CN109451410B - Electret microphone and manufacturing method - Google Patents
Electret microphone and manufacturing method Download PDFInfo
- Publication number
- CN109451410B CN109451410B CN201811369165.0A CN201811369165A CN109451410B CN 109451410 B CN109451410 B CN 109451410B CN 201811369165 A CN201811369165 A CN 201811369165A CN 109451410 B CN109451410 B CN 109451410B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- protective cover
- plate
- electret microphone
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims abstract description 50
- 230000005669 field effect Effects 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 6
- 238000013016 damping Methods 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000004044 response Effects 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- -1 Polypropylene Polymers 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
Abstract
The embodiment of the invention discloses an electret microphone and a manufacturing method thereof, wherein the electret microphone comprises a shell, a vibrating assembly, a circuit board, a field effect tube and a protective cover; the shell is of a cylindrical structure with one end open, and a first sound inlet hole is formed in one end opposite to the opening; the vibration component is arranged inside the shell and is electrically connected with the circuit board; the circuit board is covered on the opening; the field effect tube is positioned outside the shell and is electrically connected with the circuit board; the protective cover is connected with the circuit board, and the field effect tube is covered and buckled in the cavity of the protective cover; the circuit board is provided with a through hole, and the through hole is positioned in the buckling space of the protective cover. According to the technical scheme provided by the embodiment of the invention, the rear cavity of the electret microphone can be enlarged through the protective cover, and the field effect tube is protected, so that the electret microphone can perform flat frequency response in a lower frequency range.
Description
Technical Field
The embodiment of the invention belongs to the technical field of electroacoustic conversion, and particularly relates to an electret microphone and a manufacturing method thereof.
Background
The electret microphone is a novel microphone made of electret materials, has the advantages of simple structure, high sensitivity and the like, and is widely applied to the aspects of voice pickup, acoustic signal detection and the like, and for example, the most typical application of the electret microphone is an electret microphone.
However, electret microphones have a relatively flat frequency response in the frequency range of 50-20 kHz, and typically have a formant at 10 kHz. However, when using microphones on some special devices, a flat frequency response is required in a lower frequency range, e.g. the frequency requirements of electret microphones in hearing aid microphones are more specific, which requires a flat frequency response in the frequency range of 2 kHz-8 kHz. Most of the existing electret microphones cannot meet the requirements.
Disclosure of Invention
In view of the above, the embodiments of the present invention provide an electret microphone and a manufacturing method thereof, which can make the electret microphone perform a flat frequency response in a lower frequency range.
In order to solve the technical problems in the prior art, the embodiment of the invention provides an electret microphone which comprises a shell, a vibrating assembly, a circuit board, a field effect tube and a protective cover; wherein,
the shell is of a cylindrical structure with one end open, and a first sound inlet hole is formed in one end opposite to the opening;
the vibration component is arranged inside the shell and is electrically connected with the circuit board;
the circuit board is covered on the opening;
the field effect tube is positioned outside the shell and is electrically connected with the circuit board;
the protective cover is connected with the circuit board, and the field effect tube is covered and buckled in the cavity of the protective cover; the circuit board is provided with a through hole, and the through hole is positioned in the buckling space of the protective cover.
Optionally, the protective cover is made of metal.
Optionally, the vibration component comprises a gasket, a vibrating diaphragm, a gasket, a polar plate and a spring sheet which are sequentially arranged and packaged in the shell;
the edge of the polar plate is provided with a plurality of evenly distributed gaps, the polar plate is electrically connected with the circuit board through the elastic sheet, and the circuit board is provided with an electrode electrically connected with the elastic sheet.
Optionally, the elastic sheet comprises two arc-shaped sections and two straight sections, and the arc-shaped sections and the straight sections are connected at intervals in an end-to-end mode;
the arc-shaped section protrudes towards the circuit board, and the arc-shaped section is provided with protruding points,
the straight section is provided with an arc-shaped connecting lug protruding towards the circuit board;
the convex points and the arc-shaped connecting lugs are electrically connected with the circuit board, and the straight section is connected with the polar plate.
Optionally, the housing includes a cylindrical side wall and a bottom plate;
the circuit board and the bottom plate are respectively covered at two ends of the cylindrical side wall, and sealing gaskets are arranged between the cylindrical side wall and the bottom plate and between the cylindrical side wall and the circuit board;
the first sound inlet holes are formed in the bottom plate, and damping cloth covering the first sound inlet holes is covered on the bottom plate.
Optionally, a second sound inlet hole is formed in the polar plate.
Correspondingly, the embodiment of the invention also provides a manufacturing method of the electret microphone, which comprises the following steps:
respectively acquiring a shell group board comprising a plurality of shells and a circuit board group board comprising a plurality of circuit boards;
assembling a vibration assembly individually within each of said housings through said housing openings;
pressing the circuit board assembly plates on the shell assembly plates to form electret microphone assembly plates, wherein each circuit board covers an opening of one shell;
installing a field effect transistor on each circuit board;
installing a protective cover on each circuit board, wherein the protective cover covers the field effect tube in a cavity of the protective cover; the circuit board is provided with a through hole, and the through hole is positioned in the buckling space of the protective cover;
cutting the electret microphone assembly plate to obtain a plurality of individual electret microphones.
Optionally, said opening through said housing individually assembles a vibration assembly within each of said housings, comprising:
and a gasket, a vibrating diaphragm, a gasket, a polar plate and an elastic sheet are sequentially placed and packaged through the opening.
Optionally, the mounting a field effect transistor on each circuit board, and the mounting a protective cover on each circuit board, includes:
and printing solder paste on the circuit board, and mounting the field effect tube and the protective cover through a surface mounting process.
Additionally, optionally, the housing assembly plate includes a cylindrical sidewall assembly plate and a bottom plate assembly plate;
the pressing the circuit board assembly plate on the shell assembly plate comprises the following steps:
sealing gaskets are respectively arranged at two ends of each cylindrical side wall of the cylindrical side wall group plate;
and pressing the circuit board group board and the bottom board group board at two ends of the cylindrical side wall group board, and respectively extruding the sealing gaskets at corresponding positions.
According to the technical scheme provided by the embodiment of the invention, the rear cavity of the electret microphone can be enlarged through the protective cover, and the field effect tube is protected, so that the electret microphone can perform flat frequency response in a lower frequency range.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description will be given below of the drawings required for the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention and do not constitute an undue limitation on the embodiments of the invention.
In the drawings:
fig. 1 is an exploded view of an electret microphone according to an embodiment of the present invention;
fig. 2 is a schematic diagram of the structure of an electret microphone according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a polar plate according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a spring plate according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an assembly process of a housing assembly board and a circuit board assembly board according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an assembled housing assembly board and circuit board assembly board according to an embodiment of the invention.
Description of the reference numerals
10: a housing; 11: a first sound inlet hole; 12: a cylindrical side wall; 13: a bottom plate; 14: a sealing gasket; 20: a vibration assembly; 21: a gasket; 22: a vibrating diaphragm; 23: a gasket; 24: a polar plate; 241: a notch; 242: a second sound inlet hole; 25: a spring plate; 251: an arc section; 252: a straight section; 253: a bump; 254: arc-shaped connecting lugs; 30: a circuit board; 31: a through hole; 40: a field effect transistor; 50: a protective cover; 60: a housing assembly plate; 61: a circuit board assembly; 62: a cylindrical side wall panel; 63: and (5) assembling the bottom plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the embodiments of the present invention.
The inventors have found that in the practice of the present invention, the frequency response of current electret microphones is relatively flat in the frequency range of 50-20 kHz, with a formant typically at 10 kHz. However, when using microphones on some special devices, a flat frequency response is required in a lower frequency range, and most electret microphones in the prior art are not satisfactory.
Therefore, to solve the defects in the prior art, the embodiment of the invention provides an electret microphone and a manufacturing method thereof, which can enable the electret microphone to perform flat frequency response in a lower frequency range.
The following will describe the implementation of the embodiments of the present invention in detail with reference to the drawings and examples, so that the implementation process of the embodiments of the present invention that apply technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented, and the following description will further describe the structure of the present invention with reference to the drawings.
The same or similar reference numbers in the drawings of embodiments of the invention correspond to the same or similar components; in the description of the embodiments of the present invention, it should be understood that, if there is an orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, so that the terms describing the positional relationship in the drawings are merely for exemplary illustration and are not to be construed as limiting the embodiments of the present invention, and that the specific meaning of the terms described above may be understood by those of ordinary skill in the art depending on the specific circumstances.
Example 1
Fig. 1 is an exploded structure view of an electret microphone according to an embodiment of the present invention, and fig. 2 is a structure view of the electret microphone according to an embodiment of the present invention, as shown in fig. 1 and 2.
An embodiment of the present invention provides an electret microphone, which includes a housing 10, a vibration assembly 20, a circuit board 30, a field effect transistor 40 (FET, field Effect Transistor, field effect transistor, abbreviated as field effect transistor), and a protective cover 50.
The casing 10 has a cylindrical structure with an opening at one end, and a first sound inlet 11 is disposed at an end opposite to the opening. The vibration assembly 20 is disposed inside the housing 10 and is electrically connected to the circuit board 30. The circuit board 30 is covered over the opening. The field effect transistor 40 is located outside the housing 10 and is electrically connected to the circuit board 30. The protective cover 50 is connected with the circuit board 30, and covers the field effect tube 40 in the cavity of the protective cover 50; the circuit board 30 is provided with a through hole 31, the through hole 31 is positioned in the cover fastening space of the protective cover 50, the cover fastening space surrounded by the protective cover 50 and the circuit board 30 is communicated with the inner space of the shell 10 by the through hole 31, and the rear cavity of the microphone is enlarged.
According to the technical scheme provided by the embodiment of the invention, the rear cavity of the electret microphone can be enlarged through the protective cover 50, and the field effect tube 40 is protected, so that the frequency response of the electret microphone in a lower frequency range can be regulated, and the electret microphone can perform flat frequency response in the lower frequency range.
In one embodiment of the present invention, the circuit board 30 is covered at the opening of the casing 10 by a pressing process, and compared with the prior art in which the gap between the circuit board 30 and the casing 10 is sealed by glue after laser spot welding, the assembling cost of the electret microphone can be greatly reduced by the pressing process, and the process difficulty is small and the operation is easy.
Further, in one embodiment of the present invention, the protective cover 50 is made of metal. The protective cover 50 made of metal material can prevent the interference of external electromagnetic waves to the protective cover 50 and the components in the housing 10. The size of the protective cover 50 can be adjusted according to different requirements, for example, the projection area on the circuit board 30, and the protective cover 50 is twice as large as the field effect transistor 40. The height of the protective cap 50 is twice the height of the field effect transistor 40 relative to the circuit board 30. The different dimensions of the protective cover 50 also allow the back volume of the microphone to be adjusted accordingly, so that the frequency response of the electret microphone in a lower frequency range can be adjusted.
With continued reference to fig. 1, in one possible embodiment of the invention, the vibration assembly 20 includes a gasket 21, a diaphragm 22, a spacer 23, a pole plate 24, and a spring 25 disposed and enclosed in that order within the housing 10. The gasket 21 is in close contact with the bottom of the housing 10, and the diaphragm 22 is prevented from making hard contact with the bottom of the housing 10 by the gasket 21. The pole plate 24 is electrically connected with the circuit board 30 through the elastic sheet 25, wherein the circuit board 30 is provided with an electrode electrically connected with the elastic sheet 25.
The gasket 23 is located between the polar plate 24 and the diaphragm 22, and the diaphragm 22 and the polar plate 24 form a capacitor due to the isolation effect of the gasket 23. When the diaphragm 22 is vibrated by the sound wave, the distance between the diaphragm 22 and the polar plate 24 will also change slightly, and the change will cause the capacitance between the diaphragm 22 and the polar plate 24 to change, so that the sound signal is converted into an electrical signal. Based on physical knowledge, the capacitance formed by two parallel metal plates is related to the facing areas of the two metal plates, and the smaller the facing area, the smaller the capacitance. By utilizing this principle, in solving the parasitic capacitance problem, the embodiment of the present invention uses the electrode plate 24 with the notch 241, specifically, referring to fig. 3, the edge of the electrode plate 24 is provided with a plurality of uniformly distributed notches 241, where the notches 241 include, but are not limited to, circular arc shapes or saw tooth shapes. The gap 241 can effectively reduce the facing area of the polar plate 24 and the diaphragm 22, thereby inhibiting parasitic capacitance generated between the polar plate 24 and the diaphragm 22. In addition, a second sound inlet 242 may be provided in the pole plate 24. The facing area of the polar plate 24 and the diaphragm 22 is reduced by the second sound inlet 242.
In one possible embodiment of the present invention, the implementation manner of the elastic sheet 25 includes a plurality of ways, and in one possible embodiment, referring to fig. 4, the elastic sheet 25 includes two arc segments 251 and two straight segments 252, where the arc segments 251 and the straight segments 252 are connected at intervals in an end-to-end manner. Wherein, the arc-shaped section 251 is protruded towards the circuit board 30, the arc-shaped section 251 is provided with a convex point 253, and the straight section 252 is provided with an arc-shaped connecting lug 254 protruded towards the circuit board 30. The bump 253 and the arc-shaped connecting lug 254 are electrically connected with the circuit board 30, and the flat section 252 is connected with the polar plate 24. The arc-shaped sections 251 and the straight sections 252 are connected at intervals in an end-to-end mode to form an annular structure, so that the weight of the elastic sheet 25 is reduced, and manufacturing cost is saved. The facing area between the elastic sheet 25 and the housing 10 is small, so that parasitic capacitance is not easy to generate between the elastic sheet 25 and the metal housing 10. The bump 253 and the arc-shaped connecting lug 254 form multi-point electrical connection with the circuit board 30, so that poor contact between the elastic sheet 25 and the circuit board 30 can be prevented.
With continued reference to fig. 1, in one possible embodiment of the invention, the housing 10 includes a cylindrical side wall 12 and a bottom plate 13. The circuit board 30 and the bottom plate 13 are respectively covered on both ends of the cylindrical side wall 12. The cylindrical side wall 12 encloses a housing chamber in which the vibration assembly 20 is mounted. The base 13 serves as a support for the vibration assembly 20. In order to seal the accommodating chamber, a gasket 14 is provided between the cylindrical sidewall 12 and the bottom plate 13 and between the cylindrical sidewall 12 and the circuit board 30, and the gasket 14 includes, but is not limited to, being made of PP (Polypropylene) material. The first sound inlet 11 is arranged on the bottom plate 13, and the bottom plate 13 is covered with damping cloth covering the first sound inlet 11. The sealing pad 14 can prevent impurities such as dust and water vapor from entering the shell 10 through gaps between the cylindrical side wall 12 and the bottom plate 13 or between the cylindrical side wall 12 and the circuit board 30, the damping cloth can prevent impurities such as dust from entering the shell 10 through the first sound inlet 11 of the bottom plate 13, and the purpose of protecting the internal elements of the electret microphone can be achieved through the sealing pad 14 and the damping cloth.
Example 2
Referring to fig. 5 and 6, correspondingly, the embodiment of the present invention also provides a method for manufacturing an electret microphone, and the electret microphone described in embodiment 1 can be manufactured by the method of embodiment 2. Specifically, the method comprises the following steps:
step S101: respectively acquiring a housing group board 60 including a plurality of housings 10 and a circuit board group board 61 including a plurality of circuit boards 30;
step S102: a vibration assembly 20 is individually assembled in each housing 10 through the opening of the housing 10;
step S103: pressing the circuit board assembly 61 onto the case assembly 60 to form electret microphone assembly boards, wherein each circuit board 30 covers an opening of one case 10;
step S104: mounting a field effect transistor 40 on each circuit board 30;
step S105: a protective cover 50 is arranged on each circuit board 30, wherein the protective cover 50 covers the field effect tube 40 in the cavity of the protective cover 50; the circuit board 30 is provided with a through hole 31, and the through hole 31 is positioned in the buckling space of the protective cover 50;
step S106: the electret microphone set plate is cut to obtain a plurality of individual electret microphones.
Further, for step S102, one vibration assembly 20 is individually assembled in each housing 10 through the opening of the housing 10, including: through the opening, a gasket 21, a diaphragm 22, a gasket 23, a polar plate 24 and a spring plate 25 are placed and encapsulated in sequence.
Further, for step S104 and step S105, mounting the field effect transistor 40 on each circuit board 30 and mounting the protection cover 50 on each circuit board 30 includes: solder paste is printed on the circuit board 30, and the fet 40 and the protective cap 50 are mounted by a surface mount process (SMT, surface Mounted Technology). Firstly, the field effect tube 40 is attached to the circuit board 30, then the protective cover 50 is attached to the circuit board 30, and the field effect tube 40 is covered and buckled in the cavity of the protective cover 50.
Further, the case set plate 60 includes a cylindrical side wall set plate 62 and a bottom plate set plate 63. For step S103, pressing the circuit board assembly board 61 onto the housing assembly board 60 includes:
sealing gaskets 14 are respectively arranged at two ends of each cylindrical side wall 12 of the cylindrical side wall group plate 62;
the circuit board assembly 61 and the bottom board assembly 63 are pressed against both ends of the cylindrical side wall assembly 62, and the gaskets 14 at the corresponding positions are pressed respectively.
The technical features of embodiment 2 and embodiment 1 may be referred to each other, and will not be described in detail here.
In summary, according to the technical solution provided in the embodiments of the present invention, the back cavity of the electret microphone can be enlarged by the protective cover 50, and the field effect tube 40 is protected, so that the electret microphone can perform a flat frequency response in a lower frequency range. In addition, in the embodiment of the invention, the circuit board 30 is covered at the opening of the shell 10 through the pressing process, compared with the scheme of sealing the gap between the circuit board 30 and the shell 10 by glue after laser spot welding in the prior art, the assembly cost of the electret microphone can be greatly reduced through the pressing process, and the process difficulty is small and the operation is easy.
It should be noted that, although the specific embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention should not be construed as limiting the scope of the present invention. Various modifications and variations which may be made by those skilled in the art without the creative effort fall within the protection scope of the present invention within the scope described in the claims.
Examples of embodiments of the present invention are intended to briefly illustrate technical features of embodiments of the present invention so that those skilled in the art may intuitively understand the technical features of the embodiments of the present invention, and are not meant to be undue limitations of the embodiments of the present invention.
The apparatus embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separate. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
While the foregoing description illustrates and describes several preferred embodiments of the present invention, it is to be understood that the embodiments of the invention are not limited to the forms disclosed herein, but are not to be construed as excluding other embodiments, and that various other combinations, modifications and environments are possible and may be made within the scope of the application described herein, either by way of the foregoing teachings or by way of the relevant art or knowledge. And that modifications and variations such as will be apparent to those skilled in the art are intended to be included within the spirit and scope of embodiments of the invention as defined by the following claims.
Claims (10)
1. An electret microphone is characterized by comprising a shell, a vibration assembly, a circuit board, a field effect tube and a protective cover; wherein,
the shell is of a cylindrical structure with one end open, and a first sound inlet hole is formed in one end opposite to the opening;
the vibration component is arranged inside the shell and is electrically connected with the circuit board;
the circuit board is covered on the opening;
the field effect tube is positioned outside the shell and is electrically connected with the circuit board;
the protective cover is connected with the circuit board, and the field effect tube is covered and buckled in the cavity of the protective cover; the circuit board is provided with a through hole, and the through hole is positioned in the buckling space of the protective cover.
2. The electret microphone of claim 1 wherein the protective cover is made of metal.
3. The electret microphone of claim 1 wherein the vibration assembly comprises a gasket, a diaphragm, a spacer, a polar plate, and a dome placed in sequence and encapsulated inside the housing;
the edge of the polar plate is provided with a plurality of evenly distributed gaps, the polar plate is electrically connected with the circuit board through the elastic sheet, and the circuit board is provided with an electrode electrically connected with the elastic sheet.
4. The electret microphone of claim 3 wherein the spring comprises two arcuate segments and two straight segments, the arcuate segments and the straight segments being connected end to end at a spacing;
the arc-shaped section protrudes towards the circuit board, and the arc-shaped section is provided with protruding points,
the straight section is provided with an arc-shaped connecting lug protruding towards the circuit board;
the convex points and the arc-shaped connecting lugs are electrically connected with the circuit board, and the straight section is connected with the polar plate.
5. The electret microphone of any one of claims 1 to 4 wherein the housing comprises a cylindrical side wall and a base plate;
the circuit board and the bottom plate are respectively covered at two ends of the cylindrical side wall, and sealing gaskets are arranged between the cylindrical side wall and the bottom plate and between the cylindrical side wall and the circuit board;
the first sound inlet holes are formed in the bottom plate, and damping cloth covering the first sound inlet holes is covered on the bottom plate.
6. The electret microphone according to any one of claims 3 to 4, characterized in that the plate is provided with a second sound inlet.
7. A method of making an electret microphone, comprising:
respectively acquiring a shell group board comprising a plurality of shells and a circuit board group board comprising a plurality of circuit boards;
assembling a vibration assembly individually within each of said housings through said housing openings;
pressing the circuit board assembly plates on the shell assembly plates to form electret microphone assembly plates, wherein each circuit board covers an opening of one shell;
installing a field effect transistor on each circuit board;
installing a protective cover on each circuit board, wherein the protective cover covers the field effect tube in a cavity of the protective cover; the circuit board is provided with a through hole, and the through hole is positioned in the buckling space of the protective cover;
cutting the electret microphone assembly plate to obtain a plurality of individual electret microphones.
8. The method of claim 7, wherein said individually assembling a vibration assembly within each of said housings through said housing opening comprises:
and a gasket, a vibrating diaphragm, a gasket, a polar plate and an elastic sheet are sequentially placed and packaged through the opening.
9. The method of claim 7 or 8, wherein said mounting a field effect transistor on each of said circuit boards, and said mounting a protective cover on each of said circuit boards, comprises:
and printing solder paste on the circuit board, and mounting the field effect tube and the protective cover through a surface mounting process.
10. The method of claim 7 or 8, wherein the shell stack plate comprises a cylindrical sidewall stack plate and a bottom plate stack plate;
the pressing the circuit board assembly plate on the shell assembly plate comprises the following steps:
sealing gaskets are respectively arranged at two ends of each cylindrical side wall of the cylindrical side wall group plate;
and pressing the circuit board group board and the bottom board group board at two ends of the cylindrical side wall group board, and respectively extruding the sealing gaskets at corresponding positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811369165.0A CN109451410B (en) | 2018-11-16 | 2018-11-16 | Electret microphone and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811369165.0A CN109451410B (en) | 2018-11-16 | 2018-11-16 | Electret microphone and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109451410A CN109451410A (en) | 2019-03-08 |
| CN109451410B true CN109451410B (en) | 2024-01-16 |
Family
ID=65553041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811369165.0A Active CN109451410B (en) | 2018-11-16 | 2018-11-16 | Electret microphone and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109451410B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007032579A1 (en) * | 2005-09-15 | 2007-03-22 | Bse Co., Ltd. | Electret condenser microphone for surface mounting and main board including the same |
| CN202395980U (en) * | 2011-12-19 | 2012-08-22 | 昌邑市新达电声科技有限公司 | Capacitive electret microphone |
| CN102917302A (en) * | 2012-10-09 | 2013-02-06 | 深圳市豪恩声学股份有限公司 | Unidirectional electret microphone |
| CN209017314U (en) * | 2018-11-16 | 2019-06-21 | 歌尔股份有限公司 | A kind of electret microphone |
-
2018
- 2018-11-16 CN CN201811369165.0A patent/CN109451410B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007032579A1 (en) * | 2005-09-15 | 2007-03-22 | Bse Co., Ltd. | Electret condenser microphone for surface mounting and main board including the same |
| CN202395980U (en) * | 2011-12-19 | 2012-08-22 | 昌邑市新达电声科技有限公司 | Capacitive electret microphone |
| CN102917302A (en) * | 2012-10-09 | 2013-02-06 | 深圳市豪恩声学股份有限公司 | Unidirectional electret microphone |
| CN209017314U (en) * | 2018-11-16 | 2019-06-21 | 歌尔股份有限公司 | A kind of electret microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109451410A (en) | 2019-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7260230B2 (en) | High performance microphone and manufacturing method thereof | |
| JP3908059B2 (en) | Electret condenser microphone | |
| JP4751057B2 (en) | Condenser microphone and manufacturing method thereof | |
| EP0371620B1 (en) | Electret condenser microphone | |
| TWI376963B (en) | ||
| US20030063768A1 (en) | Microphone for a hearing aid or listening device with improved dampening of peak frequency response | |
| US8144898B2 (en) | High performance microphone and manufacturing method thereof | |
| WO2009051317A1 (en) | Mems microphone package | |
| KR20000062580A (en) | Electroacoustic Transducer | |
| EP1699258B1 (en) | Electro-acoustic transducer with holder | |
| CN1757261A (en) | Electret condenser microphone | |
| CN101141833B (en) | Electret condenser microphone | |
| JP4205420B2 (en) | Microphone device and holder | |
| CN109451410B (en) | Electret microphone and manufacturing method | |
| KR20020089145A (en) | Electrostatic microphone | |
| KR20130062569A (en) | Microphone assembly having ear set function and method of making the same | |
| CN209017314U (en) | A kind of electret microphone | |
| KR20080010293A (en) | Condenser microphone | |
| KR100464700B1 (en) | Electret condenser microphone | |
| KR100797438B1 (en) | Microphone without curling process and method of assemblying the microphone | |
| JP4014886B2 (en) | Condenser microphone | |
| WO2006085707A1 (en) | Case of condenser microphone having ventilation slit | |
| CN209982669U (en) | Microphone packaging structure and electronic equipment | |
| JP2003087898A (en) | Condenser microphone | |
| JP2008035045A (en) | Condenser microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200604 Address after: 261031 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 No. 268 Dongfang Road, Weifang hi tech Industrial Development Zone, Shandong, Weifang Applicant before: GOERTEK Inc. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |