WO2006081519A3 - Procedes et appareil permettant d'ameliorer le fonctionnement de manipulateurs de supports de substrats - Google Patents

Procedes et appareil permettant d'ameliorer le fonctionnement de manipulateurs de supports de substrats Download PDF

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Publication number
WO2006081519A3
WO2006081519A3 PCT/US2006/003130 US2006003130W WO2006081519A3 WO 2006081519 A3 WO2006081519 A3 WO 2006081519A3 US 2006003130 W US2006003130 W US 2006003130W WO 2006081519 A3 WO2006081519 A3 WO 2006081519A3
Authority
WO
WIPO (PCT)
Prior art keywords
tool
methods
substrate carrier
carrier handlers
specific carrier
Prior art date
Application number
PCT/US2006/003130
Other languages
English (en)
Other versions
WO2006081519A2 (fr
Inventor
Michael Teferra
Amitabh Puri
Eric Englhardt
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/067,302 external-priority patent/US20050209721A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR1020067022889A priority Critical patent/KR101079487B1/ko
Priority to CN2006800002053A priority patent/CN101273312B/zh
Publication of WO2006081519A2 publication Critical patent/WO2006081519A2/fr
Publication of WO2006081519A3 publication Critical patent/WO2006081519A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)

Abstract

Cette invention concerne des systèmes, des outils et des procédés selon lesquels un premier signal est envoyé d'un outil à un équipement de fabrication (Fab), lequel signal indique que tous les substrats à traiter ont été retirés d'un support spécifique et que le support spécifique peut être temporairement déchargé d'un port de chargement de l'outil. Un deuxième signal est envoyé de l'outil à l'équipement de fabrication, lequel deuxième signal indique que le support spécifique peut être renvoyé à l'outil. Tandis que le support est déchargé de l'outil, d'autres supports peuvent être chargés sur le port de chargement libéré. Cette invention porte également sur un grand nombre d'autres caractéristiques et aspects.
PCT/US2006/003130 2005-01-28 2006-01-27 Procedes et appareil permettant d'ameliorer le fonctionnement de manipulateurs de supports de substrats WO2006081519A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020067022889A KR101079487B1 (ko) 2005-01-28 2006-01-27 기판 캐리어 핸들러의 향상된 동작을 위한 방법 및 장치
CN2006800002053A CN101273312B (zh) 2005-01-28 2006-01-27 增强衬底载具搬运器操作的方法和装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US64883805P 2005-01-28 2005-01-28
US60/648,838 2005-01-28
US11/067,302 2005-02-25
US11/067,302 US20050209721A1 (en) 2003-11-06 2005-02-25 Methods and apparatus for enhanced operation of substrate carrier handlers

Publications (2)

Publication Number Publication Date
WO2006081519A2 WO2006081519A2 (fr) 2006-08-03
WO2006081519A3 true WO2006081519A3 (fr) 2007-02-01

Family

ID=36657280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/003130 WO2006081519A2 (fr) 2005-01-28 2006-01-27 Procedes et appareil permettant d'ameliorer le fonctionnement de manipulateurs de supports de substrats

Country Status (4)

Country Link
KR (1) KR101079487B1 (fr)
CN (1) CN101273312B (fr)
TW (1) TWI350812B (fr)
WO (1) WO2006081519A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
JP2010115723A (ja) * 2008-11-11 2010-05-27 Seiko Epson Corp ロボット及びロボットシステム
JP5440518B2 (ja) 2011-01-20 2014-03-12 パナソニック株式会社 部品実装装置および部品実装装置における機種切替え方法
US9576834B2 (en) * 2015-03-16 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Stocker and method for dispatching wafer carrier in stocker
CN106909129B (zh) * 2017-02-23 2019-10-18 惠科股份有限公司 一种搬运管理的方法及系统
TWI695805B (zh) * 2019-08-14 2020-06-11 力晶積成電子製造股份有限公司 貨物搬運系統及貨物搬運方法
CN115332128A (zh) * 2022-10-14 2022-11-11 西安奕斯伟材料科技有限公司 晶圆载具管理系统及方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63234511A (ja) * 1987-03-24 1988-09-29 Nec Kyushu Ltd 半導体基板処理装置
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
JPH06132696A (ja) * 1992-10-20 1994-05-13 Tokico Ltd 基板搬送装置
EP0850720A1 (fr) * 1996-12-24 1998-07-01 Datalogic S.P.A. Procédé de fabrication d'un article
WO1999028952A2 (fr) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Interface de port de chargement a localisation de plaquettes
US20020114684A1 (en) * 2001-02-22 2002-08-22 Gyu-Chan Jeong Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same
US20030202866A1 (en) * 2002-04-25 2003-10-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for identifying a wafer cassette
US20040187342A1 (en) * 2003-03-25 2004-09-30 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus
WO2005006408A1 (fr) * 2003-07-11 2005-01-20 Tec-Sem Ag Dispositif de livraison pour des postes d'usinage de plaquettes

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100278600B1 (ko) * 1998-01-14 2001-01-15 윤종용 반도체 제조설비 관리시스템의 설비유닛의 상태 관리방법
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
JP3911624B2 (ja) * 2001-11-30 2007-05-09 東京エレクトロン株式会社 処理システム

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63234511A (ja) * 1987-03-24 1988-09-29 Nec Kyushu Ltd 半導体基板処理装置
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
JPH06132696A (ja) * 1992-10-20 1994-05-13 Tokico Ltd 基板搬送装置
EP0850720A1 (fr) * 1996-12-24 1998-07-01 Datalogic S.P.A. Procédé de fabrication d'un article
WO1999028952A2 (fr) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Interface de port de chargement a localisation de plaquettes
US20020114684A1 (en) * 2001-02-22 2002-08-22 Gyu-Chan Jeong Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same
US20030202866A1 (en) * 2002-04-25 2003-10-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for identifying a wafer cassette
US20040187342A1 (en) * 2003-03-25 2004-09-30 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus
WO2005006408A1 (fr) * 2003-07-11 2005-01-20 Tec-Sem Ag Dispositif de livraison pour des postes d'usinage de plaquettes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 034 (E - 708) 25 January 1989 (1989-01-25) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 425 (E - 1590) 9 August 1994 (1994-08-09) *

Also Published As

Publication number Publication date
KR20070097299A (ko) 2007-10-04
TWI350812B (en) 2011-10-21
KR101079487B1 (ko) 2011-11-03
CN101273312A (zh) 2008-09-24
CN101273312B (zh) 2012-07-04
TW200635840A (en) 2006-10-16
WO2006081519A2 (fr) 2006-08-03

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