WO2004114465A3 - Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials - Google Patents

Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials Download PDF

Info

Publication number
WO2004114465A3
WO2004114465A3 PCT/US2004/019259 US2004019259W WO2004114465A3 WO 2004114465 A3 WO2004114465 A3 WO 2004114465A3 US 2004019259 W US2004019259 W US 2004019259W WO 2004114465 A3 WO2004114465 A3 WO 2004114465A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
fiber
loaded resin
combination
absorbing devices
Prior art date
Application number
PCT/US2004/019259
Other languages
French (fr)
Other versions
WO2004114465A2 (en
Inventor
Thomas Aisenbrey
Original Assignee
Integral Technologies Inc
Thomas Aisenbrey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integral Technologies Inc, Thomas Aisenbrey filed Critical Integral Technologies Inc
Publication of WO2004114465A2 publication Critical patent/WO2004114465A2/en
Publication of WO2004114465A3 publication Critical patent/WO2004114465A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/002—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using short elongated elements as dissipative material, e.g. metallic threads or flake-like particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Electromagnetic absorbing devices (13) are formed of a conductive loaded resin-based material (32). The conductive loaded resin-based material (32) comprises micron conductive powder(s), conductive fiber(s) (38), or a combination of conductive powder and conductive fibers (38) in a base resin host (30). The ratio of the weight of the conductive powder(s) (34), conductive fiber(s), or a combination of conductive powder (34) and conductive fibers (38) to the weight of the base resin host (30) is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of nonmetal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
PCT/US2004/019259 2003-06-16 2004-06-16 Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials WO2004114465A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47891803P 2003-06-16 2003-06-16
US60/478,918 2003-06-16

Publications (2)

Publication Number Publication Date
WO2004114465A2 WO2004114465A2 (en) 2004-12-29
WO2004114465A3 true WO2004114465A3 (en) 2006-01-12

Family

ID=33539129

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/019259 WO2004114465A2 (en) 2003-06-16 2004-06-16 Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials

Country Status (1)

Country Link
WO (1) WO2004114465A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107069274B (en) 2010-05-07 2020-08-18 安费诺有限公司 High performance cable connector
CN104704682B (en) 2012-08-22 2017-03-22 安费诺有限公司 High-frequency electrical connector
US9905975B2 (en) 2014-01-22 2018-02-27 Amphenol Corporation Very high speed, high density electrical interconnection system with edge to broadside transition
CN114552261A (en) 2015-07-07 2022-05-27 安费诺富加宜（亚洲）私人有限公司 Electrical connector
US10243304B2 (en) 2016-08-23 2019-03-26 Amphenol Corporation Connector configurable for high performance
CN208862209U (en) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 A kind of connector and its pcb board of application
WO2021154718A1 (en) 2020-01-27 2021-08-05 Fci Usa Llc High speed, high density direct mate orthogonal connector
TW202135385A (en) 2020-01-27 2021-09-16 美商Ｆｃｉ美國有限責任公司 High speed connector
CN215816516U (en) 2020-09-22 2022-02-11 安费诺商用电子产品(成都)有限公司 Electrical connector
CN213636403U (en) 2020-09-25 2021-07-06 安费诺商用电子产品(成都)有限公司 Electrical connector
CN118471832A (en) * 2024-07-12 2024-08-09 威海嘉瑞光电科技股份有限公司 Integrated circuit device and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232775A (en) * 1990-10-23 1993-08-03 Minnesota Mining And Manufacturing Company Semi-conducting static-dissipative polymeric composites
US5409968A (en) * 1992-11-06 1995-04-25 Minnesota Mining And Manufacturing Company Controlled conductivity antistatic articles
US6930291B2 (en) * 1997-02-28 2005-08-16 Robert H. Johnson, Jr. Adhesive or sealant composition including high efficiency heating agents and methods of use

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5232775A (en) * 1990-10-23 1993-08-03 Minnesota Mining And Manufacturing Company Semi-conducting static-dissipative polymeric composites
US5409968A (en) * 1992-11-06 1995-04-25 Minnesota Mining And Manufacturing Company Controlled conductivity antistatic articles
US6930291B2 (en) * 1997-02-28 2005-08-16 Robert H. Johnson, Jr. Adhesive or sealant composition including high efficiency heating agents and methods of use

Also Published As

Publication number Publication date
WO2004114465A2 (en) 2004-12-29

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