WO2005106512A1 - マニュアル試験用器具 - Google Patents
マニュアル試験用器具 Download PDFInfo
- Publication number
- WO2005106512A1 WO2005106512A1 PCT/JP2004/006305 JP2004006305W WO2005106512A1 WO 2005106512 A1 WO2005106512 A1 WO 2005106512A1 JP 2004006305 W JP2004006305 W JP 2004006305W WO 2005106512 A1 WO2005106512 A1 WO 2005106512A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact
- height
- regulating
- electronic component
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Definitions
- the present invention relates to an apparatus for manually testing electronic components such as an IC device.
- the IC device As a type of test equipment for testing electronic components such as IC devices, the IC device is transported onto a test head, and the IC device is pressed into a test head socket by a pusher driven by a pusher drive. Then, the external terminals of the IC device are electrically connected to the connection terminals of the socket, and the IC device is tested by the electric signal from the test head. According to the test results, at least a good chip and a defective product There is known an electronic component test apparatus that separates the chip into chips.
- the above-mentioned electronic component test equipment is useful for testing a large number of IC devices as finished products automatically in a short period of time. Using a few heads
- IC devices are manually tested, and debugging is performed based on the test results.
- test device 8 a manual test device 8 (hereinafter referred to as “test device 8”) as shown in FIGS. 4 and 5 has been conventionally used.
- test device 8 a concave device housing portion 83 is formed on the lower surface side of the main body portion 81.
- an opening portion 82 Fixed plate with 1 formed The IC device 7 is fixed to the main body 8 1 with the external terminals of the IC device 7 exposed from the opening 8 2 1 of the fixing plate 8 2. Then, insert the mouthlet screw 4 into the main body 8
- the external terminals of the IC device 7 are socketed by screwing them into the holes 8 4 of the 5. Connect to probe pin 1 and test IC device 7.
- the device accommodating portion 83 is provided with the IC terminal 7 so as to securely connect the external terminal of the IC device 7 to the probe pin of the socket 51.
- the fixing plate 82 It has dimensions (vertical, horizontal, and depth) corresponding to the shape of the C device 7, and the fixing plate 82 also has an opening 82 that has a shape corresponding to the arrangement of the external terminals of the IC device 7. Have one. Therefore, when testing IC devices 7 having different shapes, it is necessary to replace the device housing portion 83 and the fixed plate 82, that is, the entire test device 8.
- the present invention has been made in view of the above situation, and an object of the present invention is to provide a manual testing instrument that can deal with different types of electronic components.
- the present invention relates to a manual testing instrument for connecting an external terminal of an electronic component to a contact portion of an electronic component testing device, wherein the electronic component is connected to the contact portion. Abuts on the top surface of the electronic component, with the planar position defining part that can define the position in the planar direction of the A height regulating portion having a contact member, wherein the height of the electronic component can be regulated by the contact member.
- the contact member of the height regulating portion has a height
- the present invention provides a manual test device characterized in that the position in the vertical direction is variable (Invention 1).
- the present invention relates to a manual testing instrument for connecting external terminals of an electronic component to connection terminals provided on a socket of an electronic component testing device, and the socket and the Z or the guide of the socket are provided.
- a planar position defining portion that is detachably mounted and that can define a position of the electronic component in a planar direction with respect to the connection terminal of the socket; and an electronic device provided on the opposite side of the socket in the planar position defining portion.
- a height regulating portion that can regulate the position of the component in the height direction, wherein the height regulating portion has a contact member that contacts an upper surface of the electronic component; and a height of the contact member. And a variable height member capable of changing the position in the vertical direction.
- a manual test device is provided (Invention 2).
- the position of the electronic component in the planar direction can be defined by the planar position defining portion, and the position of the contact member in contact with the upper surface of the electronic component in the height direction is changed.
- This makes it possible to cope with electronic components having different thicknesses and perform a manual test of the electronic components.
- the plane position defining section and the height regulating section separate structures, electronic components having different sizes in the plane direction can be dealt with by changing only the plane position defining section. There is no need to change the entire test fixture.
- the height-variable member has a regulating member that regulates a position in a height direction of the contact member, and a contact portion having a different height with which a part of the regulating member contacts.
- a block, and the regulating member has a height of the regulating member according to a contact position of the block with respect to a contact portion.
- the position in the direction may be variable (Invention 3).
- the position of the contact member in the height direction can be changed with a simple configuration.
- the groove of the block may be formed radially in a plan view, and the regulating member may be provided rotatably around a center of the groove in a radial view in plan view.
- the regulating member may be provided rotatably around a center of the groove in a radial view in plan view.
- a center portion of the regulating member is an operation portion capable of rotating the regulating member (Invention 6).
- the position in the height direction of the restricting member and thus the contact member can be easily changed by rotating the operation part.
- the contact member is urged against the regulating member by an elastic body, whereby the regulating member is urged against a contact portion of the block.
- Invention 7 there is no play between the contact member and the regulating member, and between the regulating member and the contact portion of the hook, and the position of the contact member in the height direction is reliably defined. Can be.
- the regulating member is separated from the contact portion of the block by being pressed toward the contact member against the bias of the elastic body, and the height of the regulating member is increased. It is preferable that the position in the direction can be changed (Invention 8).
- the height regulating portion further includes a guide member for guiding the contact member (Invention 9).
- the contact member whose position in the height direction is variable can be reliably guided and held.
- the height regulating portion guides the contact member, a first guide member mounted on the plane position defining portion, and the first guide.
- a second guide member provided on a side of the member opposite to the plane position defining portion, wherein a flange is formed on the contact member, and a flange of the contact member and the first guide are provided.
- the elastic body is provided between the elastic member and the elastic member (Invention 10).
- invention 10 it is possible to reliably guide and hold the contact member whose position in the height direction is variable, and to urge the contact member against the regulating member with a simple configuration.
- the height control part is easy to assemble.
- FIG. 1 is an exploded perspective view of a manual test device according to one embodiment of the present invention.
- FIG. 2 is an exploded perspective view of a part of the manual test device according to the embodiment.
- FIG. 3 is a schematic perspective view and a cross-sectional view showing the operation of the manual test device according to the embodiment.
- FIG. 4 is an exploded perspective view of a conventional manual test device as viewed from the upper surface side.
- FIG. 5 is an exploded perspective view of a conventional manual test device as viewed from the lower surface side.
- test device 1 As shown in FIG. 1, a manual test device 1 (hereinafter, referred to as “test device 1”) according to the present embodiment is an IC device 7 (an example of an electronic component in the present invention, which has a rectangular shape in plan view).
- a device accommodating member 2 (an example of a planar position defining portion in the present invention) for accommodating the IC device 7 and a height regulating device 3 for regulating the position of the IC device 7 in the height direction.
- the device housing member 2 has a generally plate-like shape with four corners cut out as a whole. At the center of the device accommodating member 2, a device accommodating portion 21 formed of a substantially rectangular through hole in a plan view is formed. At both ends of the device accommodating member 2, a guide bush of a socket guide 6 described later is provided. Through holes 22 and 22 into which 61 is inserted are formed.
- the device accommodating portion 21 of the device accommodating member 2 has four inner side walls on which the four side surfaces of the IC device 7 can come into close contact with each other, and the upper portion of each inner side wall facilitates insertion of the IC device 7. Has spread slightly.
- the height regulating device 3 includes a contact member 31 contacting the upper surface of the IC device 7 accommodated in the device accommodating member 2, an opening guide 32 guiding the lower part of the contact member 31, and a contact member. 3 Upper guide 3 that guides the upper part of 1 3, regulating member 3 4 that regulates the height position of contact member 3 1, and block 3 5 that determines the position of regulating member 3 4 in the height direction And a coil spring 36 for urging the contact member 31.
- the contact member 31 includes a square pillar-shaped main body 311, a cylindrical boss 312 formed at the upper end, and a flange formed between the main body 311 and the boss 312. It is composed of 3 1 3.
- the lower guide 32 is entirely covered by the device accommodating member 2 and has a shape that fits into the device accommodating member 2.
- a guide hole 3 21 consisting of a rectangular through hole that guides the body 3 11 of the contact member 3 1 is formed.
- Guide pins 3 2 inserted into through holes 22, 22 of the device housing member 2 and guide bushes 6 1 of socket guides 6 described later are provided at lower end portions of the lower guide 32. 2, 3 2 2 are formed.
- screw holes 3 2 4 and 3 2 into which screws 3 7 and 3 7 for fixing the upper guide 33 and the block 35 are screwed.
- the bottom surface of the lower guide 32 is an abutting surface 325 that abuts against a stopper portion 63 of the socket guide 6 described later.
- the coil spring 36 is provided between the upper surface of the lower guide 32 and the flange 3 13 of the contact member 31, and the contact member 31 is formed by the elastic force of the coil spring 36. It is urged in the opposite direction of (2) (regulation member 34 side).
- the upper guide 33 has a substantially quadrangular prism shape as a whole. At the center of the upper guide 33, a boss 312 of the contact member 311 is inserted, and a circular through hole 331 is formed in the upper guide 3 for guiding the boss 312.
- a guide hole 3 3 2 formed of a circular hole in a plan view that guides the flange portion 3 1 3 of the contact member 3 1 into which the upper part of the contact member 3 1 is inserted is formed. .
- a concave portion 33 33 shaped like a combination of two fan shapes is formed on the upper side of the upper guide 33 so that the regulating member 34 can be fitted and rotated. Further, at the corners of the upper guide 33, through holes 3334, 334 through which the screws 37, 37 pass are formed.
- the regulating member 34 has a generally T-shaped shape as viewed from the side as a whole.
- the regulating member 34 has a substantially cylindrical operating part 34 3 at the upper part, and a cylindrical boss 34 1 that can be inserted into the through hole 33 1 of the upper guide 33 at the lower end.
- a groove is formed at the upper end of the operation unit 3 4 3 so that the tip of a flathead screwdriver can be inserted.
- Two arms 3 4 2 and 3 4 2 extending in the radial direction of the regulating member 3 4 are formed between the operating section 3 4 3 and the boss 3 4 1 of the regulating member 3 4.
- the two arms 342 and 342 are arranged in a straight line.
- the block 35 has a substantially quadrangular prism shape as a whole.
- an operating portion 343 of the regulating member 34 is inserted, and a circular through hole 352 is formed in a plan view to guide the operating portion 3443.
- Holes 35 3 and 35 3 are formed in the corners of 5 through which the threads of the screws 37 and 37 penetrate and the heads of the screws 37 and 37 are locked.
- grooves 3 5 1 with different depths are radially Numbers are formed.
- the groove 351 has a shape in which the arm portion 3422 of the regulating member 34 is fitted, and the depth of the groove 351 facing each other across the through hole 352 is the same. I have. In the present embodiment, ten grooves 351 are formed, and therefore, the depth of the grooves 351 is five levels.
- the depth of the groove 351 can be appropriately changed according to the thickness of the IC device 7, but for example, 0.8 mm, 1.0 mm, 1.2 mm, 1.4 mm, and 1.4 mm. And a depth of 1.6 mm.
- an indicator indicating the depth of each of the grooves 351 may be provided around the through hole 352.
- the regulating member 34 is accommodated between the block 35 and the upper guide 33, and the upper surface of the lower guide 32 and the flange 31 of the abutting member 31 are formed.
- the coil spring 36 is interposed between the guide member 3 and the upper part of the contact member 31 and the guide hole 33 of the upper guide 33, and the lower part of the contact member 31 is the guide hole of the lower guide 32. Insert into 1. In this state, insert screws 3 7 and 3 7 into holes 3 3 3 and 3 5 3 of block 35 and through holes 3 3 4 and 3 3 4 of upper guide 33 and screw holes 3 and 3 of lower guide 3 2 Screw into 2 4 and 3 2 4.
- the contact member 31 is urged toward the regulating member 34 by the elastic force of the coil spring 36, and the upper end surface of the boss 3 1 2 of the contact member 31 is attached to the boss 3 4 of the regulating member 34.
- the restricting member 34 is urged toward the block 35 side by contacting the lower end surface of 1. Then, the upper surface of the arm portion 342 of the regulating member 34 is pressed against the inner surface of the groove 351 of the block 35.
- the height position of the regulating member 34 is determined according to the depth of the groove 35 1 of the block 35 in which the arm 3 42 of the regulating member 34 is fitted.
- the position in the height direction of (the lower end surface of) the contact member 31 located below the regulating member 34 is determined.
- the tip of the flathead screwdriver D is Insert into the groove at the upper end of 3 and press the regulating member 34 downward against the elastic force of the coil spring 36.
- the arm 342 of the restricting member 34 is separated from the groove 351 of the block 35, and the restricting member 34 becomes rotatable.
- FIG. 3 (c) As shown in the figure, the downward pressing of the regulating member 34 is released, and the arm portion 34 of the regulating member 34 is fitted into the groove 35 of the block 35 by the elastic force of the coil spring 36. 4 The upper surface of 2 is brought into contact with the inner surface of groove 3 51.
- test device 1 Next, a method of performing a manual test using the test device 1 will be described.
- the mounting target of the test device 1 has the following configuration. That is, a socket port 5 is arranged on a test head of the electronic component test apparatus, and a socket 51 having a plurality of probe pins is provided on the socket board 5.
- the probe pins are provided in a number and a pitch corresponding to the external terminals of the IC device 7, and are urged upward by a spring.
- a socket guide 6 is fixed around the socket 51.
- guide bushes 61, 61 which can be fitted into the through holes 22, 22, of the device housing member 2, and the guide bushes 61, 61 are provided in the guide bushes 61, 61.
- a hole is formed in which the guide pins 32 and 32 of the lower guide 32 can be fitted.
- Stoppers 63, 63 are formed near the guide bushes 61, 61 at both ends of the socket guide 6, to which the contact surface 32, 5 of the lower guide 32 can abut.
- stocks Screw holes 62, 62 into which the knurled screw 4 can be screwed are formed in the openings 63, 63 (both corners of the socket guide 6).
- the device housing member 2 When performing a manual test, first, the device housing member 2 is attached to the socket guide 6. Specifically, the device housing member 2 is put on the socket guide 6 by inserting the guide bushes 61, 61 of the socket guide 6 into the through holes 22, 22, of the device housing member 2. At this time, the probe pins of the socket 51 are exposed in the device housing portion 21 of the device housing member 2.
- the IC device 7 is dropped into the device housing portion 21 of the device housing member 2.
- the IC device 7 is mounted on the probe pins, and the four side surfaces of the IC device 7 are in close contact with the four inner walls of the device housing member 2, so that the planar direction of the IC device 7 (X-axis direction and Y-axis) Direction) is defined. Thereby, the alignment between the external terminal of the IC device 7 and the probe pin is reliably performed.
- the height regulating device 3 in which the regulating member 34 and the contact member 31 are set to predetermined heights according to the thickness of the IC device 7 is mounted on the device housing member 2.
- the lower guide 32 is put on the device housing member 2, and the guide pins 3 2 2, 3 2 2 of the lower guide 3 are passed through the through holes 22, 22 of the device housing member 2. Insert the guide bushings 6 1, 6 1 of the socket guide 6 into the holes.
- the knurled screw 4 is passed through the through holes 3 2 3 and 3 2 3 of the lower guide 32 and screwed into the screw holes 6 2 and 6 2 of the socket guide 6.
- the lower end surface of the contact member 31 of the height regulating device 3 abuts on the upper surface of the IC device 7 at a predetermined height, and the external terminal of the IC device 7 is pressed against the probe pin of the socket 51.
- the lower limit position of the height regulating device 3 is defined by the contact surface 3 25 of the lower guide 32 contacting the stopper portion 63 of the socket guide 6.
- the regulating device 3 can press the external terminal of the IC device 7 against the probe pin of the socket 51 with an appropriate pressure that does not damage the IC device 7 or the probe pin.
- a test electric signal is transmitted from the test main device to the IC device 7 via the probe pin of the socket 51 to perform the test.
- the knurled screw 4 is removed, the height regulating device 3 is removed from the device housing member 2, and then the device is removed from the device housing member 2.
- the restricting member 3 4 of the height restricting device 3 is rotated while being pressed by a flathead screwdriver 1 D, so that the restricting member 34 and the abutting member 31 are set to the height corresponding to the thickness of the next IC device 7. Set. Subsequent procedures are as described above.
- test device 1 As described above, according to the test device 1 according to the present embodiment, it is possible to cope with the IC devices ⁇ having different thicknesses without replacing the test device 1, and perform the manual test of the IC device 7. Can be.
- the device accommodating member 2 is placed in the vertical and horizontal directions of the IC device 7. It is sufficient to replace the device with the device housing portion 21 having a size corresponding to the length of the test device 1, and it is not necessary to replace the entire test device 1.
- the number of test devices 1 to be used can be reduced, so that the cost required for the manual test can be reduced, and the test operation caused by the proper use of the test device can be reduced. Complexity can be reduced.
- a plurality of grooves 351 having different depths are formed radially in a plan view.
- the present invention is not limited to this. 51 may be formed in parallel with each other, or a stepped surface or a slope surface instead of the groove 35 1 may be formed on the lower side of the block 35.
- the manual test device of the present invention it is possible to deal with electronic components having different thicknesses, and it is possible to perform a manual test on the electronic component. That is, the manual testing device of the present invention is useful for manually testing various types of electronic components.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2004/006305 WO2005106512A1 (ja) | 2004-04-30 | 2004-04-30 | マニュアル試験用器具 |
| US11/294,577 US7199596B2 (en) | 2004-04-30 | 2005-12-06 | Manual testing instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2004/006305 WO2005106512A1 (ja) | 2004-04-30 | 2004-04-30 | マニュアル試験用器具 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/294,577 Continuation US7199596B2 (en) | 2004-04-30 | 2005-12-06 | Manual testing instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005106512A1 true WO2005106512A1 (ja) | 2005-11-10 |
Family
ID=35241801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2004/006305 Ceased WO2005106512A1 (ja) | 2004-04-30 | 2004-04-30 | マニュアル試験用器具 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7199596B2 (ja) |
| WO (1) | WO2005106512A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019003819A1 (ja) * | 2017-06-27 | 2019-01-03 | 株式会社ヨコオ | マニュアルアクチュエータ |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7656179B2 (en) * | 2006-11-10 | 2010-02-02 | Yokowo Co., Ltd. | Relay connector having a pin block and a floating guide with guide hole |
| JP4845031B2 (ja) * | 2006-11-10 | 2011-12-28 | 株式会社ヨコオ | 中継コネクター |
| TWI442053B (zh) * | 2009-12-01 | 2014-06-21 | Mpi Corporaion | 探針卡以及用於探針卡的維修裝置和方法 |
| CN102749482A (zh) * | 2011-04-22 | 2012-10-24 | 鸿富锦精密工业(深圳)有限公司 | 电容测试夹具及具有该电容测试夹具的电容测试装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03183972A (ja) * | 1989-12-13 | 1991-08-09 | Fujitsu Ltd | Icパッケージの特性試験装置及び試験方法 |
| JPH05249182A (ja) * | 1992-03-04 | 1993-09-28 | Nippon Maikuronikusu:Kk | 半導体チップソケット |
| JPH10197598A (ja) * | 1997-01-16 | 1998-07-31 | Jsr Corp | 検査治具 |
| JP2003243117A (ja) * | 2002-02-14 | 2003-08-29 | Yamaichi Electronics Co Ltd | Icソケット |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3119686A1 (de) * | 1981-05-18 | 1982-12-02 | Siemens AG, 1000 Berlin und 8000 München | Be- und entstueckautomat fuer bauelemente |
| JPS63291375A (ja) * | 1987-05-22 | 1988-11-29 | Yamaichi Electric Mfg Co Ltd | Icソケット |
| US4940935A (en) * | 1989-08-28 | 1990-07-10 | Ried Ashman Manufacturing | Automatic SMD tester |
-
2004
- 2004-04-30 WO PCT/JP2004/006305 patent/WO2005106512A1/ja not_active Ceased
-
2005
- 2005-12-06 US US11/294,577 patent/US7199596B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03183972A (ja) * | 1989-12-13 | 1991-08-09 | Fujitsu Ltd | Icパッケージの特性試験装置及び試験方法 |
| JPH05249182A (ja) * | 1992-03-04 | 1993-09-28 | Nippon Maikuronikusu:Kk | 半導体チップソケット |
| JPH10197598A (ja) * | 1997-01-16 | 1998-07-31 | Jsr Corp | 検査治具 |
| JP2003243117A (ja) * | 2002-02-14 | 2003-08-29 | Yamaichi Electronics Co Ltd | Icソケット |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019003819A1 (ja) * | 2017-06-27 | 2019-01-03 | 株式会社ヨコオ | マニュアルアクチュエータ |
| JP2019007879A (ja) * | 2017-06-27 | 2019-01-17 | 株式会社ヨコオ | マニュアルアクチュエータ |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060084290A1 (en) | 2006-04-20 |
| US7199596B2 (en) | 2007-04-03 |
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