WO2005113647A6 - 低線熱膨張係数を有するポリエステルイミドとその前駆体 - Google Patents

低線熱膨張係数を有するポリエステルイミドとその前駆体

Info

Publication number
WO2005113647A6
WO2005113647A6 PCT/JP2004/016627 JP2004016627W WO2005113647A6 WO 2005113647 A6 WO2005113647 A6 WO 2005113647A6 JP 2004016627 W JP2004016627 W JP 2004016627W WO 2005113647 A6 WO2005113647 A6 WO 2005113647A6
Authority
WO
WIPO (PCT)
Prior art keywords
polyesterimide
thermal expansion
linear thermal
low coefficient
precursor therefor
Prior art date
Application number
PCT/JP2004/016627
Other languages
English (en)
French (fr)
Other versions
WO2005113647A1 (ja
Inventor
Masatoshi Hasegawa
Shinsuke Inoue
Original Assignee
Manac Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manac Inc. filed Critical Manac Inc.
Priority to JP2006513666A priority Critical patent/JP4627297B2/ja
Publication of WO2005113647A1 publication Critical patent/WO2005113647A1/ja
Publication of WO2005113647A6 publication Critical patent/WO2005113647A6/ja

Links

Abstract

　本発明は低誘電率、低線熱膨張係数、高ガラス転移温度を有し、且つフレキシブルプリント配線基板用途として十分な膜靭性を併せ持つ、実用上有益なポリエステルイミドとその前駆体、およびそれらの製造方法を提供するものである。 　式（２）： 式中、 　ＡおよびＢは、独立して、二価の芳香族基、脂環式基またはそれらの組合せであるが、但し隣接する原子に対する二価の結合位置関係は、全てパラ位またはそれに相当する関係にある、 で表される繰り返し単位を含むことを特徴とするポリエステルイミド。
PCT/JP2004/016627 2004-05-21 2004-11-10 低線熱膨張係数を有するポリエステルイミドとその前駆体 WO2005113647A6 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006513666A JP4627297B2 (ja) 2004-05-21 2004-11-10 低線熱膨張係数を有するポリエステルイミドとその前駆体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004152406 2004-05-21
JP2004-152406 2004-05-21

Publications (2)

Publication Number Publication Date
WO2005113647A1 WO2005113647A1 (ja) 2005-12-01
WO2005113647A6 true WO2005113647A6 (ja) 2005-12-01

Family

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