WO2005122267A8 - Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy - Google Patents

Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy

Info

Publication number
WO2005122267A8
WO2005122267A8 PCT/US2005/018823 US2005018823W WO2005122267A8 WO 2005122267 A8 WO2005122267 A8 WO 2005122267A8 US 2005018823 W US2005018823 W US 2005018823W WO 2005122267 A8 WO2005122267 A8 WO 2005122267A8
Authority
WO
WIPO (PCT)
Prior art keywords
gallium nitride
growth
vapor phase
dislocation density
phase epitaxy
Prior art date
Application number
PCT/US2005/018823
Other languages
French (fr)
Other versions
WO2005122267A3 (en
WO2005122267A2 (en
Inventor
Benjamin A Haskell
Melvin B Mclaurin
Steven P Denbaars
James S Speck
Shuji Nakamura
Original Assignee
Univ California
Japan Science & Tech Agency
Benjamin A Haskell
Melvin B Mclaurin
Steven P Denbaars
James S Speck
Shuji Nakamura
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ California, Japan Science & Tech Agency, Benjamin A Haskell, Melvin B Mclaurin, Steven P Denbaars, James S Speck, Shuji Nakamura filed Critical Univ California
Priority to JP2007515412A priority Critical patent/JP5461773B2/en
Priority to KR1020077000164A priority patent/KR101332391B1/en
Priority to KR1020127004001A priority patent/KR101251443B1/en
Publication of WO2005122267A2 publication Critical patent/WO2005122267A2/en
Publication of WO2005122267A3 publication Critical patent/WO2005122267A3/en
Publication of WO2005122267A8 publication Critical patent/WO2005122267A8/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C30B29/406—Gallium nitride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02378—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02387—Group 13/15 materials
    • H01L21/02389—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/0242—Crystalline insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/02433—Crystal orientation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02455—Group 13/15 materials
    • H01L21/02458—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02494—Structure
    • H01L21/02496—Layer structure
    • H01L21/02502—Layer structure consisting of two layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02609—Crystal orientation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02647—Lateral overgrowth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Semiconductor Lasers (AREA)

Abstract

A method of growing highly planar, fully transparent and specular m-plane gallium nitride (GaN) films. The method provides for a significant reduction in structural defect densities via a lateral overgrowth technique. High quality, uniform, thick m-plane gaN films are produced for use as substrates for polarization-free device growth.
PCT/US2005/018823 2004-06-03 2005-05-31 Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy WO2005122267A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007515412A JP5461773B2 (en) 2004-06-03 2005-05-31 Growth of flat and low dislocation density m-plane gallium nitride by hydride vapor deposition
KR1020077000164A KR101332391B1 (en) 2004-06-03 2005-05-31 Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy
KR1020127004001A KR101251443B1 (en) 2004-06-03 2005-05-31 Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57668504P 2004-06-03 2004-06-03
US60/576,685 2004-06-03

Publications (3)

Publication Number Publication Date
WO2005122267A2 WO2005122267A2 (en) 2005-12-22
WO2005122267A3 WO2005122267A3 (en) 2006-08-17
WO2005122267A8 true WO2005122267A8 (en) 2007-01-11

Family

ID=35503823

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/018823 WO2005122267A2 (en) 2004-06-03 2005-05-31 Growth of planar reduced dislocation density m-plane gallium nitride by hydride vapor phase epitaxy

Country Status (3)

Country Link
JP (1) JP5461773B2 (en)
KR (2) KR101251443B1 (en)
WO (1) WO2005122267A2 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
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US8847279B2 (en) 2006-09-07 2014-09-30 Taiwan Semiconductor Manufacturing Company, Ltd. Defect reduction using aspect ratio trapping
US8860160B2 (en) 2006-09-27 2014-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
US8878243B2 (en) 2006-03-24 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures and related methods for device fabrication
US8981427B2 (en) 2008-07-15 2015-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
US8987028B2 (en) 2005-05-17 2015-03-24 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US8994070B2 (en) 2008-07-01 2015-03-31 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
US9040331B2 (en) 2007-04-09 2015-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US9153645B2 (en) 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US9299562B2 (en) 2009-04-02 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Devices formed from a non-polar plane of a crystalline material and method of making the same
US9365949B2 (en) 2008-06-03 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Epitaxial growth of crystalline material
US9449868B2 (en) 2007-04-09 2016-09-20 Taiwan Semiconductor Manufacutring Company, Ltd. Methods of forming semiconductor diodes by aspect ratio trapping with coalesced films
US9455299B2 (en) 2008-09-24 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for semiconductor sensor structures with reduced dislocation defect densities
US9508890B2 (en) 2007-04-09 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Photovoltaics on silicon

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EP2595176B1 (en) * 2005-05-17 2020-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US9673044B2 (en) 2006-04-07 2017-06-06 Sixpoint Materials, Inc. Group III nitride substrates and their fabrication method
KR100809209B1 (en) * 2006-04-25 2008-02-29 삼성전기주식회사 METHOD OF GROWING NON-POLAR m-PLANE NITRIDE SEMICONDUCTOR
KR20090018106A (en) * 2006-05-09 2009-02-19 더 리전츠 오브 더 유니버시티 오브 캘리포니아 In-situ defect reduction techniques for nonpolar and semipolar (al, ga, in)n
JP4713426B2 (en) * 2006-08-30 2011-06-29 京セラ株式会社 Epitaxial substrate and vapor phase growth method
US20080187018A1 (en) 2006-10-19 2008-08-07 Amberwave Systems Corporation Distributed feedback lasers formed via aspect ratio trapping
JP2008108924A (en) * 2006-10-26 2008-05-08 Matsushita Electric Works Ltd Compound semiconductor light-emitting element, illumination apparatus employing the same and manufacturing method of compound semiconductor light-emitting element
KR100860709B1 (en) 2006-12-21 2008-09-26 주식회사 실트론 Method of growing GaN layer for manufacturing Light Emitting Diode having enhanced light extraction characteristics, Method of manufacturing Light Emitting Diode using the same, and Light Emitting Diode device thereof
US7825328B2 (en) 2007-04-09 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Nitride-based multi-junction solar cell modules and methods for making the same
US8329541B2 (en) 2007-06-15 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. InP-based transistor fabrication
JP4825745B2 (en) * 2007-07-13 2011-11-30 日本碍子株式会社 Method for producing nonpolar group III nitride
JP4825746B2 (en) * 2007-07-13 2011-11-30 日本碍子株式会社 Method for producing nonpolar group III nitride
WO2009035746A2 (en) 2007-09-07 2009-03-19 Amberwave Systems Corporation Multi-junction solar cells
JP5295871B2 (en) * 2008-07-03 2013-09-18 古河機械金属株式会社 Method for manufacturing group III nitride semiconductor substrate
US20100072515A1 (en) 2008-09-19 2010-03-25 Amberwave Systems Corporation Fabrication and structures of crystalline material
WO2010033813A2 (en) 2008-09-19 2010-03-25 Amberwave System Corporation Formation of devices by epitaxial layer overgrowth
WO2010100699A1 (en) * 2009-03-06 2010-09-10 パナソニック株式会社 Crystal growth process for nitride semiconductor, and method for manufacturing semiconductor device
EP2461376A4 (en) 2009-11-12 2013-03-13 Panasonic Corp Gallium nitride compound semiconductor light-emitting element
JP5891390B2 (en) * 2012-10-05 2016-03-23 パナソニックＩｐマネジメント株式会社 Nitride semiconductor structure, laminated structure, and nitride semiconductor light emitting device
WO2014097931A1 (en) * 2012-12-17 2014-06-26 三菱化学株式会社 Gallium nitride substrate, and method for producing nitride semiconductor crystal
CN107002275B (en) * 2014-12-04 2020-01-21 希波特公司 Group III nitride substrate and method for manufacturing same
KR20180077433A (en) * 2016-12-29 2018-07-09 주식회사 루미스탈 Nitride Semiconductor Device and Method for manufacturing thereof
WO2019191760A1 (en) * 2018-03-30 2019-10-03 The Regents Of The University Of California Method of fabricating non-polar and semi-polar devices using epitaxial lateral overgrowth
CN112397604B (en) * 2020-11-18 2022-05-17 西安电子科技大学 PN junction ultraviolet detector based on m-plane 4H-SiC heteroepitaxy nonpolar AlGaN/BN and preparation method
CN114577659B (en) * 2022-01-26 2024-02-06 株洲科能新材料股份有限公司 Method for detecting gallium content in gallium nitride material

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Cited By (23)

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Publication number Priority date Publication date Assignee Title
US9153645B2 (en) 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US9431243B2 (en) 2005-05-17 2016-08-30 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US8987028B2 (en) 2005-05-17 2015-03-24 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US9219112B2 (en) 2005-05-17 2015-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US8878243B2 (en) 2006-03-24 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures and related methods for device fabrication
US8847279B2 (en) 2006-09-07 2014-09-30 Taiwan Semiconductor Manufacturing Company, Ltd. Defect reduction using aspect ratio trapping
US9318325B2 (en) 2006-09-07 2016-04-19 Taiwan Semiconductor Manufacturing Company, Ltd. Defect reduction using aspect ratio trapping
US9559712B2 (en) 2006-09-27 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
US9105522B2 (en) 2006-09-27 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
US8860160B2 (en) 2006-09-27 2014-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
US9040331B2 (en) 2007-04-09 2015-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US9231073B2 (en) 2007-04-09 2016-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US9508890B2 (en) 2007-04-09 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Photovoltaics on silicon
US9449868B2 (en) 2007-04-09 2016-09-20 Taiwan Semiconductor Manufacutring Company, Ltd. Methods of forming semiconductor diodes by aspect ratio trapping with coalesced films
US9543472B2 (en) 2007-04-09 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US9365949B2 (en) 2008-06-03 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Epitaxial growth of crystalline material
US9356103B2 (en) 2008-07-01 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
US8994070B2 (en) 2008-07-01 2015-03-31 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
US9287128B2 (en) 2008-07-15 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
US8981427B2 (en) 2008-07-15 2015-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
US9455299B2 (en) 2008-09-24 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for semiconductor sensor structures with reduced dislocation defect densities
US9299562B2 (en) 2009-04-02 2016-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Devices formed from a non-polar plane of a crystalline material and method of making the same
US9576951B2 (en) 2009-04-02 2017-02-21 Taiwan Semiconductor Manufacturing Company, Ltd. Devices formed from a non-polar plane of a crystalline material and method of making the same

Also Published As

Publication number Publication date
JP5461773B2 (en) 2014-04-02
KR20070051831A (en) 2007-05-18
KR101251443B1 (en) 2013-04-08
KR101332391B1 (en) 2013-11-22
KR20120046748A (en) 2012-05-10
WO2005122267A3 (en) 2006-08-17
WO2005122267A2 (en) 2005-12-22
JP2008501606A (en) 2008-01-24

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