosité et le système de combinaison de plusieurs fibres. Ce système de combinaison peut être des fibres jointes ensemble ou fusionnées ensemble. Le groupe de cœur des fibres ou le groupe de cœur de fibres fusionnées comprend un assemblage de concentration de la lumière en guise d'alternative.
PCT/CN2006/000552 2005-04-01 2006-03-30 Couplage de lumiere tres efficace d'une source de lumiere a l'etat solide en un guide d'ondes/une fibre optique maintenant l'etendue WO2006102846A1 (fr)

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Cited By (13)

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US7547114B2 (en) 2007-07-30 2009-06-16 Ylx Corp. Multicolor illumination device using moving plate with wavelength conversion materials
US7621677B2 (en) 2007-08-21 2009-11-24 Ylx Corp. Optical coupler for a light emitting device with enhanced output brightness
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JP2011048371A (ja) * 2009-08-28 2011-03-10 General Electric Co <Ge> 発光ダイオード−光ガイドカップリング装置
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WO2012062355A1 (fr) * 2010-11-09 2012-05-18 Osram Ag Assemblage luminophore avec élément luminophore et système optique
US8278806B1 (en) 2011-03-02 2012-10-02 Osram Sylvania Inc. LED reflector lamp
WO2015026998A1 (fr) * 2013-08-23 2015-02-26 Corning Incorporated Appareil coupleur de lumière et procédés de fabrication de fibres optiques diffusant la lumière
US9075170B2 (en) 2009-09-16 2015-07-07 Koninklijke Philips N. V. Optical element
WO2018063348A1 (fr) * 2016-09-30 2018-04-05 Chiu Chia Pin Concentrateur parabolique composite comprenant une saillie
WO2019036689A1 (fr) * 2017-08-18 2019-02-21 Thorlabs, Inc. Source de lumière à large bande basée sur un luminophore cristallin
EP3625603B1 (fr) 2017-05-18 2021-02-24 Lumileds LLC Ensemble éclairage à éclairement énergétique élevé

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US7726861B2 (en) 2006-07-31 2010-06-01 Ylx Corporation Brightness enhancement with directional wavelength conversion
US7744241B2 (en) 2007-06-13 2010-06-29 Ylx, Ltd. High brightness light source using light emitting devices of different wavelengths and wavelength conversion
EP4043959A1 (fr) 2007-07-30 2022-08-17 Appotronics Corporation Limited Dispositif d'éclairage multicolore utilisant une plaque mobile avec des matériaux de conversion de longueur d'onde
USRE48107E1 (en) 2007-07-30 2020-07-21 Appotronics Corporation Limited Multicolor illumination device using moving plate with wavelength conversion materials
EP3291002A1 (fr) 2007-07-30 2018-03-07 Appotronics Corporation Limited Dispositif d'éclairage multicolore utilisant une plaque mobile avec des matériaux de conversion de longueur d'onde
EP3291003A1 (fr) 2007-07-30 2018-03-07 Appotronics Corporation Limited Dispositif d'éclairage multicolore au moyen d'une plaque mobile avec des matériaux de conversion de longueur d'onde
US7547114B2 (en) 2007-07-30 2009-06-16 Ylx Corp. Multicolor illumination device using moving plate with wavelength conversion materials
US7621677B2 (en) 2007-08-21 2009-11-24 Ylx Corp. Optical coupler for a light emitting device with enhanced output brightness
US7922378B2 (en) 2007-11-14 2011-04-12 Carl Zeiss Surgical Gmbh Medical illumination unit
JP2011048371A (ja) * 2009-08-28 2011-03-10 General Electric Co <Ge> 発光ダイオード−光ガイドカップリング装置
EP2296025A3 (fr) * 2009-08-28 2011-09-21 General Electric Company Appareil de couplage entre une diode électroluminescente et un guide de lumière
KR102025016B1 (ko) 2009-08-28 2019-09-24 제너럴 일렉트릭 캄파니 커플링 장치
KR20180085380A (ko) * 2009-08-28 2018-07-26 제너럴 일렉트릭 캄파니 커플링 장치
US9075170B2 (en) 2009-09-16 2015-07-07 Koninklijke Philips N. V. Optical element
US9103526B2 (en) 2010-11-09 2015-08-11 Osram Gmbh Phosphor assembly with phosphor element and optical system
WO2012062355A1 (fr) * 2010-11-09 2012-05-18 Osram Ag Assemblage luminophore avec élément luminophore et système optique
US8278806B1 (en) 2011-03-02 2012-10-02 Osram Sylvania Inc. LED reflector lamp
US9158080B2 (en) 2013-08-23 2015-10-13 Corning Incorporated Light-coupling apparatus and methods for light-diffusing optical fibers
WO2015026998A1 (fr) * 2013-08-23 2015-02-26 Corning Incorporated Appareil coupleur de lumière et procédés de fabrication de fibres optiques diffusant la lumière
WO2018063348A1 (fr) * 2016-09-30 2018-04-05 Chiu Chia Pin Concentrateur parabolique composite comprenant une saillie
US11156815B2 (en) 2016-09-30 2021-10-26 Intel Corporation Compound parabolic concentrator including protrusion
EP3625603B1 (fr) 2017-05-18 2021-02-24 Lumileds LLC Ensemble éclairage à éclairement énergétique élevé
US10317046B2 (en) 2017-08-18 2019-06-11 Thorlabs, Inc. Broadband light source based on crystalline phosphor
WO2019036689A1 (fr) * 2017-08-18 2019-02-21 Thorlabs, Inc. Source de lumière à large bande basée sur un luminophore cristallin
CN111033113A (zh) * 2017-08-18 2020-04-17 统雷有限公司 基于结晶磷光体的宽带光源

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