WO2006067689A3 - Systeme de carte imprimee - Google Patents

Systeme de carte imprimee Download PDF

Info

Publication number
WO2006067689A3
WO2006067689A3 PCT/IB2005/054244 IB2005054244W WO2006067689A3 WO 2006067689 A3 WO2006067689 A3 WO 2006067689A3 IB 2005054244 W IB2005054244 W IB 2005054244W WO 2006067689 A3 WO2006067689 A3 WO 2006067689A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
conductor
board arrangement
buried
Prior art date
Application number
PCT/IB2005/054244
Other languages
English (en)
Other versions
WO2006067689A2 (fr
Inventor
Samber Marc A De
Os Koen Van
Original Assignee
Koninkl Philips Electronics Nv
Samber Marc A De
Os Koen Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Samber Marc A De, Os Koen Van filed Critical Koninkl Philips Electronics Nv
Priority to US11/722,342 priority Critical patent/US20100012367A1/en
Priority to JP2007546291A priority patent/JP2008524841A/ja
Publication of WO2006067689A2 publication Critical patent/WO2006067689A2/fr
Publication of WO2006067689A3 publication Critical patent/WO2006067689A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un système de carte imprimée à substrat multicouches (1, 2) comportant un conducteur enterré (4) et une zone de contact (3), reliée au conducteur (4) et se trouvant sur une surface du substrat. Pour améliorer le refroidissement du conducteur enterré, une zone de refroidissement métallique (6) est établie au-dessus du conducteur (4), reliée à celui-ci via un ou plusieurs conducteurs (7).
PCT/IB2005/054244 2004-12-21 2005-12-14 Systeme de carte imprimee WO2006067689A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/722,342 US20100012367A1 (en) 2004-12-21 2005-12-14 Printed circuit board arrangement
JP2007546291A JP2008524841A (ja) 2004-12-21 2005-12-14 プリント回路基板装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04106756.2 2004-12-21
EP04106756 2004-12-21

Publications (2)

Publication Number Publication Date
WO2006067689A2 WO2006067689A2 (fr) 2006-06-29
WO2006067689A3 true WO2006067689A3 (fr) 2006-09-21

Family

ID=36588696

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2005/054244 WO2006067689A2 (fr) 2004-12-21 2005-12-14 Systeme de carte imprimee

Country Status (4)

Country Link
JP (1) JP2008524841A (fr)
CN (1) CN101088310A (fr)
TW (1) TW200638822A (fr)
WO (1) WO2006067689A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011084326A1 (de) * 2011-10-12 2013-04-18 Osram Opto Semiconductors Gmbh Flexible Leiterplatte zur elektrischen Kontaktierung und mechanischen Befestigung einer Lampe in einer Leuchte
DE102014217927A1 (de) * 2014-09-08 2016-03-10 Robert Bosch Gmbh Verfahren zur lötfreien elektrischen Einpresskontaktierung von elektrisch leitfähigen Einpress-Stiften in Leiterplatten
JP6251420B1 (ja) * 2016-05-30 2017-12-20 三菱電機株式会社 電子モジュールおよび電子モジュールの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768813A2 (fr) * 1995-10-13 1997-04-16 Murata Manufacturing Co., Ltd. Panneaux à circuit imprimé
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6212076B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Enhanced heat-dissipating printed circuit board package
US6335862B1 (en) * 1999-11-17 2002-01-01 Nec Corporation Multilayer printed wiring board provided with injection hole for thermally conductive filler

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768813A2 (fr) * 1995-10-13 1997-04-16 Murata Manufacturing Co., Ltd. Panneaux à circuit imprimé
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6212076B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Enhanced heat-dissipating printed circuit board package
US6335862B1 (en) * 1999-11-17 2002-01-01 Nec Corporation Multilayer printed wiring board provided with injection hole for thermally conductive filler

Also Published As

Publication number Publication date
CN101088310A (zh) 2007-12-12
WO2006067689A2 (fr) 2006-06-29
TW200638822A (en) 2006-11-01
JP2008524841A (ja) 2008-07-10

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