WO2005089187A3 - Low cost method to form solderable contact points for structures manufactured from conductive loaded resin- based materials - Google Patents

Low cost method to form solderable contact points for structures manufactured from conductive loaded resin- based materials Download PDF

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Publication number
WO2005089187A3
WO2005089187A3 PCT/US2005/007978 US2005007978W WO2005089187A3 WO 2005089187 A3 WO2005089187 A3 WO 2005089187A3 US 2005007978 W US2005007978 W US 2005007978W WO 2005089187 A3 WO2005089187 A3 WO 2005089187A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
fiber
loaded resin
contact points
combination
Prior art date
Application number
PCT/US2005/007978
Other languages
French (fr)
Other versions
WO2005089187A2 (en
Inventor
Thomas Aisenbrey
Original Assignee
Integral Technologies Inc
Thomas Aisenbrey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/060,089 external-priority patent/US20050170078A1/en
Priority claimed from US11/060,090 external-priority patent/US20050146072A1/en
Application filed by Integral Technologies Inc, Thomas Aisenbrey filed Critical Integral Technologies Inc
Publication of WO2005089187A2 publication Critical patent/WO2005089187A2/en
Publication of WO2005089187A3 publication Critical patent/WO2005089187A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/16—Fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates

Abstract

Solderable contact points are formed for a conductive device formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
PCT/US2005/007978 2004-03-12 2005-03-10 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin- based materials WO2005089187A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US55249304P 2004-03-12 2004-03-12
US60/552,493 2004-03-12
US11/060,089 US20050170078A1 (en) 2001-02-15 2005-02-17 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin-based materials
US11/060,089 2005-02-17
US11/060,090 2005-02-17
US11/060,090 US20050146072A1 (en) 2001-02-15 2005-02-17 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin-based materials

Publications (2)

Publication Number Publication Date
WO2005089187A2 WO2005089187A2 (en) 2005-09-29
WO2005089187A3 true WO2005089187A3 (en) 2007-11-15

Family

ID=34994187

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/007978 WO2005089187A2 (en) 2004-03-12 2005-03-10 Low cost method to form solderable contact points for structures manufactured from conductive loaded resin- based materials

Country Status (1)

Country Link
WO (1) WO2005089187A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108281761B (en) * 2018-01-08 2021-06-18 国御望泓(山东)科技有限公司 Carbon/metal conductive composite material and application thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643798A (en) * 1984-08-07 1987-02-17 Mitsubishi Denki Kabushiki Kaisha Composite and circuit board having conductive layer on resin layer and method of manufacturing
US5789142A (en) * 1996-01-16 1998-08-04 Motorola, Inc. Solder mask system
US6197220B1 (en) * 2000-06-06 2001-03-06 Therm-O-Disc Corporation Conductive polymer compositions containing fibrillated fibers and devices
GB2377449A (en) * 2001-07-09 2003-01-15 Michael Patrick Sayers Electrically conductive polymer composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4643798A (en) * 1984-08-07 1987-02-17 Mitsubishi Denki Kabushiki Kaisha Composite and circuit board having conductive layer on resin layer and method of manufacturing
US5789142A (en) * 1996-01-16 1998-08-04 Motorola, Inc. Solder mask system
US6197220B1 (en) * 2000-06-06 2001-03-06 Therm-O-Disc Corporation Conductive polymer compositions containing fibrillated fibers and devices
GB2377449A (en) * 2001-07-09 2003-01-15 Michael Patrick Sayers Electrically conductive polymer composition

Also Published As

Publication number Publication date
WO2005089187A2 (en) 2005-09-29

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