WO2005064354A1

WO2005064354A1 - Circuit pattern testing apparatus and circuit pattern testing method

Info

Publication number: WO2005064354A1
Application number: PCT/JP2004/019805
Authority: WO
Inventors: Shuji Yamaoka; Hiroshi Hamori; Shogo Ishioka
Original assignee: Oht Inc.
Priority date: 2003-12-26
Filing date: 2004-12-27
Publication date: 2005-07-14
Also published as: TW200537112A; JP2005208058A

Abstract

A circuit testing apparatus capable of accurately and easily detecting failures of circuit boards. During testing a pattern arranged in a line, a test signal supplying electrode (35) and test signal detection sensor electrodes (25) are shifted in such a manner that they traverse the tested pattern (15) with a predetermined distance kept therefrom. Meanwhile, test signals, which have been supplied from the supplying electrode (35) through a capacitive coupling to the tested pattern (15), are detected by the sensor electrodes (25) that are also capacitively coupled with the tested pattern. If the successively detected test signal values are constant to some degree, then it is determined that no failures are existent. If the successively detected test signal values exhibit an abrupt change, then it is determined that some failures are existent.

Description

Description '' Circuit pattern inspection apparatus and circuit pattern inspection method

The present invention relates to a circuit pattern inspection device and a circuit pattern inspection method capable of inspecting the quality of a conductive pattern formed on a substrate. Background art

When manufacturing a circuit board having a conductive pattern formed on a substrate, it was necessary to inspect the conductive pattern formed on the substrate for disconnections or short circuits.

Conventionally, as a conductive pattern inspection method, for example, as in Patent Document 1, a pin is brought into contact with both ends of a conductive pattern, an electric signal is supplied from the pin on one end to the conductive pattern, and a pin is connected from the other end. A contact-type inspection method (pin contact method) that performs a continuity test of a conductive pattern or the like by receiving the electric signal is known. Electrical signals are supplied by setting up metal probes on all terminals and passing current through the conductive patterns.

In this pin contact method, in order to directly contact the pin probe,

It has the advantage of a high S / N ratio.

However, in recent years, the wiring pitch for connection has become finer due to the increase in the density of conductive patterns, and those having a pitch of less than 50; m have appeared. A probe card composed of a large number of narrow-pitch probes is expensive to manufacture.

At the same time, use each time the wiring pattern is different (for each inspection object). A new probe card must be produced accordingly. For this reason, the inspection cost is increased, which has been a major obstacle to the cost reduction of electronic components.

In addition, the probe card is fragile due to its fine structure, and it was necessary to always consider the risk of breakage in actual use.

Therefore, as shown in Patent Document 2, a pin probe is brought into direct contact with one end of a conductor pattern to be inspected to apply an inspection signal containing an AC component, and a probe at the other end has a predetermined contact without contacting the conductor pattern. There has been proposed a contact-non-contact system in which the inspection signal is detected through capacitive coupling by positioning the electrodes in a state where they are separated from each other.

In this combined use of contact and non-contact, the probe at the other end of the pattern wire does not need to directly contact the pattern with the pin hole, so that the positioning accuracy can be roughened. Furthermore, since the non-contact portion can be shared for a plurality of pattern lines, the number of probes can be reduced. Therefore, it is possible to cope with a case where the distance between the conductive patterns is fine.

Patent Document 1 JP-A-62-26 9 0 7 5

Patent Literature 2 Japanese Patent Laid-Open Publication

However, in the above-mentioned contact-non-contact method, since the probes disposed at both ends of the conductive pattern and the processing of detection signals from the probes are provided in accordance with the intervals at which the conductive patterns are disposed, the shape of the conductive pattern Is a predetermined type, and if the conductive pattern is different, the jig also had to be manufactured according to the pattern.

In addition, in the above-mentioned contact-non-contact method, one end of the conductor pattern to be inspected for directly contacting the pin probe is also made finer, and it is becoming difficult for the pin probe to make contact. In addition, there was an unavoidable risk that the conductor pattern to be inspected might be damaged by contacting the pin probe. Disclosure of the invention

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide an inspection apparatus and an inspection method capable of forming a fine wiring pattern with a simple configuration and capable of responding to a change in the wiring pattern. is there. As one means for achieving the above object, for example, an embodiment of the present invention has the following configuration.

That is, an alternating-current inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target areas are formed in a row, and a signal from the inspection target pattern is detected from the other to detect the inspection target pattern. In a circuit pattern inspection apparatus for inspecting, a supply unit having a supply electrode for supplying the inspection signal to the inspection target pattern in one of the inspection target regions of the inspection target pattern, and a signal from the inspection target pattern A detecting means having a detecting electrode for detecting the detection pattern, and a moving means for moving the supply electrode of the supplying means and the detecting electrode of the detecting means apart from the pattern to be inspected while traversing the row pattern portion of the inspection area. A circuit pattern inspection device comprising: a supply unit or a detection unit, wherein at least one of the supply unit and the detection unit Characterized in that it is provided in addition to part.

For example, the pattern to be inspected is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.

Further, for example, the width of the detection electrode is at least two columns of the pattern to be inspected.

Further, for example, the detection means comprises: a first detection electrode disposed at the other end position of the pattern to be inspected to which an inspection signal is supplied by the supply electrode at one end position; Inspection signal is supplied by the supply electrode And a second detection electrode disposed at the other end of the inspection target pattern adjacent to the inspection target pattern.

Also, for example, the width of the first detection electrode is not more than the pattern width of the pattern to be inspected.

Further, for example, the width of the second detection electrode is not more than the pattern width of the pattern to be inspected.

Further, for example, the moving unit traverses a row-like portion near both ends of the inspection target area in a state where a supply electrode surface of the supply unit and a detection electrode surface of the detection unit are capacitively coupled to the inspection target pattern. It is characterized by being moved.

In addition, for example, the apparatus further comprises a determination unit that determines that the inspection target pattern is normal when the detection result by the detection unit is within a predetermined range, and that determines that the inspection target pattern is defective when the detection result is out of the predetermined range. Features.

Further, for example, the supply electrode of the supply unit and the detection electrode of the detection unit are moved to both ends of the inspection target pattern that the determination unit has determined to be defective, and the supply electrode of the supply unit or the detection electrode of the detection unit is moved. A second moving means for moving one of them along the pattern toward the other, and a position detecting means for detecting a detected change position based on a detection result of the detecting means are provided.

Also, for example, a contact unit is provided for bringing one of the supply electrode of the supply unit and the detection electrode of the detection unit into contact with the pattern to be inspected.

Further, for example, an imaging unit is provided on at least one of the supply electrode and the detection electrode moved by the second moving unit. Or, the supply electrode moved by the second moving means and the detection It is characterized by including a separation control means for performing positioning control so that the distance between at least one of the output electrodes and the pattern to be inspected is substantially constant. And, for example, a separation distance control means for performing positioning control such that a separation distance between at least one of the supply electrode and the detection electrode moved by the movement means and the pattern to be inspected is substantially constant.

Also, for example, the separation processing control means includes a displacement meter that moves together with the detection electrode or the supply electrode at a position near the detection electrode or the supply electrode, and inspects the detection electrode or the supply electrode in accordance with a detection result of the displacement meter. Positioning control is performed in a direction orthogonal to the inspection object so that the distance from the object is substantially constant.

Further, for example, the separation processing control means sets an average displacement of the detection result of the displacement meter between a plurality of pitches of the pattern to be inspected as a separation distance between the detection electrode or the supply electrode and the inspection object, and is orthogonal to the inspection object. It is characterized by performing positioning control in the direction of movement.

Further, for example, a supply unit having a supply electrode for supplying an inspection signal to the inspection target pattern from one of the inspection target regions of the inspection target pattern in which the inspection target regions are formed in a row, and the inspection target pattern A pattern inspection method in a circuit pattern inspection apparatus having a detection means having a detection electrode for detecting a supply signal, wherein a supply electrode of the supply means and a detection electrode of the detection means are connected to a supply electrode surface of the supply means and While maintaining the state in which the detection electrode surface of the detection means is separated from the surface of the pattern to be inspected, one of the supply electrode and the detection electrode is connected to the pattern to be inspected by the line pattern portion of the inspection target area. An end portion is moved across, and the other one of the supply electrode or the detection electrode is connected to the pattern to be inspected by the row pattern portion of the area to be inspected. Moved across the other end, said object putter The inspection target pattern is inspected by supplying an AC inspection signal from one of the inspection target regions and detecting a signal from the inspection target pattern from the other.

Further, for example, the circuit pattern is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.

Further, for example, the width of the detection electrode is at least two columns of the pattern to be inspected, and a signal from a conductive pattern adjacent to the conductive pattern supplying the inspection signal is detected to detect a gap between the adjacent conductive patterns. It is characterized in that a short circuit can be detected.

Further, for example, a signal from a conductive pattern supplying an inspection signal from the detection electrode can be detected by a first detection electrode of the detection means to enable a disconnection between the conductive patterns to be detected. A signal from a conductive pattern adjacent to the supplied conductive pattern is detected by a second detection electrode of the detection means, and a short circuit between the adjacent conductive patterns can be inspected.

Also, for example, the position of the roughly disconnected portion of the conductive pattern is detected from the position of the detection means which is not detected by the detection means.

Further, for example, it is characterized in that the pattern to be inspected is determined to be normal when the detection result by the detection means is within a predetermined range, and to be defective when the detection result is out of the predetermined range.

Further, for example, the position of the inspection target pattern determined by the determination unit to be defective is identified and held, and the supply electrode of the supply unit and the detection electrode of the detection unit are provided at both ends of the inspection target pattern determined to be defective. Moving one of the supply electrode and the detection electrode along the pattern toward the other, and setting a change position as a defective position of the pattern to be inspected based on a detection result of the detection means. And Further, for example, one of the supply electrode of the supply unit and the other of the detection electrodes of the detection unit is brought into contact with the pattern to be inspected.

Further, for example, an imaging means provided on one of the supply electrode and the detection electrode is moved along the pattern toward the other, and an image of a defect state at a defect position of the pattern to be inspected is taken. I do.

Further, for example, a displacement meter that moves together with the detection electrode or the supply electrode is disposed at a position near the detection electrode or the supply electrode, and a separation distance between the detection electrode or the supply electrode and the test object is determined according to a detection result of the displacement meter. Positioning control is performed in a direction orthogonal to the inspection object so as to be substantially constant, and the result of the detection electrode is made constant.

Further, for example, the position of the inspection object is controlled by setting the average displacement of the detection result of the displacement meter between the plurality of pitches of the inspection object pattern as the distance between the detection electrode or the supply electrode and the inspection object. I do. In addition, an inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target area is formed in a row, and an inspection signal from the inspection target pattern is detected from the other to detect the inspection target pattern. A supply means for supplying the inspection signal to the inspection target pattern from one of the inspection target regions of the inspection target pattern, and detecting the inspection signal from the inspection target pattern. And a moving unit that moves the supply electrode and the detection electrode across the inspection target area while separating the supply electrode and the detection electrode from the inspection target pattern.

Further, at least one of the supply unit and the detection unit is provided at a position other than an end of the inspection target pattern.

Further, a plurality of the supply units are provided.

Further, at least one of the plurality of supply units or the detection unit Is disposed at a position other than the end of the pattern to be inspected.

Further, a plurality of the detecting means are provided.

Further, at least one of the supply unit and the plurality of detection units is provided at a position other than an end of the inspection target pattern.

Further, the width of the detection electrode is at least a width of two rows of the inspection target pattern.

Further, the detection means includes: a first detection electrode for detecting a test signal from a test pattern supplied with a test signal by the supply electrode; and a detection pattern adjacent to the test pattern supplied with the test signal by the supply electrode. And a second detection electrode for detecting an inspection signal from the inspection target pattern to be inspected.

The moving means may move across the inspection target area in a state where the supply electrode surface of the supply means and the detection electrode surface of the detection means are capacitively coupled to the inspection target pattern.

Further, the moving means includes a separation distance control means for performing positioning control so that the separation distance between the supply electrode and the detection electrode and the pattern to be inspected is substantially constant. In addition, the separation processing control means includes a displacement meter, and is orthogonal to the pattern to be inspected so that the distance between the supply electrode and the detection electrode and the pattern to be inspected is substantially constant according to the detection result of the displacement meter. It is characterized by performing positioning control in the direction in which it moves. .

Further, the separation processing control means may determine an average displacement of the detection result of the displacement meter during a plurality of pitches of the test pattern as a separation distance between the detection electrode or the supply electrode and the test object in a direction orthogonal to the test pattern. It is characterized by positioning control.

When the detection result of the inspection signal by the detection means is within a predetermined range, it is determined that the inspection target pattern is normal, and when the detection result of the inspection signal is out of the predetermined range, a defect of the inspection target pattern and the inspection target pattern are determined. And a determining means for determining a defective position on the terminal.

In addition, the supply electrode of the supply unit and the detection electrode of the detection unit are moved to the inspection target pattern determined to be defective by the determination unit, and either the supply electrode of the supply unit or the detection electrode of the detection unit is moved. A second moving means for moving the second direction along the pattern toward the other, and a position detecting means for detecting a detected change position based on a detection result of the detecting means.

In addition, it is characterized in that it comprises a contacting means for bringing the other of the supply electrode of the supply means or the detection electrode of the detection means into contact with the pattern to be inspected.

In addition, the supply electrode moved by the second moving means or the detection electrode moved by the second moving means is provided with an imaging means.

The supply electrode moved by the second moving means; or

The detection electrode moved by the second moving means; It is characterized in that it is provided with a separation control means for performing positioning control so as to make the distance substantially constant.

Further, when the detection result of the inspection signal by the detection means is a detection signal value that is constant to some extent, it is determined that the pattern to be inspected is normal, and when the detection result of the inspection signal is a detection signal value that changes rapidly, It is characterized by comprising a judging means for judging a defect of the inspection target pattern and a defect position on the inspection target pattern.

In addition, the supply electrode of the supply unit and the detection electrode of the detection unit are moved to the inspection target pattern determined to be defective by the determination unit, and either the supply electrode of the supply unit or the detection electrode of the detection unit is moved. , And a position detecting means for detecting a detected change position based on a detection result of the detecting means.

Further, the supply electrode moved by the second moving means, or the detection electrode moved by the second moving means, and the inspection target panel are so arranged that the distance is substantially constant. It is characterized by including a separation control means for performing positioning control.

In addition, an inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target area is formed in a row, and an inspection signal from the inspection target pattern is detected from the other, thereby detecting the inspection target pattern. Circuit circuit to inspect In the turn inspection method, the supply electrode of the supply unit and the detection electrode of the detection unit are maintained in a state where the supply electrode surface of the supply unit and the detection electrode surface of the detection unit are separated from the surface of the pattern to be inspected. Moving at least one of the supply electrode or the detection electrode across the inspection target area of the inspection target pattern, and when the detection result of the inspection signal detected by the detection electrode is within a predetermined range, Determining that the pattern is normal, and determining a defect of the inspection target pattern and a defect position on the inspection target pattern when a detection result of the inspection signal detected by the detection electrode is out of a predetermined range. .

An inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target area is formed in a row, and an inspection signal from the inspection target pattern is detected from the other to inspect the inspection target pattern. In the detection method, the supply electrode of the supply unit and the detection electrode of the detection unit are separated from the supply electrode surface of the supply unit and the detection electrode surface of the detection unit from the surface of the pattern to be inspected. Is maintained, and at least one of the supply electrode and the detection electrode is moved across the inspection target area of the inspection target pattern, and the detection result of the inspection signal detected by the detection electrode is a detection signal value that is constant to some extent. In this case, it is determined that the pattern to be inspected is normal, and the detection result of the inspection signal detected by the detection electrode is a detection signal value that has rapidly changed. Characterized in that the defective inspection object pattern and defective position on the inspection target butter over down to determine if that.

In addition, the width of the detection electrode is at least two columns of the pattern to be inspected, the disconnection is detected by the inspection signal from the pattern to be inspected to which the inspection signal is supplied, and the inspection in which the inspection signal is supplied. It is characterized in that a short circuit is detected by a test signal from a test pattern adjacent to the target pattern. In addition, the detection electrode includes a first detection electrode and a second detection electrode, and the first detection electrode detects a disconnection based on a test signal from a test target pattern to which a detection signal is supplied, and performs an inspection. A short circuit is detected by the second detection electrode based on a test signal from a test pattern adjacent to the test pattern to which the signal is supplied.

In addition, the position of the detection unit which is not detected by the detection unit is identified and held, and the supply electrode of the supply unit and the detection electrode of the detection unit are moved to the detection position, and the detection of the supply electrode or the detection electrode is performed. It is characterized in that either one is moved along the pattern toward the other, and the change position is determined as the defective position of the inspection target pattern based on the detection result of the detection means.

Further, one of the supply electrode of the supply means and the other of the detection electrodes of the detection means is brought into contact with the pattern to be inspected.

Further, an imaging means provided on one of the supply electrode and the detection electrode is moved along the pattern toward the other, and an image of a defective state at a defective position of the inspection target pattern is taken. And Brief Description of Drawings

FIG. 1 is a diagram for explaining a pattern inspection principle of an embodiment of the present invention.

FIG. 2 is a flowchart for explaining inspection control of the inspection apparatus according to the present embodiment.

FIG. 3 is a diagram showing an example of detection signals when three adjacent inspection target patterns are short-circuited (short-circuited) in the inspection apparatus according to the present embodiment. FIG. 4 is a diagram showing an example of a detection waveform in a case where one of the inspection target patterns in the inspection apparatus according to the present embodiment is disconnected (open) in the middle. FIG. 5 is a diagram showing a configuration of an inspection apparatus according to the second embodiment'example of the present invention.

FIG. 6 is a diagram showing a configuration of an inspection apparatus according to a third embodiment of the present invention.

FIG. 7 is a diagram for explaining electrode movement control in the inspection apparatus according to the third embodiment.

FIG. 8 is a flowchart for explaining the pattern defect location specifying control according to the third embodiment.

FIG. 9 is a diagram showing an example of a defective pattern detection signal waveform at a sensor electrode in the device according to the third embodiment.

FIG. 10 is a diagram showing an example of a detection signal waveform of a sensor electrode in a defective pattern.

FIG. 11 is a diagram for explaining a configuration of an inspection apparatus according to a fourth embodiment of the present invention.

FIG. 12 is a diagram for explaining a configuration of an inspection apparatus according to a fifth embodiment of the present invention.

FIG. 13 is a diagram for explaining a configuration of an inspection device according to a modified example 2 of the fifth embodiment according to the present invention.

FIG. 14 is a view for explaining a configuration of an inspection apparatus according to a modified example 2 of the fifth embodiment according to the present invention.

FIG. 15 is a diagram for explaining a configuration of an inspection device according to a modified example 2 of the fifth embodiment according to the present invention.

FIG. 16 is a diagram for explaining a configuration of an inspection device according to a modified example 2 of the fifth embodiment according to the present invention.

FIG. 17 is a diagram for explaining a configuration of an inspection apparatus according to a sixth embodiment of the present invention. FIG. 18 is a view for explaining a configuration of an inspection apparatus according to a modified example II of the sixth embodiment according to the present invention.

FIG. 19 is a view for explaining a configuration of an inspection apparatus according to a modified example II of the sixth embodiment according to the present invention.

FIG. 20 is a view for explaining a configuration of an inspection apparatus according to a modified example II of the sixth embodiment of the present invention.

FIG. 21 is a diagram for explaining a configuration of an inspection apparatus according to a modified example II of the sixth embodiment according to the present invention.

FIG. 22 is a diagram for explaining a configuration of an inspection apparatus according to a seventh embodiment of the present invention.

FIG. 23 is a view for explaining a configuration of an inspection apparatus according to a modified example の of the seventh embodiment of the present invention.

FIG. 24 is a diagram for explaining the configuration of the inspection device of Modification Example II of the seventh embodiment of the present invention.

FIG. 25 is a view for explaining a configuration of an inspection apparatus according to a modified example II of the seventh embodiment of the present invention.

FIG. 26 is a view for explaining a configuration of an inspection apparatus according to a modified example II of the seventh embodiment of the present invention.

FIG. 27 is a view for explaining the configuration of the inspection apparatus according to the eighth embodiment of the present invention.

FIG. 28 is a view for explaining the configuration of an inspection apparatus according to a modified example II of the eighth embodiment of the present invention.

FIG. 29 is a view for explaining a configuration of an inspection apparatus according to a modified example II of the eighth embodiment of the present invention.

FIG. 30 is a view for explaining a configuration of an inspection apparatus according to a modified example II of the eighth embodiment of the present invention. FIG. 31 is a diagram for explaining a configuration of an inspection apparatus according to a modified example II of the eighth embodiment of the present invention.

FIG. 32 is a diagram of a substrate to be inspected having a disconnection and a short circuit among the substrates to be inspected according to the present invention.

FIG. 33 is a diagram illustrating a detection result of a test signal according to the fifth embodiment of the present invention.

FIG. 34 is a diagram showing a detection result of a test signal according to the sixth embodiment of the present invention.

FIG. 35 is a diagram showing a detection result of a test signal according to the seventh embodiment of the present invention.

FIG. 36 is a diagram showing a detection result of a test signal according to the eighth embodiment of the present invention.

FIG. 37 is an example showing another shape of the conductive pattern 15 to be inspected.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention according to the present invention will be described in detail with reference to the drawings. In the following description, a circuit pattern inspection apparatus for inspecting the quality of a dot matrix pattern before bonding in a dot matrix display panel forming a liquid crystal display panel as a pattern to be inspected will be described as an example.

However, the present invention is not limited to the examples described below, and is not limited in any way as long as at least the vicinity of both ends of the inspection target area is formed in a row.

[Example of Embodiment of First Invention]

FIG. 1 illustrates the principle of pattern inspection according to an embodiment of the present invention. FIG. -In FIG. 1, reference numeral 10 denotes a substrate on which a conductive pattern to be detected according to the present embodiment is provided. In the present embodiment, a glass substrate used for a liquid crystal display panel is used. I have.

Conductive patterns 15 for forming a dot matrix display panel to be inspected by the circuit pattern inspection apparatus of the present embodiment are arranged in rows on the surface of the glass substrate 10 at regular intervals. In the example of the conductive pattern shown in FIG. 1, the width of each pattern 15 is substantially the same, and the intervals between the patterns are also substantially equal. However, in the present embodiment, the inspection can be performed in the same manner even if the pattern intervals are not equal.

20 is a sensor unit, 30 is an inspection signal supply unit, 50 is an analog signal processing circuit that processes a detection signal from the sensor unit 20 and outputs it to the control unit 60, and 60 is an example of the present embodiment. A control section that controls the entire inspection apparatus, 70 is a robot controller that controls the scalar mouth pot 80, 80 is a liquid crystal panel that is positioned and held at the inspection position, and is controlled according to the control of the mouth pot controller 70. This is a slurry pot that scans so that the sensor electrodes of the sensor unit 20 and the supply electrodes of the inspection signal supply unit 30 sequentially cross all the connection terminals of the conductive pattern to be inspected on the liquid crystal panel 10.

In the present embodiment, the scalar robot 80 is configured to be three-dimensionally positionable in order to position the inspection target substrate (liquid crystal panel) 10 at a predetermined inspection position. Similarly, three-dimensional positioning control is possible so that the sensor unit 20 and the inspection signal supply unit 30 are moved on the inspection target pattern while maintaining a predetermined distance from the surface of the inspection target substrate 10. .

In the above description, an example has been described in which the sensor unit 20 and the inspection signal supply unit 30 are moved on the inspection target pattern while maintaining the sensor unit 20 and the inspection signal supply unit 30 at a predetermined distance from the surface of the inspection target substrate 10 by the scalar port 80. . However, this embodiment is However, the sensor section 2 ′ 0 and the inspection signal supply section 30 are fixed, and the substrate to be inspected 10 is the sensor section 20 and the tip electrodes 25 of the inspection signal supply section 30. It may be controlled so that the substrate is moved while maintaining a predetermined distance from the surface of the substrate 35. Even with such control, exactly the same operation and effect can be obtained.

In the actual inspection control, when the pattern intervals are not equal or when the pattern pitches at both ends are different, the moving distance of the sensor electrode 25 and the moving distance of the supply electrode 35 are mutually set. It is necessary to synchronize and control at least a part of the sensor electrode 25 so that the supply electrode 35 is at the other end position of the pattern to which the test signal is actually supplied. By controlling in this way, even if the pattern intervals are not equal or the pattern pitches at the both ends are different, it is possible to respond simply by controlling the moving speed of both electrodes of the scalar rod.

A sensor electrode 25 and a supply electrode 35 are disposed on at least the front end surfaces of the sensor unit 20 and the detection signal supply unit 30 according to the present embodiment. The sensor electrode 25 and the supply electrode 35 are formed of metal, for example, copper (Cu) or gold (Au). Each electrode may be covered with an insulating material for protection. Further, for example, a semiconductor may be used as the electrode, but the reason why the electrode is formed of metal is that the capacitance between the electrode and the conductive pattern can be increased.

The inspection signal supply unit 30 is moved by the scalar robot 80 so as to cross one terminal of the pattern to be inspected, such as the liquid crystal panel 10, and sequentially supplies the inspection signal to each pattern to be inspected via capacitive coupling. It is desirable that the width of the supply electrode 35 at the tip end be, for example, equal to or less than the pattern pitch of the pattern to be inspected (the width of the pattern width and the pattern gap of the inspection pattern). This is because when the width of the supply electrode 35 is larger than the pattern pitch of the pattern to be inspected, when the sensor electrode 25 of the sensor unit 20 detects the inspection signal, the inspection signal from the pattern to be inspected other than the pattern to be inspected is detected. Is detected.

However, the width of the supply electrode 35 does not necessarily have to be equal to or smaller than the pattern pitch of the pattern to be inspected. If only a plurality of patterns to be inspected and patterns adjacent to this pattern can be grasped, the present embodiment, which will be described in detail later, will be described. The inspection can be performed by the inspection method of the embodiment.

That is, since the inspection signal supply unit 30 according to the present embodiment supplies the inspection signal in a non-contact manner, it is impossible to completely eliminate the supply of the inspection signal to the adjacent pattern to be inspected. Therefore, even if the width of the supply electrode 35 is set to be equal to or smaller than the pattern pitch of the pattern to be inspected, the inspection signal is generated in the same manner as when the width of the supply electrode 35 is not smaller than the pattern pitch of the pattern to be inspected. Is supplied to an adjacent pattern to be inspected. However, as described later, the inspection apparatus of the present invention inspects a pattern to be inspected by using a ratio of a relative change of a detection signal value of a defective pattern to a detection signal value of a normal pattern. Even if the detection of 25 includes the inspection signal supplied to the adjacent pattern to be inspected, it does not affect the relative change rate, so that the inspection is possible.

The sensor section 20 is moved by the scalar port 80 so as to cross one terminal of the pattern to be inspected such as the liquid crystal panel 10 and sequentially supplies an inspection signal to each pattern to be inspected via capacitive coupling. The detection signal supplied by the section 30 is to be detected, and the width of the sensor electrode 25 at the tip end is, for example, wider than the width of the supply electrode 35 by at least one pitch of the pattern to be inspected. Is desirable.

The detection signal from the sensor unit 20 is sent to the analog signal processing circuit 50 The analog signal is processed. The analog signal processed by the analog signal processing circuit 50 is sent to the control unit 60, and the quality of the test pattern to which the test signal supply unit 30 of the LCD panel 10 is in contact is determined. You. The control section 60 also controls the supply of the test signal to the test signal supply section 30.The analog signal processing circuit 50 amplifies the detection signal from the sensor section 20 by the amplifier 51 and the amplifier 51. The bandpass filter 52, which removes the noise component of the detected signal and allows the detection signal to pass, and the rectifier circuit 53, which performs full-wave rectification of the signal from the bandpass filter 52, is full-wave rectified by the rectifier circuit 53. It has a smoothing circuit 54 for smoothing the detected signal. It is not necessary to provide the rectifier circuit 53 for performing full-wave rectification and the smoothing circuit 54 for smoothing the detection signal.

The control unit 60 controls the entire inspection apparatus of the present embodiment, and processes the computer 62 (CPU) 61, the ROM 62 storing the control procedure of the CPU 61, and the like, and processes the CPU 61. RAM 63, which temporarily stores progress information and detection signals, etc., converts analog signals from analog signal processing circuit 50 into corresponding digital signals, and supplies them to AZD converter 64, inspection signal supply unit 30 A signal supply unit 65 for supplying a test signal to be provided, and a display unit 66 for displaying test results, operation instruction guidance, and the like are provided.

The signal supply unit 65 generates, for example, a sine wave signal of, for example, AC 200 kHz, 200 V as a test signal, and supplies the signal to the test signal supply unit 30. In this case, the band-pass filter 52 is a band-pass filter that passes the test signal 200 kHz. It is needless to say that the inspection signal is not limited to a sine wave signal, but may be a rectangular wave or a pulse wave as long as it is an AC signal.

Inspection control of the conductive pattern of the present embodiment having the above configuration is shown in FIG. This will be described below with reference to the flowchart of FIG. FIG. 2 is a flowchart for explaining inspection control of the inspection apparatus of the present embodiment.

When the inspection is performed by the inspection apparatus according to the present embodiment, the glass substrate on which the conductive pattern to be inspected is formed is moved to a position (work position) of the circuit pattern inspection apparatus according to the present embodiment on a transport path (not shown). It is transported. For this reason, first, in step S1, the liquid crystal panel 10 to be inspected is set in the inspection device. In this case, the substrate to be inspected that has been automatically transported may be set in the inspection apparatus by a transport rod (not shown), or may be directly set by an operator. When the inspection target is set in the inspection device, the control unit 60 activates the mouth pot controller 70 to control the scalar robot 80 and positions the inspection target at the inspection position.

Subsequently, in step S3, an inspection signal is supplied to an initial position on one end side of the inspection target pattern 15 to be inspected (the liquid crystal panel) 10 (the position of the first inspection target pattern separated by a predetermined distance). In addition to positioning the supply electrode 35 of the part 30, the sensor electrode 25 of the sensor part 20 is conveyed to the initial position (the position of the endmost pattern to be inspected away from the predetermined distance) on the other end side of the pattern to be inspected. Position.

In the present embodiment, the gap (distance between the pattern to be inspected and the electrode) is kept in a range of, for example, 100 m to 200 m. However, the gap is not limited to the above example, and the gap in the present embodiment is determined according to the size of the pattern to be inspected. When the size is small, the gap becomes narrow.

When the pattern size is very small, a coating is formed on the electrode surface with an insulating material so that the pattern and the electrode do not come into direct contact with each other. Supply unit 30 directly on substrate By controlling the gap so that the thickness is substantially equal to the thickness of the material, the distance between the pattern to be inspected and the electrode can be easily and accurately set to a fixed distance to perform the inspection.

Thereby, an easy and accurate detection result can be obtained with a simple structure even with a very fine pattern.

Then, in the following step S5, the signal supply unit 65 is instructed to start supplying the test signal to the supply electrode 35 of the test supply unit 30.

Next, proceeding to step S7, keeping the distance between the pattern and the electrodes constant, synchronizing the electrodes 25 and 35 of the sensor section 20 and the inspection signal supply section 30 so as to cross the pattern to be inspected. In addition, the control (scanning of the inspection target) that starts moving while controlling so as to keep the separation distance from the surface of the inspection target pattern constant is started. As a result, the sensor electrode 25 thereafter detects the signal potential from the pattern to be inspected to which the inspection signal is supplied by capacitive coupling with the supply electrode 35.

That is, when the supply electrode 35 is located at the position of the pattern to which the inspection signal is supplied, at least a part of the sensor electrode 25 is at the other end position of the inspection target pattern to which the inspection signal is supplied, and The sensor electrode 25 at the other end is also controlled to move by one pitch of the pattern to be inspected while 35 moves by one pitch of the pattern to be inspected at the one end.

Therefore, in step S 10, the signal processing circuit 50 is started, and control is performed so that the detection signal from the sensor electrode 25 is processed and output to the control unit 60. In the signal processing circuit 50, as described above, the detection signal from the sensor electrode 25 of the sensor section 20 is amplified to a required level by the amplifier 51, and the detection signal amplified by the amplifier 51 is converted into a signal of the inspection signal frequency. The signal from the bandpass filter 52 is sent to a bandpass filter 52, which removes noise components, and then the signal from the bandpass filter 52 is subjected to full-wave rectification by a rectifier circuit 53. Is smoothed by the smoothing unit ^ 54 and sent to the AZD conversion unit 64 of the control unit 60.

The CPU 61 activates the AZD conversion unit 64 to convert the input analog signal into a corresponding digital signal, and reads the detection signal detected by the sensor electrode 25 as a digital value.

In a subsequent step S12, the CPU 61 converts the read detection signal

Send to RAM63. The RAM 63 sequentially stores the sent detection signals. The read detection signal includes all of the detection signals from the normal inspection target pattern, the detection signals from the disconnected inspection target pattern, and the detection signals from the adjacent inspection target pattern short-circuited with the inspection target pattern. It is.

In step S14, it is determined whether or not the inspection of the pattern to be inspected is completed, for example, whether or not the sensor electrode 25 has moved to a position beyond the last pattern of the pattern to be inspected. Check whether the inspection of the target pattern has been completed).

If the inspection has been completed only halfway through the pattern to be inspected, the flow advances to step S16 to continue scanning the electrodes and supply an inspection signal to the next pattern. Then, the process returns to step S10 to continue the reading process.

On the other hand, in step S14, when the inspection for all the inspection target patterns is completed, the process proceeds to step S20, instructing the signal supply unit 65 to stop the supply of the inspection signal, and The processing circuit 50 stops the operation of the AZD conversion unit 64.

Finally, in step S22, the inspection object is removed from the inspection position, positioned and transported to the next transport position, and necessary post-processing is performed.

By performing the control as described above, the pattern inspection can be performed without any contact between the sensor electrode 25 and the supply electrode 35 at all. I can do it. For this reason, even a substrate having a low strength of the inspection target pattern can be inspected without causing a problem such as damaging the inspection target pattern.

For this reason, even for a glass substrate for a liquid crystal display panel used for a liquid crystal display panel for a small mobile phone, which does not have sufficient strength, it is possible to reliably inspect the wiring pattern without damaging the wiring pattern.

In the inspection control of the conductive pattern of the present embodiment, the AC sine wave signal which is a continuous signal from the supply electrode 35 is moved while moving the sensor electrode 25 and the supply electrode 35 across the pattern to be inspected. Is supplied to the pattern to be inspected, and the signal potential from the pattern to be inspected is detected by the sensor electrode 25.Therefore, the detection signal, which is the signal potential obtained from the sensor electrode 25, has a certain constant continuous detection signal value. Is detected as

Therefore, among the plurality of inspection target patterns provided on the inspection target substrate, there are defect inspection target patterns such as open (disconnection inspection target pattern) and short (inspection target pattern short-circuited with the next inspection target pattern). In this case, a continuous detection signal value that is constant to some extent that a normal inspection target pattern without open or short circuit is detected in a continuous range, and a defect detection signal value that is detected at a defect inspection target pattern position that has open or short circuit There is a numerical difference between.

As described above, the detection signal value of a failure due to an open shot appears as a numerical value difference, that is, a change in the numerical value, among the detection signal values that are constant to a certain extent. By making a graph as shown in FIG. 3 or FIG. 4, which will be described later, it is possible to easily determine the defect of the inspection target substrate and specify the position of the defect inspection target pattern having an open or short circuit. ''

In addition, when the inspection device performs inspection while sequentially changing the inspection target substrate, Due to a change in the gap between the sensor electrode 25 and the pattern to be inspected, a change in the gap between the supply electrode 35 and the pattern to be inspected, etc. Each time is changed, the value becomes a different value as the absolute value.

However, the determination of the defect of the inspection target substrate and the identification of the position of the defect inspection target pattern having an open or short circuit by the inspection control of the conductive pattern according to the present embodiment are performed by detecting an open circuit that appears in a certain constant continuous detection signal value. It is possible to use the numerical value difference between the detection signal values of the failures due to the short circuit and the short circuit, that is, the relative change in the detection signal value.

For this reason, a relative value such as a ratio of a failure detection signal value to a continuous detection signal value or a variation ratio of a failure detection signal value can be used as a threshold value for determining a failure and specifying a failure position. Even if the inspection apparatus does not use continuous detection signal values which are constant to some extent as absolute values, even if the inspection apparatus performs inspection while sequentially changing the inspection target board, it is possible to reliably determine a defect and specify a defective position.

Note that the inspection control of the conductive pattern according to the present embodiment is not limited to the above example, and the detection read in step S12 is performed between step S12 and step S14. It is checked whether or not the signal is within the threshold range based on the relative value. If the detection result is within the threshold range, the process proceeds to step S14. A step of determining that the pattern is an open or short-circuited defect inspection target pattern and storing the position or state of the inspection target pattern may be provided. FIGS. 3 and 4 show test signal detection results by the sensor electrode 25 under the above control. Fig. 3 is a diagram showing an example of detection of an inspection signal when three points of an inspection pattern in the inspection apparatus according to the present embodiment are broken (open), and Fig. 4 is a diagram showing one of the inspection target patterns according to the present embodiment. Short circuit in the middle ( It is a figure which shows the example of an inspection signal detection in case of (short).

When the inspection target pattern is normal, the inspection signal (AC signal) supplied from the signal supply unit 65 to the supply electrode 35 is supplied to the capacitively coupled inspection target pattern, and the inspection target pattern is And reaches the lower part of the sensor electrode 25 through the sensor, is detected by the sensor electrode 25 by capacitive coupling with the sensor electrode 25, and is output to the controller 60.

In this way, the supply electrode 35 and the sensor electrode 25 supply and detect the inspection signal (AC signal) while traversing the pattern to be inspected, so that the detection signal is continuously obtained as a somewhat constant detection signal value. Is detected.

When at least a part of the pattern to be inspected is disconnected, at least a part of the inspection signal (AC power) supplied to the supply electrode 35 from the signal supply unit 65 is connected to the disconnected part of the pattern to be inspected. Since the light does not reach the sensor electrode 25 side, the detection signal value becomes small. Therefore, as shown in FIG. 3, the detection signal value of the disconnected inspection target pattern portion is smaller than a continuous constant value detected from a normal inspection target pattern.

On the other hand, when the test pattern is short-circuited with the adjacent test pattern, the test signal (alternating power) supplied to the supply electrode 35 from the signal supply unit 65 is short-circuited with the adjacent test pattern. The detection signal from the sensor electrode 25 is superimposed on the detection signal of the adjacent test target pattern, and the detection signal value becomes large. Therefore, as shown in FIG. 4, the detection signal value of the short-circuited pattern to be inspected is larger than a continuous constant value detected from the normal pattern to be inspected.

The disconnection and short circuit of the pattern to be detected as described above can be performed with one sensor electrode 25 because the width of the sensor electrode 25 is wider than the width of the supply electrode 35 by at least one pitch of the pattern to be inspected. Because it is set However, the width of the sensor electrode 25 does not necessarily have to be greater than the width of the supply electrode 35 by one pitch or more of the pattern to be inspected. If the inspection target panel that has short-circuited can be inspected, for example, the configuration of the second embodiment described later in detail may be adopted.

If a threshold value is set within a certain range for a continuous detection signal value having a certain constant value as an absolute value, if the detection signal value is smaller than the threshold value, the disconnection of the pattern to be inspected and the detection signal value are set to the threshold value. If it is larger, it can be determined that the pattern to be inspected is short-circuited. For example, in FIG. 3, if the threshold value is set to 0.02 V pp with respect to a constant detection signal value of 0.60 V pp to a certain extent, the sensor movement distance of 0.58 V pp or less is obtained. The pattern to be inspected at the positions of 2 mm, 2 mm, and 78 mm is judged to be broken.

Also, relative values such as the ratio of the detection signal value of the defect to the continuous detection signal Rishi and the rate of change of the detection signal value of the defect are used as the threshold value for determining the defect and specifying the position of the defect. If the continuous detection signal value drops by 3% or more, it can be determined that the inspection pattern is broken, and if the continuous replacement signal value rises by 3% or more, it can be determined that the inspection pattern is short-circuited.

That is, in FIG. 3, assuming that the detection signal value 0.60 Vpp, which is constant to some extent, is 100, the rate of change of the detection signal value is reduced by 3% or more. The pattern to be inspected at the positions of 2 mm and 78 mm is judged to be disconnected.

Further, as shown in FIG. 4, the continuous detection signal value, which is constant to some extent, changes from about 0.45 V pp (at a position of about 12 mm of the sensor moving distance) to about 0.4 IV pp (about 2 mm of the sensor moving distance). 5 mm position) and about 0.49 It may rise to V pp (sensor movement distance about 48 mm). Even in such a case, the rate of change of the detection signal value at the defective part is somewhat larger than the rate of change of the continuous detection signal value to a certain degree (that is, abrupt). It is possible to do.

As described above, in the present embodiment, not only the absolute value can be used as the threshold value for determining the quality of the pattern, but also the relative change of the detection signal value of the defective pattern with respect to the detection signal value of the normal pattern. Since the ratio can be used as a threshold value, even if the inspection device sequentially inspects the test target substrate while changing it, it is possible to set an optimal threshold value according to the detection result, and the detection signal value varies from inspection to inspection. However, even if the detection signal value is low, these effects can be completely prevented, and an accurate inspection result can be obtained.

As described above, even in the inspection method in which the detection signal value is minute because both the sensor unit and the inspection signal supply unit are non-contact, by using the inspection device of the present embodiment, The difference can be reliably recognized, and the inspection of the pattern state can be performed easily and surely.

For this reason, the quality of the pattern can be detected very accurately and easily compared to the conventional method of determining the quality using the absolute value of the detection signal value as a threshold. In addition, since it is non-contact, accurate positioning accuracy is not required, and the inspection can be performed with high accuracy even on a substrate having a very fine pattern pitch to be inspected.

Furthermore, even if the detection signal value is not completely constant, it is possible to identify a defective portion based on a sudden change in the detection signal value.

[Example of Embodiment of Second Invention]

In the above description, an example has been described in which at least a part of the sensor electrode 25 is controlled such that the supply electrode 35 is always at the other end position of the pattern to which the test signal is actually supplied. However, the present invention is not limited to the above examples. However, for example, a plurality of sensor electrodes 25 are provided, and one of the plurality of sensor electrodes 25 is a supply electrode. At least one of the plurality of sensor electrodes 25 provided at the other end of the pattern adjacent to the pattern to which the supply electrode 35 is actually supplying the inspection signal. A second embodiment according to the present invention configured as described above will be described below with reference to FIG. FIG. 5 is a diagram for explaining the configuration of the inspection apparatus according to the second embodiment of the present invention.

In FIG. 5, the same components as those shown in FIG. 1 of the first embodiment are denoted by the same reference numerals, and detailed description will be omitted.

In FIG. 5, a first sensor electrode 22 and a second sensor electrode 24 are provided on at least the tip surface of the sensor section 20. The first sensor electrode 22 and the second sensor electrode 24 are spaced apart from each other by the pattern pitch of the pattern to be inspected, and the first sensor electrode 22 actually has the supply electrode 35. The second sensor electrode 24 is provided adjacent to the inspection target pattern to which the supply electrode 35 actually supplies the inspection signal. It is provided in an offset state at the other end position of the adjacent inspection target pattern.

Further, since the first sensor electrode 22 is provided so that the supply electrode 35 is located at the other end of the pattern to be inspected to which the inspection signal is actually supplied, the inspection of the disconnection of the pattern to be inspected is performed. Do. Further, the second sensor electrode 24 is provided in a state where the supply electrode 35 is offset to the other end position of the adjacent test pattern adjacent to the test pattern to which the test signal is actually supplied. Inspect the short-circuit between the pattern to be inspected and the adjacent pattern to be inspected. It is desirable that the width of the first sensor electrode 22 and the second sensor electrode 24 be equal to or smaller than the pattern width of the pattern to be inspected. This is because the first sensor electrode 22 performs an inspection for disconnection of the pattern to be inspected, and the second sensor electrode 24 performs an inspection for a short circuit between the pattern to be inspected and the adjacent pattern to be inspected. This is to realize very high-precision inspection.

Specifically, if the width of the first sensor electrode 22 is less than or equal to the pattern width of the pattern to be inspected, the pattern to be inspected is broken, and the pattern to be inspected and the adjacent pattern to be inspected are short-circuited. Even in such a case, the first sensor electrode 22 is less susceptible to the detection signal from the test signal from the adjacent test pattern that has flowed into the adjacent test pattern from the test pattern through the short-circuited portion. Become. If the width of the second sensor electrode 24 is smaller than the pattern width of the pattern to be inspected, there is no disconnection or short circuit in the pattern to be inspected. Even when the target pattern is short-circuited, the second sensor electrode 24 is less likely to be affected by the inspection signal from the inspection target pattern.

As described above, the inspection of the disconnection / short-circuit by the first sensor electrode 22 and the second sensor electrode 24 depends on whether or not the inspection target pattern is disconnected and whether or not the adjacent inspection target pattern is short-circuited. Even if it is present, very high-precision inspection can be realized.

However, the fact that the widths of the first sensor electrode 22 and the second sensor electrode 24 do not necessarily have to be smaller than the pattern width of the pattern to be inspected is different from the sensor electrode 25 according to the first embodiment. Is clearer.

In addition, since the first sensor electrode 22 and the second sensor electrode 24 detect the inspection signal in a non-contact manner, it is impossible to completely eliminate the detection signal from the adjacent inspection target pattern. That is, even if the width of the first sensor electrode 22 and the second sensor electrode 24 is smaller than the pattern pitch of the pattern to be inspected. In the case where the width of the first sensor electrode 22 and the width of the 'second sensor electrode 24' are not smaller than the pattern pitch of the pattern to be inspected, the inspection signal from the adjacent pattern to be inspected is detected. Will be done. However, since the inspection apparatus of the present invention performs the inspection of the inspection target pattern using the relative change ratio of the detection signal value of the defective pattern to the detection signal value of the normal pattern, the first sensor electrode 2 Even if the second and second sensor electrodes 24 detect an inspection signal from an adjacent inspection target pattern, the inspection is possible because it does not affect the relative rate of change.

Furthermore, in the second embodiment described in detail above, the offset sensor electrode is described to be the second sensor electrode 24, but the adjacent sensor pattern adjacent to the test pattern is different from the adjacent sensor pattern. By providing a third sensor electrode that detects the test signal from the second adjacent test pattern adjacent on the opposite side, a short circuit with two adjacent test patterns adjacent to both sides of the power test pattern is provided. It is also possible to inspect at the same time.

Further, the sensor electrode provided in the sensor section 20 is a first sensor electrode 2

Needless to say, there is no problem with only 2 or only the second sensor electrode 24, and three or more offset sensor electrodes may be provided.

[Example of Embodiment of Third Invention]

In the above description, an example of detecting a defective pattern by moving the sensor electrode 25 and the supply electrode 35 so as to cross the end of the pattern to be inspected has been described. However, the present invention is not limited to the above example. For example, one of the sensor electrode 25 and the supply electrode 35 can be moved and controlled along the pattern to be inspected. After identifying the defective pattern, both electrodes are positioned at the position of the defective pattern, one electrode is moved on the pattern along the defective pattern, the detected signal value at sensor electrode 25 is read, and the detected signal value changes. Detects the position and identifies it as a pattern defect occurrence location May be configured.

A third embodiment according to the present invention configured as described above will be described below with reference to FIGS. FIG. 6 is a diagram illustrating an inspection apparatus according to a third embodiment of the present invention, and FIG. 7 is a diagram illustrating electrode movement control in the inspection apparatus according to the third embodiment of the present invention. FIG. 9 is a flowchart for explaining the pattern defect location specifying control of the third embodiment, and FIG. 9 is an example of a defect pattern detection signal waveform at the sensor electrode 25 in the device of the third embodiment. FIG. 10 is a diagram showing an example of a detection signal waveform of the sensor electrode 25 in a defective pattern.

6, the same components as those shown in FIG. 1 of the first embodiment described above are denoted by the same reference numerals, and detailed description will be omitted.

In FIG. 6, a camera 26 is attached to the detection unit 20. The camera 26 of ζ! is connected to, for example, the display unit 66 of the control unit 60 to display the captured image, and is used to observe the state of occurrence of a pattern failure at the location where the pattern failure has occurred. . Further, the inspection signal supply unit 30 is provided with a probe contact means 32 to which an inspection signal supply probe for supplying an inspection signal is attached. The probe contact means 32 and the inspection signal supply probe are used to reliably identify the location where the pattern defect has occurred. In the third embodiment, the movement of the scalar rod is controlled not only in the direction of the arrow in FIG. 6 but also in the longitudinal direction of the pattern in FIG. Then, first, the inspection control shown in FIG. 2 of the first embodiment described above is performed to inspect whether or not the inspection target pattern has a defect. As a result of the inspection, for example, the inspection target pattern position of the inspection target pattern which is determined to be the pattern disconnection is held in, for example, RAM63.

When the defective pattern is detected in this way and the position of the defective pattern is specified, the process proceeds to the defective portion specifying process. Defective part feature of the third embodiment In the constant processing, the supply electrode 35 and the sensor electrode 25 are first synchronized and moved to the pattern position determined to be defective, as shown by ① in Fig. 7. Subsequently, as shown by the triangle in FIG. 7, the inspection signal is sequentially read while moving the sensor electrode 25 from the pattern end toward the other end, and the position where the read signal changes rapidly (the detection signal is not detected) , Or a position that changes to a low level), and identifies that position as a pattern defect location.

Hereinafter, this will be described in detail with reference to the flowchart of FIG. In the third embodiment, following the processing of step S14 in the above-described first embodiment, the detection signal stored in the RAM 63 is checked to determine whether or not a defective pattern has been detected. Then, if no defective pattern is detected, the process proceeds to step S20.

On the other hand, if a defective pattern is detected as a result of the inspection, the signal supply unit 65 is deenergized, and the electrodes are positioned at the initial position as in step S3, and the process proceeds to the processing shown in FIG. Then, after the processing shown in FIG.

In the third embodiment, first, as shown in step S31 of FIG. 8, a defective pattern position detected in the processing of steps S1 to S'16 shown in FIG. 2 is specified. For example, Fig. 9 shows the detection signal waveform when a part of the pattern is broken. In the example shown in FIG. 9, a signal before signal processing in the analog signal processing circuit 50 is shown. The circles indicate the signal waveforms detected as open patterns (when two patterns are broken).

Subsequently, in step S33, the robot controller 70 is started, and the scalar port pot 80 is controlled to move the sensor electrode 25 and the supply electrode 35 to the defective pattern position while synchronizing with each other. At this time, in order to perform detection with high sensitivity, the sensor voltage is placed almost at the center of the width of the defective pattern. Position the electrode 25 and the supply electrode 35 in such a way that the center in the width direction is square (control (1) in Fig. 7).

Subsequently, the process proceeds to step S35, in which the signal supply unit 65 is activated to apply an inspection signal to the supply electrode 35 and supply the inspection signal to the defective pattern. Then, the mouth pot controller 70 is activated to move the sensor electrode 25 in the direction of the supply electrode 35 along the pattern (control (1) in FIG. 7).

At the same time, the detection signal from the sensor electrode 25 is read as shown in step S40. Then, in the following step S42, it is checked whether or not the detection signal value from the sensor electrode 25 has changed significantly. If not, the process returns to step S37 to continue the movement of the sensor electrode 25.

On the other hand, if the detection signal value from the sensor electrode 25 greatly changes in step S42, the process proceeds to the change step S44, and the position where the detection signal from the sensor electrode 25 starts to change greatly The position where the large change has disappeared is determined, and the intermediate position between those positions is specified as the pattern defective portion.

FIG. 10 shows an example of a detection signal waveform at the sensor electrode 25. As shown in FIG. 10, the inspection signal supplied by the supply electrode 35 did not reach the sensor electrode 25 up to the disconnection point, and the detection signal value was low, but the inspection signal was supplied beyond the disconnection point. Since the inspection signal arrives, the detection signal value increases. For example, an intermediate position between the position at which the detection signal from the sensor electrode 25 starts to change significantly and the position at which the detection signal no longer changes is identified as a pattern defect portion. Is identified as a defective part.

In the above description, the sensor electrode 25 is moved in the direction of the supply electrode. However, instead of the sensor electrode 25, the supply electrode 35 may be moved in the direction of the sensor electrode 25.

As described above, according to the third embodiment, the first embodiment In the same way as in the above embodiment, it is possible to perform a high-precision pattern pass / fail inspection without contact, and by controlling the movement of the sensor electrode in the X and Y directions, it is possible to determine whether there is only a defective pattern. Not only inspection but also specific failures can be identified. For this reason, for example, if necessary, a defective portion can be repaired in a short time.

In order to determine whether or not repair is possible in repairing the above-mentioned defective portion, it is desirable to be able to observe the defect occurrence state of the pattern defect occurrence portion. For example, if it is found that only dust or the like has adhered to the location where the pattern defect has occurred, it can be determined that the repair can be performed on the spot, and if the failure is fatal, it is determined that the repair is not performed. be able to. 'The camera 26 attached to the detection unit 20 is used for observing the failure occurrence state at the pattern failure occurrence location. Since the camera 26 is attached to the detection unit 20, the photographing of the camera 26 is started in the step S35, and the photographing is performed while the steps S40 and S42 are performed. Continue to continue shooting until after the pattern defect location is specified in step S42. ₉ The image of the pattern defect location captured in this way is displayed during shooting and after the pattern defect location is specified. Displayed in part 66, it is used to observe the failure occurrence state of the pattern failure occurrence location.

In addition, the state of a defective portion of the pattern varies from a completely disconnected state or a short-circuited state to a partially disconnected state or a partially short-circuited state due to an attached substance such as dust. In this partially disconnected or partially short-circuited state, a test signal waveform as shown in FIG. 10 may not be obtained in an inspection in which both the sensor electrode 25 and the supply electrode 35 are in non-contact. In such a case, the probe contact means 32 is operated to bring the inspection signal supply probe into contact with one end of the defective pattern, and then the sensor electrode 25 is moved on the pattern along the defective pattern. Thus, it is possible to reliably identify the location where the pattern defect occurs. Note that a contact-type sensor probe is used in place of the sensor electrode '25 at the other end of the defective pattern, and this sensor probe is brought into contact with the other end to connect the non-contact supply electrode 35 with the defective pattern. It may be moved in the direction of the sensor probe at the other end.

[Embodiment of the fourth invention]

In the above description, an example in which the movement control of the sensor electrode 25 and the supply electrode 35 by the scalar mouth pot 80 is two-dimensionally controlled mainly in the XY direction has been described. This is because the substrate to be inspected was a liquid crystal panel, and the glass substrate had high smoothness. When inspecting a substrate that has a large pattern thickness or a large inspection substrate that cannot prevent surface irregularities, control not only the above two-dimensional control but also the vertical direction (Z direction). It should be configured so that the inspection result can be obtained even if there is unevenness on the inspection target board.

A fourth embodiment according to the present invention configured to control not only two-dimensional control but also in the vertical direction (Z direction) will be described below with reference to FIG. FIG. 11 is a view for explaining the configuration of the inspection apparatus according to the fourth embodiment of the present invention. 11, the same components as those shown in FIG. 1 of the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In Fig. 11, a laser displacement meter 28 is attached to the detection unit 20 and a laser displacement meter 38 is attached to the inspection signal supply unit 30. Detection from both displacement meters 28, 38 A distance measuring unit 90 for measuring the distance from the result to the detecting unit 20, the inspection signal supplying unit 30, and the surface of the inspection target substrate is provided.

In addition, the scalar robot 80 can control the detection unit 20 and the inspection signal supply unit 30 two-dimensionally (X-Y), and can also control the direction orthogonal to the figure (vertical direction, that is, perpendicular to the paper surface). (Z direction). In the fourth embodiment having the above-described configuration, the distance measurement unit 90 activates the laser displacement meters 28 and 38 simultaneously with the movement of the electrodes, so that the distance between each electrode and the surface of the inspection target substrate is increased. The distance is measured, and the measurement result is output to the control unit 60. The control unit 60 also averages the measurement results of the measurement distances from the distance measurement unit 9.0 while the electrodes move a fixed distance, and adjusts the distance between the electrodes and the pattern so that the averaged distance is constant. Controlling.

For example, the distance between the electrode and the substrate surface is controlled according to the average of the distances of three inspection target patterns.

The reason for averaging the distances in this way is to prevent abrupt Z-direction control and provide gentle control, as well as to reduce the effects of noise and measurement errors.

Controlling not only the X-Y direction but also the Z-direction in this way is particularly effective for large-scale board c inspection. For example, in the inspection of a pattern to be inspected on the surface of a large flat display panel, the curvature of the substrate surface cannot be avoided, and even in such a case, it is possible to effectively prevent the electrode from coming into contact with the pattern.

When the pattern is thick, the range of the measurement distance to be averaged should be narrowed to enable more sensitive detection.

[Embodiment of the fifth invention]

In the description of the embodiment of the first invention, the sensor unit 20 and the inspection signal

The example in which the signal supply units 30 are provided at both ends of the pattern to be inspected has been described. However, the present invention is not limited to the above example. For example, a configuration may be adopted in which the inspection signal supply unit 30 is disposed substantially at the center of the inspection target pattern.

A fifth embodiment according to the present invention configured as described above will be described below with reference to FIG. FIG. 12 shows the inspection according to the fifth embodiment of the present invention. It is a figure for explaining composition of a device.

12, the same components as those of the first embodiment described above and shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 12, the sensor unit is composed of a first sensor unit 20a and a second sensor unit.

The first sensor section 20a is provided with a sensor electrode 25a, and the second sensor section 20b is provided with a sensor electrode 25b. The inspection signal supply unit 30 is moved by the scalar port 80 so as to substantially cross the center of the pattern to be inspected, such as the liquid crystal panel 10, and sequentially outputs the inspection signal to each pattern to be inspected via capacitive coupling. Supply. However, the crossing position of the inspection signal supply section 30 does not have to be approximately at the center of the pattern to be inspected, but is between the first sensor section 20a and the second sensor section 20b. If the configuration is arranged in this manner, the inspection can be performed by the inspection method of the present embodiment.

The first sensor unit 20a is moved by the scalar port 80 so as to cross one end of the pattern to be inspected, such as the liquid crystal panel 10, and the second sensor unit 20b is The test signal supply unit moves across the other end of the pattern to be inspected and sequentially connects to the pattern to be inspected via capacitive coupling.

The detection of the inspection signal supplied by 30 is performed.

In the inspection method of the present embodiment, the width of each of the sensor electrode 25a of the first sensor unit 20a and the sensor electrode 25b of the second sensor unit 20b is, for example, Although the width is substantially the same as the width of the electrode 35, the present invention is not limited to this configuration. For example, at least one pitch of the pattern to be inspected is larger than the width of the supply electrode 35 described in the first embodiment. As described above, the configuration may be wide, or the configuration in which a plurality of sensor electrodes are provided in one sensor unit as described in the second embodiment.

The inspection apparatus according to the fifth embodiment provides the inspection apparatus according to the first embodiment. Similarly to the second embodiment, even in the inspection method in which the detection signal value becomes very small because both the sensor unit and the supply of the inspection signal are not in contact with each other, By using the inspection device, the difference can be reliably recognized, and the inspection of the background state can be performed easily and reliably.

In particular, in the inspection method of the present embodiment, the supply electrode 35, the sensor electrode 25a, and the sensor electrode 25 are provided by arranging the crossing position of the inspection signal supply unit 30 at a position other than both ends of the pattern to be inspected. The inspection distance supplied to the pattern to be inspected by the supply electrode 35 is transmitted to the adjacent pattern to be inspected, and the inspection object is inspected again without passing through the disconnection point of the pattern to be inspected. By reducing the number of detection signals detected by being transmitted to the pattern, the level of the detection signal at the time of disconnection of the pattern to be inspected can be increased, so that the pattern state can be inspected accurately.

In addition, if the distance between the supply electrode 35 and the sensor electrode 25 is long, the impedance due to the resistance component of the pattern to be inspected increases, and the impedance between the pattern to be inspected and the pattern adjacent thereto increases due to the capacitance. Becomes smaller. As a result, the measurement accuracy is reduced because the impedance of the resistance component and the impedance of the capacitance are close to each other. However, in the detection method of the present embodiment, the supply electrode 35, the sensor electrode 25a, and the sensor Since the distance from the pole 25b can be reduced, the pattern state can be inspected with high accuracy.

[Variation of Embodiment 5 of the Fifth Invention]

In the embodiment of the fifth invention, the sensor unit 20 and the inspection signal supply unit 30 are configured to scan the pattern to be inspected sequentially with the scalar port, so as to sequentially traverse the pattern. The present invention is not limited to the above example. For example, the inspection signal supply unit 30 may be configured as shown in FIG. 13 or FIG. As described above, a configuration may be employed in which the inspection target substrate 10 is fixedly arranged at a predetermined distance from the surface of the inspection target substrate 10.

In FIG. 13, the inspection signal supply unit 30 is disposed on the surface of the inspection target substrate 10 on the side where the inspection target pattern is provided.

In FIG. 14, the inspection signal supply unit 30 is provided on the surface of the inspection target substrate 10 opposite to the surface on which the inspection target pattern is provided. On the surface on the opposite side, the inspection target substrate 10 is an insulator such as glass, so that the inspection signal supply unit 30 and the inspection target pattern can be closely attached to each other in order to reduce the separation distance. Also, since the dielectric constant of glass is higher than that of air, more reliable measurement is possible.

In the modified example 1 of the fifth embodiment of the present invention, the inspection target pattern is supplied with the inspection signal from the supply electrode 35 of the inspection signal supply unit 30 by supplying the inspection signal from the scalar mouth pot, By the method described in the fifth embodiment, the pattern state can be inspected accurately.

[Variation of Embodiment 5 of the Fifth Invention]

In the fifth embodiment of the present invention, the sensor unit 20 and the inspection signal supply unit 30 are configured to scan the inspection target pattern by the scalar robot so as to sequentially cross the inspection target pattern. Is not limited to the above example.For example, the sensor section 20a and the sensor section 20b are separated from the surface of the inspection target substrate 10 by a predetermined distance as shown in FIG. 15 or FIG. It may be configured to be fixedly arranged in this state.

In FIG. 15, the sensor unit 20 a and the sensor unit 20 b are disposed on the surface of the surface of the inspection target substrate 10 on which the inspection target pattern is provided. The sensor unit 20a and the sensor unit 20b are formed on the surface of the surface of the inspection target substrate 10 opposite to the surface on which the inspection target pattern is provided. It is arranged in. Since the inspection target substrate 10 is an insulating material such as glass on the opposite surface, the inspection target substrate 10 is brought into close contact with the inspection target pattern to reduce the separation distance between the sensor portions 20a and 20b and the inspection target pattern. be able to . In addition, since the dielectric constant of glass is higher than that of air, more reliable measurement is possible.

In the modified example 1 of the fifth embodiment of the present invention, the inspection signal is supplied from the supply electrode 35 of the inspection signal supply section 30 by supplying the inspection signal from the scalar port. The inspection signal is detected by the sensor electrode of the sensor section 20a, the sensor electrode 25a of the sensor section 20a and the sensor electrode 25b of the sensor section 20b, and the pattern is accurately determined by the method described in the fifth embodiment of the present invention. An inspection of the condition can be made.

[Embodiment of the sixth invention]

In the description of the embodiment of the first invention, an example in which the sensor unit 20 and the inspection signal supply unit 30 are arranged at both ends of the pattern to-be-inspected has been described. However, the present invention is not limited to the above example. For example, a configuration may be adopted in which the sensor unit 20 is disposed substantially at the center of the inspection target pattern.

A sixth embodiment according to the present invention configured as described above will be described below with reference to FIG. FIG. 17 is a view for explaining the configuration of the inspection apparatus according to the sixth embodiment of the present invention.

17, the same components as those of the first embodiment described above and shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 17, the test signal supply unit includes a first test signal supply unit 30 a and a second test signal supply unit 3 Ob, and the first test signal supply unit 30 a A second supply electrode 35b is provided in the first supply electrode 35a and the second inspection signal supply section 30b. The first inspection signal supply unit 30a is moved by the scalar port 80 so as to cross one end of the pattern to be inspected, such as the liquid crystal panel 10, and the second inspection signal supply unit 30a 30b moves across the other end of the pattern to be inspected, and sequentially supplies the inspection signal to the pattern to be inspected via capacitive coupling.

Further, the sensor unit 20 is moved by the scalar mouth pot 80 so as to substantially cross the center of the pattern to be inspected such as the liquid crystal panel 10, and the sensor electrode 25 of the sensor unit 20 is moved from each pattern to be inspected. The sequential inspection signal is detected via capacitive coupling.

However, the traversing position of the sensor section 20 does not have to be approximately at the center of the pattern to be inspected, but rather the first inspection signal supply section 30a and the second inspection signal supply section 30b. If the configuration is arranged between the above, the inspection can be performed by the inspection method of the present embodiment.

In the inspection method according to the present embodiment, the width of the sensor electrode 25 of the sensor section 20 is substantially the same as the width of the supply electrode 35a and the supply electrode 35b, for example. However, the present invention is not limited to this configuration. For example, as described in the first embodiment, a configuration in which the width of the inspection target pattern is at least one pitch or more wider than the width of the supply electrode 35, As described in the second embodiment, a configuration in which a plurality of sensor electrodes are provided in one sensor unit may be employed.

According to the inspection device of the sixth embodiment, the sensor unit and the inspection signal supply unit are both in non-contact as in the first and second embodiments. Even in the inspection method in which the detection signal value is very small, the difference can be reliably recognized by using the inspection apparatus of the present embodiment, and the inspection of the pattern state can be performed easily and surely. .

In particular, in the inspection method according to the present embodiment, the supply electrode 3 5a and the supply electrode 35b and the sensor electrode 25 are separated from each other, and the distance between the supply electrode 35b and the sensor electrode 25 is shortened. By reducing the number of detection signals that are detected by transmitting to the pattern to be inspected again without passing through the disconnection point of the pattern to be inspected without passing through the pattern to be inspected, it is possible to increase the level of the detection signal when the pattern to be inspected is disconnected. Because it is possible, the pattern state can be inspected accurately.

Also, if the distance between the supply electrode 35a and the supply electrode 35b and the sensor electrode 25 is long, the impedance due to the resistance component of the pattern to be inspected becomes large, and the pattern to be inspected and the pattern adjacent thereto become large. The impedance due to the capacitance of the capacitor decreases. As a result, the impedance of the capacitance component and the impedance of the capacitance component are close to each other, so that the measurement accuracy is low. However, in the inspection method of the present embodiment, the supply electrode 35a and the supply electrode 35 Since the distance between .b and the sensor electrode 25 can be reduced, the pattern state can be inspected with high accuracy.

[Variation of Embodiment 6 of the Sixth Invention]

In the embodiment of the sixth invention, the sensor unit 20 and the inspection signal supply unit 30a and the inspection signal supply unit 30b are arranged so as to sequentially traverse the inspection target pattern by the scalar port. Although it was configured to scan, the present invention is not limited to the above example. For example, as shown in FIG. 18 or FIG. It may be configured to be fixedly arranged at a predetermined distance.

In FIG. 18, the sensor unit 20 is disposed on the surface of the surface of the inspection target substrate 10 on the side where the inspection target panel is provided.

In FIG. 19, the sensor unit 20 is disposed on the surface of the surface of the inspection target substrate 10 opposite to the surface on which the inspection target pattern is provided. This On the other side, the inspection target substrate 10 ′ is made of an inexpensive material such as glass, so that it can be adhered to the sensor unit 20 to reduce the separation distance between the inspection target pattern. Also, since the dielectric constant of glass is higher than that of air, more reliable measurement is possible.

In the modified example 1 of the sixth embodiment, the pattern to be inspected is

The inspection signal is supplied from the supply electrode 35a of the inspection signal supply section 30a by the supply of the inspection signal from the scalar port, and at the same time, the inspection is performed from the supply electrode 35b of the inspection signal supply section 30b. The signal is supplied, and the pattern state can be inspected accurately by the method described in the sixth embodiment of the present invention.

[Variation of Embodiment 6 of the Sixth Invention]

Further, in the embodiment of the sixth invention, the sensor unit 20 and the inspection signal supply unit 30a and the inspection signal supply unit 30b scan by a scalar drop so as to sequentially traverse the inspection target pattern. However, the present invention is not limited to the above example. For example, the test signal supply unit 30a and the test signal supply unit 30b may be configured as shown in FIG. 20 or FIG. Alternatively, it may be configured to be fixedly arranged at a predetermined distance from the surface of the inspection target substrate 10.

In FIG. 20, the inspection signal supply unit 30a and the inspection signal supply unit 30b are arranged on the surface of the inspection target substrate 10 on the side where the inspection target pattern is provided.

In FIG. 21, the inspection signal supply unit 30a and the inspection signal supply unit 30b are arranged on the surface of the surface of the inspection target substrate 10 opposite to the side on which the inspection target pattern is provided. ing. On the opposite side, since the inspection target substrate 10 is an insulator such as glass, the separation distance between the inspection signal supply unit 30a and the inspection signal supply unit 30b and the inspection target pattern is reduced. For Can be adhered to. Further, since the dielectric constant of glass is higher than that of air, more reliable measurement is possible.

In the modified example 1 of the sixth embodiment of the present invention, the inspection target pattern is supplied by the inspection signal from the scalar opening pot, and is supplied to the supply electrode 35a of the inspection signal supply unit 30a and the inspection signal supply unit. The inspection signal is supplied from the supply electrode 35b of the 30b, the inspection signal is detected by the sensor electrode 25 of the sensor unit 20, and the inspection signal is accurately obtained by the method described in the sixth embodiment of the invention. Inspection of the pattern state can be performed in a short time.

[Embodiment of the seventh invention]

In the embodiment of the fifth aspect of the present invention, the arrangement of the sensor unit and the test signal supply unit is as follows: from the left in FIG. 12, the first sensor unit 20 a, the test signal supply unit 30, The second sensor unit 20 b is arranged, but this arrangement is not limited to this. For example, from the left in FIG. 12, the inspection signal supply unit 30, the first sensor unit Needless to say, they may be arranged at 20 a and the second sensor unit 20 b.

A seventh embodiment according to the present invention configured as described above will be described below with reference to FIG. FIG. 22 is a view for explaining the configuration of the inspection apparatus according to the seventh embodiment of the present invention.

In FIG. 22, the same components as those shown in FIG. 12 of the fifth embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 22, the sensor section includes a first sensor section 20a and a second sensor section 20b. The first sensor section 20a has a sensor electrode 25a and a second sensor section 20b. The sensor section 20b is provided with a sensor electrode 25b. The test signal supply unit 30 is moved by the scalar port 80 so as to cross one end of the pattern to be inspected, such as the liquid crystal panel 10, and the test signal is sequentially supplied to each pattern to be inspected via capacitive coupling. Supply. The first sensor unit 20a is moved by the scalar port 80 so as to traverse substantially the center of the pattern to be inspected, such as the liquid crystal panel 10, and the second sensor unit 2Ob is Then, the inspection signal is moved across the other end of the pattern to be inspected, and the inspection signal sequentially supplied by the inspection signal supply unit 30 to the inspection pattern via the capacitive coupling is detected.

However, the traversing position of the first sensor section 20a does not have to be approximately at the center of the pattern to be inspected, but is located between the inspection signal supply section 30 and the second sensor section 20b. With the configuration provided, the inspection can be performed by the inspection method of the present embodiment.

In the inspection method of the present embodiment, the width of each of the sensor electrode 25a of the first sensor unit 20a and the sensor electrode 25b of the second sensor unit 20b is, for example, Although the width is substantially the same as the width of the electrode 35, the present invention is not limited to this configuration. For example, at least one pitch of the pattern to be inspected is larger than the width of the supply electrode 35 described in the first embodiment. The configuration may be wide as described above, or the configuration in which a plurality of sensor electrodes are provided in one sensor unit as described in the second embodiment.

According to the inspection apparatus of the seventh embodiment, the sensor unit and the inspection signal supply unit are both in non-contact as in the first and second embodiments. Even in the inspection method in which the detection signal value is very small, the difference can be reliably recognized by using the inspection apparatus of the present embodiment, and the inspection of the pattern state can be performed easily and surely. .

In particular, in the inspection method of the present embodiment, since the crossing position of the first sensor section 20a is disposed substantially at the center of the pattern to be inspected, the supply electrode 35 and the sensor electrode 25a As the separation distance becomes shorter, the inspection signal supplied to the pattern to be inspected by the supply electrode 35 is transmitted to the adjacent pattern to be inspected, and the signal to be inspected again does not pass through the disconnection point of the pattern to be inspected. Since the number of detection signals detected by transmission to the turn is reduced, the level of the detection signal at the time of disconnection of the inspection target pattern can be increased, so that the pattern state can be inspected accurately.

[Modification Example 7 of Embodiment of Seventh Invention]

In the seventh embodiment of the present invention, the sensor unit 20 and the inspection signal supply unit 30 are configured to scan the pattern to be inspected sequentially using a scalar robot. Is not limited to the above example. For example, as shown in FIG. 23 or FIG. 24, the inspection signal supply unit 30 is fixedly arranged with a predetermined distance from the surface of the inspection target substrate 10. It may be configured.

In FIG. 23, the inspection signal supply unit 30 is provided on the surface of the inspection target substrate 10 on the side where the inspection target pattern is provided.

In FIG. 24, the inspection signal supply unit 30 is provided on the surface of the inspection target substrate 10 opposite to the surface on which the inspection target pattern is provided. On the surface on the opposite side, the inspection target substrate 10 is an insulator such as glass, so that the inspection signal supply unit 30 and the inspection target pattern can be closely attached to each other in order to reduce the separation distance. Also, since the dielectric constant of glass is higher than that of air, more reliable measurement is possible.

In the modified example 1 of the seventh embodiment of the present invention, the inspection target pattern is supplied with the inspection signal from the supply electrode 35 of the inspection signal supply unit 30 by supplying the inspection signal from the scalar mouth pot, By the method described in the seventh embodiment of the present invention, the pattern state can be inspected accurately.

[Modification Example 7 of Embodiment of Seventh Invention]

Further, in the seventh embodiment of the present invention, the sensor unit 20 and the inspection signal supply unit 30 are configured to scan the inspection target pattern by the scalar robot so as to sequentially cross the inspection target pattern. The invention is limited to the above examples However, for example, the sensor unit 20a and the sensor unit 20b are fixedly arranged at a predetermined distance from the surface of the inspection target substrate 10 as shown in FIG. 25 or FIG. 26. It may be configured.

In FIG. 25, the sensor unit 20a and the sensor unit 20b are disposed on the surface of the surface of the inspection target substrate 10 on which the inspection target pattern is provided. The sensor unit 20a and the sensor unit 20b are arranged on the surface of the surface of the inspection target substrate 10 opposite to the surface on which the inspection target pattern is provided. On the opposite surface, since the inspection target substrate 10 is an insulator such as glass, the inspection target substrate 10 is brought into close contact with the inspection target pattern in order to reduce the separation distance between the sensor portions 20a and 20b and the inspection target pattern. be able to . In addition, since the dielectric constant of glass is higher than that of air, more reliable measurement is possible. .

In the modified example 1 of the seventh embodiment of the present invention, the inspection signal is supplied from the supply electrode 35 of the inspection signal supply section 30 by supplying the inspection signal from the scalar port. The inspection signal is detected by the sensor electrode 25a of the sensor unit 20a and the sensor electrode 25b of the sensor unit 20b, and the pattern state is accurately determined by the method described in the seventh embodiment of the present invention. Inspections can be performed.

[Eighth embodiment of the invention]

In the sixth embodiment of the present invention, the arrangement of the sensor unit and the inspection signal supply unit is as follows from the left in FIG. The second test signal supply unit 30b is arranged, but this arrangement is not limited to this. For example, from the left in FIG. It goes without saying that the signal supply unit 30a and the second inspection signal supply unit 30b may be arranged. An eighth embodiment of the present invention configured as described above will be described below with reference to FIG. FIG. 27 is a view for explaining the configuration of the inspection apparatus according to the eighth embodiment of the present invention.

27, the same components as those shown in FIG. 17 of the sixth embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 27, the test signal supply unit includes a first test signal supply unit 30a and a second test signal supply unit 30b, and the first test signal supply unit 30a has A second supply electrode 35b is provided in the first supply electrode 35a and the second inspection signal supply section 30b.

The sensor section 20 is moved by the scalar robot 80 so as to cross one end of the pattern to be inspected, such as the liquid crystal panel 10, and the sensor electrode 25 of the sensor section 20 is moved from each pattern to be inspected. The test signals are sequentially detected via capacitive coupling.

The first inspection signal supply unit 30a is moved by the scalar rod 8 so as to cross almost the center of the inspection target pattern such as the liquid crystal panel 10, and the second inspection signal supply unit 30a b moves across the other end of the pattern to be inspected, and sequentially supplies the inspection signal to the pattern to be inspected via capacitive coupling.

However, the traversing position of the first inspection signal supply unit 30a does not have to be substantially at the center of the pattern to be inspected, but is between the sensor unit 20 and the second inspection signal supply unit 30b. If the configuration is arranged in the inspection, the inspection can be performed by the inspection method of the embodiment.

In the inspection method of the present embodiment, the width of the sensor electrode 25 of the sensor unit 20 is substantially the same as the width of the supply electrode 35a and the supply electrode 35b, for example. The present invention is not limited to this configuration. For example, the width of the supply electrode 35 may be smaller than the width of the supply electrode 35 described in the first embodiment. Or a configuration in which a plurality of sensor electrodes are provided in one sensor section as described in the second embodiment.

According to the inspection apparatus of the eighth embodiment, the sensor unit and the inspection signal supply unit are both in non-contact as in the first and second embodiments. Even in the inspection method in which the detection signal value is very small, the difference can be reliably recognized by using the inspection apparatus of the present embodiment, and the inspection of the pattern state can be performed easily and surely. .

In particular, in the inspection method of the present embodiment, the sensor electrode 25 and the supply electrode are provided by arranging the crossing position of the first inspection signal supply unit 30a at a position other than both ends of the pattern to be inspected. The inspection distance supplied to the test pattern by the supply electrode 35a is shortened, and the test signal is transmitted to the adjacent test pattern, and the test is performed again without passing through the disconnection point of the test pattern. Since the number of detection signals detected by being transmitted to the target pattern is reduced, the level of the detection signal at the time of disconnection of the inspection target pattern can be increased, so that the pattern state can be accurately inspected.

In addition, if the distance between the supply electrode 35a and the sensor electrode 25 is long, the impedance due to the resistance component of the pattern to be inspected increases, and the capacitance between the pattern to be inspected and the pattern adjacent thereto increases. Impedance is reduced. As a result, the impedance of the resistance component and the impedance of the capacitance are close to each other, so that the measurement accuracy is low. However, in the inspection method of the present embodiment, the separation distance between the supply electrode 35 a and the sensor electrode 25 is small. Can be shortened, so that the pattern state can be inspected with high accuracy.

[Modification of Embodiment 8 of the Eighth Invention]

In the embodiment of the eighth invention, the sensor unit 20 and the inspection signal supply unit 30a and the inspection signal supply unit 30b are connected to each other by a scalar robot. Although it was configured to scan so as to sequentially traverse the elephant pattern, the present invention is not limited to the above example.

As shown in FIG. 28 or FIG. 29, a configuration may be adopted in which the inspection target substrate 10 is fixedly arranged at a predetermined distance from the surface of the inspection target substrate 10.

In FIG. 28, the sensor unit 20 is disposed on the surface of the surface of the inspection target substrate 10 on the side where the inspection target panel is provided.

In FIG. 29, the sensor unit 20 is provided on the surface of the surface of the inspection target substrate 10 opposite to the surface on which the inspection target pattern is provided. On the opposite surface, since the inspection target substrate 10 is an insulator such as glass, the inspection target substrate 10 can be in close contact with the inspection target pattern in order to reduce the separation distance between the sensor portion 20 and the inspection target pattern. Also, since the dielectric constant of glass is higher than air,

A more reliable measurement is possible.

In the modified example の of the eighth embodiment of the ^ invention, the pattern to be inspected is

The inspection signal is supplied from the supply electrode 35a of the inspection signal supply unit 30a by the supply of the inspection signal from the scalar port, and at the same time, the inspection is performed from the supply electrode 35b of the inspection signal supply unit 3Qb. The signal is supplied, and the pattern state can be inspected accurately by the method described in the sixth embodiment of the present invention.

[Modification of Embodiment 8 of the Eighth Invention]

Further, in the embodiment of the eighth invention, the sensor section 20 and the inspection signal supply section 30a and the inspection signal supply section 30b scan by a scalar drop so as to sequentially traverse the pattern to be inspected. However, the present invention is not limited to the above example. For example, the test signal supply unit 30a and the test signal supply unit 30b may be configured as shown in FIG. 30 or FIG. Alternatively, it may be configured to be fixedly arranged at a predetermined distance from the surface of the inspection target substrate 10. In FIG. 30, the inspection signal supply unit 30 a and the inspection signal supply unit 30 b are provided on the surface of the inspection target substrate 10 on the side where the inspection target pattern is provided.

In FIG. 31, the inspection signal supply unit 30 a and the inspection signal supply unit 3 Ob are provided on the surface of the surface of the inspection target substrate 10 opposite to the surface on which the inspection target pattern is provided. ing. On the opposite surface, since the inspection target substrate 10 is an insulator such as glass, the separation distance between the inspection signal supply unit 30a and the inspection signal supply unit 30b and the inspection target pattern is reduced. Can be brought into close contact. Also, since the dielectric constant of glass is higher than that of air, more reliable measurement is possible.

In the modified example (1) of the eighth embodiment of the present invention, the inspection target pattern is formed by supplying the inspection signal from the scalar mouth pot, the supply electrode 35a of the inspection signal supply unit 30a and the inspection signal supply unit. The inspection signal is supplied from the supply electrode 35b of the 30b, the inspection signal is detected by the sensor electrode 25 of the sensor section 20, and the inspection signal is accurately obtained by the method described in the sixth embodiment of the present invention. The state of the pattern can be detected in a short time.

[Example of test signal detection result]

Hereinafter, an example of the detection result of the inspection signal will be described with reference to FIGS. 32 to 36.

FIG. 32 shows an example of a substrate to be inspected which has a disconnection and a short circuit among the substrates to be inspected in the present invention. As shown by the circles in the figure, the inspection target board shown in Fig. 32 has two breaks 11 and 13 in the longitudinal direction (horizontal direction in the figure) of the conductor pattern i5. There are short-circuit part 17 and short-circuit part 19. Further, the disconnection portion 11 and the short-circuit portion 17 are on the right side of the longitudinal center of the conductor pattern 15, and the disconnection portion 13 and the short-circuit portion 19 are from the longitudinal center of the conductor pattern 15. On the left. [Example of detection result of test signal 'in embodiment of fifth invention]

When the inspection target substrate as shown in FIG. 32 having such a disconnection and a short circuit is inspected according to the fifth embodiment of the present invention, an inspection signal as shown in FIG. 33 is detected. . In order to detect the inspection signal in FIG. 33, that is, to detect disconnection and short circuit simultaneously, the sensor electrodes 25a and 25a of the first sensor section 20a of the fifth embodiment are used. The sensor electrode 25 b of the sensor section 20 b of the second embodiment is configured to be wider than the width of the supply electrode 35 of the first embodiment by at least one pitch of the pattern to be inspected. Either of the configurations in which a plurality of sensor electrodes are provided in one sensor unit was used.

In FIG. 33, S1 indicates a sensor output voltage detected by the sensor electrode 25a of the first sensor unit 20a. S2 indicates a sensor output voltage detected by the sensor electrode 25b of the second sensor unit 20b. In the inspection apparatus according to the fifth embodiment, the signal supply unit 30 and the first sensor unit 20a and the second sensor unit 20b are scanned, and when the signal reaches the disconnection unit 11, A change in the inspection signal indicating a disconnection in the sensor output voltage S2 is detected. Further, when reaching the disconnection portion 13, a change in the inspection signal indicating disconnection in the sensor output voltage S1 is detected. Further, when the short circuit portion 17 is reached, a change in the inspection signal indicating a short circuit in the sensor output voltage S2 is detected. Furthermore, when the short circuit portion 19 is reached, a change in the inspection signal indicating a short circuit in the sensor output voltage S1 is detected. It should be noted that the same result can be obtained in the above detection result of the inspection signal also in the modified example の of the embodiment of the fifth invention and the modified example の of the embodiment of the fifth invention.

When two sensor electrodes such as the sensor electrode 25a and the sensor electrode 25b are used as in the fifth embodiment, the disconnection of the pattern to be inspected Can only be increased Therefore, it is possible to know where in the longitudinal direction of the conductor pattern 15 there is a disconnection or short circuit.

In the inspection signal detection according to the fifth embodiment, two sensor electrodes are used. However, the number of sensor electrodes is not limited to two. For example, in the longitudinal direction of the conductor pattern 15, it is possible to specify a specific point of disconnection or short circuit.

[Example of detection result of inspection signal in embodiment of sixth invention]

When the inspection target substrate as shown in FIG. 32 having such disconnection and short circuit is inspected according to the sixth embodiment of the present invention, an inspection signal as shown in FIG. 34 is detected. In order to detect the inspection signal shown in FIG. 34, that is, to simultaneously detect disconnection and short circuit, the sensor electrode 25 of the sensor section 20 of the sixth embodiment is connected to the sensor electrode 25 of the first embodiment. Either a configuration in which the width of the pattern to be inspected is at least one pitch wider than at least the width of the supply electrode 35, or a configuration in which a plurality of sensor electrodes are provided in one sensor unit in the second embodiment. Was used.

In FIG. 34, S 3 indicates a sensor output voltage detected by the sensor electrode 25 of the sensor unit 20. In the inspection apparatus according to the sixth embodiment, the first inspection signal supply unit 30a and the second inspection signal supply unit 30b and the sensor unit 20 are scanned, and when the inspection unit reaches the disconnection unit 11 A change in the inspection signal indicating a disconnection in the sensor output voltage S3 is detected. 'In addition, upon reaching the disconnection portion 13, a change in the inspection signal indicating disconnection in the sensor output voltage S3 is detected. Further, when the short circuit portion 17 is reached, a change in the inspection signal indicating a short circuit in the sensor output voltage S3 is detected. Furthermore, when the short circuit portion 19 is reached, a change in the inspection signal indicating a short circuit in the sensor output voltage S3 is detected. It should be noted that similar detection results are obtained in the detection results of these test signals in the modified example ① of the sixth embodiment and the modified example の of the sixth embodiment. As in the sixth embodiment, the first supply electrode 35a of the first inspection signal supply unit 30a and the second supply electrode 3 of the second inspection signal supply unit 30b When two supply electrodes are used as in 5b, the level of change of the inspection signal at the time of disconnection or short circuit of the pattern to be inspected can be made larger than in the first and second embodiments. it can.

[Example of detection result of test signal in embodiment of seventh invention]

When an inspection target substrate as shown in FIG. 32 having such a disconnection and a short circuit is inspected according to the seventh embodiment of the present invention, an inspection signal as shown in FIG. 35 is detected. In order to detect the inspection signal of FIG. 35, that is, to simultaneously detect disconnection and short circuit, the sensor electrodes 25a and the second sensor electrode of the first sensor section 20a of the seventh embodiment are used. The sensor electrode 25 b of the sensor section 20 b of the second embodiment is configured to be wider than the width of the supply electrode 35 of the first embodiment by at least one pitch of the pattern to be inspected, or the second embodiment. In FIG. 35, S 4 is a sensor output voltage detected by the sensor electrode 25 a of the first sensor unit 20 a. Is shown. S5 indicates a sensor output voltage detected by the sensor electrode 25b of the second sensor unit 20b. In the inspection device according to the seventh embodiment, the signal supply unit 30 and the first sensor unit 20a and the second sensor unit 20b are scanned, and when the signal supply unit 30 reaches the disconnection unit 11, A change in the inspection signal indicating disconnection in the sensor output voltage S5 is detected. Further, when reaching the disconnection portion 13, a change in the inspection signal indicating disconnection is detected in both the sensor output voltage S4 and the sensor output voltage S5. Further, when the short circuit portion 17 is reached, a change in the inspection signal indicating a short circuit is detected in both the sensor output voltage S4 and the sensor output voltage S5. Furthermore, when the short-circuit portion 19 is reached, both the sensor output voltage S4 and the sensor output voltage S5 become short. A change in the test signal indicating a fault is detected. It should be noted that the same result can be obtained with the detection result of the above-mentioned inspection signal in the modified example の of the embodiment of the seventh invention and the modified example の of the embodiment of the seventh invention.

Further, when the inspection is performed according to the seventh embodiment of the present invention, the change of the inspection signal detected at the short-circuit portion 17 is (change of the detection signal value of the sensor output voltage S5)> ( A change in the detection signal value of the sensor output voltage S4). This is because the short-circuit portion 17 is between the sensor electrode 25a and the sensor electrode 25b. That is, the inspection signal detected by the sensor electrode 25a is slightly affected because the inspection signal sneaking from the short-circuit portion 17 is also detected.

The change in the inspection signal detected at the short-circuit portion 19 is as follows: (change in detection signal value of sensor output voltage S4)> (change in detection signal value of sensor output voltage S5). This is because the short-circuit portion 19 is between the supply electrode 35 and the sensor electrode 25a. That is, the relationship between the distance between the supply electrode 35 and the sensor electrode 25a and the distance between the supply electrode 35 and the sensor electrode 25b is expressed as (power supply S 35 and sensor electrode 2 ) (Distance between the supply electrode 35 and the sensor electrode 25b), so that the inspection signal detected by the sensor electrode 25a, which is short, has a greater effect. To receive.

FIG. 35 shows an example of the detection result of the inspection signal. The change of the inspection signal detected by the sensor electrode 25a at the short-circuit portion 17 (the detection signal at the short-circuit portion 17 of the sensor output voltage S4) Value change) may not be detected due to various conditions.

As in the seventh embodiment, when two sensor electrodes such as the sensor electrode 25a and the sensor electrode 25b are used, the level of the change of the inspection signal at the time of disconnection and short circuit of the pattern to be inspected is obtained. Not only can be increased, but also where in the longitudinal direction of the conductor pattern 15 It is possible to do.

Note that, in the detection of the inspection signal in the seventh embodiment, two sensor electrodes are used, but the number of sensor electrodes is not limited to two, and more sensor electrodes may be used. For example, in the longitudinal direction of the conductor pattern 15, it is possible to specify a specific point of disconnection or short circuit.

[Example of detection result of inspection signal in embodiment of eighth invention]

Further, when the inspection target substrate as shown in FIG. 32 having such a disconnection and a short circuit is inspected according to the eighth embodiment of the present invention, an inspection signal as shown in FIG. To detect. In order to detect the inspection signal shown in FIG. 36, that is, to simultaneously detect disconnection and short circuit, the sensor electrode 25 of the sensor section 20 of the eighth embodiment is connected to the sensor electrode 25 of the first embodiment. Either a configuration in which the width of the pattern to be inspected is at least one pitch wider than the width of the supply electrode 35 or a configuration in which a plurality of sensor electrodes are provided in one sensor unit of the second embodiment is used. . .

In FIG. 36, S 6 indicates a sensor output voltage detected by the sensor electrode 25 of the sensor section 20. In the inspection apparatus according to the eighth embodiment, the first inspection signal supply unit 30a and the second inspection signal supply unit 30b and the sensor unit 20 are scanned, and when the inspection unit reaches the disconnection unit 11 A change in the inspection signal indicating a disconnection in the sensor output voltage S6 is detected. Further, when reaching the disconnection portion 13, a change in the inspection signal indicating disconnection in the sensor output voltage S6 is detected. Further, when the short circuit portion 17 is reached, a change in the inspection signal indicating a short circuit in the sensor output voltage S6 is detected. Furthermore, when the short circuit portion 19 is reached, a change in the inspection signal indicating a short circuit in the sensor output voltage S6 is detected. It should be noted that the same result is obtained in the detection results of these test signals in the modified example の of the embodiment of the eighth invention and the modified example ② of the embodiment of the eighth invention.

When the inspection is performed according to the eighth embodiment of the present invention, The change in the inspection signal indicating the disconnection detected by the sensor output voltage S6 is (change in the inspection signal in the disconnection portion 13)> (change in the inspection signal in the disconnection portion 11). This is because the inspection signal detected by the sensor electrode 25 is detected by superimposing the inspection signals of both the supply electrode 35a and the supply electrode 35b. That is, when the disconnection is at the disconnection portion 11 located between the supply electrode 35a and the supply electrode 35b, only the inspection signal from the supply electrode 35a reaches the sensor electrode 25. This is because, when the disconnection is at the disconnection portion 13, the inspection signal of both the supply electrode 35a and the supply electrode 35b does not reach the sensor electrode 25.

Further, when the inspection is performed according to the eighth embodiment of the present invention, the change of the inspection signal indicating the short circuit detected by the sensor output voltage S6 is (change of the inspection signal at the short circuit portion 19). )> (Change of the inspection signal at the short-circuit part 17). This is because the inspection signal detected by the sensor electrode 25 is detected by superimposing the inspection signals of both the supply electrode 35a and the supply electrode 35b. In other words, when the short circuit is at the short circuit portion 17 located between the supply electrode 35a and the supply electrode 35b, the inspection signal due to the short circuit is generated only by the test signal from the supply electrode 35b. Although a change occurs, when the short-circuit is in the short-circuit portion 19, a change in the test signal due to the short-circuit occurs in the test signal of both the supply electrode 35a and the supply electrode 35b.

As in the eighth embodiment, the first supply electrode 35a of the first test signal supply unit 30a and the second supply electrode 35 of the second test signal supply unit 30b When two supply electrodes are used as in b, the level of the change of the inspection signal at the time of disconnection and short circuit of the pattern to be inspected can be made higher than in the first embodiment and the second embodiment. Not only that, it is possible to know where in the longitudinal direction of the conductor pattern 15 there is a disconnection or short circuit.

[Other examples of substrates to be inspected] In the first to eighth embodiments of the present invention, the conductive pattern 15 to be inspected in the inspection target substrate is illustrated as not connected to the adjacent conductive pattern. The embodiment is not limited to this configuration. For example, as shown in FIG. 3.7, even if the conductive pattern is connected in a comb shape at one end of the conductive pattern 15, Even if all the conductive patterns are connected at the other end, the conductive patterns are arranged in a row within the range where the sensor electrodes and supply electrodes scan so as to sequentially cross the conductive patterns. Needless to say, any conductive pattern can be inspected. Industrial applicability

As described above, according to the present invention, it is possible to reliably detect a defect of a pattern to be inspected.

Further, it is possible to easily recognize the pattern defect status, and it is also possible to specify a specific defective portion.

Furthermore, even if the surface to be inspected has irregularities, it is possible to inspect reliably without damaging the pattern.

Further, even when the resistance value of the pattern to be inspected on the substrate to be inspected is large, it is possible to reliably detect the defect of the pattern to be inspected.

Claims

The scope of the claims

1. An AC inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target areas are formed in a row, and a signal from the inspection target pattern is detected from the other to thereby inspect the inspection target pattern. Circuit pattern inspection equipment that inspects

A supply unit having a supply electrode for supplying the inspection signal to the inspection target pattern from one of the inspection target regions of the inspection target pattern; a detection unit having a detection electrode for detecting a signal from the inspection target pattern; A circuit pattern inspection apparatus comprising: a moving unit configured to move a supply electrode of a supply unit and a detection electrode of the detection unit apart from the pattern to be inspected and to move across the row pattern part of the inspection region,

A circuit pattern inspection apparatus, wherein at least one of the supply unit and the detection unit is provided at a position other than an end of the pattern to be inspected.

2. The circuit pattern inspection device according to claim 1, wherein the inspection target pattern is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.

3. The circuit pattern inspection device according to claim 1, wherein a width of the detection electrode is at least a width of two rows of the pattern to be inspected.

4. The detection means comprises: a first detection electrode provided at the other end of the pattern to be inspected to which the inspection signal is supplied by the supply electrode at one end; 3.A second detection electrode disposed at the other end position of the inspection target pattern adjacent to the inspection target pattern to which the inspection signal is supplied by the electrode, wherein the second detection electrode is provided. Circuit pattern inspection equipment.

5. The circuit pattern inspection device according to claim 4, wherein a width of the first detection electrode is equal to or less than a pattern width of a pattern to be inspected.

6. The circuit pattern inspection device according to claim 4, wherein a width of the second detection electrode is equal to or smaller than a pattern width of a pattern to be inspected.

7. The moving means traverses a row portion near both ends of the inspection target area in a state where the supply electrode surface of the supply means and the detection electrode surface of the detection means are capacitively coupled to the pattern to be inspected. 7. The circuit pattern inspection device according to claim 1, wherein:

8. Further, there is provided a judging means for judging that the pattern to be inspected is normal when the result of detection by the detecting means is within a predetermined range, and a failure of the turn to be inspected when the detection result is out of the predetermined range. 8. The circuit pattern inspection device according to claim 1, wherein:

9. The supply electrode of the supply unit and the detection electrode of the detection unit are moved to both ends of the pattern to be inspected determined by the determination unit to be defective, and either the supply electrode of the supply unit or the detection electrode of the detection unit is moved. 9. The apparatus according to claim 8, further comprising: a second moving unit configured to move one of them along the pattern toward the other, and a position detecting unit that detects a detected change position based on a detection result of the detecting unit. Circuit pattern inspection equipment.

10. A contact means for contacting either the supply electrode of the supply means or the detection electrode of the detection means with the pattern to be inspected.

The circuit pattern inspection device according to claim 9, wherein:

11. The circuit pattern inspection apparatus according to claim 9, wherein at least one of the supply electrode and the detection electrode moved by the second moving means includes an imaging means.

12. A separation control means for performing positioning control so that a distance between at least one of the supply electrode and the detection electrode moved by the second moving means and the pattern to be inspected is substantially constant. The circuit patency inspection device according to any one of claims 9 to 11, wherein:

13. A separation distance control means for performing positioning control such that a separation distance between at least one of the supply electrode and the detection electrode moved by the movement means and the pattern to be inspected is substantially constant. The circuit pattern inspection device according to any one of claims 1 to 12.

14. The separation processing control means includes a displacement meter that moves together with the detection electrode or the supply electrode at a position near the detection electrode or the supply electrode.

The positioning control in a direction orthogonal to the test object so that the distance between the detection electrode or the supply electrode and the test object is substantially constant according to the detection result of the displacement meter. Item 13. A circuit pattern inspection device according to item 13.

15. The separation processing control means sets the average displacement of the detection result of the displacement meter between a plurality of pitches of the pattern to be inspected as a separation distance between the detection electrode or the supply electrode and the object to be inspected, and is orthogonal to the object to be inspected. 15. The circuit pattern inspection device according to claim 14, wherein positioning control is performed in a direction.

16. Supply means having a supply electrode for supplying an inspection signal from one of the inspection target areas to the inspection target pattern in which the inspection target area is formed in a row, A pattern inspection method in a circuit pattern inspection apparatus having a detection unit having a detection electrode for detecting a signal.

The supply electrode of the supply unit and the detection electrode of the detection unit are connected to the supply electrode surface of the supply unit and the detection electrode surface of the detection unit by the inspection target pattern table. While maintaining the state of being separated from the surface, one of the supply electrode or the detection electrode is moved across the end of the row pattern portion of the inspection target area with the inspection target pattern, and The other electrode or the other of the detection electrodes is moved across the pattern to be inspected except for the end of the row pattern portion of the inspection area,

A circuit pattern inspection method, comprising: supplying an AC detection signal from one of the inspection target areas of the inspection target pattern and detecting a signal from the inspection target pattern from the other to inspect the inspection target pattern.

17. The circuit pattern detection method according to claim 16, wherein the circuit pattern is a conductive pattern formed in a substantially bar shape with a predetermined width on a substrate.

18. The width of the detection electrode should be at least the width of two rows of the pattern to be detected, and the width between the adjacent conductive patterns by detecting a signal from the conductive pattern adjacent to the conductive pattern supplying the inspection signal. The circuit pattern inspection method according to claim 17, wherein a short circuit can be detected.

19.. A signal from the conductive pattern supplying an inspection signal from the detection electrode is detected by the first detection electrode of the detection means to enable a disconnection between the conductive patterns to be detected. 2. A signal from a conductive pattern adjacent to a conductive pattern that supplies an electric current is detected by a second detection electrode of the detection means so that a short circuit between the adjacent conductive patterns can be inspected. The circuit pattern inspection method according to claim 6 or claim 17.

20. The circuit pattern inspection method according to any one of claims 16 to 19, wherein a position of a roughly disconnected portion of the conductive pattern is detected from a position of the detection means which is not detected by the detection means.

21. Further, when the detection result by the detection means is within a predetermined range, the inspection target pattern is normal, and when the detection result is out of the predetermined range, the inspection is performed. The circuit pattern inspection method according to any one of claims 16 to 20, wherein it is determined that the target pattern is defective.

2 2. The position of the pattern to be inspected determined by the determination means to be defective is identified and held, and the supply electrode of the supply means and the detection electrode of the detection means are disposed at both ends of the pattern to be inspected determined to be defective. And moving either the supply electrode or the detection electrode along the pattern toward the other, and set the change position based on the detection result of the detection means as the defective position of the inspection target pattern. 22. The circuit pattern inspection method according to claim 21, wherein:

23. The circuit pattern inspection method according to claim 22, wherein one of the supply electrode of the supply unit and the detection electrode of the detection unit is brought into contact with a pattern to be inspected.

24. An imaging means provided on one of the supply electrode and the detection electrode is moved along the pattern toward the other, and an image of a defective state at a defective position of the inspection target pattern is taken. The circuit pattern inspection method according to claim 22 or claim 23.

25. A displacement meter that moves together with the detection electrode or the supply electrode is disposed at a position near the detection electrode or the supply electrode, and a separation distance between the detection electrode or the supply electrode and the inspection object according to a detection result of the displacement meter. The circuit pattern according to any one of claims 16 to 24, wherein positioning control is performed in a direction orthogonal to the inspection object so that a result of the detection electrode is made constant so that is substantially constant. Inspection methods.

26. The positioning of the inspection object is controlled by setting the average displacement of the detection result of the displacement meter between the plurality of pitches of the inspection object pattern as the separation distance between the detection electrode or the supply electrode and the inspection object. 26. The circuit pattern inspection method according to claim 25.

27. An inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target area is formed in a row, and an inspection signal from the inspection target pattern is detected from the other to perform the inspection. In a circuit pattern inspection device that inspects a pair pattern,

Supply means having a supply electrode for supplying the inspection signal from the one of the inspection target areas of the inspection target pattern to the inspection target pattern;

Detection means having a detection electrode for detecting an inspection signal from the inspection target pattern;

A circuit pattern inspection apparatus, comprising: moving means for moving the supply electrode and the detection electrode across the inspection target area while separating the supply electrode and the detection electrode from the inspection target pattern.

28. The circuit pattern inspection apparatus according to claim 27, wherein at least one of the supply unit and the detection unit is provided at a position other than an end of the pattern to be inspected.

29. The circuit pattern inspection apparatus according to claim 27, wherein a plurality of said supply means are provided.

30. The circuit pattern inspection apparatus according to claim 29, wherein at least one of the plurality of supply units or the detection unit is provided at a position other than an end of the pattern to be inspected.

31. The circuit pattern inspection apparatus according to claim 27, wherein a plurality of said detection means are provided.

32. The circuit pattern inspection apparatus according to claim 31, wherein at least one of the supply unit and the plurality of detection units is provided at a position other than an end of the pattern to be inspected.

33. The circuit pattern inspection apparatus according to claim 27, wherein a width of the detection electrode is at least a width of two rows of the pattern to be inspected.

34. The circuit pattern inspection apparatus according to claim 31, wherein the width of the detection electrode is at least a width of two rows of the inspection target pattern. A first detection electrode for detecting a test signal from the test pattern supplied with the test signal; and a test signal from a test pattern adjacent to the test pattern supplied with the test signal by the supply electrode. 28. The circuit pattern inspection device according to claim 27, further comprising a second detection electrode.

36. The detection means comprises: a first detection electrode for detecting a test signal from a test pattern supplied with a test signal by the supply electrode; and a test pattern to be supplied with a test signal by the supply electrode. 31. The circuit pattern inspection device according to claim 31, further comprising a second detection electrode for detecting an inspection signal from an adjacent inspection target pattern.

37. The moving means, wherein the supply electrode surface of the supply means and the detection electrode surface of the detection means are capacitively coupled to the pattern to be inspected, and move across the inspection area. 27 The circuit pattern inspection device described in 7.

38. The system according to claim 27, wherein the moving unit includes a separation distance control unit that performs positioning control so that a separation distance between the supply electrode and the detection electrode and the pattern to be inspected is substantially constant. Circuit pattern inspection equipment.

39. The separation processing control means includes a displacement meter, and is orthogonal to the test pattern so that the separation distance between the supply electrode and the detection electrode and the test pattern is substantially constant according to the detection result of the displacement meter. 39. The circuit pattern inspection apparatus according to claim 38, wherein the circuit pattern is controlled in a direction.

40. The separation processing control means sets the average displacement of the detection result of the displacement meter between a plurality of pitches of the pattern to be inspected as a separation distance between the detection electrode or the supply electrode and the object to be inspected, and is orthogonal to the pattern to be inspected. The circuit pattern inspection device according to claim 39, wherein positioning control is performed in a direction.

4 1. If the detection result of the inspection signal by the detection means is within a predetermined range, it is determined that the pattern to be inspected is normal. If the detection result of the inspection signal is out of the predetermined range, it is determined that the pattern to be inspected is defective. The circuit pattern inspection device according to any one of claims 27 to 40, further comprising a determination unit configured to determine a defective position on the pattern.

42. The supply electrode of the supply unit and the detection electrode of the detection unit are moved to the inspection target pattern determined to be defective by the determination unit, and either the supply electrode of the supply unit or the detection electrode of the detection unit is moved. 41. A method according to claim 41, further comprising: a second moving unit that moves one of the moving units toward the other along the pattern; and a position detecting unit that detects a detection change position based on a detection result of the detecting unit. The circuit pattern inspection device according to the above.

43. The circuit pattern inspection apparatus according to claim 41, further comprising: a contact unit configured to contact one of a supply electrode of the supply unit and a detection electrode of the detection unit with a pattern to be inspected.

44. The imaging device according to claim 41, further comprising an imaging unit provided at the supply electrode moved by the second moving unit, or the detection electrode moved by the second moving unit. Circuit pattern inspection equipment.

45. The distance between the supply electrode moved by the second moving means, or the detection electrode moved by the second moving means, and the inspection object pattern is substantially constant. 42. The circuit pattern inspection apparatus according to claim 41, further comprising a separation control unit for performing positioning control.

4 6. If the detection result of the inspection signal by the detection means is a detection signal value that is constant to some extent, it is determined that the pattern to be inspected is normal, and the detection result of the inspection signal is a detection signal value that changes rapidly. The circuit pattern inspection apparatus according to any one of claims 27 to 40, further comprising determining means for determining a defect of the inspection target pattern and a defective position on the inspection target pattern.

47. The supply electrode of the supply unit and the detection electrode of the detection unit are moved to the pattern to be inspected determined by the determination unit to be defective, and either the supply electrode of the supply unit or the detection electrode of the detection unit is moved. 47. A method according to claim 46, further comprising: a second moving unit that moves one of the moving units toward the other along the pattern; and a position detecting unit that detects a detected change position based on a detection result of the detecting unit. The circuit pattern inspection device according to the above.

48. The circuit pattern inspection device according to claim 46, further comprising: a contact unit configured to contact one of a supply electrode of the supply unit and a detection electrode of the detection unit with a pattern to be inspected.

49.The supply electrode moved by the second moving means, or the detection electrode moved by the second moving means, wherein an imaging means is provided. Circuit pattern inspection equipment.

50. The distance between the supply electrode moved by the second moving means, or the detection electrode moved by the second moving means, and the inspection object pattern is substantially constant. 47. The circuit pattern inspection apparatus according to claim 46, further comprising a separation control means for performing positioning control.

5 1. An inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target area is formed in a row, and an inspection signal from the inspection target pattern is detected from the other to perform the inspection. In the circuit pattern inspection method for inspecting the target pattern, Maintaining the state in which the supply electrode of the supply unit and the detection electrode of the detection unit are separated from the supply electrode surface of the supply unit and the detection electrode surface of the detection unit from the surface of the pattern to be inspected; Moving at least one of the detection electrodes across the inspection target area of the inspection target pattern;

When the detection result of the inspection signal detected by the detection electrode is within a predetermined range, it is determined that the inspection target pattern is normal,

A circuit pattern inspection method, comprising: judging a defect of an inspection target pattern and a defect position on the inspection target pattern when a detection result of an inspection signal detected by the detection electrode is out of a predetermined range.

5 2. An inspection signal is supplied from one of the inspection target areas of the inspection target pattern in which the inspection target area is formed in a row, and an inspection signal from the inspection target pattern is detected from the other to perform the inspection. In a circuit pattern inspection method for inspecting a target pattern,

Maintaining the state in which the supply electrode of the supply unit and the detection electrode of the detection unit are separated from the supply electrode surface of the supply unit and the detection electrode surface of the detection unit from the surface of the pattern to be inspected; At least one of the detection electrodes is moved across the inspection target area of the inspection target pattern, and when the detection result of the inspection signal detected by the detection electrode has a somewhat constant detection signal value, the inspection target pattern is normal. Judge,

A circuit pattern inspection method comprising: judging a defect of a pattern to be inspected and a defect position on the pattern to be inspected when a detection result of the inspection signal detected by the detection electrode is a detection signal value that has changed rapidly. . 5 3. The width of the detection electrode should be at least the width of two rows of the pattern to be inspected, and should be based on the inspection signal from the inspection pattern to which the inspection signal is supplied. Disconnection is detected,

The circuit pattern inspection method according to claim 51 or 52, wherein a short circuit is detected by an inspection signal from an inspection target pattern adjacent to the inspection target pattern to which the inspection signal is supplied.

5 4. The detection electrode includes a first detection electrode and a second detection electrode, and based on a test signal from a pattern to be tested to which a test signal is supplied, disconnection is detected by the first detection electrode,

Claim 51 or Claim 51 characterized in that a short circuit is detected by the second detection electrode based on a test signal from a test pattern adjacent to the test pattern to which the test signal is supplied. The described circuit pattern inspection method. 55: Identifying and holding the position of the detection means that is not detected by the detection means, moving the supply electrode of the supply means and the detection electrode of the detection means to the detection position, the supply electrode or the detection electrode 51.A method according to claim 51, further comprising: moving any one of them along the pattern toward the other, and setting a change position as a defective position of the pattern to be detected based on a detection result of the detection means. The circuit pattern inspection method according to claim 52.

56. The circuit pattern inspection method according to claim 55, wherein one of the supply electrode of the supply unit and the detection electrode of the detection unit is brought into contact with a pattern to be inspected.

57. An imaging means provided on one of the supply electrode and the detection electrode is moved along the pattern toward the other, and an image of a defective state at a defective position of the inspection target pattern is taken. A circuit inspection method according to claim 55.