WO2005110665A1 - Procede de decoupe par laser de materiaux - Google Patents

Procede de decoupe par laser de materiaux Download PDF

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Publication number
WO2005110665A1
WO2005110665A1 PCT/RU2004/000188 RU2004000188W WO2005110665A1 WO 2005110665 A1 WO2005110665 A1 WO 2005110665A1 RU 2004000188 W RU2004000188 W RU 2004000188W WO 2005110665 A1 WO2005110665 A1 WO 2005110665A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
οbeκτivοv
lazeρnyχ
cut
ποsρedsτvοm
Prior art date
Application number
PCT/RU2004/000188
Other languages
English (en)
Russian (ru)
Inventor
Yuri Konstantinovich Nizienko
Original Assignee
Yuri Konstantinovich Nizienko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuri Konstantinovich Nizienko filed Critical Yuri Konstantinovich Nizienko
Priority to PCT/RU2004/000188 priority Critical patent/WO2005110665A1/fr
Publication of WO2005110665A1 publication Critical patent/WO2005110665A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser

Definitions

  • the process is carried out in the physical spot of the product, as a result of which There is always a spot of vibration, since any laser is charac- terized by such a parameter, as well as the angular stability of the laser generation direction. Consequently, on a smaller scale, in the case of a diffracted angle, it vibrates (is taken), which also has a negative effect on 5 This is a fundamentally random process, which cannot be completely excluded.
  • the known method is not optimal for laser cutting of favorable materials, for example 10
  • the main claimed invention was the task of creating such a method of laser cutting of materials, in the case of a large number of
  • the directionally directed laser beams are optimized to operate in the horizontal area.
  • Fig. 1 General diagram of a device for the implementation of the declared 30 laser cutting method.
  • Fig. 2 - Cutting method we shall distribute on the basis of the use of the declared declared method of laser cutting.
  • the claimed method of laser cutting of materials is the following. It should be noted that there are two important important conditions that must be fulfilled in the declared laser process of the laser materials.
  • the cutter in the process, they interconnect the laser channels 13.14 by means of electrical equipment for the prevention of electrical disturbances.
  • the cutter is equipped with a laser beam 5, for example, with a left-handed
  • a cut - a beam of 6 with polarization In general, in one laser beam it is formed 7 the radiation is circularly polarized, and in the other (all-round) beam, the circular radiation is polarized (left).
  • the average intensity and the peak intensity can be independently regulated by the friend of the friend, in connection with which 20 the overheating of the material is excluded. In this case, it is possible to increase the speed of processing, and the depth of cut in each random process, which increases the productivity. Disruptive laser beams 5.6 use caution in the physical area to exclude damage to 25 laser process devices.
  • the advantages of the declared technological process in respect of the above are known in the following.
  • the claimed processing technology will allow you to significantly change the width of the input (as compared to the one that is used otherwise). Nearly every other laser beam 5.6 penetrates into the material to a depth of a little more than half of its thickness, which also helps to save power.
  • the declared method can be used in different ways where there is no need to use

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention se rapporte à des procédés de découpe par laser de matériaux, en particulier de matériaux précieux, et peut être appliquée à divers secteurs techniques, comme dans l'industrie joaillière, pour la découpe de cristaux de diamants avant leur facettage. Le procédé de traitement (découpe) par laser de matériaux selon l'invention consiste à procéder à l'ablation de matière d'une zone de découpe à l'aide d'un rayon laser (5, 6) qui est focalisé par au moins un objectif (1, 2), et à former une découpe simultanément sur les deux côtés de la pièce à travailler (9) à l'aide de deux rayons laser (5, 6) coaxiaux et possédant une orientation opposée. Dans le même temps, l'on utilise des données reçues préalablement concernant le profil des sections de surface (7, 8) de la pièce (9) de chaque côté de la découpe sur toute sa longueur, ce qui permet d'ajuster la mise au point des objectifs laser (1, 2) sur les sections correspondantes des surfaces traitées (7, 8). En outre, lors du processus de traitement, l'on procède à la séparation réciproque des canaux laser (13, 14) par l'intermédiaire d'un procédé de polarisation, afin d'empêcher la destruction des éléments des systèmes optiques par un rayonnement de retour (15, 16). Pour ce faire, le traitement est effectué par un rayon laser (5) à polarisation circulaire gauche sur un côté de la découpe, et par un rayon (6) à polarisation circulaire droite sur l'autre côté.
PCT/RU2004/000188 2004-05-18 2004-05-18 Procede de decoupe par laser de materiaux WO2005110665A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/RU2004/000188 WO2005110665A1 (fr) 2004-05-18 2004-05-18 Procede de decoupe par laser de materiaux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU2004/000188 WO2005110665A1 (fr) 2004-05-18 2004-05-18 Procede de decoupe par laser de materiaux

Publications (1)

Publication Number Publication Date
WO2005110665A1 true WO2005110665A1 (fr) 2005-11-24

Family

ID=35394034

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU2004/000188 WO2005110665A1 (fr) 2004-05-18 2004-05-18 Procede de decoupe par laser de materiaux

Country Status (1)

Country Link
WO (1) WO2005110665A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102718398A (zh) * 2012-06-07 2012-10-10 江阴德力激光设备有限公司 一种超短脉冲双光路激光异形切割玻璃的装置及方法
CN105798469A (zh) * 2016-05-16 2016-07-27 广州广源激光科技有限公司 一种多激光头激光切割机

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2025927A (en) * 1978-07-21 1980-01-30 Self Powered Lighting Ltd Apparatus for and method of dividing gas-filled glass tubing
GB2139614A (en) * 1983-05-13 1984-11-14 Glaverbel Method and apparatus for cutting glass
SU1225156A1 (ru) * 1984-06-15 1990-06-15 Московский автомобильный завод им.И.А.Лихачева Установка дл лазерной обработки
SU1581520A1 (ru) * 1988-06-27 1990-07-30 Предприятие П/Я В-2190 Устройство управлени процессом лазерной закалки
SU1640887A1 (ru) * 1989-07-19 1994-02-15 Н.А. Архипенко Установка для лазерной обработки
RU1593057C (ru) * 1988-12-29 1994-11-15 Научно-исследовательский центр по технологическим лазерам РАН Способ лазерной обработки
RU2085843C1 (ru) * 1994-09-30 1997-07-27 Нижегородский центр инкубации наукоемких технологий Оптический профилометр
JP2000023560A (ja) * 1998-04-24 2000-01-25 Kureatera:Kk 培土改質剤およびそれにより改質された改質培土
RU2172233C2 (ru) * 1999-06-29 2001-08-20 Жулев Юрий Григорьевич Способ и устройство для резки материалов лазерным лучом

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2025927A (en) * 1978-07-21 1980-01-30 Self Powered Lighting Ltd Apparatus for and method of dividing gas-filled glass tubing
GB2139614A (en) * 1983-05-13 1984-11-14 Glaverbel Method and apparatus for cutting glass
SU1225156A1 (ru) * 1984-06-15 1990-06-15 Московский автомобильный завод им.И.А.Лихачева Установка дл лазерной обработки
SU1581520A1 (ru) * 1988-06-27 1990-07-30 Предприятие П/Я В-2190 Устройство управлени процессом лазерной закалки
RU1593057C (ru) * 1988-12-29 1994-11-15 Научно-исследовательский центр по технологическим лазерам РАН Способ лазерной обработки
SU1640887A1 (ru) * 1989-07-19 1994-02-15 Н.А. Архипенко Установка для лазерной обработки
RU2085843C1 (ru) * 1994-09-30 1997-07-27 Нижегородский центр инкубации наукоемких технологий Оптический профилометр
JP2000023560A (ja) * 1998-04-24 2000-01-25 Kureatera:Kk 培土改質剤およびそれにより改質された改質培土
RU2172233C2 (ru) * 1999-06-29 2001-08-20 Жулев Юрий Григорьевич Способ и устройство для резки материалов лазерным лучом

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102718398A (zh) * 2012-06-07 2012-10-10 江阴德力激光设备有限公司 一种超短脉冲双光路激光异形切割玻璃的装置及方法
CN105798469A (zh) * 2016-05-16 2016-07-27 广州广源激光科技有限公司 一种多激光头激光切割机
CN105798469B (zh) * 2016-05-16 2017-09-05 广州广源激光科技有限公司 一种多激光头激光切割机

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