WO2005110235A1 - Ultrasonic probe and method for the fabrication thereof - Google Patents
Ultrasonic probe and method for the fabrication thereof Download PDFInfo
- Publication number
- WO2005110235A1 WO2005110235A1 PCT/KR2004/001164 KR2004001164W WO2005110235A1 WO 2005110235 A1 WO2005110235 A1 WO 2005110235A1 KR 2004001164 W KR2004001164 W KR 2004001164W WO 2005110235 A1 WO2005110235 A1 WO 2005110235A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- piezoelectric element
- electrode
- face
- grooves
- ultrasonic probe
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 14
- 239000013078 crystal Substances 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000012071 phase Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910003781 PbTiO3 Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0677—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a high impedance backing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
- B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements
Definitions
- the present invention relates to an ultrasonic probe having uniquely designed electrodes, and a method for the fabrication thereof.
- Ultrasonic imaging equipments have been widely used, and they conventionally comprise an ultrasonic probe for transducing an ultrasonic wave to an electric signal, a processing unit for processing the electric signal to an image and a display unit for displaying the image.
- the ultrasonic probe plays an important role in obtaining high-resolution image, and it is required to have a high electromechanical coupling coefficient, as well as good ultrasonic wave pulse and focusing characteristics of ultrasonic beam.
- An ultrasonic probe typically comprises an ultrasonic transmitting/receiving element consisting essentially of a piezoelectric element having a pair of electrodes, and as the piezoelectric element, lead zirconate titanate-based ceramics (PZT) was previously employed, but recently, a lead zirconia niobate-lead titanate(Pb(Zn ⁇ / 3Nb2 / 3)03-PbTi0 3 ; "PZN-PT”)- or lead magnesium niobate-lead titanate (Pb(Mg ⁇ / 3Nb 2 /3) ⁇ 3-PbTi0 3 ; "PMN-PT”) based piezoelectric single crystals have become favored because of their better properties.
- PZT lead zirconate titanate-based ceramics
- PZN-PT and PMN-PT have the disadvantage of poor thermal stability due to a low phase transition temperature.
- PZT has a phase transition temperature range of about 200 to 385 °C
- 0.67PMN-0.33PT exhibits the phase transition phenomena at about 150 ° c. If a piezoelectric element is subjected to a temperature higher than the phase transition temperature, it will become depolarized, and thus, the preparing process of an ultrasonic probe using such piezoelectric elements should not involve a high-temperature step. Accordingly, the electrical connection in an ultrasonic probe has been often achieved by using an epoxy paste which does not require a high temperature, rather than by soldering.
- an ultrasonic probe comprising: a piezoelectric element consisting essentially of a piezoelectric single crystal and having a first and second main faces and a first and second side faces; a first electrode deposited on a substantial portion of the first main face, the first side face, and a part of the second main face of the piezoelectric element, and a second electrode deposited on a substantial portion of the second main face, the second side face, and a part of the first main face of the piezoelectric element, the first and second electrodes being isolated from each other by two grooves formed on the first and second main faces of the piezoelectric element, in a manner parallel to the side edges of the piezoelectric element, respectively, at positions separated from the second and
- a method of the fabrication of an ultrasonic probe comprising: depositing an electrode layer on a first and second main faces and a first and second side faces of a piezoelectric element; forming two grooves on the first and second main face of the piezoelectric element, in a manner parallel to the side edges of the piezoelectric element, respectively, at positions separated from the second and first side edges of the piezoelectric element by a given distance, respectively, to separate the electrode layer into two electrodes; attaching a backing layer to the electrode layer deposited on the second main face of the piezoelectric element; attaching a ground electrode to the first electrode at the side face of piezoelectric element; and attaching a flexible printed circuit board to the second electrode in the front of the groove positioned on the first main face, extending from the second side face, of the piezoelectric element, by the end part bended at a right angle.
- Fig. 1 a schematic view of an ultrasonic probe according to the present invention
- Figs. 2a to 2c the procedures for forming two electrodes on a piezoelectric element in accordance with the present invention
- Figs. 3a to 3d the procedure for fabricating the inventive ultrasonic probe using the assembly of Fig. 2c, in accordance with the present invention
- Fig. 4a the vibration characteristic of a piezoelectric element having the electrodes formed according to Example of the present invention
- Fig. 4b the vibration characteristic of a piezoelectric element having the electrodes formed in Comparative Example.
- the inventive ultrasonic probe is characterized by comprising uniquely designed electrodes and FPCB attached thereto in a form not influenced by the paste used for the attachment.
- An ultrasonic probe conventionally contains a piezoelectric device (an ultrasonic transmitting/receiving element) comprising a piezoelectric element consisting essentially of a piezoelectric single crystal; a first and second electrodes formed on an ultrasonic wave transmitting/receiving face and the face opposite to the transmitting/receiving face of the piezoelectric element, respectively; acoustic matching layers formed on the first electrode; an acoustic lens formed to cover the entire surface of the acoustic matching layer; a ground electrode connected to the first electrode; and a flexible printed circuit board for signal, connected to the second electrode.
- the inventive ultrasonic probe is characterized in that the first electrode is formed on a substantial portion of a first main face, a first side face and a part of a second main face of the piezoelectric element, and the second electrode is formed on a substantial portion of a second main face, a second side face and a part of a first main face of the piezoelectric element, and that the two electrodes are isolated from each other by two grooves formed on the first and second main faces of the piezoelectric element, in a manner parallel to the side edges of the piezoelectric element, respectively, at positions separated from the second and first side edges by a given distance, respectively.
- the inventive ultrasonic probe may be fabricated as shown in Figs. 2 and
- electrode layer 20" is deposited on the first and second main faces 10a, 10b and the first and second side faces 10c, 10d of single crystal piezoelectric element or wafer 10 (see Fig. 2a), to obtain a coated wafer (see Fig.
- the piezoelectric element may have a thickness of 20 to 500,000 ⁇ m, preferably 50 to 400 an, in the direction of vibration.
- the electrode layer may be made of a conductive metal such as Cr, Cu, Ni, Au, etc., and a combination thereof.
- the deposition of the electrode layer may be conducted using a sputtering, electronic-beam, thermal-evaporation or electroplating method, and the thickness of the deposited electrode may range from 100 to 10,000 A .
- two grooves 30, 30' are formed to separate electrode layer 20" into first electrode 20 formed mainly on first main face 10a and first side face 10c (an ultrasonic wave transmitting/receiving face), and second electrode 20' formed mainly on second main face 10b and second side face 10d (the face opposite to the transmitting/receiving face), as shown in Fig. 2c.
- the grooves 30, 30' may each be formed at a position separated from the side edge of the piezoelectric element by a given distance, for example a distance to make room for applying an epoxy paste to attach the electrode to a flexible printed circuit board or a ground electrode in a later step, using a dicing saw.
- the grooves may be formed at the position of 1 to 1.5 mm inwardly from each side edge, and to a depth corresponding to 70 to 80% of the wafer thickness, in order to inhibit the generation of undesirable vibration.
- the resulting assembly 100 is then used to fabricate the inventive ultrasonic probe, as shown in Figs. 3a to 3d.
- Fig. 3a shows the step of attaching backing layer 40 to the electrode layer deposited on second main face 10b of the piezoelectric element, using an epoxy paste in a conventional manner
- Fig. 3b shows the step of attaching ground electrode plate 50 and flexible printed circuit board 60 for signal.
- Fig. 3a shows the step of attaching backing layer 40 to the electrode layer deposited on second main face 10b of the piezoelectric element, using an epoxy paste in a conventional manner
- Fig. 3b shows the step of attaching ground electrode plate 50 and flexible printed circuit board 60 for signal.
- Fig. 3a shows the step of attaching backing layer 40 to the electrode layer deposited on second main face 10b
- ground electrode plate 50 is attached to first electrode 20 at first side face 10c of piezoelectric element 10
- flexible printed circuit board 60 is attached to second electrode 20' in the front portion of the groove 30 positioned on first main face 10a of the piezoelectric element, extending from second side face 10d of the piezoelectric element, and bending at the end part at a right angle.
- the attachment of the ground electrode plate and the flexible printed circuit board to the first and second electrodes, respectively, may be conventionally carried out using conductive epoxy paste 70, preferably a conductive silver epoxy paste, as shown in Fig. 3c, and the use of such bended end part make the bonding of the electrode with the flexible printed circuit board strong.
- At least one acoustic matching layer 80 may be formed on the electrode layer deposited on the first main face of the piezoelectric element, as in Fig. 3d, and thereon an acoustic lens may be covered.
- the ultrasonic probe fabricated by the inventive method, as shown in Fig. 1 can have excellent vibration characteristics, a wide frequency band, and a high sensitivity.
- the piezoelectric single crystal used in the ultrasonic probe may be any strongly ferroelectric, homogeneous single crystal, preferably PMN-PT, of which an example may have the composition of formula (I): x(A)y(B)z(C)-p(P)n(N) (I) wherein,
- (A) is Pb(Mg ⁇ /3Nb 2/ 3)0 3 or Pb(Zn ⁇ 3 Nb2 / 3)0 3 ,
- (B) is PbTiOs
- (P) is a metal selected from the group consisting of Pt, Au, Ag, Pd and Rh
- (N) is an oxide of a metal selected from the group consisting of Ni, Co, Fe, Sr, Sc,
- the single crystal of formula (I) may be prepared by way of conducting a solid phase reaction followed by melting-crystallization, by a method described in Korean Patent No. 392754.
- the piezoelectric single crystal of formula (I) has a high dielectric constant of about 5,500 or higher, a piezoelectric constant of about 1 ,500 pC/N or higher at an ambient temperature, and a low temperature coefficient in a broad temperature range of 20 to 90 ° C.
- the inventive ultrasonic probe has a relative dielectric constant ranging from about 1 ,000 to 10,000, the velocity of a sound wave generated on the (001 ) face ranging from 1 ,200 to 4,000 m/s (frequency constant: 1 ,400 to 2,000 Hz.m), and a high electromechanical coefficient (k33') ranging from 80 to 95%. Accordingly, the inventive ultrasonic probe can be beneficially used for an ultrasonic diagnosis in medical, military, and industrial fields.
- the following Examples are given for the purpose of illustration only and are not intended to limit the scope of the invention.
- FIG. 1 An ultrasonic probe as shown in Fig. 1 , according to the present invention, was fabricated by a method comprising the procedures as shown in Figs. 2 and 3.
- Piezoelectric single crystal substrate 10 having a (001 ) face (surface 10a) and a size of 20-25mm x 15-20mm x 0.4-0.5mm was prepared, and metal layer (Cr/Cu/Au) 20" was deposited using a DC sputtering method on surfacesl Oa, 10b, 10c and 10d of the substrate (but not on surfaces 10e and 10f) at an ambient temperature under a pressure of 1.2 x 10 -7 mmHg (Figs. 2a and 2b). Subsequently, two grooves 30 and 30' were formed on surfaces 10a and
- ground electrode plate 50 was attached to electrode 20 at first side face 10c of piezoelectric substrate 10 while flexible printed circuit board 60 was attached to electrode 20' at a part of the front of groove 30, beyond second side face 10d, of piezoelectric substrate 10, by bending at a right angle (Fig. 3b).
- two acoustic matching layers 80 were laminated on the electrode layer deposited on surface 10a of piezoelectric substrate 10, and thereon an acoustic lens was covered to fabricate the inventive ultrasonic probe, as shown in Fig. 1 .
- Example 2 The procedures of Example were repeated except that the two electrodes 20, 20' were formed by coating an electrode material after a masking tape was covered on the isolation portions 30, 30' and then removing the masking tape after coating, to fabricate an ultrasonic probe.
- Vibration Characteristics The vibration characteristic of the piezoelectric elements on which the electrodes were deposited according to Example and Comparative Example were tested and the results are represented in Fig. 4a and Fig. 4b, respectively. From Fig. 4b, it can be seen that the piezoelectric element according to Comparative Example generates an undesirable vibration as shown in a dot-line box. In contrast, Fig. 4a shows that such undesirable vibration did not appear in the piezoelectric element according to the present invention. Accordingly, the inventive probe comprising electrodes isolated by grooves having a given depth gives improved vibration performance.
- the probing characteristics (the relative sensitivity and the band-width) of the ultrasonic probes fabricated in Example and Comparative Example were measured with a pulse-echo response test, and the results are shown in Table 1.
- Table 1 shows that the inventive probe having electrode isolation grooves is better in terms of sensitivity and band-width than the probe of Comparative Example having a simple isolation portion.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004800430574A CN100473353C (en) | 2004-05-17 | 2004-05-17 | Ultrasonic probe and method for the fabrication thereof |
PCT/KR2004/001164 WO2005110235A1 (en) | 2004-05-17 | 2004-05-17 | Ultrasonic probe and method for the fabrication thereof |
EP04733484.2A EP1765175B1 (en) | 2004-05-17 | 2004-05-17 | Ultrasonic probe and method for the fabrication thereof |
JP2007526959A JP4486127B2 (en) | 2004-05-17 | 2004-05-17 | Ultrasonic probe and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2004/001164 WO2005110235A1 (en) | 2004-05-17 | 2004-05-17 | Ultrasonic probe and method for the fabrication thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005110235A1 true WO2005110235A1 (en) | 2005-11-24 |
Family
ID=35393947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2004/001164 WO2005110235A1 (en) | 2004-05-17 | 2004-05-17 | Ultrasonic probe and method for the fabrication thereof |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1765175B1 (en) |
JP (1) | JP4486127B2 (en) |
CN (1) | CN100473353C (en) |
WO (1) | WO2005110235A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106446752B (en) * | 2015-08-04 | 2019-07-02 | 上海箩箕技术有限公司 | Electronic product |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR830004830A (en) * | 1980-05-09 | 1983-07-20 | 사바 쇼오이찌 | Ultrasound diagnostic device |
KR830004828A (en) * | 1981-03-31 | 1983-07-20 | 시바 쇼오이찌 | Ultrasonic Diagnostic Device |
US5810009A (en) | 1994-09-27 | 1998-09-22 | Kabushiki Kaisha Toshiba | Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61112500A (en) * | 1984-11-06 | 1986-05-30 | Matsushita Electric Ind Co Ltd | Ultrasonic probe |
US5423220A (en) * | 1993-01-29 | 1995-06-13 | Parallel Design | Ultrasonic transducer array and manufacturing method thereof |
US5402791A (en) * | 1993-08-06 | 1995-04-04 | Kabushiki Kaisha Toshiba | Piezoelectric single crystal, ultrasonic probe, and array-type ultrasonic probe |
US5857974A (en) * | 1997-01-08 | 1999-01-12 | Endosonics Corporation | High resolution intravascular ultrasound transducer assembly having a flexible substrate |
JP4153576B2 (en) * | 1997-11-25 | 2008-09-24 | 株式会社東芝 | Ultrasonic transducer |
US20040054287A1 (en) * | 2002-08-29 | 2004-03-18 | Stephens Douglas Neil | Ultrasonic imaging devices and methods of fabrication |
-
2004
- 2004-05-17 WO PCT/KR2004/001164 patent/WO2005110235A1/en active Application Filing
- 2004-05-17 JP JP2007526959A patent/JP4486127B2/en not_active Expired - Lifetime
- 2004-05-17 CN CNB2004800430574A patent/CN100473353C/en not_active Expired - Lifetime
- 2004-05-17 EP EP04733484.2A patent/EP1765175B1/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR830004830A (en) * | 1980-05-09 | 1983-07-20 | 사바 쇼오이찌 | Ultrasound diagnostic device |
KR830004828A (en) * | 1981-03-31 | 1983-07-20 | 시바 쇼오이찌 | Ultrasonic Diagnostic Device |
US5810009A (en) | 1994-09-27 | 1998-09-22 | Kabushiki Kaisha Toshiba | Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe |
Also Published As
Publication number | Publication date |
---|---|
CN100473353C (en) | 2009-04-01 |
CN1953710A (en) | 2007-04-25 |
EP1765175A1 (en) | 2007-03-28 |
JP4486127B2 (en) | 2010-06-23 |
EP1765175A4 (en) | 2017-07-12 |
JP2007537818A (en) | 2007-12-27 |
EP1765175B1 (en) | 2019-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4778003B2 (en) | Multilayer ultrasonic transducer and manufacturing method thereof | |
US9812634B2 (en) | Method of making thick film transducer arrays | |
US5115809A (en) | Ultrasonic probe | |
US4370785A (en) | Method for making ultracoustic transducers of the line curtain or point matrix type | |
US6153967A (en) | Ultrasonic probe and ultrasonic diagnostic apparatus | |
US6951135B2 (en) | Ultrasonic probe and method for the fabrication thereof | |
EP1765175B1 (en) | Ultrasonic probe and method for the fabrication thereof | |
JP3313171B2 (en) | Ultrasonic probe and manufacturing method thereof | |
KR100642677B1 (en) | Ultrasonic probe and preparing method thereof | |
JP2013026682A (en) | Medical composite single-crystal piezoelectric vibrator, medical ultrasonic probe, method of manufacturing medical composite single-crystal piezoelectric vibrator, and method of manufacturing medical ultrasonic probe | |
EP1703571B1 (en) | Piezoelectric device | |
JPH0865793A (en) | Ultrasonic probe | |
JP3413025B2 (en) | Piezoelectric element | |
JP3559497B2 (en) | Ultrasonic probe | |
JPH0750898A (en) | Ultrasonic probe | |
JP2001102650A (en) | Laminated piezoelectric single-crystal element, its manufacturing method, and ultrasonic probe using it | |
JPS6059899A (en) | Ultrasonic wave probe | |
JP3302124B2 (en) | Ultrasonic probe and manufacturing method thereof | |
JPS61172546A (en) | Ultrasonic probe | |
JPH01174199A (en) | Manufacture of multi-layer ultrasonic probe | |
JPS6054599A (en) | Linear array type ultrasonic probe | |
JP2000340851A (en) | Piezoelectric element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 200480043057.4 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007526959 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2004733484 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2004733484 Country of ref document: EP |