WO2006054407A1

WO2006054407A1 - Electrostatic chuck for vacuum bonding equipment and vacuum bonding equipment using the same

Info

Publication number: WO2006054407A1
Application number: PCT/JP2005/018679
Authority: WO
Inventors: Yoshikazu Ohtani; Takeshi Shima; Ritsu Kawase
Original assignee: Shin-Etsu Engineering Co., Ltd.; Tomoegawa Paper Co., Ltd.
Priority date: 2004-10-29
Filing date: 2005-10-11
Publication date: 2006-05-26
Also published as: JP2008026338A; TW200629460A

Abstract

[PROBLEMS] To prevent breakage of an electrostatic attraction functioning part due to biting of a foreign material. [MEANS FOR SOLVING PROBLEMS] At least one layer of a dielectric protecting layer (1c) having a prescribed thickness is provided on a surface of a dielectric layer (1b). A portion between a board contact plane (1’) of the dielectric protecting layer (1c) arranged on the outermost side and an electrode layer (1a) is permitted to have a laminate structure composed of a plurality of layers. A distance between the board contact plane (1’) and the electrode layer (1a) is increased by the thickness of the dielectric protecting layer (1c). Thus, probability of causing damage to the electrode layer (1a) due to biting of a large foreign material is reduced, and at the same time, even when the board contact plane (1’) of the dielectric protecting layer (1c) is scratched by biting of a small foreign material, a crack does not reach the dielectric layer (1a) by being prevented from advancing by the dielectric protecting layer (1c). When the layer constitution is divided while maintaining the entire thickness from the board contact plane (1’) to the electrode layer (1a) substantially the same, the crack does not reach the dielectric layer (1a) by being prevented from advancing by the dielectric protecting layer (1c) in the same manner.

Description

Specification

Electrostatic chuck for vacuum bonding apparatus and vacuum bonding apparatus using the same

Technical field

The present invention relates to a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP), which is attached to a substrate such as CF glass or TFT glass by suction. The present invention relates to an electrostatic chuck for a vacuum bonding apparatus used in the case and a vacuum bonding apparatus using the same.

Specifically, a flat electrode layer is covered with a dielectric layer, and an electrostatic chuck for a vacuum bonding apparatus that holds the dielectric layer in contact with the substrate and holds the same in contact with the substrate, or a dielectric layer deposited on the surface of the electrode layer. The present invention relates to an electrostatic chuck for a vacuum bonding apparatus formed by bonding an electroadhesive function unit and a pedestal disposed on the back surface of the electrode layer, and a vacuum bonding apparatus using the same.

Background art

Conventionally, as an electrostatic chuck for a vacuum bonding apparatus of this type, a dielectric layer with which a substrate is in contact

A plate-like laminated structure in which an electrostatic adsorption function portion in which (dielectric) and an electrode layer (electrode portion) for supplying an electric field thereto are laminated and a pedestal portion (supporting base material) serving as a base thereof Because the insulating organic material such as polyimide used as the material of the dielectric layer has water absorbency, it is incorporated into a vacuum bonding apparatus (a bonding apparatus for flat panel substrates), and the material is incorporated into a vacuum bonding apparatus. When used, it generates moisture and other gases, and the adsorption of the substrate can not be maintained accordingly, causing the substrate to fall. The surface of this dielectric layer is a polyethylene film having low gasification and low gas permeability. By covering with a dielectric film, the surface of the dielectric and the atmosphere are shut off to prevent the generation of gas during use in vacuum, thereby preventing the substrate from falling by its own weight (for example, a patent). Reference 1).

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-324144 (Page 2-5, FIG. 1, FIG. 4)

Disclosure of the invention

Problem that invention tries to solve However, in such a conventional electrostatic bonding apparatus for vacuum bonding apparatus, the surface of the electrode layer is a single-layer dielectric layer that also has a force such as polyimide and a very thin dielectric film such as a polyethylene film. When the surface is brought into contact with the substrate and held by suction, if foreign matter adheres to the surface of the substrate and penetrates between them, electrostatics generated around the foreign matter will occur. We are absorbed into dielectric film and dielectric layer by adsorption power! As a result, if the foreign material is large by breaking the thin dielectric film and damaging the surface of the dielectric layer, the electrode layer is damaged and the electrostatic adsorption functional part is easily damaged. there were. Furthermore, even if the scratch caused by such foreign matter is a scratch caused by a minute foreign matter, it gradually progresses in the thickness direction of the dielectric layer over time and becomes a crack, and the dielectric layer becomes a single layer. Because of the structure, cracks from the surface side directly reach the electrode layer.

In particular, when such a conventional electrostatic chuck is incorporated into a vacuum bonding apparatus and a pair of glass substrates are closely held in vacuum while being held by suction, a large number of substrates are repeatedly brought into contact and adsorbed. Since there is a pressing process of the substrate, cracks in the dielectric layer proceed at a stretch in this pressing process to expose the electrode layer, and when current is supplied to the electrode layer in this state, plasma discharge is caused at a certain timing in vacuum, The problem is that it leads to damage of

Further, in the electrostatic chuck for a vacuum bonding apparatus provided with the dielectric layer described above, a base material layer having a single-layer structure is provided on the back surface side of the electrode layer using an adhesive or an adhesive. Although the back surface and the pedestal portion are bonded using an adhesive or an adhesive agent, when the back surface of the base material layer and the pedestal portion are bonded together in the manufacturing process, foreign matter may be entrapped between these both. Also, if there is an uneven portion such as solder on the bonding surface of the pedestal portion, the electrode layer may be damaged via the base material layer to damage the electrostatic adsorption function portion.

In this case, there is a problem that the resistance value mainly decreases between the electrode layer and the pedestal portion which is at the ground potential, and an abnormal current flows between them, leading to a decrease in the electrostatic attraction. o

Among the present inventions, the inventions set forth in claims 1 and 4 have an object to prevent damage to the electrostatic adsorption functional part due to the intrusion of foreign matter.

In addition to the object of the invention according to claim 1, the invention according to claim 2 It is intended to be completely prevented.

In addition to the object of the invention described in claim 1 or 2, the invention described in claim 3 aims to reduce the crack generation rate of the dielectric protective layer.

The invention according to claim 5 is intended to prevent the occurrence of plasma discharge in the air in addition to the object of the invention according to claims 1, 2, 3 or 4.

Means to solve the problem

[0006] In order to achieve the above object, the invention according to claim 1 of the present invention is characterized in that at least one or more dielectric protective layers of a predetermined thickness are provided on the surface of the dielectric layer and disposed on the most surface side. The structure from the substrate contact surface of the dielectric protective layer to the electrode layer is a laminated structure comprising a plurality of layers.

The "dielectric protective layer having a predetermined thickness" referred to herein is preferably larger than a foreign substance which may be swallowed.

The invention according to claim 2 is characterized in that the configuration according to claim 1 is provided with a buffer layer provided between the dielectric layer and the dielectric protective layer or between the dielectric protective layers. . The invention according to claim 3 is characterized in that a constitution using a ceramic as the dielectric protective layer is added to the constitution according to the invention according to claim 1 or 2.

According to the fourth aspect of the present invention, at least one base protection layer having a predetermined thickness is provided between the base layer provided on the back side of the electrode layer and the bonding surface of the pedestal, It is characterized in that a laminated structure of a plurality of layers is formed between the bonding surface of the part and the electrode layer.

The invention according to claim 5 provides the electrostatic chuck for a vacuum bonding apparatus according to claim 1, 2, 3 or 4 on only one or both of the facing surfaces of a pair of upper and lower holding plates, and this vacuum bonding apparatus. It is characterized in that two substrates are held by suction on the electrostatic chuck for chucking, and both substrates are brought close to each other in a vacuum and pressure-bonded. Effect of the invention

Among the present inventions, according to claim 1 of the present invention, at least one dielectric protective layer having a predetermined thickness is provided on the surface of the dielectric layer, and the substrate contact surface of the dielectric protective layer disposed on the outermost surface side. A large amount of foreign matter is entrapped by increasing the distance from the substrate contact surface to the electrode layer by the thickness of the dielectric protective layer by forming a multilayer structure consisting of multiple layers from the electrode layer to the electrode layer. At the same time, the probability of damage to the electrode layer is reduced, and at the same time, even if the substrate contact surface of the dielectric protective layer is scratched due to the small foreign substance being swallowed, the progress of the crack is suppressed in the dielectric protective layer and the dielectric layer is Even when the structure of the layer is divided while maintaining the entire thickness from the substrate contact surface to the electrode layer substantially the same, the progress of the crack is similarly suppressed by the dielectric protective layer, and the dielectric layer is similarly obtained. It does not reach to.

Therefore, damage to the electrostatic attraction function unit due to the entrapment of foreign matter can be prevented. As a result, the durability is improved and can be used for a long time, and the reliability is improved, as compared with the conventional one having a laminated structure in which a single-layer dielectric layer and a thin dielectric film are stacked on the surface of an electrode layer. It can be done.

According to the invention of claim 2, in addition to the effect of the invention of claim 1, foreign matter is engulfed by providing a buffer layer between the dielectric layer and the dielectric protective layer or between the dielectric protective layers. Even if the crack progresses through the entire dielectric protective layer, it is cut off at the buffer layer, and the crack does not proceed to the next dielectric layer or the next dielectric protective layer.

Therefore, the progress of the crack can be completely prevented.

As a result, it is possible to further reduce the failure rate due to the intrusion of foreign matter.

According to the invention of claim 3, in addition to the effects of the invention of claim 1 or 2, by using ceramic as the dielectric protective layer, the dielectric protective layer itself becomes hard and the hard foreign matter is engulfed. Even then, the dielectric protective layer is not easily damaged. .

Therefore, the crack generation rate of the dielectric protective layer can be reduced.

[0010] In the invention of claim 4, at least one or more base material protective layers having a predetermined thickness are provided between the base material layer provided on the back surface side of the electrode layer and the base, and the base is attached A large number of foreign particles can be engulfed and the bonding surface of the pedestal part by increasing the distance to the electrode layer by the thickness of the base material protective layer by forming a laminated structure of multiple layers up to the electrode layer. At the same time, the probability of damage to the electrode layer due to uneven parts such as burrs decreases, and at the same time the crack on the back side of the base material protective layer is scratched by small foreign matter entrapment! It is suppressed to the dielectric layer.

Therefore, damage to the electrostatic attraction function unit due to the entrapment of foreign matter can be prevented. As a result, since the decrease in electrostatic adsorption does not occur due to the flow of abnormal current between the electrode layer and the pedestal which is at the ground potential, stable adsorption and holding of the substrate can be realized over a long period of time.

[0011] In addition to the effects of the inventions of claim 1, 2, 3 or 4, the invention of claim 5 is characterized in that the electrostatic chuck for vacuum bonding apparatus is formed on only one or both of the opposing surfaces of the upper and lower pair of holding plates. In the vacuum bonding apparatus, provided that the substrates are held by suction and opposed to the electrostatic chuck for vacuum bonding apparatus, and these two substrates are closely approached in a vacuum and pressure bonded, the electrostatic chuck for vacuum bonding apparatus is provided. By trapping foreign matter between the substrate contact surface of the substrate and the substrate, even if a crack with a scratch is generated on the substrate contact surface, it does not reach the electrode layer and does not become exposed.

Therefore, generation of plasma discharge in vacuum can be prevented.

As a result, damage to the substrate due to plasma discharge and a decrease in electrostatic attraction can be prevented, as compared with the conventional one in which cracks in the dielectric layer rapidly advance in the pressing step and the electrode layer is easily exposed.

BEST MODE FOR CARRYING OUT THE INVENTION

The electrostatic chuck A for a vacuum bonding apparatus according to the present invention is an electrostatic chucking portion 1 in which a dielectric layer lb is laminated on the surface of an electrode layer la as shown in FIGS. 1 to 3, and this electrode layer The dielectric layer lb is, for example, an insulating material such as polyimide or the like, which is a plate-like laminated structure comprising a base material layer 2 provided on the back surface side of la and a pedestal 3 bonded to the back surface of the base material layer 2. Organic materials to form a single layer structure.

Then, a force to provide at least one dielectric protective layer lc having a predetermined thickness on the surface of the dielectric layer lb, or a predetermined thickness between the base layer 2 and the bonding surface 3a of the pedestal 3 is provided. At least one base protection layer 2b is provided, or one or more dielectric protection layer 1c and base protection layer 2b are respectively provided.

Hereinafter, embodiments of the present invention will be described based on the drawings.

Example 1

In Example 1, at least one dielectric protective layer lc is provided on the surface of the dielectric layer lb as shown in FIGS. 1 (a) and 1 (b), and the dielectric protective layer lc disposed on the most surface side is provided. The surface of the substrate is the contact surface of the substrate, and the contact layer between the electrode and the electrode layer la is a multi-layered laminated structure. The distance from the touch surface to the electrode layer la is increased by the thickness of the dielectric protective layer lc, or the structure of the layer is divided while maintaining the overall thickness to the substrate contact surface ca. It shows the case.

[0015] When the total thickness of the dielectric layer lb and the dielectric protective layer lc increases, the adsorptive power generally tends to decrease. Therefore, the dielectric protective layer lc of the single-layer structure shown in the example is a surface of the dielectric layer lb. In the case where there is only a single layer, or if there is a surplus in adsorption power, two or more layers of dielectric protective layer lc having a single layer structure are laminated, not shown, and the substrate is contacted by the thickness of this dielectric protective layer lc. surface! The distance from / to the electrode layer la is increased.

Further, when it is not desired to reduce the adsorption force due to the relationship with the substrate W to be adsorbed, the dielectric protective layer 1c is divided into a plurality of layers, and the substrate contact surface is not shown. It may be multilayered while maintaining the overall thickness up to about the same.

A material of the dielectric protective layer lc is A10.

Ceramics such as 2 3, SiC, A1N, Zr O, etc.

twenty three

It is preferable to use an inorganic material other than the above, or an insulating organic material such as polyimide, polyetheretherketone (PEEK), polyethylene naphthalate (PEN) or the like.

When the dielectric protective layer lc made of ceramic is laminated, the dielectric protective layer lc itself is hard, and the dielectric protective layer lc is made of an organic material such as polyimide which is difficult to be scratched even when a hard foreign object is swallowed. When the dielectric protective layer lc is stacked, the electrical characteristics are excellent.

Further, it is preferable to provide a buffer layer Id between the dielectric layer lb and the dielectric protective layer lc or between the dielectric protective layers lc.

In the case of this embodiment, the buffer layer Id is an adhesive layer made of a pressure sensitive adhesive or an adhesive, but the buffer layer Id may be made of a material other than the pressure sensitive adhesive or the adhesive.

In addition, on the back surface side of the electrode layer la, a base layer 2 having a single-layer structure including an insulating material such as an insulating material with an adhesive layer 2a such as an adhesive or an adhesive interposed therebetween is used. The back surface of the base material layer 2 and the bonding surface 3a of the pedestal portion 3 are attached so as to sandwich the adhesive layer 4 such as an adhesive or an adhesive.

The above-described electrostatic chuck A for a vacuum bonding apparatus is, for example, a vacuum bonding apparatus for manufacturing a liquid crystal display (LCD), a plasma display (PDP), etc. Opposite holding plates B, C, etc., with force placed on the surface plate etc. It is incorporated by attaching it to the entire surface or a part of only one side or both sides of the surface, and a substrate W such as TFT glass or CF glass is adsorbed and held as the substrate W on the electrostatic chuck A for vacuum bonding device. After positioning and moving the pair of upper and lower substrates W, W relative to each other in the X and Y directions, the two are approached and crimped in vacuum.

The operation of the above vacuum bonding apparatus will be described in detail according to an example shown in the drawings. As shown in FIG. 1 (a), the upper and lower electrostatic bonding chucks A and A in the atmosphere are shown in FIG. A closed space S which can be opened and closed vertically between the upper and lower holding plates B and C is formed so as to surround the upper and lower substrates W and W, respectively. After the inside of S reaches a predetermined degree of vacuum, adjust the relative movement of upper and lower holding plates B and C and electrostatic chucks A and A for vacuum bonding device in the direction of arrow so that upper and lower substrates W and W Alignment is performed.

Thereafter, as shown in FIG. 1 (b), the upper and lower holding plates B and C are brought closer to each other, or the upper substrate W is forcibly peeled off from the upper electrostatic chuck A for vacuum bonding device. The liquid crystal is sealed between the two by instantaneous pressure bonding to the above annular adhesive (sealing material) X, and then the atmosphere in the closed space S is returned to atmospheric pressure, whereby both substrates The pressure difference between the two substrates W and W is pressurized to a predetermined gap to complete the bonding process.

Next, the operation of the electrostatic chuck A for a vacuum bonding device and the vacuum bonding device using the same will be described.

The electrostatic chuck A for each vacuum bonding device is provided with at least one dielectric protective layer lc having a predetermined thickness on the surface of the dielectric layer lb, and the substrate contact surface of the dielectric protective layer lc disposed on the outermost surface side. If the distance from the substrate contact surface to the electrode layer la is increased by the thickness of the dielectric protective layer lc in a multi-layered laminated structure with a distance of up to the electrode layer la, the substrate contact surface is When the substrate W is brought into contact with and held by suction, the large foreign matter which has entered the surface of the substrate W, for example, adheres to the surface of the substrate W and the substrate contact surface of the dielectric protective layer lc disposed on the surface and the outermost surface. Even if it sinks in, the thickness of the dielectric protective layer lc reduces the probability of damage to the electrode layer la. [0023] At the same time, even if the substrate contact surface 1 'of the dielectric protective layer lc disposed closest to the surface side is scratched due to entrapment of small foreign matter, the dielectric protective layer lc suppresses the progress of the crack and dielectric Because it does not reach the layer la, the probability of such failure modes is extremely low.

In the case where the structure of the layer is divided and multilayered while maintaining the entire thickness substantially the same until the electrode contact layer la, the small particle is entrapped and the substrate contact surface is damaged. However, the progress of the crack is suppressed by the multi-layered dielectric protective layer lc, and the dielectric layer la is not reached.

As a result, it is possible to prevent damage to the electrostatic attraction function unit 1 due to the foreign matter being trapped with the substrate W.

Then, when such an electrostatic chuck A for vacuum bonding device is incorporated into a vacuum bonding device, the substrate contact surface 1 ′ of the electrostatic chuck A for vacuum bonding device is brought into contact with the substrate W. During adsorption and retention, foreign matter is trapped between the two, so that even if a crack with a scratch is generated on the substrate contact surface, it does not reach the electrode layer la, and this electrode layer la is not exposed, so vacuum It is possible to prevent the occurrence of plasma discharge in the inside.

Furthermore, when a buffer layer Id is provided between the dielectric layer lb and the dielectric protective layer lc or between the dielectric protective layer lc, cracks generated due to the inclusion of foreign matter become the dielectric protective layer lc. This crack is completely cut off at the buffer layer Id, and does not continue to the next dielectric layer lb or to the next dielectric protective layer lc, even if it proceeds over the entire thickness direction of the There is an advantage that the rate of occurrence of breakage of the electrostatic attraction function part 1 due to

Example 2

In Example 2, the dielectric protective layer lc and the buffer layer Id of Example 1 shown in FIGS. 1 (a) and 1 (b) shown in FIGS. Instead of providing on the surface, instead, between the base layer 2 provided on both sides of the adhesive layer 2a on the back side of the electrode layer la and the bonding surface 3a of the pedestal portion 3, a base protection of a predetermined thickness is provided. At least one or more layers 2b are provided, and the structure from the bonding surface 3a of the pedestal portion 3 to the electrode layer la has a laminated structure of a plurality of layers is the embodiment shown in FIGS. 1 (a) and (b). Unlike Example 1, the other configuration is the same as Example 1.

The base material protective layer 2b is formed into a single layer structure from the same material as the dielectric protective layer lc, and in the case of the illustrated example, the bonding surface 3a of the back surface of the base material layer 2 and the pedestal portion 3 Only between Although there is room in the overall thickness dimension of the electrostatic chuck A for a vacuum bonding apparatus, although two layers or more of the base material protective layer 2b having a single layer structure are laminated, The distance from the bonding surface 3a of the pedestal 3 to the electrode layer la is increased by the thickness of the base material protective layer 2b.

In the case where the thickness dimension of the entire electrostatic bonding chuck A for a vacuum bonding apparatus can not be increased, the base protection layer 2 b is divided into a plurality of layers (not shown) so that the base portion 3 is not shown. It may be multilayered while maintaining the thickness from the bonding surface 3a to the electrode layer la substantially the same.

Furthermore, by providing the buffer layer 2 c between the base layer 2 and the base protective layer 2 b or between the base protective layer 2 b, the entire base protective layer 2 b is cracked. It is preferable that even if the process proceeds, the buffer layer 2c cuts off and the crack does not progress to the next substrate layer 2 or the next substrate protective layer 2b.

In the case of this embodiment, the buffer layer 2c is an adhesive layer made of a pressure sensitive adhesive or an adhesive, but the buffer layer 2c may be made of a material other than the pressure sensitive adhesive or the adhesive.

Accordingly, in the case shown in FIGS. 2 (a) and 2 (b), when the distance from the bonding surface 3a of the pedestal 3 to the electrode layer la is extended by the thickness of the base material protective layer 2b, When bonding the back surface of the base material protective layer 2b to the bonding surface 3a of the pedestal portion 3 in the manufacturing process, large foreign particles invading between the two may be captured or burrs may be formed on the bonding surface 3a of the pedestal portion 3 Even if the asperities are present, the thickness of the substrate protective layer 2b reduces the probability of damage to the electrode layer la.

At the same time, even if the base-side back surface of the base material protective layer 2b is damaged by small foreign particles being engulfed, the base layer protective layer 2b suppresses the progress of the crack and does not reach the dielectric layer la. The probability of such failure modes is extremely low.

In the case of dividing the layer structure into multiple layers while maintaining the entire thickness of the base material protective layer 2b to the base side back surface of the base side caustic electrode layer la substantially the same, the small foreign matter is collected Even if the base side back surface of the base material protective layer 2b is scratched, the progress of the crack is suppressed by the multilayer base material protective layer 2b and the dielectric layer la is reached!

As a result, it is possible to prevent damage to the electrostatic attraction function unit 1 due to foreign matter absorption during manufacturing and unevenness such as burrs on the bonding surface 3 a of the pedestal 3.

Example 3 Example 3 corresponds to dielectric protective layer lc and buffer layer Id of Example 1 shown in FIGS. 1 (a) and (b) as shown in FIGS. 3 (a) and (b), and FIG. (a) The structure which provided both the base material protective layer 2b and the buffer layer 2c of Example 2 shown to (b) differs from the said Example 1 and Example 2, and the other structure is Example 1 and it differs. And the same as in Example 2.

[0033] In the case of the illustrated example, only a single layer dielectric protective layer lc is stacked on the surface of the dielectric layer lb. However, the present invention is not limited thereto, and two or more single layer dielectric protective layer lc may be provided. The distance from the substrate contact surface to the electrode layer la is increased by the thickness of the dielectric protective layer 1c, or the dielectric protective layer 1c is divided into a plurality of layers to form the substrate contact surface. Layering may be performed while maintaining the same overall thickness to the layer la.

Furthermore, although only a single layer of the substrate protective layer 2b is laminated between the back surface of the substrate layer 2 and the bonding surface 3a of the pedestal portion 3, the present invention is not limited thereto. By laminating two or more base material protective layers 2b, the distance from the bonding surface 3a of the pedestal 3 to the electrode layer la is increased by the thickness of the base material protective layer 2b, or the base material protective layer 2b is It may be divided into a plurality of layers, and may be multilayered while maintaining the thickness from the bonding surface 3a of the pedestal portion 3 to the electrode layer la substantially the same.

[0035] Therefore, what is shown in Figs. 3 (a) and 3 (b) is the prevention of damage to the electrostatic adsorption function unit 1 due to the foreign matter being caught between the substrate W and the foreign matter being caught during manufacture or the pedestal part. At the same time, it is possible to simultaneously prevent breakage of the electrostatic attraction function unit 1 by the uneven portion such as burrs on the bonding surface 3a of 3.

Although in the above-described embodiment, the electrostatic chuck A for a vacuum bonding apparatus is incorporated into the vacuum bonding apparatus and a glass substrate is held by suction as the substrate W, the present invention is not limited thereto. Even in the case where a substrate made of a material other than glass is adsorbed and held, the same function and effect as those of the above-described embodiment can be obtained.

Further, the vacuum bonding apparatus has shown the case where the substrate W is held by suction only with the electrostatic chuck A. The present invention is not limited to this. In addition to the suction holding of the substrate W by the electrostatic chuck A, A suction / adsorption means or an adhesion holding means may be provided to assist the holding of the substrate W in the atmosphere.

Brief description of the drawings

FIG. 1 is a longitudinal sectional front view of an electrostatic chuck for a vacuum bonding apparatus showing an embodiment of the present invention, in which (a) shows a state before bonding, and (b) shows a state after bonding It shows the state. 2) A longitudinal sectional front view of an electrostatic chuck for vacuum bonding apparatus showing another embodiment of the present invention, (a) shows a state before bonding, (b) shows a state after bonding ing. 3) A longitudinal sectional front view of an electrostatic chuck for vacuum bonding apparatus showing another embodiment of the present invention, (a) shows a state before bonding, (b) shows a state after bonding ing. Explanation of sign

A Electrostatic chuck B, C Holding plate

W substrate

1 'Substrate contact surface

la electrode layer lb dielectric layer

lc dielectric protective layer Id buffer layer (adhesive layer)

2 base material layer 2a adhesive layer

2b base material protective layer 2c buffer layer (adhesive layer)

3 pedestal 3a bonding surface

4 Adhesive layer

Claims

The scope of the claims

[1] An electrostatic chuck for a vacuum bonding apparatus, which covers a flat electrode layer (la) with a dielectric layer (lb) and brings the dielectric layer (lb) and the substrate (W) into contact with each other and holds them by suction.

At least one dielectric protective layer (lc) having a predetermined thickness is provided on the surface of the dielectric layer (lb), and an electrode is provided from the substrate contact surface (1 ') of the dielectric protective layer (lc) disposed on the outermost surface side. An electrostatic chuck for a vacuum bonding apparatus characterized in that a laminated structure having a plurality of layers is provided between layers (la).

[2] A buffer layer between the dielectric layer (lb) and the dielectric protective layer (lc) or between the dielectric protective layers (lc)

The electrostatic chuck for a vacuum bonding apparatus according to claim 1, wherein (Id) is provided.

[3] The electrostatic chuck for a vacuum bonding apparatus according to claim 1 or 2, wherein a ceramic is used as the dielectric protective layer (lc).

[4] For vacuum bonding apparatus formed by bonding an electrostatic adsorption function section (1) in which a dielectric layer (lb) is laminated on the surface of an electrode layer (la) and a pedestal section (3) as a base thereof In an electrostatic chuck, a substrate of a predetermined thickness is protected between a substrate layer (2) provided on the back surface side of the electrode layer (la) and a bonding surface (3a) of a pedestal portion (3). A vacuum bonding apparatus characterized in that at least one layer (2b) is provided, and a plurality of layers are formed between the bonding surface (3a) of the pedestal (3) and the electrode layer (la). For electrostatic chucks.

[5] The electrostatic chuck (A) for a vacuum bonding apparatus according to claim 1, 2, 3 or 4 is provided on only one or both of the opposing surfaces of the upper and lower holding plates (B, C). A vacuum bonding apparatus characterized in that a substrate (W) is held by suction and opposed to an electrostatic chuck (A) for a bonding apparatus, and these two substrates (W, W) are approached and pressure bonded in a vacuum.