WO2006080201A1 - Dispositif d'affichage a cristaux liquides - Google Patents

Dispositif d'affichage a cristaux liquides Download PDF

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Publication number
WO2006080201A1
WO2006080201A1 PCT/JP2006/300440 JP2006300440W WO2006080201A1 WO 2006080201 A1 WO2006080201 A1 WO 2006080201A1 JP 2006300440 W JP2006300440 W JP 2006300440W WO 2006080201 A1 WO2006080201 A1 WO 2006080201A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid crystal
aluminum heat
wall
resin frame
plate
Prior art date
Application number
PCT/JP2006/300440
Other languages
English (en)
Japanese (ja)
Inventor
Motoji Egawa
Hiroshi Johmen
Original Assignee
Minebea Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005020377A external-priority patent/JP4618546B2/ja
Priority claimed from JP2005020378A external-priority patent/JP2006208723A/ja
Application filed by Minebea Co., Ltd. filed Critical Minebea Co., Ltd.
Publication of WO2006080201A1 publication Critical patent/WO2006080201A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package

Definitions

  • the present invention relates to an improvement of a liquid crystal display device provided with a sidelight type planar illumination device.
  • Liquid crystal display devices are widely used as display means of today's electronic devices, but since this liquid crystal display device is not self-luminous, it is necessary to ensure visibility at night or in dark places.
  • the lighting means is necessary.
  • planar illumination devices have been used as such illumination means.
  • a side-light type planar lighting device is widely used.
  • a side-light type planar illumination device is composed of a light guide plate having translucency and a rod-like light source such as a fluorescent tube arranged on a side end surface of the light guide plate (for example, Patent Document 1). ).
  • a planar lighting device having a point light source capable of simplifying a drive circuit is used due to an increase in applications to small electronic devices such as portable information terminals. (For example, refer to Patent Document 2.) 0
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2003-338214 ([0013] to [0017], [0022])
  • Patent Document 2 Japanese Patent Laid-Open No. 2004-186004 ([Claim 1], FIG. 2)
  • a surface illumination device for a liquid crystal display device having a relatively large display area which is used for stationary equipment such as industrial machines and car navigation systems, needs to illuminate a wide area with high brightness.
  • a fluorescent tube is generally used as the primary light source.
  • An example of the structure of the liquid crystal display device 10 is shown in FIG.
  • an aluminum heat sink 18 is laid on the surface of the floor plate 16 of the resin frame 12 having the frame 14 and the floor plate 16 surrounded by the frame 14 together with a reflection sheet (not shown).
  • a reflection sheet (not shown).
  • the light guide plate 20 and optical sheets are installed one on top of the other, and the fluorescent tube 22 extends along the side edge of the light guide plate 20 in the light source installation space. Is arranged.
  • a liquid crystal panel 24 is overlaid on the frame body 14 of the resin frame 12.
  • a circuit board 26 for driving the liquid crystal panel 24 and the like is fixed to the back surface of the floor plate 16 of the resin frame 12.
  • the liquid crystal panel 24 side force of the resin frame 12 is covered with a face cover 28 having an opening 28a for the liquid crystal panel 24, and from the circuit board 26 side, the electromagnetic shielding of the circuit board 26 is secured.
  • a shield cover 30 for covering each of the parts is put on and each part is integrally formed.
  • the fluorescent tube 22 as a light source is an LED (white color) excellent in environmental resistance and impact resistance, as in the case of a liquid crystal display device having a relatively small display area.
  • LED white color
  • the current supplied to the LED it is necessary to increase the current supplied to the LED or to use a large number of LEDs. Both of these configurations cause an increase in the amount of heat generated by the LED power accompanying an increase in the power consumption of the LED, resulting in conflicting problems such as a significant reduction in the luminous efficiency of the LED. .
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a sufficient illumination capability for a sidelight type planar illumination device in a liquid crystal display device having a relatively large display area. It is necessary to ensure the cost reduction by replacing the fluorescent tube, which is the light source, with the LED, and to reduce the heat dissipation of the LED.
  • a planar lighting device has a liquid crystal panel and a sidelight type planar lighting device and a circuit board positioned with a resin frame interposed therebetween. And a liquid crystal display device having a structure in which a shield cover is put on each side of the circuit board, and the respective parts are integrated together.
  • the oil frame has a frame body and a floor plate surrounded by the frame body, and an aluminum heat sink is laid on the surface of the floor plate, and on one side of the grease frame on the aluminum heat sink plate.
  • the light guide plate of the planar lighting device is installed in a state where a light source installation space of a certain width is secured along the frame body, and the liquid crystal panel is overlaid on the frame body of the resin frame.
  • a circuit board is fixed to the rear surface of the floor plate, and a wall parallel to the side end surface of the light guide plate is disposed on the side of the light guide plate at a portion facing the light source installation space of the aluminum radiator plate.
  • a plurality of LEDs mounted on the FPC are closely attached and fixed to the side wall surface of the light guide plate via the FPC in a state of being opposed to the side end surface of the light guide plate, and the shield frame is attached to the shield cover.
  • a cut-and-raised portion that penetrates through the floor plate and comes into close contact with the portion of the aluminum heat sink that faces the light source installation space is formed, and the cut-and-raised portion formed on the shielding force bar penetrates the floor plate of the resin frame. A through hole is formed.
  • the liquid crystal panel and the sidelight type planar lighting device and the circuit board are positioned across the resin frame, and the face cover is arranged from the liquid crystal panel side of the resin frame to the circuit board.
  • the frame on one side of the resin frame A wall parallel to the side end surface of the light guide plate is erected at a predetermined distance from the side end surface of the light guide plate in a light source installation space of a constant width provided along the light guide plate side wall surface of the light guide plate.
  • a plurality of LEDs mounted on the FPC are in close contact with and fixed to the side end face of the light guide plate through the FPC, so that the light guide plate is illuminated by the LEDs.
  • the LED support means is constituted by the wall, and the heat of the LED is transmitted to the wall, so that the wall also functions as the LED heat dissipation means.
  • the cut and raised formed in the shield force bar is brought into close contact with the wall through the through hole in the floor plate of the resin frame, so that the aluminum heat sink and the shield cover are in physical contact with each other. Aluminum heat sink and Heat exchange with the first cover becomes possible. Therefore, the heat of the LED is dissipated to the outside of the liquid crystal display device through each part of the wall, the aluminum heat sink, the cut and raised shield cover, and the LED is cooled.
  • the LED cooling effect can also be obtained by discharging the heat of the LED trapped in the light source installation space from the through-hole formed in the floor plate of the resin frame.
  • the wall of the aluminum heat radiating plate that is erected in the light source installation space is such that the end of the aluminum heat radiating plate stands up in a wall shape. Therefore, the wall is integrated with the aluminum heat sink. Therefore, the heat of the LED is smoothly transferred to the aluminum heat sink, and the LED heat is further cut and raised, dissipated to the outside of the liquid crystal display device via each part of the shield cover, and the LED is cooled. .
  • the liquid crystal panel and the sidelight type planar lighting device and the circuit board are positioned with the resin frame interposed therebetween.
  • a liquid crystal display device having a structure in which the liquid crystal panel side force face cover of the resin frame is covered with a shield cover, such as a circuit board side cover, and the parts are integrated.
  • the resin frame includes a frame body and a floor plate surrounded by the frame body, and an aluminum heat sink is laid on the surface of the floor plate, and one side of the resin frame is disposed on the aluminum heat sink plate.
  • the light guide plate of the planar lighting device is installed in a state where a light source installation space of a certain width is secured along the frame body, and a liquid crystal panel is overlaid on the frame body of the resin frame.
  • a circuit board is fixed to the back surface of the floor board.
  • the wall of the aluminum radiator plate facing the light source installation space is parallel to the side end surface of the light guide plate and has a higher thermal conductivity than the material of the aluminum radiator plate.
  • a plurality of LEDs mounted on the FPC are arranged opposite to the side end surface of the light guide plate.
  • the shield cover penetrates the floor plate of the resin frame and forms a cut-out that closely contacts the portion of the aluminum heat sink that faces the light source installation space.
  • a through hole is formed in the floor plate of the resin frame, through which a cut and raised formed in the shield cover passes.
  • the liquid crystal panel and the surface of the sidelight system are sandwiched between the resin frames.
  • the circuit board is positioned, the face cover is covered from the liquid crystal panel side of the resin frame, and the shield cover is also put on the circuit board side force, so that the respective parts are integrated.
  • the side end face of the light guide plate A wall made of a metal that is parallel and has a higher thermal conductivity than the material of the aluminum heat sink is erected with a predetermined distance from the side end face of the light guide plate, and on the side wall surface of the light guide plate of the wall, A plurality of LEDs mounted on the FPC are closely fixed via the FPC in a state of being opposed to the side end face of the light guide plate, so that the light guide plate is illuminated by the LEDs.
  • the LED support means is constituted by the wall, and the heat of the LED is transmitted to the wall, so that the wall also functions as the LED heat dissipation means.
  • the cutting and raising formed on the shield cover penetrates through the through hole in the floor plate of the resin frame and comes into close contact with the aluminum heat sink with the wall fixed, so that the aluminum heat sink and the shield cover are physically connected. Heat exchange between the wall, aluminum heat sink, and shield cover. Therefore, the heat of the LED is dissipated to the outside of the liquid crystal display device through the walls, the aluminum heat sink, the cut and raised parts, and the LED is cooled.
  • the wall has a higher thermal conductivity than the material of the aluminum heat sink and is made of metal, so the cooling effect of the LED through the wall is further enhanced.
  • the LED cooling effect can also be obtained by discharging the heat of the LED trapped in the light source installation space from the through-hole formed in the floor plate of the resin frame.
  • the wall fixed to the portion of the aluminum heat radiating plate facing the light source installation space is composed of a prismatic member having a thickness greater than that of the aluminum heat radiating plate.
  • the high thermal conductivity of the wall allows the heat of the LED to be absorbed sufficiently by the wall and allows the LED to be efficiently cooled.
  • a method of fixing the wall to the aluminum heat sink not only adhesion but also screwing can be performed using the thickness of the prismatic member.
  • the present invention is configured as described above, in a liquid crystal display device having a relatively large display area, a fluorescent tube as a light source is used as an LED while ensuring the illumination capability required for a sidelight type planar illumination device. It is possible to realize cost reduction by replacing and LED heat dissipation measures.
  • FIG. 1 is an exploded view of a liquid crystal display device according to a first embodiment of the present invention.
  • FIG. 2 is a plan view showing a state in which the liquid crystal display device shown in FIG. 1 has a face cover and a liquid crystal panel removed.
  • FIG. 3 is a cross-sectional view taken along line AA in FIG.
  • FIG. 4 is a cross-sectional view of a liquid crystal display device according to a second embodiment of the present invention, and shows a cross-sectional view of a portion corresponding to FIG. 3 of the liquid crystal display device according to the first embodiment of the present invention. It is a thing.
  • FIG. 5 is an exploded view of a conventional liquid crystal display device.
  • the liquid crystal display device 32 includes a frame 14 and a floor plate 16 surrounded by the frame 14, and the surface of the floor plate 16 has a reflection (not shown)
  • An aluminum heat sink 18 is laid together with the sheet, and on the aluminum heat sink 18, a certain width (a width capable of installing the fluorescent tube 22 in FIG. 5) along the frame 14 a on one side of the resin frame 12.
  • the light guide plate 20 and optical sheets (not shown) are stacked in a state where the light source installation space S is secured.
  • the printed circuit board FPC34 is A plurality of mounted LEDs 36 are arranged to face the side end face of the light guide plate 20.
  • a wall 18a parallel to the side end face of the light guide plate 20 is provided at a portion facing the light source installation space S of the aluminum heat radiating plate 18 with a predetermined distance (FPC34 and LED36 from the side end face of the light guide plate 20).
  • a plurality of LEDs 36 are disposed opposite to the side end surface of the light guide plate 20 by adhering and fixing the FPC 34 to the side wall surface of the light guide plate of the wall 18a. It is fixed in the state.
  • the wall 18a erected in the light source installation space S is such that the end of the aluminum heat radiating plate 18 stands up in a wall shape.
  • a liquid crystal panel 24 is overlaid on the frame body 14 of the resin frame 12.
  • a circuit board 26 for driving the liquid crystal panel 24 and the like is fixed to the back surface of the floor board 16 of the resin frame 12.
  • the liquid crystal panel 24 side of the resin frame 12 is covered with a face cover 28 in which an opening 28a for the liquid crystal panel 24 is formed, and the circuit board 26 side ensures electromagnetic shielding of the circuit board 26.
  • each part is covered with a shield cover 30 and the parts are integrated together.
  • the shield cover 30 is a sheet metal part.
  • the shield cover 30 is formed with a cut-and-raised 30a.
  • the cut-and-raised 30a passes through the floor plate 16 of the resin frame 14 to the surface of the wall 18a formed in the part facing the light source installation space of the aluminum heat sink 18 on the side opposite to the surface to which the FPC 34 is bonded. It is closely attached to.
  • a through hole 16a through which the cut and raised 30a of the shield cover 30 passes is formed in the floor plate 16 of the resin frame 14. Note that the wall 18a and the cut-and-raised 30a may be bonded and fixed by an adhesive having a good thermal conductivity even in a state where they are simply pressed.
  • the light source installation space S in the above structure is a space where the fluorescent tube 22 is arranged in the conventional example shown in FIG. 5, and the fluorescent tube 22 that requires a relatively large installation volume is deleted.
  • the space created by this is effectively used to install the LED36.
  • the light guide plate 20, the liquid crystal panel 24, the circuit board 26, and the face cover 28 have the same shape as the conventional example shown in FIG.
  • the resin frame 12, the aluminum heat sink 18, and the shield cover 30 also have only a through hole 16a, a wall 18a, and a cut-and-raised 30a, respectively, added to the conventional shape. By making changes, it becomes possible to mold the required shape.
  • the aluminum heat dissipation plate 18 laid on the surface of the floor plate 16 of the resin frame 12 is led to the light source installation space S having a constant width provided along the frame body 14a on one side of the resin frame 12.
  • a wall 18a parallel to the side end surface of the light plate 20 is erected with a predetermined distance from the side end surface of the light guide plate 20, and a plurality of LEDs 36 mounted on the FPC 34 are mounted on the wall surface of the wall 18a on the light guide plate side.
  • the light guide plate 20 is illuminated by the LED 36 by being in close contact with and fixed to the side end face of the light guide plate 20 via the FPC 34.
  • the wall 18a constitutes the support means for the LED 36, and the heat of the LED 36 is transferred to the wall 18a, so the wall 18a also functions as a heat dissipation means for the LED 36. .
  • the cut-and-raised 30a formed in the shield cover 30 penetrates the wall 18a through the through-hole 16a of the floor plate 16 of the grease frame 14 and adheres to the aluminum heat sink 18 with the wall 18a.
  • the metal cover 30 is in physical contact with the aluminum heat sink 18 and the heat exchange between the aluminum heat sink 18 and the shield cover 30 becomes possible. Therefore, the heat of the LED 36 is radiated to the outside of the liquid crystal display device 32 through each part of the wall 18a, the aluminum heat sink 18, the cut and raised 30a, and the shield cover 30, and the LED 36 is efficiently cooled. It will be.
  • the LED 36 can be cooled by actively utilizing the shield cover 30.
  • the cooling effect of the LED 36 can also be obtained by discharging the heat of the LED 36 trapped in the light source installation space S from the through hole 16a formed in the floor plate 16 of the resin frame 12.
  • the wall 18a of the aluminum heat radiating plate 18 standing in the light source installation space S is such that the end of the aluminum heat radiating plate 18 stands up like a wall. Therefore, the wall 18a is integrated with the aluminum heat sink 18. Therefore, the heat of the LED 36 is smoothly transferred from the wall 18a to the aluminum heat sink 18 and further radiated to the outside of the liquid crystal display device 32 through each part of the cut and raised 30a and the shield cover 30. It becomes.
  • the difference between the liquid crystal display device 38 according to the second embodiment of the present invention and the liquid crystal display device 32 according to the first embodiment faces the light source installation space S of the aluminum heat sink 18.
  • the cut-and-raised 30b formed on the shield cover 30 was bent once at a right angle and then again parallel to the back surface of the aluminum heat sink 18 as shown in FIG.
  • the cut and raised 30b and the aluminum heat sink 18 are in close contact with the back surface of the aluminum heat sink 18.
  • the wall 40 is formed of a prismatic member thicker than the aluminum radiator plate 18, the fixing method of the wall 40 to the aluminum radiator plate 18 is not only adhesion but also a wall that is a prismatic member. It is also possible to perform screwing using a wall thickness of 40. Furthermore, the wall 40, the aluminum heat sink 18, and the cut and raised 30b can all be fixed with screws.
  • the cut-and-raised 30b of the shield cover 30 has a shape that is bent only once so that it is in close contact with the surface of the wall 40 opposite to the surface to which the FPC 34 is attached. It is also possible to do this.
  • the light guide plate 20 is provided in the light source installation space S having a constant width provided along the frame body 14a on one side of the resin frame 12.
  • a wall 40 made of a metal parallel to the side end face and having a higher thermal conductivity than the material of the aluminum heat sink 18 is erected with a predetermined distance from the side end face of the light guide plate 20, and the wall 40 side of the light guide plate
  • the light guide plate 20 is illuminated by the LED 36 by fixing the plurality of LEDs 36 mounted on the FPC 34 on the wall surface in close contact with the side end surface of the light guide plate 20 via the FPC 34. It becomes.
  • the wall 40 constitutes a support means for the LED 36, and the heat of the LED 36 is transferred to the wall 40. It also functions as a means.
  • the cut-and-raised 30b force formed on the shield cover 30 also passes through the through hole of the floor plate 16 of the grease frame 12 and comes into close contact with the aluminum heat sink 18 to which the wall 40 is fixed. 18 and the shield cover 30 are in physical contact, and heat exchange between the wall 40, the aluminum heat sink 18, and the shield cover 12 becomes possible. Therefore, the heat of the LED 36 is radiated to the outside of the liquid crystal display device 38 through the wall 40, the aluminum heat radiating plate 16, the cut-and-raised 30b, and the shield cover 30, and the LED 36 is cooled.
  • the wall 40 fixed to the portion of the aluminum heat radiating plate 18 facing the light source installation space S is composed of a prismatic member that is thicker than the aluminum heat radiating plate 18. Therefore, the high thermal conductivity of the wall 40 allows the heat of the LED 36 to be sufficiently absorbed by the wall and allows the LED 36 to be efficiently cooled. In the simulation calculation example, it was confirmed that the junction temperature of the LED 36 decreased by 4.0 ° C due to the cooling effect.

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  • Physics & Mathematics (AREA)
  • Liquid Crystal (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)

Abstract

Dans la présente invention, une paroi (18a) parallèle à une face d'extrémité latérale d'une plaque-guide lumineux (20) est montée dans un espace (S) d'installation de source lumineuse, à partir d'une plaque à rayonnement thermique en aluminium (18). L'espace (S) d'installation de source lumineuse est disposé le long d'un élément de châssis (14a) sur un côté d'un cadre en résine (12) et la plaque à rayonnement thermique (18) est posée sur la surface d'un panneau de plancher (16) du cadre en résine (12). Des diodes (36) électroluminescentes (DEL) montées sur un circuit imprimé flexible (FPC) sont fixées en contact étroit sur la surface de la paroi (18a). Une partie découpée et recourbée vers le haut (30a) d'un couvercle de protection (30) pénètre à travers un trou traversant (16a) pour se trouver en contact étroit avec la paroi (18a), ledit trou traversant (16a) étant aménagé sur le panneau de plancher (16) du cadre en résine (14). Ceci permet un échange thermique entre la plaque à rayonnement thermique en aluminium (18) et le couvercle de protection (30). Par conséquent, la chaleur émise par les DEL (36) est libérée à l'extérieur du dispositif d'affichage à cristaux liquides (32) à travers chaque partie de la paroi (18a), de la plaque à rayonnement thermique en aluminium (18), de la partie découpée et recourbée (30a) et du couvercle de protection (30).
PCT/JP2006/300440 2005-01-27 2006-01-16 Dispositif d'affichage a cristaux liquides WO2006080201A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005-020377 2005-01-27
JP2005-020378 2005-01-27
JP2005020377A JP4618546B2 (ja) 2005-01-27 2005-01-27 液晶表示装置
JP2005020378A JP2006208723A (ja) 2005-01-27 2005-01-27 液晶表示装置

Publications (1)

Publication Number Publication Date
WO2006080201A1 true WO2006080201A1 (fr) 2006-08-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/300440 WO2006080201A1 (fr) 2005-01-27 2006-01-16 Dispositif d'affichage a cristaux liquides

Country Status (2)

Country Link
TW (1) TW200702817A (fr)
WO (1) WO2006080201A1 (fr)

Cited By (9)

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JP2010177190A (ja) * 2009-01-29 2010-08-12 Samsung Electronics Co Ltd バックライトアセンブリ
JP2010281897A (ja) * 2009-06-02 2010-12-16 Sumitomo Wiring Syst Ltd 車両用表示器
CN102077012A (zh) * 2008-08-08 2011-05-25 夏普株式会社 照明装置以及具备该照明装置的液晶显示装置
JP2011113904A (ja) * 2009-11-30 2011-06-09 Nippon Seiki Co Ltd バックライト装置及び表示装置
JP2012004113A (ja) * 2010-06-11 2012-01-05 Lg Innotek Co Ltd バックライトユニット及びこれを備える表示装置
EP2490051A1 (fr) * 2011-02-16 2012-08-22 Samsung Electronics Co., Ltd. Ensemble de rétroéclairage, dispositif d'affichage l'incluant et procédé d'assemblage dudit dispositif
WO2013007034A1 (fr) * 2011-07-14 2013-01-17 深圳市华星光电技术有限公司 Module de rétroéclairage et dispositif d'affichage à cristaux liquides
CN102943964A (zh) * 2012-10-11 2013-02-27 京东方科技集团股份有限公司 一种发光二极管led灯
EP2057491B1 (fr) * 2006-08-25 2019-05-01 Lumileds Holding B.V. Rétroéclairage faisant appel à des diodes électroluminescentes d'angle à haute puissance

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CN101556008B (zh) * 2007-03-09 2012-02-01 友达光电股份有限公司 侧光式背光模块的组装方法

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JP2004006193A (ja) * 2002-04-04 2004-01-08 Seiko Epson Corp 放熱部材、照明装置、電気光学装置及び電子機器
JP2004325604A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 表示器
JP2004349143A (ja) * 2003-05-23 2004-12-09 Advanced Display Inc 面状光源装置及び表示装置

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JP2004006193A (ja) * 2002-04-04 2004-01-08 Seiko Epson Corp 放熱部材、照明装置、電気光学装置及び電子機器
JP2004325604A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 表示器
JP2004349143A (ja) * 2003-05-23 2004-12-09 Advanced Display Inc 面状光源装置及び表示装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2057491B1 (fr) * 2006-08-25 2019-05-01 Lumileds Holding B.V. Rétroéclairage faisant appel à des diodes électroluminescentes d'angle à haute puissance
CN102077012A (zh) * 2008-08-08 2011-05-25 夏普株式会社 照明装置以及具备该照明装置的液晶显示装置
US9194571B2 (en) 2009-01-29 2015-11-24 Samsung Display Co., Ltd. Backlight assembly and display device including the same
JP2010177190A (ja) * 2009-01-29 2010-08-12 Samsung Electronics Co Ltd バックライトアセンブリ
USRE49458E1 (en) 2009-01-29 2023-03-14 Samsung Display Co., Ltd. Backlight assembly and display device including the same
JP2010281897A (ja) * 2009-06-02 2010-12-16 Sumitomo Wiring Syst Ltd 車両用表示器
JP2011113904A (ja) * 2009-11-30 2011-06-09 Nippon Seiki Co Ltd バックライト装置及び表示装置
JP2012004113A (ja) * 2010-06-11 2012-01-05 Lg Innotek Co Ltd バックライトユニット及びこれを備える表示装置
EP2490051A1 (fr) * 2011-02-16 2012-08-22 Samsung Electronics Co., Ltd. Ensemble de rétroéclairage, dispositif d'affichage l'incluant et procédé d'assemblage dudit dispositif
EP2607936A1 (fr) 2011-02-16 2013-06-26 Samsung Display Co., Ltd. Ensemble de rétroéclairage et dispositif d'affichage l'incluant
US8734001B2 (en) 2011-02-16 2014-05-27 Samsung Display Co., Ltd. Backlight assembly including a light source cover including a sidewall cover portion which contacts with an exterior surface of a sidewall of a receiving container and a light source cover portion which covers a light source and a portion of the exiting surface of a light guide plate, display device having the same and method of assembling the display device
WO2013007034A1 (fr) * 2011-07-14 2013-01-17 深圳市华星光电技术有限公司 Module de rétroéclairage et dispositif d'affichage à cristaux liquides
US8687141B2 (en) 2011-07-14 2014-04-01 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight module and liquid crystal display
CN102943964A (zh) * 2012-10-11 2013-02-27 京东方科技集团股份有限公司 一种发光二极管led灯

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