WO2006088277A1 - Electret condenser microphone assembly for smd - Google Patents

Electret condenser microphone assembly for smd Download PDF

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Publication number
WO2006088277A1
WO2006088277A1 PCT/KR2005/002616 KR2005002616W WO2006088277A1 WO 2006088277 A1 WO2006088277 A1 WO 2006088277A1 KR 2005002616 W KR2005002616 W KR 2005002616W WO 2006088277 A1 WO2006088277 A1 WO 2006088277A1
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WO
WIPO (PCT)
Prior art keywords
smd
microphone
positive
negative
assembly
Prior art date
Application number
PCT/KR2005/002616
Other languages
French (fr)
Inventor
Chung Dam Song
Eek Joo Chung
Sung Ho Park
Jun Lim
Original Assignee
Bse Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd. filed Critical Bse Co., Ltd.
Publication of WO2006088277A1 publication Critical patent/WO2006088277A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
    • A41D13/002—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment
    • A41D13/005—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
    • A41D13/002—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment
    • A41D13/005—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
    • A41D13/0051—Heated garments
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
    • A41D13/002—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment
    • A41D13/005—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
    • A41D13/0053—Cooled garments
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
    • A41D13/012—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches for aquatic activities, e.g. with buoyancy aids
    • A41D13/0125—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches for aquatic activities, e.g. with buoyancy aids with buoyancy aids
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D7/00—Bathing gowns; Swim-suits, drawers, or trunks; Beach suits
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D2400/00—Functions or special features of garments
    • A41D2400/10—Heat retention or warming
    • A41D2400/12—Heat retention or warming using temperature-controlled means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • the present invention relates to an electret condenser microphone assembly for
  • a SMT Surface Mount Technology
  • a component mounting technology of a SMD is essential to small-sized electronic devices such as a cellular phone and a PDA. Therefore, most of components used in the cellular phone and so forth is developed and used as parts for the SMD having a robust temperature characteristic so that a SMD technology may be applied.
  • an electret condenser microphone used in the cellular phone and so forth comprises a voltage bias element (commonly, consists of an electret), a pair of a diaphragm/backplate for constituting a capacitor C varying according to a sound pressure, and a JFET (Junction Field Effect Transistor) for buffering an output signal.
  • the electret condenser microphone includes an electret formed on one of the diaphragm and the backplate, and the electret is commonly formed by injecting a charge into an organic film.
  • the electretcondenser microphone is manufactured by forcibly injecting the charge into the organic film, a performance of the electret is degraded when a humidity or a temperature is high due to breakaway of a charged electron. Therefore, it is difficult to apply the SMD to the electret condenser microphone.
  • the electret condenser microphone of the registered utility patent may be mounted on a main PCB of a product such as the cellular phone where a microphone is surface-mounted.
  • PCB of the product such as the cellular phone where the microphone is surface- mounted, it is difficult to mount/unmount the microphone in case of replacement due to a defect of the microphone.
  • a microphone connection pattern of the main PCB having the microphone surface-mounted thereon may change depending on a model of an application product or mechanical condition
  • a microphone for SMD that may adaptively correspond with the microphone connection pattern of the main PCB. Disclosure of Invention
  • an electret condenser microphone assembly for SMD to be mounted on a main PCB of an application product by a SMD method, the assembly comprising: a microphone capsule for SMD; at least one positive extension terminal for connecting a positive connection terminal of the microphone capsule for SMD to a positive connection pattern of the main PCB; and at least one negative extension terminal for connecting a negative connection terminal of the microphone capsule for SMD to a negative connection pattern of the main PCB.
  • the number of the positive extension terminal may be one and that of the negative extension terminals may be three, and the positive extension terminal and the negative extension terminals are arranged perpendicular to one another, and the positive and the negative extension terminals are bent at a middle portion thereof when a height of the positive and the negative connection terminals of the microphone capsule is smaller than that of a curled surface, and have a planar structure when the height of the positive and the negative connection terminals of the microphone capsule is larger than or the same as that of the curled surface.
  • the microphone assembly for SMD in accordance with the present invention may adaptively correspond with the microphone connection pattern of the main PCB of a product having the microphone surface-mounted thereon so that the microphone assembly for SMD in accordance with the present invention may easily be surface-mounted on various application products.
  • condenser microphone assembly for SMD in accordance with the present invention may easily be unmounted by heating a extruding portion of an extension terminal with a soldering gun during a repair (rework) process, and a defective condenser microphone assembly for SMD be easily replaced with a new microphone capsule by heating the extruding portion of the extension terminal with the soldering gun without applying a heat to the new microphone capsule.
  • the microphone assembly for SMD in accordance with the present invention may adaptively correspond with the microphone connection pattern of the main PCB of a product having the microphone surface-mounted thereon so that the microphone assembly for SMDin accordance with the present invention may easily be surface-mounted on various application products.
  • condenser microphone assembly for SMD in accordance with the present invention may easily be unmounted by heating a extruding portion of an extension terminal with a soldering gun during a repair (rework) process, and a defective condenser microphone assembly for SMD be easily replaced with a new microphone capsule by heating the extruding portion of the extension terminal with the soldering gun without applying a heat to the new microphone capsule.
  • FIG. 1 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with a first embodiment of the present invention.
  • FIG. 2 is a diagram illustrating a state after attaching the extension terminalto the microphone capsule in accordance with the first embodiment of the present invention.
  • FIG. 3 is a perspective view illustrating a microphone assembly in accordance with the first embodiment of the present invention.
  • Fig. 4 is a plane view illustrating the microphone assembly of Fig. 3.
  • Fig. 5 is a bottom view illustrating the microphone assembly of Fig. 3.
  • FIG. 6 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with a second embodiment of the present invention.
  • Fig. 7 is a diagram illustrating a state after attaching the extension terminal to the microphone capsule in accordance with the second embodiment of the present invention.
  • FIG. 8 is a perspective view illustrating a microphone assembly in accordance with the second embodiment of the present invention.
  • Fig. 9 is a plane view illustrating the microphone assembly of Fig. 8.
  • Fig. 10 is a bottom view illustrating the microphone assembly of Fig. 8.
  • the present invention employs an extension terminal for mediating a microphone capsule for SMD and a connection pattern of a main PCB so that the microphone for SMD adaptively corresponds with the connection pattern of the main PCB. Therefore, although the shape and the number of the extension terminal may be determined according to the shape and the number of the connection pattern of the main PCB and a connection terminal of the microphone capsule, a first embodiment wherein the connection terminal of the microphone capsule does not extrude (regular connection terminal) and a second embodiment wherein the connection terminal of the microphone capsule extrudes in case that four connection patterns of the main PCB are arranged perpendicular to one another, three of which are designed to be negative connection patterns and one of which is designed to be a positive connection pattern in accordance with the present invention.
  • Fig. 1 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with the first embodiment of the present invention
  • Fig. 2 is a diagram illustrating a state after attaching the extension terminal to the microphone capsule in accordance with the first embodiment of the present invention.
  • the electret condenser microphone assembly for SMD comprises a microphone capsule 100 capable of a SMD and an extension terminal 200 for connecting the microphone capsule to a connection pattern of a main PCB.
  • the microphone capsule 100 has a shape of a cylinder as shown in Figs. 1 and 2, and is assembled by inserting common components such as a diaphragm and a back electret into a casing 102 and then by curling an end portion of the casing after inserting a PCB 104.
  • connection terminal 106 of a positive electrode and a connection terminal 108 of a negative electrode are formed on a surface of the PCB 104 of the microphone to transmit an electrical signal of the microphone to outside through the connection terminals 106 and 108. That is, the connection terminal 106 of the positive electrode having a circular shape for connecting to a power supply/output (Vdd/Out) is disposed at a center portion and the connection terminal 108 of the negative electrode having a circular shape for connecting to ground is disposed at an outer portion spaced apart from the connection terminal 106.
  • Vdd/Out power supply/output
  • connection terminals 106 and 108 formed as a planar type pattern disposed a lower than a curling surface 102a on a surface of the PCB, whereby the extension terminal 200 is bent so as to be easily connected to the planar type connection terminal.
  • the extension terminal 200 comprises at least one positive extension terminal and at least one negative extension terminal.
  • one positive extension terminal 210 and three negative terminals 220-1, 220-2 and 220-3 are used as an example.
  • a size ofthe positive extension terminal 210 may be larger (or smaller) than a size of the negative extension terminals 220-1, 220-2 and 220-3 so that a worker may easily distinguish polarities.
  • the three negative extension terminals 220-1, 220-2 and 220-3 are separate in accordance with this embodiment, the three negative extension terminals 220-1, 220-2 and 220-3 may be connected to one another to be a single unit if necessary.
  • the extension terminal 200 may have a structure wherein insulating materials 214 and 224 such as PSR (Photo Solder Resist) are coated over metal plates 212 and 222 to form a film, and various methods such as a laser welding, a soldering using a high temperature solder or a conductive adhesive (epoxy) may be employed as a method for fixing the extension terminal 200 to the connection terminals 106 and 108 of the microphone capsule 100.
  • insulating materials 214 and 224 such as PSR (Photo Solder Resist) are coated over metal plates 212 and 222 to form a film
  • various methods such as a laser welding, a soldering using a high temperature solder or a conductive adhesive (epoxy) may be employed as a method for fixing the extension terminal 200 to the connection terminals 106 and 108 of the microphone capsule 100.
  • FIG. 3 is a perspective view illustrating a microphone assembly in accordance with the first embodiment of the present invention
  • Fig. 4 is a plane view illustrating the microphone assembly of Fig. 3
  • Fig. 5 is a bottom view illustrating the microphone assembly of Fig. 3.
  • the extension terminal 200 is attached to a typical microphone capsule for SMD 100 by a laser welding, a soldering or a conductive adhesive.
  • the condenser microphone assembly may be mounted through the extension terminal 200 by SMD method ona main PCB of a product such as a cellular phone wherein the microphone capsule 100 is mounted.
  • the microphone capsule 100 is a cylinder type and four extension terminals 200 extrude toward sides.
  • the microphone capsule 100 may be connected to the connection pattern of the main PCB 300 through the extension terminal 200 by SMD method.
  • the extension terminals 210, 220-1, 220-2 and 220-2 are arranged in four directions of the cylinder type microphone capsule 100 so that portions of the extension terminals 210, 220-1, 220-2 and 220-2 which connect to the connection pattern of the main PCB 300 extrude.
  • the extruding portion of the extension terminal 200 may be heated with a soldering gun during a repair (rework) process to unmount the microphone capsule 100, and a defective condenser microphone assembly for SMD be easily replaced with a new microphone capsule by heating only the extruding portion of the extension terminal 200 with the soldering gun without applying a heat to the new microphone capsule 100.
  • Fig. 6 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with a second embodiment of the present invention
  • Fig. 7 is a diagram illustrating a state after attaching the extension terminal to the microphone capsule in accordance with the second embodiment of the present invention.
  • the electret condenser microphone assembly for SMD comprises a microphone capsule 100 capable of a SMD and an extension terminal 200 for connecting the microphone capsule to a connection pattern of a main PCB 300.
  • the microphone capsule 100 has a shape of a cylinder, and is assembled by inserting common components such as a diaphragm and a back electret into a casing 102 and then by curling an end portion of the casing after inserting a PCB 104.
  • connection terminal 106 of a positive electrode and a connection terminal 108 of a negative electrode are formed on a surface of the PCB 104 of the microphone to transmit an electrical signal of the microphone to outside through the connection terminals 106 and 108. That is, the connection terminal 106 of the positive electrode having acircular shape for connecting to a power supply/output (Vdd/Out) is disposed at a center portion and the connection terminal 108 of the negative electrode having a circular shape for connecting to ground is disposed at an outer portion spaced apart from the connection terminal 106.
  • Vdd/Out power supply/output
  • connection terminals 106 and 108 extrude above a surface of the PCB to be disposed higher than a curling surface 102a, whereby the extension terminal 200 is a planar type.
  • the extension terminal 200 comprises at least one positive extension terminal and at least one negative extension terminal.
  • one positive extension terminal 210 and three negative terminals 220-1, 220-2 and 220-3 are used as an example.
  • a size of the positive extension terminal 210 may be larger (or smaller) than a size of the negative extension terminals 220-1, 220-2 and 220-3 so that a worker may easily distinguish polarities.
  • the three negative extension terminals 220-1, 220-2 and 220-3 are separate in accordance with this embodiment, the three negative extension terminals 220-1, 220-2 and 220-3 may be connected to one another to be a single unit if necessary.
  • the extension terminal 200 may have a structure wherein insulating materials 214 and 224 are coated over metal plates 212 and 222, and various methods such as a laser welding, a soldering using a high temperature solder or a conductive adhesive (epoxy) may be employed as a method for fixing the extension terminal 200 to the connection terminals 106 and 108 of the microphone capsule 100.
  • FIG. 8 is a perspective view illustrating a microphone assembly in accordance with the second embodiment of the present invention
  • Fig. 9 is a plane view illustrating the microphone assembly of Fig. 8
  • Fig. 10 is a bottom view illustrating the microphone assembly of Fig. 8.
  • connection terminals 106 and 108 of the microphone capsule 100 extrude above the curling surface 102a so that the extension terminal 200 has a planar structure. Therefore, a description in detail is hereby omitted.
  • an electret condenser microphone assembly for SMD for facile mount/unmount of a microphone for SMD.
  • an electret condenser microphone assembly for SMD which may adaptively correspond with a microphone connection pattern of a main PCB.

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Abstract

The present invention relates to anelectret condenser microphone assembly for SMD which may be easily mounted on and unmounted from a main PCB. An electret condenser microphone assembly for SMD in accordance with the present invention comprises a microphone capsule for SMD, at least one positive extension terminal for connecting a positive connection terminal of the microphone capsule for SMD to a positive connection pattern of the main PCB, the positive extension terminal extruding above the microphone capsule for SMD, and at least one negative extension terminal for connecting a negative connection terminal of the microphone capsule for SMD to a negative connection pattern of the main PCB, the negative extension terminal extruding above the microphone capsule for SMD. Therefore, since the electret condenser microphone assembly for SMD in accordance with the present invention may adaptively correspond to a connection pattern of the main PCB having the microphone mounted thereon, the assembly may be mounted on various applied products, and may easily be replaced by heating the extruding portion with a solder without heating the microphone capsule.

Description

Description
ELECTRET CONDENSER MICROPHONE ASSEMBLY FOR
SMD
Technical Field
[1] The present invention relates to an electret condenser microphone assembly for
SMD, and more particularly to an electret condenser microphone assembly for SMD which may be easily mounted on and unmounted from a main PCB. Background Art
[2] While a reduction in a size of an electronic device is in trend as a manufacturing technology of the electronic device develops, a SMT (Surface Mount Technology) is widely used for a small electronic device. Particularly, a component mounting technology of a SMD is essential to small-sized electronic devices such as a cellular phone and a PDA. Therefore, most of components used in the cellular phone and so forth is developed and used as parts for the SMD having a robust temperature characteristic so that a SMD technology may be applied.
[3] On the other hand, an electret condenser microphone used in the cellular phone and so forth comprises a voltage bias element (commonly, consists of an electret), a pair of a diaphragm/backplate for constituting a capacitor C varying according to a sound pressure, and a JFET (Junction Field Effect Transistor) for buffering an output signal. The electret condenser microphone includes an electret formed on one of the diaphragm and the backplate, and the electret is commonly formed by injecting a charge into an organic film.
[4] Since the electretcondenser microphone is manufactured by forcibly injecting the charge into the organic film, a performance of the electret is degraded when a humidity or a temperature is high due to breakaway of a charged electron. Therefore, it is difficult to apply the SMD to the electret condenser microphone.
[5] In order to solve this problem, the applicant of the present application has developed an electret condenser microphone for SMD and was granted a utility patent (utility patent no. 20-332944). The electret condenser microphone of the registered utility patent may be mounted on a main PCB of a product such as the cellular phone where a microphone is surface-mounted.
[6] However, when an electret condenser microphone for SMD is mounted on the main
PCB of the product such as the cellular phone where the microphone is surface- mounted, it is difficult to mount/unmount the microphone in case of replacement due to a defect of the microphone.
[7] In addition, since a microphone connection pattern of the main PCB having the microphone surface-mounted thereon may change depending on a model of an application product or mechanical condition, a microphone for SMD that may adaptively correspond with the microphone connection pattern of the main PCB. Disclosure of Invention
Technical Problem
[8] It is an object of the present invention to provide an electret condenser microphone assembly for SMD which may be easily mounted on and unmounted from a main PCB.
[9] It is another object of the present invention to provide a microphone for SMD adaptively corresponding with the microphone connection pattern of the main PCB. Technical Solution
[10] In order to achieve the above-described object, there is provided an electret condenser microphone assembly for SMD to be mounted on a main PCB of an application product by a SMD method, the assembly comprising: a microphone capsule for SMD; at least one positive extension terminal for connecting a positive connection terminal of the microphone capsule for SMD to a positive connection pattern of the main PCB; and at least one negative extension terminal for connecting a negative connection terminal of the microphone capsule for SMD to a negative connection pattern of the main PCB.
[11] The number of the positive extension terminal may be one and that of the negative extension terminals may be three, and the positive extension terminal and the negative extension terminals are arranged perpendicular to one another, and the positive and the negative extension terminals are bent at a middle portion thereof when a height of the positive and the negative connection terminals of the microphone capsule is smaller than that of a curled surface, and have a planar structure when the height of the positive and the negative connection terminals of the microphone capsule is larger than or the same as that of the curled surface.
[12] As described above, the microphone assembly for SMD in accordance with the present invention may adaptively correspond with the microphone connection pattern of the main PCB of a product having the microphone surface-mounted thereon so that the microphone assembly for SMD in accordance with the present invention may easily be surface-mounted on various application products.
[13] In addition, condenser microphone assembly for SMD in accordance with the present invention may easily be unmounted by heating a extruding portion of an extension terminal with a soldering gun during a repair (rework) process, and a defective condenser microphone assembly for SMD be easily replaced with a new microphone capsule by heating the extruding portion of the extension terminal with the soldering gun without applying a heat to the new microphone capsule. [14] While the present invention has been particularly shown and described with reference to the preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be effected therein without departing from the spirit and scope of the invention as defined by the appended claims.
Advantageous Effects
[15] As described above, the microphone assembly for SMD in accordance with the present invention may adaptively correspond with the microphone connection pattern of the main PCB of a product having the microphone surface-mounted thereon so that the microphone assembly for SMDin accordance with the present invention may easily be surface-mounted on various application products.
[16] In addition, condenser microphone assembly for SMD in accordance with the present invention may easily be unmounted by heating a extruding portion of an extension terminal with a soldering gun during a repair (rework) process, and a defective condenser microphone assembly for SMD be easily replaced with a new microphone capsule by heating the extruding portion of the extension terminal with the soldering gun without applying a heat to the new microphone capsule.
[17] While the present invention has been particularly shown and described with reference to the preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be effected therein without departing from the spirit and scope of the invention as defined by the appended claims. Brief Description of the Drawings
[18] Fig. 1 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with a first embodiment of the present invention.
[19] Fig. 2 is a diagram illustrating a state after attaching the extension terminalto the microphone capsule in accordance with the first embodiment of the present invention.
[20] Fig. 3 is a perspective view illustrating a microphone assembly in accordance with the first embodiment of the present invention.
[21] Fig. 4 is a plane view illustrating the microphone assembly of Fig. 3.
[22] Fig. 5 is a bottom view illustrating the microphone assembly of Fig. 3.
[23] Fig. 6 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with a second embodiment of the present invention.
[24] Fig. 7 is a diagram illustrating a state after attaching the extension terminal to the microphone capsule in accordance with the second embodiment of the present invention.
[25] Fig. 8is a perspective view illustrating a microphone assembly in accordance with the second embodiment of the present invention.
[26] Fig. 9 is a plane view illustrating the microphone assembly of Fig. 8. [27] Fig. 10 is a bottom view illustrating the microphone assembly of Fig. 8.
Best Mode for Carrying Out the Invention
[28] Firstly, the present invention employs an extension terminal for mediating a microphone capsule for SMD and a connection pattern of a main PCB so that the microphone for SMD adaptively corresponds with the connection pattern of the main PCB. Therefore, although the shape and the number of the extension terminal may be determined according to the shape and the number of the connection pattern of the main PCB and a connection terminal of the microphone capsule, a first embodiment wherein the connection terminal of the microphone capsule does not extrude (regular connection terminal) and a second embodiment wherein the connection terminal of the microphone capsule extrudes in case that four connection patterns of the main PCB are arranged perpendicular to one another, three of which are designed to be negative connection patterns and one of which is designed to be a positive connection pattern in accordance with the present invention.
[29] Fig. 1 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with the first embodiment of the present invention, and Fig. 2 is a diagram illustrating a state after attaching the extension terminal to the microphone capsule in accordance with the first embodiment of the present invention.
[30] As shown in Figs. 1 and 2, the electret condenser microphone assembly for SMD comprises a microphone capsule 100 capable of a SMD and an extension terminal 200 for connecting the microphone capsule to a connection pattern of a main PCB.
[31] In accordance with the embodiment of the present invention, the microphone capsule 100 has a shape of a cylinder as shown in Figs. 1 and 2, and is assembled by inserting common components such as a diaphragm and a back electret into a casing 102 and then by curling an end portion of the casing after inserting a PCB 104.
[32] A connection terminal 106 of a positive electrode and a connection terminal 108 of a negative electrode are formed on a surface of the PCB 104 of the microphone to transmit an electrical signal of the microphone to outside through the connection terminals 106 and 108. That is, the connection terminal 106 of the positive electrode having a circular shape for connecting to a power supply/output (Vdd/Out) is disposed at a center portion and the connection terminal 108 of the negative electrode having a circular shape for connecting to ground is disposed at an outer portion spaced apart from the connection terminal 106.
[33] In accordance with the first embodiment, the connection terminals 106 and 108 formed as a planar type pattern disposed a lower than a curling surface 102a on a surface of the PCB, whereby the extension terminal 200 is bent so as to be easily connected to the planar type connection terminal. [34] The extension terminal 200 comprises at least one positive extension terminal and at least one negative extension terminal. In this embodiment, one positive extension terminal 210 and three negative terminals 220-1, 220-2 and 220-3 are used as an example. A size ofthe positive extension terminal 210 may be larger (or smaller) than a size of the negative extension terminals 220-1, 220-2 and 220-3 so that a worker may easily distinguish polarities. In addition, although the three negative extension terminals 220-1, 220-2 and 220-3 are separate in accordance with this embodiment, the three negative extension terminals 220-1, 220-2 and 220-3 may be connected to one another to be a single unit if necessary.
[35] In addition, the extension terminal 200 may have a structure wherein insulating materials 214 and 224 such as PSR (Photo Solder Resist) are coated over metal plates 212 and 222 to form a film, and various methods such as a laser welding, a soldering using a high temperature solder or a conductive adhesive (epoxy) may be employed as a method for fixing the extension terminal 200 to the connection terminals 106 and 108 of the microphone capsule 100.
[36] Fig. 3 is a perspective view illustrating a microphone assembly in accordance with the first embodiment of the present invention, Fig. 4 is a plane view illustrating the microphone assembly of Fig. 3 and Fig. 5 is a bottom view illustrating the microphone assembly of Fig. 3.
[37] As shown in Fig. 3, in accordance with the electret condenser microphone assembly for SMD of the present invention, the extension terminal 200 is attached to a typical microphone capsule for SMD 100 by a laser welding, a soldering or a conductive adhesive. The condenser microphone assembly may be mounted through the extension terminal 200 by SMD method ona main PCB of a product such as a cellular phone wherein the microphone capsule 100 is mounted.
[38] In accordance with the embodiment of the present invention, the microphone capsule 100 is a cylinder type and four extension terminals 200 extrude toward sides. The microphone capsule 100 may be connected to the connection pattern of the main PCB 300 through the extension terminal 200 by SMD method.
[39] In addition, as shown in the plane view of Fig. 4 and the bottom view of Fig. 5, the extension terminals 210, 220-1, 220-2 and 220-2, are arranged in four directions of the cylinder type microphone capsule 100 so that portions of the extension terminals 210, 220-1, 220-2 and 220-2 which connect to the connection pattern of the main PCB 300 extrude.
[40] Therefore, when a defect of the microphone capsule 100 is detected after mounting the microphone assembly in accordance with the present invention on the main PCB 300, the extruding portion of the extension terminal 200 may be heated with a soldering gun during a repair (rework) process to unmount the microphone capsule 100, and a defective condenser microphone assembly for SMD be easily replaced with a new microphone capsule by heating only the extruding portion of the extension terminal 200 with the soldering gun without applying a heat to the new microphone capsule 100. Mode for the Invention
[41] Fig. 6 is a diagram illustrating a state prior to attaching an extension terminal to a microphone capsule in accordance with a second embodiment of the present invention and Fig. 7 is a diagram illustrating a state after attaching the extension terminal to the microphone capsule in accordance with the second embodiment of the present invention.
[42] As shown in Figs. 6 and 7, the electret condenser microphone assembly for SMD comprises a microphone capsule 100 capable of a SMD and an extension terminal 200 for connecting the microphone capsule to a connection pattern of a main PCB 300.
[43] In accordance with the embodiment of the present invention, the microphone capsule 100 has a shape of a cylinder, and is assembled by inserting common components such as a diaphragm and a back electret into a casing 102 and then by curling an end portion of the casing after inserting a PCB 104.
[44] A connection terminal 106 of a positive electrode and a connection terminal 108 of a negative electrode are formed on a surface of the PCB 104 of the microphone to transmit an electrical signal of the microphone to outside through the connection terminals 106 and 108. That is, the connection terminal 106 of the positive electrode having acircular shape for connecting to a power supply/output (Vdd/Out) is disposed at a center portion and the connection terminal 108 of the negative electrode having a circular shape for connecting to ground is disposed at an outer portion spaced apart from the connection terminal 106.
[45] In accordance with the second embodiment, the connection terminals 106 and 108 extrude above a surface of the PCB to be disposed higher than a curling surface 102a, whereby the extension terminal 200 is a planar type.
[46] The extension terminal 200 comprises at least one positive extension terminal and at least one negative extension terminal. In this embodiment, one positive extension terminal 210 and three negative terminals 220-1, 220-2 and 220-3 are used as an example. A size of the positive extension terminal 210 may be larger (or smaller) than a size of the negative extension terminals 220-1, 220-2 and 220-3 so that a worker may easily distinguish polarities. In addition, although the three negative extension terminals 220-1, 220-2 and 220-3 are separate in accordance with this embodiment, the three negative extension terminals 220-1, 220-2 and 220-3 may be connected to one another to be a single unit if necessary. [47] In addition, the extension terminal 200 may have a structure wherein insulating materials 214 and 224 are coated over metal plates 212 and 222, and various methods such as a laser welding, a soldering using a high temperature solder or a conductive adhesive (epoxy) may be employed as a method for fixing the extension terminal 200 to the connection terminals 106 and 108 of the microphone capsule 100.
[48] Fig. 8 is a perspective view illustrating a microphone assembly in accordance with the second embodiment of the present invention, Fig. 9 is a plane view illustrating the microphone assembly of Fig. 8 and Fig. 10 is a bottom view illustrating the microphone assembly of Fig. 8.
[49] The microphone assembly in accordance with the second embodiment is substantially the same as the first embodiment except that the connection terminals 106 and 108 of the microphone capsule 100 extrude above the curling surface 102a so that the extension terminal 200 has a planar structure. Therefore, a description in detail is hereby omitted. Industrial Applicability
[50] There is provided an electret condenser microphone assembly for SMD for facile mount/unmount of a microphone for SMD. In accordance with another object of the present invention, there is provided an electret condenser microphone assembly for SMD which may adaptively correspond with a microphone connection pattern of a main PCB.
[51]
[52]

Claims

Claims
[1] An electret condenser microphone assembly for SMD to be mounted on a main
PCB of an application product by a SMD method, the assembly comprising: a microphone capsule for SMD at least one positive extension terminal for connecting a positive connection terminal of the microphone capsule for SMD to a positive connection pattern of the main PCB, the positive extension terminal extruding above the microphone capsule for SMD and consisting of a metallic material having an insulating coating coated thereon; and at least one negative extension terminal for connecting a negative connection terminal of the microphone capsule for SMD to a negative connection pattern of the main PCB, the negative extension terminal extruding above the microphone capsule for SMD and consisting of the metallic material having the insulating coating coated thereon.
[2] The assembly in accordance with claim 1, the assembly comprising a single positive extension terminal and three negative extension terminals, wherein the positive extension terminal and the negative extension terminals are arranged perpendicular to one another.
[3] The assembly in accordance with claim 2, wherein the three negative extension terminals are connected to one another as a single unit.
[4] The assembly in accordance with one of claims 1 through 3, wherein the positive and the negative extension terminals are bent at a middle portion thereof when a height of the positive and the negative connection terminals of the microphone capsule is smaller than that of a curled surface, and wherein the positive and the negative extension terminals have a planar structure when the height of the positive and the negative connection terminals of the microphone capsule is larger than or the same as that of the curled surface.
[5] The assembly in accordance with one of claims 1 through 3, wherein the positive and the negative extension terminals are respectively fixed to the positive and the negative connection terminals electrically and mechanically by a laser welding, a soldering or a conductive epoxy.
PCT/KR2005/002616 2005-02-18 2005-08-11 Electret condenser microphone assembly for smd WO2006088277A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050013514A KR100675509B1 (en) 2005-02-18 2005-02-18 Electret condenser microphone assembly for SMD
KR10-2005-0013514 2005-02-18

Publications (1)

Publication Number Publication Date
WO2006088277A1 true WO2006088277A1 (en) 2006-08-24

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KR (1) KR100675509B1 (en)
WO (1) WO2006088277A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1141683A (en) * 1997-05-23 1999-02-12 Fuji Kobunshi Kogyo Kk Small-sized microphone assembly
EP1257150A2 (en) * 2001-05-10 2002-11-13 Matsushita Electric Industrial Co., Ltd. Electret condenser microphone and method of producing same
JP2003153392A (en) * 2001-11-16 2003-05-23 Primo Co Ltd Electret capacitor microphone
JP2004201291A (en) * 2002-12-03 2004-07-15 Hosiden Corp Microphone

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1141683A (en) * 1997-05-23 1999-02-12 Fuji Kobunshi Kogyo Kk Small-sized microphone assembly
EP1257150A2 (en) * 2001-05-10 2002-11-13 Matsushita Electric Industrial Co., Ltd. Electret condenser microphone and method of producing same
JP2003153392A (en) * 2001-11-16 2003-05-23 Primo Co Ltd Electret capacitor microphone
JP2004201291A (en) * 2002-12-03 2004-07-15 Hosiden Corp Microphone

Also Published As

Publication number Publication date
KR20060092538A (en) 2006-08-23
KR100675509B1 (en) 2007-01-30

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