WO2007027155A1 - Invertible modular test device for testing integrated circuit devices - Google Patents

Invertible modular test device for testing integrated circuit devices Download PDF

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Publication number
WO2007027155A1
WO2007027155A1 PCT/SG2006/000102 SG2006000102W WO2007027155A1 WO 2007027155 A1 WO2007027155 A1 WO 2007027155A1 SG 2006000102 W SG2006000102 W SG 2006000102W WO 2007027155 A1 WO2007027155 A1 WO 2007027155A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive housing
housing body
pin
holes
modular socket
Prior art date
Application number
PCT/SG2006/000102
Other languages
French (fr)
Inventor
Thiam Hee Boo
Original Assignee
Knight Auto Precision Engineering Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knight Auto Precision Engineering Pte Ltd filed Critical Knight Auto Precision Engineering Pte Ltd
Priority to TW095135340A priority Critical patent/TW200815773A/en
Publication of WO2007027155A1 publication Critical patent/WO2007027155A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Definitions

  • the present invention relates to an integrated circuit (IC) device testing, and more particularly, to a modular socket and method for testing IC devices.
  • IC integrated circuit
  • Testing an IC device often involves establishing an electrical connection between a testing equipment and the IC device.
  • One way of testing the IC device using a test socket begins with placing the IC device into a socket, which comprises a body with holes that span through the body. These holes house contacts that are aligned with electrical contact points of the IC device.
  • the socket includes a lid that, when closed, pushes the contact points of the IC device against the contacts that are housed in the holes.
  • the socket is then plugged into a printed circuit board (PCB) to test the device's computational integrity.
  • PCB printed circuit board
  • This insertion often involves a biasing force in the opposite direction of the lid's pushing force.
  • One common way for providing electrical contacts involves the use of "pogo pin” contacts. These "pogo pins" are housed in the holes of the socket.
  • sockets When testing devices of different designs and functions, different sockets have to be used. These sockets are often mounted fixedly and are not compatible for testing another IC device of a different design or function. As a result, a variety of customized sockets and its electrical contacts must be provided to suit a variety of IC devices. This inevitably increases the cost of the manufacturing and testing process.
  • the present invention provides a "reusable" modular socket by virtue of its invertible qualities.
  • the compressible probes of the present invention also allows for "reusability" due to its invertible qualities.
  • One end of the electrical contacts is constantly in contact with the PCB while the other end is in contact with the IC devices to be tested. Due to multiple replacements of IC devices to be tested, the end of the electrical contact for establishing contact with the IC devices will be worn out or damaged.
  • the socket and its electrical contacts can be advantageously inverted, so that the end of the electrical contact previously for establishing contact with the PCB can be used to establish contacts with subsequent IC devices to be tested.
  • the worn out end of the electrical contact due to multiple contacts with the IC devices is used for establishing contact with the PCB instead.
  • the life of the socket and its electrical contacts is therefore extended considerably before any replacement is required.
  • the present invention allows for the testing of IC devices of the same pitch but with different pin counts.
  • the present invention may also be adapted to test IC devices of different designs without having the need to customize every socket to cater to the testing of each individual IC device. Such flexibility advantageously reduces costs of manufacturing process.
  • the present invention seeks to provide a non-conductive housing body having a top face and a bottom face, the non-conductive housing body comprising a plurality of pin-holes and a plurality of compressible probes disposed within the plurality of pinholes.
  • the non-conductive housing body and the plurality of compressible probes housed therein are adapted to be inverted such that either the bottom face or the top face of the non-conductive housing body is in contact with an integrated circuit device for testing.
  • the present invention provides a method of testing integrated circuit devices.
  • the method comprising the steps of: providing a modular socket comprising a non-conductive housing body having a top face and a bottom face, the non-conductive housing body comprising a plurality of pin-holes, and a plurality of compressible probes disposed within the plurality of pin-holes, wherein the non- conductive housing body with the plurality of compressible probes housed therein can be inverted such that either the bottom face or the top face of the non-conductive housing body is in contact with an integrated circuit device for testing; and testing the integrated circuit devices by sending electrical signals via the plurality of compressible probes.
  • the present invention provides another method of testing integrated circuit devices.
  • the method comprising the steps of: (a) providing a modular socket comprising an invertible non-conductive housing body; (b) securing a printed circuit board directly under the modular socket; (c) picking the integrated circuit device and aligning the integrated circuit device with the modular socket; (d) placing the integrated circuit device into the modular socket such that the integrated circuit device remains in contact with the plurality of compressible probes; (e) testing the plurality of integrated circuit devices by sending electrical signals via the plurality of compressible probes; (f) removing the modular socket from the printed circuit board after testing a predetermined plurality of integrated circuit devices; (g) inverting the invertible non- conductive housing body; and (h) repeating steps (b) to (e).
  • FIG. 1 illustrates an exploded perspective view of a modular socket in accordance with the present invention
  • FIG. 2 illustrates a perspective view of the modular socket comprising a non- conductive housing body in accordance with the present invention
  • FIG. 3 A illustrates a cross sectional view of the modular socket in accordance with the present invention taken along the direction indicated by a line A - A' as shown in FIG. 1;
  • FIG. 3B illustrates a cross sectional view of the modular socket in accordance with the present invention taken along the direction indicated by a line A — A' as shown in FIG. 1, wherein the non-conductive housing body is inverted;
  • FIG. 4 A illustrates a perspective view of the non-conductive housing body in accordance with the present invention showing the top face of the non-conductive housing body
  • FIG. 4B illustrates a perspective view of the non-conductive housing body in accordance with the present invention showing the bottom face of the non-conductive housing body
  • FIG. 5 illustrates a compressible probe in accordance with the present invention.
  • FIG. 1 an illustration is shown of an exploded perspective view of an example of a modular socket 100 in accordance with the present invention.
  • the modular socket 100 comprises an alignment plate 110, a non-conductive housing body 120 for housing a plurality of compressible probes 140, a retainer plate 130, a plurality of compressible probes 140 and at least one securing means 150 for securing the retainer plate 130 to the non-conductive housing body.
  • the modular socket 100 is secured to a PCB for testing the IC device, such that the PCB abuts either the non-conductive housing body 120 or the retainer plate 130.
  • the alignment plate 110 is for aligning an IC device handler, which picks and places IC devices to be tested into the modular socket 100 for testing.
  • the IC device to be tested is placed through a through hole 155 of the alignment plate 110, onto the non- conductive housing body 120.
  • the alignment plate 110 comprises a substantially flat top face, a substantially flat bottom face and a through hole 155 for the IC device handler to access through thereof and place the IC device to be tested.
  • the bottom face of the alignment plate 110 comprises of at least one adaptor pin 115 for coupling to the non-conductive housing body 120.
  • the at least one adaptor pin 115 can be securely inserted into at least one through hole 125 on the non-conductive housing body 120 on either face of the non- conductive housing body 120.
  • the at least one adaptor pin 115 corresponds to the at least one through hole 125 on the non-conductive housing body 120 on both faces of the non- conductive housing body 120.
  • the alignment plate 110 comprises four adaptor pins 115 and the non-conductive housing body 120 comprises four through holes 125.
  • the four adaptor pins 115 correspond to the four through holes 125 on either face of the non- conductive housing body 120.
  • the four adaptor pins 115 and four through holes 125 are symmetrically located about an axis centre of the alignment plate 110 and non- conductive housing body 120 respectively. Even when the non-conductive housing body 120 is inverted, the four adaptor pins 115 are corresponding to the four through holes 125.
  • the non-conductive housing body 120 is reversibly coupled to the alignment plate 110 such that the four adaptor pins 115 can be inserted into the four through holes 125 of the non-conductive housing body 120 at either face of the non-conductive housing body 120.
  • the bottom face of the alignment plate 110 is thus abutting either one of two faces of the non-conductive housing body 120.
  • the edges of the alignment plate 110 correspond with the edges of the non-conductive housing body 120 when the alignment plate 110 is coupled to the non-conductive housing body 120.
  • the non-conductive housing body 120 further comprises a substantially flat top face and a substantially flat bottom face.
  • the bottom face further comprises a recessed portion within which the retainer plate 130 is disposed.
  • the height of the retainer plate 130 corresponds with the depth of the recessed portion so that when the retainer plate 130 is disposed in the recessed portion, a planar surface on the face of the recessed portion is achieved.
  • the dimensions and shape of the retainer plate 130 also correspond with the dimensions and shape of the recessed portion so that the retainer plate 130 is completely disposed into the recessed portion.
  • the non-conductive housing body 120 further comprises a plurality of pin-holes 126 arranged in a predetermined pattern.
  • the retainer plate 130 for retaining the plurality of compressible probes 140 within the non-conductive housing body 120 also comprises a plurality of pin-holes 136 arranged in a predetermined order. ⁇ .
  • the number, pitch and arrangement of the plurality of pin-holes 126 of the non-conductive housing body 120 correspond with the number, pitch and arrangement of the plurality of pin-holes 136 of the retainer plate 130.
  • the plurality of pin-holes of the non- conductive housing body 120 is aligned with the plurality of pin-holes of the retainer plate 130, thus forming a plurality of through holes for housing the plurality of compressible probes 140.
  • the retainer plate 130 comprises a plurality of pin-holes 136 of number less than the number of plurality of pin-holes 126 of the non-conductive housing body 120.
  • the pitch of the plurality of pin-holes 126 of the non-conductive housing body 120 corresponds with the pitch of the plurality of pin-holes 136 of the retainer plate 130.
  • the plurality of pin-holes 126 of the retainer plate 130 is however arranged in a predetermined pattern in accordance with the desired pattern of the PCB. As such, the plurality of compressible probes 140 only establishes contacts with the PCB in the predetermined pattern that corresponds with the desired pattern of the PCB.
  • the retainer plate 130 comprises a top face abutting the recessed portion in the non-conductive housing body 120, and a bottom face abutting either an IC device or the PCB.
  • the retainer plate 130 further comprises of at least one through hole 135 that aligns with at least one groove 320 in the recessed portion of the non-conductive housing body 120 when the retainer plate 130 is disposed within the recessed portion.
  • At least one securing means 150 is used to secure the retainer plate 130 to the non-conductive housing body 120.
  • the non-conductive housing body 120 with the retainer plate 130 disposed therein is symmetrical about two axes perpendicular to each other.
  • the axes intercept at the centre of the non-conductive housing body 120, the centre being equidistance to each of two parallel edges of the non-conductive housing body 120 parallel to one of the two axes.
  • FIG.2 the perspective view of one example of the modular socket 100 in accordance with the present invention is shown.
  • the alignment plate 110 is coupled to the non-conductive housing body 120 with the edges of the alignment plate 110 aligning with the edges of the non-conductive housing body 120. Both parts are secured to each other by means of at least one adaptor pin 115 inserted snug-fit into the at least one through holes 125 of the non-conductive housing body 120.
  • the IC device handler picks the IC device to be tested and places the IC device through the through hole 155 of the alignment plate 110, onto the non- conductive housing body 120.
  • the IC device handler is guided into the through hole 155 of the alignment plate by the through hole 155.
  • the IC device handler continues to hold the IC device to be tested in place and pushes the IC device against the plurality of compressible probes so that electrical contacts between the plurality of compressible probes and the IC device are established. Electrical signals are then passed from the PCB through the compressible probes to the IC device.
  • the alignment plate 110 may be changed to adapt to the various ways the IC device is guided into the modular socket 100.
  • FIG. 3 A the cross sectional view of the modular socket 100 in accordance with the present invention as represented in FIG. 2 is shown.
  • the cross sectional view is taken along the direction indicated by the line A — A' of the modular socket 100 as shown in FIG. 2.
  • the bottom face of the alignment plate 110 is abutting the top face of the non-conductive housing body 120.
  • the retainer plate 130 is disposed within the recessed portion 310 at the bottom face of the non-conductive housing body 120.
  • the retainer plate 130 is secured to the non-conductive housing body 120 with at least one securing means 150 inserted through the at least one through hole 135 of the retainer plate 130 and into at least one grooves 320 in the recessed portion 310 of the non-conductive housing body 120.
  • the plurality of pin-holes 126 of the non-conductive housing body 120 is aligned with the plurality of pin-holes 136 of the retainer plate 130 s forming a plurality of through holes from the top face of the non-conductive housing body 120 to the face of the retainer plate 130 that is abutting a PCB 330.
  • the plurality of compressible probes 140 is disposed within the plurality of pin-holes of the non-conductive housing body 120 that are aligned with the plurality of pin-holes of the retainer plate 130. The plurality of compressible probes 140 thus establishes electrical contacts between the IC device 340 to be tested and the PCB.
  • the IC device 340 compressing against the plurality of compressible probes 140 maintains contacts between the plurality of compressible probes 140 and the contact points on the IC device 340.
  • the modular socket 100 is secured to a PCB 330 by securing means such as screws 350.
  • the plurality of compressible probes 140 at the bottom face of the non-conductive body 110 remains in contact with the PCB 330 as the PCB 330 compresses against the plurality of compressible probes 140.
  • FIG. 3B illustrates the cross sectional view taken along direction indicated by the line A - A' of the modular socket 100.
  • the non-conductive housing body 120 and the retainer plate 130 disposed therein, are however advantageously inverted.
  • the top face of the non- conductive housing body 120 is abutting the PCB 330, while the retainer plate 130 and the bottom face of the non-conductive housing body 120 are abutting the bottom face of the alignment plate 110.
  • the plurality of compressible probes 140 is also inverted with the non-conductive housing body 120 and the retainer plate 130. Electrical contacts between the IC device 340 to be tested and the PCB 330 are maintained by means of the plurality of compressible probes 140.
  • the IC device 340 is placed through the through hole 155 of the alignment plate 110 onto the bottom face of the non-conductive housing body 120, in which the retainer plate 130 is disposed.
  • the IC device 340 compressing against the plurality of compressible probes 140 maintains contacts between the plurality of compressible probes 140 and the IC device 340.
  • the modular socket 100 is secured to a PCB 330 by securing means such as screws 350.
  • the plurality of compressible probes 140 at the top face of the non-conductive body 110 now remains in contact with the PCB 330 as the PCB 330 compresses the plurality of compressible probes 140.
  • the non-conductive housing body 120, in which the retainer plate 130 is disposed is advantageously invertible.
  • FIG. 4A the perspective view of the non-conductive housing body 120 in accordance with the present invention representing the top face of the non- conductive housing body 120 is shown.
  • the non-conductive housing body 120 is having four sides with the corners chamfered.
  • the shape of the non-conductive housing body 120 is substantially rectangular.
  • the area of the plurality of pin-holes 126 is centred on the non- conductive housing body 120, the plurality of pin-holes 126 are arranged in equidistance of one another, forming an area substantially rectangular in shape.
  • the sides of the substantially rectangular area of the plurality of pin-holes 126 are parallel to the sides of the non-conductive housing body 120.
  • the non-conductive housing body 120 comprises of four through holes 125 to allow four adaptor pins on the bottom face of the alignment plate to be inserted therein. The insertion of the adaptor pins into the through holes 125 aligns the alignment plate with the non-conductive housing body 120 and secures the alignment plate to the non-conductive housing body 120.
  • FIG. 4B the perspective view of the non-conductive housing body 120 in accordance with the present invention showing the bottom face of the non- conductive housing body 120 is shown.
  • the bottom face of the non-conductive housing body 120 is having a recessed portion 310 in which the retainer plate is to be disposed.
  • the recessed portion 310 in the bottom face of the non-conductive housing body 120 is of a predetermined vertical height corresponding to the thickness of the retainer plate. When the retainer plate is disposed within the recessed portion 310, a flat surface on the non-conductive housing body 120 is achieved.
  • the recessed portion 310 further comprises at least one handling region 500 to allow the removal of the retainer plate.
  • the at least one handling region allows access to the face of the retainer plate that is abutting the bottom face of the non-conductive housing body 120.
  • the at least one handling region 500 extends beyond the four sides of the recessed portion which corresponds with the four sides of the retainer plate.
  • the height of the recessed handling region 500 is substantially similar to the height of the predetermined vertical height of the recessed portion 310.
  • the compressible probe 140 in accordance with the present invention is shown.
  • the compressible probe 140 for maintaining electrical contact between the IC device to be tested and the PCB 130 comprises of a barrel 600, a first plunger 610 for establishing contact with the IC device, a second plunger 620 for establishing contact with the PCB 130, and a helical spring 630.
  • the first plunger 610 and the second plunger 620 are axialiy disposed within the barrel 600, such that the first plunger 610, the second plunger 620 and the barrel 600 lie on the same axis.
  • the helical spring 630 is also disposed within the barrel, biasing the first plunger 610 and the second plunger 620 in opposing directions axialiy away from each other.
  • the barrel 600 is crimped at both ends to restrict displacement of the first plunger 610 and the second plunger 620 out of the barrel 600.
  • the tip 640 of the first plunger 610 is substantially similar to the tip 650 of the second plunger 620.
  • the similarity of both tips 640, 650 allows the plurality of compressible probes 140 to be inverted within the non-conductive housing body in the event that the tips 640 of the first plungers 610 are damaged or worn out due to multiple contacts with high volumes of IC devices tested.
  • the plurality of compressible probes 140 are inverted within the non-conductive housing body, and the second plunger 620 will now be in contact with the IC devices while the first plunger 640 will be in contact with the PCB 130.
  • the diameter of the plurality of pin-holes of the non-conductive housing body 120 at the top face is smaller than the diameter of the barrel 600 but corresponds to the diameter of the first plunger 610. This allows displacement of the first plunger 610 out of the pin-hole of the non-conductive housing body 120 but retaining the barrel 600 disposed within the pin-hole.
  • the diameter of the plurality of pin-holes of the retainer plate 130 at the bottom face is smaller than the diameter of the barrel 600 but corresponds to the diameter of the second plunger 620. This allows displacement of the second plunger 620 out of the pinhole of the retainer plate 130 but retaining the barrel 600 disposed within the pin-hole.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A modular socket and the method for testing integrated circuit devices using the modular socket. The modular socket comprises an invertible non-conductive housing body and a plurality of compressible probes for establishing electrical contacts disposed therein. An alignment plate for guiding and aligning the integrated circuit devices to be tested with the modular socket is further coupled to the non-conductive housing body. The modular socket with the plurality of compressible probes disposed therein are invertible such that both ends of the plurality of compressible probes are used to establish electrical contacts with the integrated circuit devices before any replacement of damaged or worn out parts is necessary. The life of the modular socket is therefore considerably extended.

Description

INVERTIBLE MODULAR TEST DEVICE FOR TESTING INTEGRATED CIRCUIT
DEVICES
Field of the Invention
[0001] The present invention relates to an integrated circuit (IC) device testing, and more particularly, to a modular socket and method for testing IC devices.
Background of the Invention
[0002] Testing an IC device often involves establishing an electrical connection between a testing equipment and the IC device. One way of testing the IC device using a test socket begins with placing the IC device into a socket, which comprises a body with holes that span through the body. These holes house contacts that are aligned with electrical contact points of the IC device. Often, the socket includes a lid that, when closed, pushes the contact points of the IC device against the contacts that are housed in the holes.
[0003] Once the IC device has been inserted, the socket is then plugged into a printed circuit board (PCB) to test the device's computational integrity. This insertion often involves a biasing force in the opposite direction of the lid's pushing force. One common way for providing electrical contacts involves the use of "pogo pin" contacts. These "pogo pins" are housed in the holes of the socket.
[0004] When testing devices of different designs and functions, different sockets have to be used. These sockets are often mounted fixedly and are not compatible for testing another IC device of a different design or function. As a result, a variety of customized sockets and its electrical contacts must be provided to suit a variety of IC devices. This inevitably increases the cost of the manufacturing and testing process.
[0005] Testing such devices in a manufacturing environment can also be quite challenging. Sockets, and its electrical contacts used for testing typically last only 5,000 cycles as they are worn out quickly or are clogged over long periods of use. In the event that the socket and/or the electrical contacts are damaged or defective, the socket with its electrical contacts have to be scrapped and replaced in its entirety with a new one. The conventional socket and/or the electrical contacts cannot be "reused".
Summary of the Invention
[0006] At present, there is no single invention that provides for a socket to be used on both sides before they are replaced in its entirety due to wear or defects. To extend the life of the socket and its electrical contacts, the present invention provides a "reusable" modular socket by virtue of its invertible qualities. The compressible probes of the present invention also allows for "reusability" due to its invertible qualities.
[0007] One end of the electrical contacts is constantly in contact with the PCB while the other end is in contact with the IC devices to be tested. Due to multiple replacements of IC devices to be tested, the end of the electrical contact for establishing contact with the IC devices will be worn out or damaged. With the present invention, the socket and its electrical contacts can be advantageously inverted, so that the end of the electrical contact previously for establishing contact with the PCB can be used to establish contacts with subsequent IC devices to be tested. The worn out end of the electrical contact due to multiple contacts with the IC devices is used for establishing contact with the PCB instead. The life of the socket and its electrical contacts is therefore extended considerably before any replacement is required.
[0008] As point contacts are sufficient to maintain good electrical contact with the PCB, "blunt" or worn out ends of the electrical contact can be used for establishing constant contacts with the PCB. There is no cycle compression on the end of the electrical contacts that is in contact with the PCB. However, the same does not apply for the IC devices. For establishing and maintaining good electrical contacts with the IC devices, new undamaged ends of the electrical contacts have to be used. [0009] Furthermore, the present invention allows for the testing of IC devices of the same pitch but with different pin counts. The present invention may also be adapted to test IC devices of different designs without having the need to customize every socket to cater to the testing of each individual IC device. Such flexibility advantageously reduces costs of manufacturing process.
[0010] The present invention seeks to provide a non-conductive housing body having a top face and a bottom face, the non-conductive housing body comprising a plurality of pin-holes and a plurality of compressible probes disposed within the plurality of pinholes. The non-conductive housing body and the plurality of compressible probes housed therein are adapted to be inverted such that either the bottom face or the top face of the non-conductive housing body is in contact with an integrated circuit device for testing.
[0011] Accordingly, in one aspect, the present invention provides a method of testing integrated circuit devices. The method comprising the steps of: providing a modular socket comprising a non-conductive housing body having a top face and a bottom face, the non-conductive housing body comprising a plurality of pin-holes, and a plurality of compressible probes disposed within the plurality of pin-holes, wherein the non- conductive housing body with the plurality of compressible probes housed therein can be inverted such that either the bottom face or the top face of the non-conductive housing body is in contact with an integrated circuit device for testing; and testing the integrated circuit devices by sending electrical signals via the plurality of compressible probes.
[0012] In another aspect, the present invention provides another method of testing integrated circuit devices. The method comprising the steps of: (a) providing a modular socket comprising an invertible non-conductive housing body; (b) securing a printed circuit board directly under the modular socket; (c) picking the integrated circuit device and aligning the integrated circuit device with the modular socket; (d) placing the integrated circuit device into the modular socket such that the integrated circuit device remains in contact with the plurality of compressible probes; (e) testing the plurality of integrated circuit devices by sending electrical signals via the plurality of compressible probes; (f) removing the modular socket from the printed circuit board after testing a predetermined plurality of integrated circuit devices; (g) inverting the invertible non- conductive housing body; and (h) repeating steps (b) to (e).
Brief Description of the Drawings
[0013] A preferred embodiment of the present invention will now be more fully described, by way of example, with reference to the drawings of which:
[0014] FIG. 1 illustrates an exploded perspective view of a modular socket in accordance with the present invention;
[0015] FIG. 2 illustrates a perspective view of the modular socket comprising a non- conductive housing body in accordance with the present invention;
[0016] FIG. 3 A illustrates a cross sectional view of the modular socket in accordance with the present invention taken along the direction indicated by a line A - A' as shown in FIG. 1;
[0017] FIG. 3B illustrates a cross sectional view of the modular socket in accordance with the present invention taken along the direction indicated by a line A — A' as shown in FIG. 1, wherein the non-conductive housing body is inverted;
[0018] FIG. 4 A illustrates a perspective view of the non-conductive housing body in accordance with the present invention showing the top face of the non-conductive housing body;
[0019] FIG. 4B illustrates a perspective view of the non-conductive housing body in accordance with the present invention showing the bottom face of the non-conductive housing body; and
[0020] FIG. 5 illustrates a compressible probe in accordance with the present invention. Detailed Description of the Drawings
[0021] A preferred embodiment of the invention in accordance with the present invention is described. In the following description, details are provided to describe the preferred embodiment. It shall be apparent to one skilled in the art, however, that the invention may be practised without such details. Some of these details may not be described at length so as not to obscure the invention.
[0022] Referring to FIG. 1, an illustration is shown of an exploded perspective view of an example of a modular socket 100 in accordance with the present invention. The modular socket 100 comprises an alignment plate 110, a non-conductive housing body 120 for housing a plurality of compressible probes 140, a retainer plate 130, a plurality of compressible probes 140 and at least one securing means 150 for securing the retainer plate 130 to the non-conductive housing body. The modular socket 100 is secured to a PCB for testing the IC device, such that the PCB abuts either the non-conductive housing body 120 or the retainer plate 130.
[0023] The alignment plate 110 is for aligning an IC device handler, which picks and places IC devices to be tested into the modular socket 100 for testing. The IC device to be tested is placed through a through hole 155 of the alignment plate 110, onto the non- conductive housing body 120.
[0024] The alignment plate 110 comprises a substantially flat top face, a substantially flat bottom face and a through hole 155 for the IC device handler to access through thereof and place the IC device to be tested. The bottom face of the alignment plate 110 comprises of at least one adaptor pin 115 for coupling to the non-conductive housing body 120. The at least one adaptor pin 115 can be securely inserted into at least one through hole 125 on the non-conductive housing body 120 on either face of the non- conductive housing body 120. The at least one adaptor pin 115 corresponds to the at least one through hole 125 on the non-conductive housing body 120 on both faces of the non- conductive housing body 120. [0025] In the example shown, the alignment plate 110 comprises four adaptor pins 115 and the non-conductive housing body 120 comprises four through holes 125. The four adaptor pins 115 correspond to the four through holes 125 on either face of the non- conductive housing body 120. The four adaptor pins 115 and four through holes 125 are symmetrically located about an axis centre of the alignment plate 110 and non- conductive housing body 120 respectively. Even when the non-conductive housing body 120 is inverted, the four adaptor pins 115 are corresponding to the four through holes 125. The non-conductive housing body 120 is reversibly coupled to the alignment plate 110 such that the four adaptor pins 115 can be inserted into the four through holes 125 of the non-conductive housing body 120 at either face of the non-conductive housing body 120.
[0026] When the alignment plate 110 is coupled to the non-conductive housing body 120, the bottom face of the alignment plate 110 is thus abutting either one of two faces of the non-conductive housing body 120. The edges of the alignment plate 110 correspond with the edges of the non-conductive housing body 120 when the alignment plate 110 is coupled to the non-conductive housing body 120.
[0027] The non-conductive housing body 120 further comprises a substantially flat top face and a substantially flat bottom face. The bottom face further comprises a recessed portion within which the retainer plate 130 is disposed. The height of the retainer plate 130 corresponds with the depth of the recessed portion so that when the retainer plate 130 is disposed in the recessed portion, a planar surface on the face of the recessed portion is achieved. The dimensions and shape of the retainer plate 130 also correspond with the dimensions and shape of the recessed portion so that the retainer plate 130 is completely disposed into the recessed portion.
[0028] The non-conductive housing body 120 further comprises a plurality of pin-holes 126 arranged in a predetermined pattern. The retainer plate 130 for retaining the plurality of compressible probes 140 within the non-conductive housing body 120 also comprises a plurality of pin-holes 136 arranged in a predetermined order. ■ . [0029] In one example, the number, pitch and arrangement of the plurality of pin-holes 126 of the non-conductive housing body 120 correspond with the number, pitch and arrangement of the plurality of pin-holes 136 of the retainer plate 130. When the retainer plate 130 is disposed within the recessed portion, the plurality of pin-holes of the non- conductive housing body 120 is aligned with the plurality of pin-holes of the retainer plate 130, thus forming a plurality of through holes for housing the plurality of compressible probes 140.
[0030] In another example, the retainer plate 130 comprises a plurality of pin-holes 136 of number less than the number of plurality of pin-holes 126 of the non-conductive housing body 120. The pitch of the plurality of pin-holes 126 of the non-conductive housing body 120 corresponds with the pitch of the plurality of pin-holes 136 of the retainer plate 130. The plurality of pin-holes 126 of the retainer plate 130 is however arranged in a predetermined pattern in accordance with the desired pattern of the PCB. As such, the plurality of compressible probes 140 only establishes contacts with the PCB in the predetermined pattern that corresponds with the desired pattern of the PCB.
[0031] The retainer plate 130 comprises a top face abutting the recessed portion in the non-conductive housing body 120, and a bottom face abutting either an IC device or the PCB. The retainer plate 130 further comprises of at least one through hole 135 that aligns with at least one groove 320 in the recessed portion of the non-conductive housing body 120 when the retainer plate 130 is disposed within the recessed portion. At least one securing means 150 is used to secure the retainer plate 130 to the non-conductive housing body 120.
[0032] The non-conductive housing body 120 with the retainer plate 130 disposed therein is symmetrical about two axes perpendicular to each other. The axes intercept at the centre of the non-conductive housing body 120, the centre being equidistance to each of two parallel edges of the non-conductive housing body 120 parallel to one of the two axes. [0033] Referring to FIG.2, the perspective view of one example of the modular socket 100 in accordance with the present invention is shown. The alignment plate 110 is coupled to the non-conductive housing body 120 with the edges of the alignment plate 110 aligning with the edges of the non-conductive housing body 120. Both parts are secured to each other by means of at least one adaptor pin 115 inserted snug-fit into the at least one through holes 125 of the non-conductive housing body 120.
[0034] In operation, the IC device handler picks the IC device to be tested and places the IC device through the through hole 155 of the alignment plate 110, onto the non- conductive housing body 120. The IC device handler is guided into the through hole 155 of the alignment plate by the through hole 155. The IC device handler continues to hold the IC device to be tested in place and pushes the IC device against the plurality of compressible probes so that electrical contacts between the plurality of compressible probes and the IC device are established. Electrical signals are then passed from the PCB through the compressible probes to the IC device. The alignment plate 110 may be changed to adapt to the various ways the IC device is guided into the modular socket 100.
[0035] Referring to FIG. 3 A, the cross sectional view of the modular socket 100 in accordance with the present invention as represented in FIG. 2 is shown. The cross sectional view is taken along the direction indicated by the line A — A' of the modular socket 100 as shown in FIG. 2.
[0036] In the example shown in FIG. 3 A, the bottom face of the alignment plate 110 is abutting the top face of the non-conductive housing body 120. The retainer plate 130 is disposed within the recessed portion 310 at the bottom face of the non-conductive housing body 120. The retainer plate 130 is secured to the non-conductive housing body 120 with at least one securing means 150 inserted through the at least one through hole 135 of the retainer plate 130 and into at least one grooves 320 in the recessed portion 310 of the non-conductive housing body 120. [0037] The plurality of pin-holes 126 of the non-conductive housing body 120 is aligned with the plurality of pin-holes 136 of the retainer plate 130s forming a plurality of through holes from the top face of the non-conductive housing body 120 to the face of the retainer plate 130 that is abutting a PCB 330. The plurality of compressible probes 140 is disposed within the plurality of pin-holes of the non-conductive housing body 120 that are aligned with the plurality of pin-holes of the retainer plate 130. The plurality of compressible probes 140 thus establishes electrical contacts between the IC device 340 to be tested and the PCB.
[0038] The IC device 340 compressing against the plurality of compressible probes 140 maintains contacts between the plurality of compressible probes 140 and the contact points on the IC device 340. The modular socket 100 is secured to a PCB 330 by securing means such as screws 350. The plurality of compressible probes 140 at the bottom face of the non-conductive body 110 remains in contact with the PCB 330 as the PCB 330 compresses against the plurality of compressible probes 140.
[0039] FIG. 3B illustrates the cross sectional view taken along direction indicated by the line A - A' of the modular socket 100. The non-conductive housing body 120 and the retainer plate 130 disposed therein, are however advantageously inverted. In this example of an inverted non-conductive housing body 120, the top face of the non- conductive housing body 120 is abutting the PCB 330, while the retainer plate 130 and the bottom face of the non-conductive housing body 120 are abutting the bottom face of the alignment plate 110.
[0040] The plurality of compressible probes 140 is also inverted with the non-conductive housing body 120 and the retainer plate 130. Electrical contacts between the IC device 340 to be tested and the PCB 330 are maintained by means of the plurality of compressible probes 140.
[0041] In the example shown in FIG. 3B, the IC device 340 is placed through the through hole 155 of the alignment plate 110 onto the bottom face of the non-conductive housing body 120, in which the retainer plate 130 is disposed. The IC device 340 compressing against the plurality of compressible probes 140 maintains contacts between the plurality of compressible probes 140 and the IC device 340. The modular socket 100 is secured to a PCB 330 by securing means such as screws 350. The plurality of compressible probes 140 at the top face of the non-conductive body 110 now remains in contact with the PCB 330 as the PCB 330 compresses the plurality of compressible probes 140. As seen in FIG. 3A and 3B, the non-conductive housing body 120, in which the retainer plate 130 is disposed, is advantageously invertible.
[0042] Referring to FIG. 4A, the perspective view of the non-conductive housing body 120 in accordance with the present invention representing the top face of the non- conductive housing body 120 is shown.
[0043] In this example, the non-conductive housing body 120 is having four sides with the corners chamfered. The shape of the non-conductive housing body 120 is substantially rectangular. The area of the plurality of pin-holes 126 is centred on the non- conductive housing body 120, the plurality of pin-holes 126 are arranged in equidistance of one another, forming an area substantially rectangular in shape. The sides of the substantially rectangular area of the plurality of pin-holes 126 are parallel to the sides of the non-conductive housing body 120.
[0044] In this example, the non-conductive housing body 120 comprises of four through holes 125 to allow four adaptor pins on the bottom face of the alignment plate to be inserted therein. The insertion of the adaptor pins into the through holes 125 aligns the alignment plate with the non-conductive housing body 120 and secures the alignment plate to the non-conductive housing body 120.
[0045] Referring to FIG. 4B, the perspective view of the non-conductive housing body 120 in accordance with the present invention showing the bottom face of the non- conductive housing body 120 is shown. The bottom face of the non-conductive housing body 120 is having a recessed portion 310 in which the retainer plate is to be disposed. In this example, there are four grooves 320 aligning with the four through holes of the retainer plates. . . • [0046] The recessed portion 310 in the bottom face of the non-conductive housing body 120 is of a predetermined vertical height corresponding to the thickness of the retainer plate. When the retainer plate is disposed within the recessed portion 310, a flat surface on the non-conductive housing body 120 is achieved.
[0047] The recessed portion 310 further comprises at least one handling region 500 to allow the removal of the retainer plate. The at least one handling region allows access to the face of the retainer plate that is abutting the bottom face of the non-conductive housing body 120. The at least one handling region 500 extends beyond the four sides of the recessed portion which corresponds with the four sides of the retainer plate. The height of the recessed handling region 500 is substantially similar to the height of the predetermined vertical height of the recessed portion 310.
[0048] Referring to FIG. 5, the compressible probe 140 in accordance with the present invention is shown. In the example shown, the compressible probe 140 for maintaining electrical contact between the IC device to be tested and the PCB 130 comprises of a barrel 600, a first plunger 610 for establishing contact with the IC device, a second plunger 620 for establishing contact with the PCB 130, and a helical spring 630. The first plunger 610 and the second plunger 620 are axialiy disposed within the barrel 600, such that the first plunger 610, the second plunger 620 and the barrel 600 lie on the same axis. The helical spring 630 is also disposed within the barrel, biasing the first plunger 610 and the second plunger 620 in opposing directions axialiy away from each other. The barrel 600 is crimped at both ends to restrict displacement of the first plunger 610 and the second plunger 620 out of the barrel 600.
[0049] The tip 640 of the first plunger 610 is substantially similar to the tip 650 of the second plunger 620. The similarity of both tips 640, 650 allows the plurality of compressible probes 140 to be inverted within the non-conductive housing body in the event that the tips 640 of the first plungers 610 are damaged or worn out due to multiple contacts with high volumes of IC devices tested. As the plurality of compressible probes 140 are inverted within the non-conductive housing body, and the second plunger 620 will now be in contact with the IC devices while the first plunger 640 will be in contact with the PCB 130.
[0050] The diameter of the plurality of pin-holes of the non-conductive housing body 120 at the top face is smaller than the diameter of the barrel 600 but corresponds to the diameter of the first plunger 610. This allows displacement of the first plunger 610 out of the pin-hole of the non-conductive housing body 120 but retaining the barrel 600 disposed within the pin-hole.
[0051] The diameter of the plurality of pin-holes of the retainer plate 130 at the bottom face is smaller than the diameter of the barrel 600 but corresponds to the diameter of the second plunger 620. This allows displacement of the second plunger 620 out of the pinhole of the retainer plate 130 but retaining the barrel 600 disposed within the pin-hole.
[0052] It will be appreciated that although one preferred embodiment has been described in detail, various modifications and improvements can be made by a person skilled in the art without departing from the scope of the present invention.

Claims

Claims
1. A modular socket for testing integrated circuit devices, the modular socket comprising: a non-conductive housing body having a top face and a bottom face, the non- conductive housing body comprising a plurality of pin-holes; and a plurality of compressible probes disposed within the plurality of pin-holes, wherein the non-conductive housing body and the plurality of compressible probes housed therein are adapted to be inverted such that either the bottom face or the top face of the non-conductive housing body is in contact with an integrated circuit device for testing.
2. The modular socket in accordance with claim 1, wherein the modular socket further comprises an alignment plate for guiding a device handler handling the device to the tested, the alignment plate having a top face and a bottom face is coupled to the non- conductive housing body.
3. The modular socket in accordance with claim 2, wherein the bottom face of the alignment plate comprising at least one adaptor pin for coupling the alignment plate to the non-conductive housing body, such that the bottom face of the alignment plate is abutting the top face of the non-conductive housing body.
4. The modular socket in accordance with claim 2, wherein the alignment plate further comprises a through hole.
5. The modular socket in accordance with claim 2, wherein the non-conductive housing body further comprising at least one through hole corresponding to the at least one adaptor pin for adapting the at least one adaptor pin, such that the sides of the alignment plate align with the sides of the non-conductive housing body when the at least one adaptor pin is adapted to the at least one through hole.
6. The modular socket in accordance with claim 1, wherein the non-conductive housing body further comprises a retainer plate for retaining the plurality of compressible probes within both the non-conductive housing body and the retainer plate.
7. The modular socket in accordance with claim 6, wherein the retainer plate is disposed within a recessed portion at the bottom face of the non-conductive housing body, thereby achieving a planar surface with the non-conductive housing body for abutment with a printed circuit board.
8. The modular socket in accordance with claim 7, wherein the retainer plate comprises a plurality of pin-holes, the number of pin-holes of the retainer plate corresponds to the number of pinholes of the non-conductive housing; the pitch of the plurality of pin-holes of the retainer plate corresponds to the pitch of the plurality of pin-holes of the non-conductive housing; and the plurality of pin-holes of the retainer plate aligns with the plurality of pinholes of the non-conductive housing when the retainer plate is disposed within the recessed portion of the non-conductive housing body.
9. The modular socket in accordance with claim 8, wherein the plurality of compressible probes are disposed within the plurality of pin-holes of the non-conductive housing body and the plurality of pin-holes of the retainer plate.
10. The modular socket in accordance with claim 7, wherein the retainer plate comprises a plurality of pin-holes, the number of pin-holes of the retainer plate is less than the number of pin-holes of the non-conductive housing; the pitch of the plurality of pin-holes of the retainer plate is equal to the pitch of the plurality of pin-holes of the non-conductive housing; and the plurality of pin-holes of the retainer plate aligns with some of the plurality of pin-holes of the non-conductive housing when the retainer plate is disposed within the portion of the non-conductive housing body.
11. The modular socket in accordance with claim 10, wherein the plurality of compressible probes are disposed within the plurality of pin-holes of the non-conductive housing body and the plurality of pin-holes of the retainer plate that are aligned with the plurality of pin-holes of the non-conductive housing body.
12. The modular socket in accordance with claim 7, wherein the recessed portion of the non-conductive housing body further comprises at least one groove.
13. The modular socket in accordance with claim 12, wherein the retainer plate further comprises at least one through hole corresponding to the at least one groove of the bottom face of the non-conductive housing body.
14. The modular socket in accordance with claim 13, wherein at least one securing means is securing the retainer plate to the non-conductive housing body through the at least one through hole of the retainer plate to the at least one groove.
15. The modular socket in accordance with claim 1 , wherein the plurality of compressible probes each comprising a first plunger having a tip for making contact with the integrated circuit device to be tested; a second plunger having a tip for making contact with the printed circuit board; a barrel within which the first plunger and the second plunger are disposed; and a resilient means biasing the first plunger and the second plunger in opposing direction axially from each other, wherein the first plunger and the second plunger are axially disposed within the barrel, the tip of the first plunger is disposed away from the tip of the second plunger.
16. The modular socket in accordance with claim 15, wherein the first plunger is substantially similar to the second plunger.
17. The modular socket in accordance with claim 16, wherein the diameter of the opening of each of the plurality of pin-holes at the top and bottom faces of the non- conductive housing body are smaller than the diameter of the barrel of each of the plurality of compressible probes, the diameter of the opening of each of the plurality of pin-holes at the top and bottom faces of the non-conductive housing body corresponds to the diameter of the first plunger and second plunger, such that the plurality of compressible probes are retained within the plurality of pin-holes while allowing the first plunger and the second plunger to be displaced out of the non-conductive housing.
18. A method of testing integrated circuit devices, the method comprising the step of providing a modular socket comprising: a non-conductive housing body having a top face and a bottom face, the non- conductive housing body comprising a plurality of pin-holes; and a plurality of compressible probes disposed within the plurality of pin-holes, wherein the non-conductive housing body and the plurality of compressible probes housed therein are adapted to be inverted such that either the bottom face or the top face of the non-conductive housing body is in contact with an integrated circuit device for testing.
19. A method of testing integrated circuit devices, the method comprising the steps of:
(a) providing a modular socket comprising an invertible non-conductive housing body;
(b) securing a printed circuit board directly under the modular socket;
(c) picking the integrated circuit device and aligning the integrated circuit device with the modular socket;
(d) placing the integrated circuit device into the modular socket such that the integrated circuit device remains in contact with the plurality of compressible probes;
(e) testing the plurality of integrated circuit devices by sending electrical signals via the plurality of compressible probes;
(f) removing the modular socket from the printed circuit board after testing a predetermined plurality of integrated circuit devices; (g) inverting the invertible non-conductive housing body; and (h) repeating steps (b) to (e).
PCT/SG2006/000102 2005-08-30 2006-04-20 Invertible modular test device for testing integrated circuit devices WO2007027155A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095135340A TW200815773A (en) 2005-08-30 2006-09-25 Modular socket and method for testing integrated circuit devices

Applications Claiming Priority (2)

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SG200505550-4A SG130067A1 (en) 2005-08-30 2005-08-30 Modular socket and method for testing integrated circuit devices
SG200505550-4 2005-08-30

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KR20180103450A (en) * 2017-03-10 2018-09-19 주식회사 파인디앤씨 A test socket for semiconductor

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JPS6358183A (en) * 1986-08-28 1988-03-12 Teru Hayashi Sound source search instrument
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KR101949844B1 (en) * 2017-03-10 2019-02-19 주식회사 파인디앤씨 A test socket for semiconductor

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SG130067A1 (en) 2007-03-20

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