WO2005109535A3 - Procede de fabrication d'un dispositif thermoelectrique - Google Patents
Procede de fabrication d'un dispositif thermoelectrique Download PDFInfo
- Publication number
- WO2005109535A3 WO2005109535A3 PCT/IB2005/051434 IB2005051434W WO2005109535A3 WO 2005109535 A3 WO2005109535 A3 WO 2005109535A3 IB 2005051434 W IB2005051434 W IB 2005051434W WO 2005109535 A3 WO2005109535 A3 WO 2005109535A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- segments
- thermoelectric device
- substrate
- type semiconductor
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04101947 | 2004-05-06 | ||
EP04101947.2 | 2004-05-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005109535A2 WO2005109535A2 (fr) | 2005-11-17 |
WO2005109535A3 true WO2005109535A3 (fr) | 2006-03-16 |
Family
ID=34965729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2005/051434 WO2005109535A2 (fr) | 2004-05-06 | 2005-05-03 | Procede de fabrication d'un dispositif thermoelectrique |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2005109535A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104868044A (zh) * | 2015-05-25 | 2015-08-26 | 中国华能集团清洁能源技术研究院有限公司 | 一种用于大温差环境下的多级联热电臂及其制造方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8241295B2 (en) | 2007-09-05 | 2012-08-14 | Wolf Ii Erich W | Apparatus and method for the dispensing of bone cement |
DE102008038985A1 (de) * | 2008-08-13 | 2010-02-18 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Thermoelektrische Vorrichtung |
EP2175500A1 (fr) | 2008-10-10 | 2010-04-14 | Ishikawa Prefectural Government | Éléments de conversion thermoélectrique, modules de conversion thermoélectrique et procédé de fabrication des modules de conversion thermoélectrique |
US8193439B2 (en) | 2009-06-23 | 2012-06-05 | Laird Technologies, Inc. | Thermoelectric modules and related methods |
CN103199188B (zh) * | 2012-01-09 | 2016-06-08 | 天津大学 | 由薄膜温差电材料制造的叠层结构微型温差电器件及制造方法 |
CN104247063B (zh) * | 2012-04-27 | 2017-08-29 | 琳得科株式会社 | 热电转换材料及其制造方法 |
CN104993740B (zh) * | 2015-07-07 | 2017-08-08 | 天津大学 | 一种分段式温差发电器结构设计方法 |
DE102015216633B4 (de) * | 2015-08-31 | 2022-10-13 | Technische Universität Dresden | Verfahren zur Herstellung thermoelektrischer Elemente auf Oberflächen von Bauteilen |
GB2577572A (en) * | 2018-09-28 | 2020-04-01 | Sumitomo Chemical Co | Thermoelectric device |
FR3113985A1 (fr) * | 2020-09-08 | 2022-03-11 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d’un dispositif thermoelectrique |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3554815A (en) * | 1963-04-30 | 1971-01-12 | Du Pont | Thin,flexible thermoelectric device |
JPS63110778A (ja) * | 1986-10-29 | 1988-05-16 | Seiko Instr & Electronics Ltd | 熱電素子の製造方法 |
JPH02260581A (ja) * | 1989-03-31 | 1990-10-23 | Murata Mfg Co Ltd | 厚膜熱電素子 |
GB2330451A (en) * | 1997-10-14 | 1999-04-21 | Thin Film Technology | Forming devices by drop-on-demand printing |
WO2001008242A1 (fr) * | 1999-07-21 | 2001-02-01 | E Ink Corporation | Procedes preferes de production d'elements de circuits electriques utilises pour commander un affichage electronique |
US6300150B1 (en) * | 1997-03-31 | 2001-10-09 | Research Triangle Institute | Thin-film thermoelectric device and fabrication method of same |
WO2003099463A2 (fr) * | 2002-05-27 | 2003-12-04 | Koninklijke Philips Electronics N.V. | Procede et systeme de transfert d'un motif d'une surface d'estampage vers un substrat |
US20040013982A1 (en) * | 1999-09-14 | 2004-01-22 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
-
2005
- 2005-05-03 WO PCT/IB2005/051434 patent/WO2005109535A2/fr active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3554815A (en) * | 1963-04-30 | 1971-01-12 | Du Pont | Thin,flexible thermoelectric device |
JPS63110778A (ja) * | 1986-10-29 | 1988-05-16 | Seiko Instr & Electronics Ltd | 熱電素子の製造方法 |
JPH02260581A (ja) * | 1989-03-31 | 1990-10-23 | Murata Mfg Co Ltd | 厚膜熱電素子 |
US6300150B1 (en) * | 1997-03-31 | 2001-10-09 | Research Triangle Institute | Thin-film thermoelectric device and fabrication method of same |
GB2330451A (en) * | 1997-10-14 | 1999-04-21 | Thin Film Technology | Forming devices by drop-on-demand printing |
WO2001008242A1 (fr) * | 1999-07-21 | 2001-02-01 | E Ink Corporation | Procedes preferes de production d'elements de circuits electriques utilises pour commander un affichage electronique |
US20040013982A1 (en) * | 1999-09-14 | 2004-01-22 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
WO2003099463A2 (fr) * | 2002-05-27 | 2003-12-04 | Koninklijke Philips Electronics N.V. | Procede et systeme de transfert d'un motif d'une surface d'estampage vers un substrat |
Non-Patent Citations (5)
Title |
---|
DECRE M M J ET AL: "Wave printing (I) : towards large-area, multilayer microcontact printing", NONTRADITIONAL APPROACHES TO PATTERNING. SYMPOSIUM (MATER. RES. SOC. SYMPSOIUM PROCEEDINGS VOL.EXS-2) MATER. RES. SOC WARRENDALE, PA, USA, 2004, pages 59 - 61, XP002349429, ISBN: 1-55899-746-6 * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 355 (E - 661) 22 September 1988 (1988-09-22) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 004 (E - 1020) 8 January 1991 (1991-01-08) * |
SCHELLEKENS J ET AL: "Wave printing (II) : polymer MISFETs using microcontact printing", NONTRADITIONAL APPROACHES TO PATTERNING. SYMPOSIUM (MATER. RES. SOC. SYMPSOIUM PROCEEDINGS VOL.EXS-2) MATER. RES. SOC WARRENDALE, PA, USA, 2004, pages 21 - 23, XP002349430, ISBN: 1-55899-746-6 * |
XIA Y ET AL: "SOFT LITHOGRAPHY", ANGEWANDTE CHEMIE. INTERNATIONAL EDITION, VERLAG CHEMIE. WEINHEIM, DE, vol. 37, 1998, pages 551 - 575, XP000985399, ISSN: 0570-0833 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104868044A (zh) * | 2015-05-25 | 2015-08-26 | 中国华能集团清洁能源技术研究院有限公司 | 一种用于大温差环境下的多级联热电臂及其制造方法 |
CN104868044B (zh) * | 2015-05-25 | 2018-11-09 | 中国华能集团清洁能源技术研究院有限公司 | 一种用于大温差环境下的多级联热电臂及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2005109535A2 (fr) | 2005-11-17 |
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