TWI350812B - Methods and apparatus for enhanced operation of substrate carrier handlers - Google Patents

Methods and apparatus for enhanced operation of substrate carrier handlers

Info

Publication number
TWI350812B
TWI350812B TW095103794A TW95103794A TWI350812B TW I350812 B TWI350812 B TW I350812B TW 095103794 A TW095103794 A TW 095103794A TW 95103794 A TW95103794 A TW 95103794A TW I350812 B TWI350812 B TW I350812B
Authority
TW
Taiwan
Prior art keywords
methods
substrate carrier
enhanced operation
carrier handlers
handlers
Prior art date
Application number
TW095103794A
Other languages
English (en)
Other versions
TW200635840A (en
Inventor
Michael Teferra
Amitabh Puri
Eric Englhardt
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/067,302 external-priority patent/US20050209721A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200635840A publication Critical patent/TW200635840A/zh
Application granted granted Critical
Publication of TWI350812B publication Critical patent/TWI350812B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
TW095103794A 2005-01-28 2006-02-03 Methods and apparatus for enhanced operation of substrate carrier handlers TWI350812B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64883805P 2005-01-28 2005-01-28
US11/067,302 US20050209721A1 (en) 2003-11-06 2005-02-25 Methods and apparatus for enhanced operation of substrate carrier handlers

Publications (2)

Publication Number Publication Date
TW200635840A TW200635840A (en) 2006-10-16
TWI350812B true TWI350812B (en) 2011-10-21

Family

ID=36657280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103794A TWI350812B (en) 2005-01-28 2006-02-03 Methods and apparatus for enhanced operation of substrate carrier handlers

Country Status (4)

Country Link
KR (1) KR101079487B1 (zh)
CN (1) CN101273312B (zh)
TW (1) TWI350812B (zh)
WO (1) WO2006081519A2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
JP2010115723A (ja) * 2008-11-11 2010-05-27 Seiko Epson Corp ロボット及びロボットシステム
JP5440518B2 (ja) 2011-01-20 2014-03-12 パナソニック株式会社 部品実装装置および部品実装装置における機種切替え方法
US9576834B2 (en) * 2015-03-16 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Stocker and method for dispatching wafer carrier in stocker
CN106909129B (zh) * 2017-02-23 2019-10-18 惠科股份有限公司 一种搬运管理的方法及系统
TWI695805B (zh) * 2019-08-14 2020-06-11 力晶積成電子製造股份有限公司 貨物搬運系統及貨物搬運方法
CN115332128A (zh) * 2022-10-14 2022-11-11 西安奕斯伟材料科技有限公司 晶圆载具管理系统及方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63234511A (ja) * 1987-03-24 1988-09-29 Nec Kyushu Ltd 半導体基板処理装置
KR0139785B1 (ko) 1990-03-20 1998-07-15 카자마 젠쥬 웨이퍼 정렬 기능을 가진 웨이퍼 카운트 장치
JPH06132696A (ja) * 1992-10-20 1994-05-13 Tokico Ltd 基板搬送装置
EP0850720B1 (en) * 1996-12-24 2002-09-18 Datasensor S.p.A. Manufacturing process for an article
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
KR100278600B1 (ko) * 1998-01-14 2001-01-15 윤종용 반도체 제조설비 관리시스템의 설비유닛의 상태 관리방법
KR100410991B1 (ko) * 2001-02-22 2003-12-18 삼성전자주식회사 반도체 제조장치의 로드포트
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
JP3911624B2 (ja) * 2001-11-30 2007-05-09 東京エレクトロン株式会社 処理システム
US6716651B2 (en) * 2002-04-25 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for identifying a wafer cassette
JP2004296506A (ja) * 2003-03-25 2004-10-21 Dainippon Screen Mfg Co Ltd 基板処理方法およびその装置
CH696829A5 (de) * 2003-07-11 2007-12-14 Tec Sem Ag Beschickungseinrichtung für Waferverarbeitungsprozesse.

Also Published As

Publication number Publication date
KR101079487B1 (ko) 2011-11-03
CN101273312B (zh) 2012-07-04
CN101273312A (zh) 2008-09-24
WO2006081519A3 (en) 2007-02-01
KR20070097299A (ko) 2007-10-04
TW200635840A (en) 2006-10-16
WO2006081519A2 (en) 2006-08-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees