WO2005059977A1 - Appareil a etage, appareil et procede d'exposition - Google Patents

Appareil a etage, appareil et procede d'exposition Download PDF

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Publication number
WO2005059977A1
WO2005059977A1 PCT/JP2004/018788 JP2004018788W WO2005059977A1 WO 2005059977 A1 WO2005059977 A1 WO 2005059977A1 JP 2004018788 W JP2004018788 W JP 2004018788W WO 2005059977 A1 WO2005059977 A1 WO 2005059977A1
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WO
WIPO (PCT)
Prior art keywords
substrate
liquid
stage device
holder
stage
Prior art date
Application number
PCT/JP2004/018788
Other languages
English (en)
Japanese (ja)
Inventor
Hiroaki Takaiwa
Nobutaka Magome
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2005516329A priority Critical patent/JP4600286B2/ja
Publication of WO2005059977A1 publication Critical patent/WO2005059977A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Definitions

  • the present invention relates to a stage apparatus having a holder for holding a substrate and a stage for supporting and moving the holder, an exposure apparatus having the stage apparatus, and an exposure method, and particularly to a projection optical system, a liquid, More particularly, the present invention relates to a stage device, an exposure apparatus, and an exposure method which are suitable for use when exposing a pattern image to a substrate via a substrate. Also, the present application
  • Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate.
  • An exposure apparatus used in the photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate.
  • the mask stage and the substrate stage are sequentially moved, and a projection optical system is used to project the pattern of the mask. Transfer to the substrate via
  • further improvement in the resolution of the projection optical system has been desired in order to cope with higher integration of device patterns.
  • the resolution of the projection optical system increases as the exposure wavelength used decreases and as the numerical aperture of the projection optical system increases. For this reason, the exposure wavelength used in the exposure apparatus is becoming shorter year by year, and the numerical aperture of the projection optical system is also increasing.
  • the mainstream exposure wavelength is 248 nm for KrF excimer laser, and 193 nm for ArF excimer laser with shorter wavelength is being put into practical use.
  • the depth of focus (DOF) is as important as the resolution.
  • the resolution and the depth of focus ⁇ are respectively represented by the following equations.
  • e is the exposure wavelength
  • NA is the numerical aperture of the projection optical system
  • kl and k2 are the process coefficients. From equations (1) and (2), to increase the resolution R, shorten the exposure wavelength and increase the numerical aperture NA. It can be seen that as the depth increases, the depth of focus ⁇ decreases.
  • a liquid immersion method disclosed in Patent Document 1 below has been proposed.
  • this immersion method the space between the lower surface of the projection optical system and the substrate surface is filled with a liquid such as water or an organic solvent to form an immersion area.
  • the resolution is improved by utilizing the fact that n (n is the refractive index of the liquid is usually about 1.2.1.6), and the depth of focus is increased by about ⁇ times.
  • Patent Document 1 WO 99/49504 pamphlet
  • a liquid is locally filled between an end surface on the image plane side of a projection optical system and a substrate (wafer).
  • a shot area near the center of the substrate is exposed, the liquid outside the substrate is exposed. No spills occur.
  • the projection area 100 of the projection optical system is applied to the peripheral area (edge area) ⁇ of the substrate ⁇ to expose the edge area ⁇ of the substrate ⁇
  • the liquid flows out of the substrate and the immersion area is not well formed, which causes a problem that the projected pattern image is deteriorated.
  • the escaping liquid causes inconvenience such as cracking of mechanical parts and the like around the substrate stage that supports the substrate, or leakage of the stage drive system.
  • the escaping liquid goes around the back surface of the substrate and enters between the substrate and the substrate stage (substrate holder), there is a disadvantage that the substrate stage cannot hold the substrate well. Also, if liquid enters the step or gap between the substrate and the substrate stage, there is a possibility that mackerel or electric leakage may occur.
  • the present invention has been made in consideration of the above points, and prevents liquid from entering between a substrate and a holder, and can satisfactorily perform liquid exposure even when an edge region of the substrate is exposed.
  • a stage apparatus an exposure apparatus, and an exposure method that can perform exposure in a state where an immersion area is formed.
  • the porpose is to do.
  • the present invention employs the following configuration corresponding to FIGS. 1 to 10 showing an embodiment of the present invention.
  • the stage device of the present invention is a stage device having a holder for holding the back surface of the substrate and a stage for supporting and moving the holder, wherein the holder holds the back surface of the substrate inside the outer periphery of the substrate. And a liquid repellent member having liquid repellency is provided at least at a position facing the back surface of the substrate.
  • the stage device of the present invention for example, by using a substrate having a liquid-repellent back and periphery, even when exposing the edge region of the substrate, the stage device is disposed between the rear surface of the substrate and the liquid-repellent member. Liquid can be prevented from entering. Therefore, it is possible to perform exposure while holding the substrate well.
  • the stage device of the present invention is a stage device having a holder for holding the back surface of the substrate and a stage for supporting and moving the holder, wherein the holder is provided inside the outer periphery of the substrate. It has a holding portion for holding the back surface, and an elastic member that is elastically deformed and comes into contact with the substrate in a liquid-tight manner is provided on the back surface of the substrate.
  • the elastic member when the substrate is held by the holder, the elastic member is elastically deformed, so that the space between the back surface of the substrate and the elastic member is liquid-tightly sealed. Can be done. Therefore, even when exposing the edge region of the substrate, it is possible to prevent liquid from entering between the back surface of the substrate and the elastic member, and it becomes possible to perform exposure while holding the substrate well.
  • An exposure apparatus of the present invention which exposes a pattern on a substrate by a projection optical system, includes the stage device according to any one of claims 1 to 13. is there. Further, the exposure method of the present invention is characterized in that exposure is performed using the exposure apparatus of the present invention while preventing liquid from entering between the back surface of the substrate and the holder.
  • the exposure apparatus and the exposure method according to the present invention even when the liquid is filled between the projection optical system and the substrate to expose the edge region of the substrate, the liquid remains between the back surface of the substrate and the liquid-repellent member. Liquid Body intrusion can be prevented. Therefore, it is possible to perform exposure while holding the substrate well.
  • the exposure light irradiated through the projection optical system is blocked by the substrate and does not reach the portion of the liquid-repellent member facing the substrate. Therefore, it is possible to prevent the liquid repellency of the liquid repellent member from being impaired by the irradiation of the exposure light, and it is possible to keep the liquid from entering between the back surface of the substrate and the liquid repellent member.
  • the liquid immersion region is formed satisfactorily for a long period of time without impairing the liquid repellency, and the liquid is discharged outside the substrate stage. Exposure can be performed in a state in which outflow of liquid is suppressed, and a device having desired performance can be manufactured.
  • FIG. 1 is a schematic configuration diagram showing one embodiment of an exposure apparatus of the present invention.
  • FIG. 2 is a schematic configuration diagram showing a liquid supply mechanism and a liquid recovery mechanism.
  • FIG. 3 is a plan view of a substrate stage.
  • FIG. 4 is a cross-sectional view of a principal part showing one embodiment of a substrate stage of the present invention.
  • FIG. 5 is a partially enlarged view showing a substrate holder and a plate portion.
  • FIG. 6 is a sectional view taken along line AA in FIG. 5.
  • FIG. 7 is a partially enlarged view showing another form of a substrate holder and a plate portion.
  • FIG. 8 is a sectional view of a main part of a substrate stage according to a second embodiment.
  • FIG. 9 is a partially enlarged view showing a positional relationship between a notch portion of the substrate and a sealing member.
  • FIG. 10 is a cross-sectional view of a main part of a substrate stage having another form of a sealing member.
  • FIG. 11 is a flowchart illustrating an example of a semiconductor device manufacturing process.
  • FIG. 12 is a schematic diagram for explaining a problem of a conventional exposure method.
  • EX exposure apparatus M mask (reticle) MST mask stage P substrate PA surface
  • FIG. 1 is a schematic configuration diagram showing an embodiment of the exposure apparatus of the present invention. (First Embodiment)
  • an exposure apparatus EX includes a mask stage MST supporting a mask M, a substrate stage PST supporting a substrate P, and an illumination for illuminating a mask M supported by the mask stage MST with exposure light EL.
  • the exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which the immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and increase the depth of focus.
  • pure water is used as the liquid 1.
  • the exposure apparatus EX uses the liquid 1 supplied from the liquid supply mechanism 10 on at least a part of the substrate P including the projection area AR1 of the projection optical system PL while transferring at least the pattern image of the mask M onto the substrate P.
  • the immersion area AR2 is formed.
  • the exposure apparatus EX fills the liquid 1 between the optical element 2 at the tip of the projection optical system PL and the surface (exposure surface) of the substrate P,
  • the pattern image of the mask M is projected onto the substrate P via the liquid 1 in between and the projection optical system PL, and the substrate P is exposed.
  • the exposure apparatus EX a pattern formed on the mask M while synchronously moving the mask M and the substrate P in different directions (opposite directions) in the running direction is used as the substrate.
  • An example in which a scanning exposure apparatus that exposes P (a so-called scanning stepper) is used will be described.
  • the direction coincident with the optical axis AX of the projection optical system PL is defined as the Z-axis direction
  • the direction perpendicular to the X-axis direction, the Z-axis direction and the Y-axis direction be the Y-axis direction.
  • directions around the X axis, the Y axis, and the Z axis are directions of ⁇ , ⁇ , and ⁇ ⁇ ⁇ ⁇ , respectively.
  • the “substrate” includes a semiconductor wafer coated with a photoresist as a photosensitive material
  • the “mask” includes a reticle on which a device pattern to be reduced and projected onto the substrate is formed.
  • the illumination optical system IL illuminates the mask ⁇ supported by the mask stage MST with the exposure light EL, and it is an exposure light source and an optical source for equalizing the illuminance of the light beam emitted from the exposure light source. It has a condenser lens that collects the exposure light EL from the canola integrator and the opticanole integrator, a relay lens system, and a variable field stop that sets the illumination area on the mask ⁇ ⁇ in a slit shape with the exposure light EL. ing. A predetermined illumination area on the mask ⁇ is illuminated by the illumination optical system IL with exposure light EL having a uniform illuminance distribution.
  • the exposure light EL emitted from the illumination optical system IL is, for example, a bright line (g-line, h-line, i-line) emitted from a mercury lamp or far ultraviolet light (KrF excimer laser light (wavelength: 248 nm)). Vacuum ultraviolet light such as DUV light, Ar F excimer laser light (wavelength 193 nm) and F laser light (wavelength 157 nm)
  • VUV light VUV light
  • ArF excimer laser light is used.
  • the liquid 1 in the present embodiment is pure water, and can be transmitted even when the exposure light EL is ArF excimer laser light. Pure water is also capable of transmitting ultraviolet light (g-line, h-line, i-line) and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength: 248 nm).
  • the mask stage MST supports the mask M, and is two-dimensionally movable in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, in the XY plane, and is capable of minute rotation in the ⁇ Z direction. .
  • the mask stage MST is driven by a mask stage driving device MST D such as a linear motor.
  • the mask stage drive MSTD is controlled by the controller CONT.
  • a moving mirror 50 is provided on the mask stage MST.
  • a laser interferometer 51 is provided at a position facing the movable mirror 50. The position and rotation angle of the mask M in the two-dimensional direction on the mask stage MST are measured in real time by the laser interferometer 51, and the measurement results are output to the control device CONT.
  • the controller CONT drives the mask stage driver MSTD based on the measurement results of the laser interferometer 51 to control the mask stage. Position the mask M supported by the stage MST.
  • the projection optical system PL is for projecting and exposing the pattern of the mask M onto the substrate ⁇ at a predetermined projection magnification ⁇ , and includes a plurality of optical elements (lenses) 2 provided at the tip of the substrate ⁇ . These optical elements are supported by a lens barrel ⁇ .
  • the projection optical system PL is a reduction system whose projection magnification j3 is, for example, 1/4 or 1/5. Note that the projection optical system PL may be either a unity magnification system or an enlargement system.
  • the optical element 2 at the tip of the projection optical system PL of the present embodiment is provided so as to be attachable / detachable (replaceable) to / from the lens barrel PK. Contact.
  • the optical element 2 is made of fluorite. Since fluorite has a high affinity for water, the liquid 1 can be brought into close contact with almost the entire liquid contact surface 2a of the optical element 2. That is, in the present embodiment, the liquid (water) 1 having a high affinity with the liquid contact surface 2a of the optical element 2 is supplied, so that the liquid contact surface 2a of the optical element 2 is supplied. The optical path between the optical element 2 and the substrate P, which has high adhesion between the substrate 1 and the liquid 1, can be reliably filled with the liquid 1.
  • the optical element 2 may be quartz having a high affinity for water.
  • the liquid contact surface 2a of the optical element 2 may be subjected to a hydrophilic (lyophilic) treatment to increase the affinity with the liquid 1.
  • the lens barrel PK has a portion near the tip in contact with the liquid (water) 1, at least the portion near the tip is formed of a metal such as Ti (titanium) that is resistant to cracks.
  • the substrate stage PST supports the substrate P, and includes a substrate table (stage) 52 for holding the substrate P via the substrate holder PH, an XY stage 53 for supporting the substrate table 52, and an XY stage. And a base 54 for supporting 53.
  • the substrate stage PST is driven by a substrate stage driving device PSTD such as a linear motor.
  • the substrate stage drive PSTD is controlled by the controller CONT.
  • the substrate table 52 functions as a Z stage that controls the focus position and the tilt angle of the substrate P to adjust the surface of the substrate P to the image plane of the projection optical system PL by the autofocus method and the autoleveling method.
  • XY stage 5 3 positions the substrate P in the X-axis direction and the Y-axis direction.
  • the substrate table and the stage may be provided integrally.
  • a movable mirror 55 is provided on the substrate stage PST (substrate table 52).
  • a laser interferometer 56 is provided at a position facing the moving mirror 55.
  • the two-dimensional position and rotation angle of the substrate ⁇ on the substrate stage PST are measured in real time by the laser interferometer 56, and the measurement result is output to the control device CONT.
  • the control device CONT drives the substrate stage driving device PSTD based on the measurement result of the laser interferometer 56 to position the substrate supported by the substrate stage PST.
  • a plate portion 30 surrounding the substrate is provided on the substrate stage PST (substrate table 52).
  • the plate portion 30 is provided integrally with the substrate table 52, and a concave portion 32 is formed inside the plate portion 30. Note that the plate unit 30 and the substrate table 52 may be provided separately.
  • the substrate holder ⁇ for holding the substrate ⁇ is disposed in the recess 32 (see FIG. 4).
  • the plate portion 30 has a flat surface (flat portion) 31 having substantially the same height as the surface ⁇ of the substrate ⁇ held by the substrate holder ⁇ arranged in the concave portion 32.
  • the liquid supply mechanism 10 supplies a predetermined liquid 1 onto the substrate, and includes a first liquid supply unit 11 and a second liquid supply unit 12 capable of supplying the liquid 1, and a first liquid supply unit
  • a first supply member 13 connected to the unit 11 via a supply pipe 11 having a flow path, and having a supply port 13A for supplying the liquid 1 sent from the first liquid supply unit 11 onto the substrate P;
  • a second supply member connected to the second liquid supply section via a supply pipe having a flow path, and having a supply port for supplying the liquid supplied from the second liquid supply section onto the substrate; It has.
  • the first and second supply members 13 and 14 are arranged close to the surface of the substrate P, and are provided at different positions in the plane direction of the substrate P. Specifically, the first supply member 13 of the liquid supply mechanism 10 is provided on one side (one X side) in the scanning direction with respect to the projection area AR1, and the second supply member 14 is provided on the other side (+ X side). Has been.
  • Each of the first and second liquid supply units 11, 12 includes a tank for accommodating the liquid 1, a pressurized pump, and the like, and connects the supply pipes 11A, 12A and the supply members 13, 14 respectively.
  • the liquid 1 is supplied onto the substrate P via Further, the liquid supply operation of the first and second liquid supply units 11 and 12 is controlled by a control device CONT, and the control device CONT includes the first and second liquid supply units 11 and 12.
  • the liquid supply amount per unit time on the substrate P can be independently controlled.
  • each of the first and second liquid supply units 11 and 12 has a liquid temperature adjusting mechanism, and supplies the liquid 1 at a temperature substantially equal to the temperature in the chamber in which the device is housed (for example, 23 ° C.). It is supplied on the substrate P.
  • the liquid recovery mechanism 20 recovers the liquid 1 on the substrate P, and has first and second recovery members 23, 24 having recovery ports 23A, 24A arranged close to the surface of the substrate P. And first and second liquid recovery sections 21 and 22 connected to the first and second recovery members 23 and 24 via recovery pipes 21A and 22A having flow paths, respectively.
  • the first and second liquid recovery units 21 and 22 are provided with, for example, a suction device such as a vacuum pump and a tank for storing the recovered liquid 1.
  • the first and second recovery members collect the liquid 1 on the substrate P. Collect via 23, 24 and collection tubes 21A, 22A.
  • the liquid recovery operation of the first and second liquid recovery units 21 and 22 is controlled by a controller CONT, and the controller CONT can control the amount of liquid recovered per unit time by the first and second liquid recovery units 21 and 22. is there.
  • FIG. 2 is a plan view showing a schematic configuration of the liquid supply mechanism 10 and the liquid recovery mechanism 20.
  • the projection area AR1 of the projection optical system PL is set in a slit shape (rectangular shape) whose longitudinal direction is in the Y-axis direction (non-scanning direction).
  • the area AR2 is formed on a part of the substrate P so as to include the projection area AR1.
  • the first supply member 13 of the liquid supply mechanism 10 for forming the liquid immersion area AR2 of the projection area AR1 is provided on one side (1X side) in the scanning direction with respect to the projection area AR1, and the second supply member 14 is provided on the other side (+ X side).
  • Each of the first and second supply members 13, 14 is formed in a substantially arc shape in plan view, and the size of the supply ports 13A, 14A in the Y-axis direction is at least the Y-axis direction of the projection area AR1. Is set to be larger than the size in.
  • the supply ports 13A and 14A formed in a substantially arc shape in plan view are arranged so as to sandwich the projection area AR1 in the running direction (X-axis direction).
  • the liquid supply mechanism 10 simultaneously supplies the liquid 1 on both sides of the projection area AR1 via the supply ports 13A and 14A of the first and second supply members 13 and 14.
  • Each of the first and second recovery members 23 and 24 of the liquid recovery mechanism 20 has recovery ports 23 A and 24 A continuously formed in an arc shape so as to face the surface of the substrate P. And each other The first and second collection members 23 and 24 arranged to face each other form a substantially annular collection port.
  • the recovery ports 23A and 24A of the first and second recovery members 23 and 24 are arranged so as to surround the first and second supply members 13 and 14 of the liquid supply mechanism 10 and the projection area AR1. Further, a plurality of partition members 25 are provided inside the collection port continuously formed so as to surround the projection area AR1.
  • the liquid 1 supplied onto the substrate P from the supply ports 13A and 14A of the first and second supply members 13 and 14 is supplied to the lower end surface of the tip (optical element 2) of the projection optical system PL and the substrate P It is supplied so that it spreads wet between.
  • the liquid 1 flowing out of the first and second supply members 13 and 14 with respect to the projection area AR1 is disposed outside the projection area AR1 with respect to the first and second supply members 13 and 14.
  • the first and second collection members 23 and 24 are collected from the collection ports 23A and 24A.
  • the liquid supply amount per unit time supplied before the projection area AR1 in the scanning direction is set to be larger than the liquid supply amount supplied on the opposite side.
  • the controller CONT controls the liquid amount from one X side (ie, the supply port 13A) to the projection area AR1 on the + X side (ie, the supply port). 14A), while performing exposure processing while moving the substrate P in the 1X direction, the liquid volume from the + X side to the projection area AR1 is larger than the liquid volume from the 1X side. I do.
  • the liquid recovery amount per unit time before the projection area AR1 is set to be smaller than the liquid recovery amount on the opposite side.
  • the recovery amount from the + X side that is, the recovery port 24A
  • the recovery amount of the -X side that is, the recovery port 23A
  • FIG. 3 is a plan view of the substrate table 52 of the substrate stage PST as viewed from above.
  • a movable mirror 55 is disposed on two rectangular edges of a rectangular substrate table 52 in a plan view.
  • a concave portion 32 is formed in a substantially central portion of the substrate table 52 in a circular shape in a plan view, and a support portion 52a for supporting the substrate holder PH is projected from the concave portion 32.
  • the substrate holder PH for holding the substrate P is supported by the support portion 52a and arranged in the recess 32 with a gap from the substrate table 52.
  • the gap between the substrate table 52 and the substrate holder PH is set (opened) to the atmospheric pressure.
  • a plate portion (liquid-repellent member) 30 having a flat surface (flat portion) 31 having substantially the same height as the surface of the substrate P is provided integrally with the substrate table 52.
  • the two corners of the flat surface 31 of the plate portion 30 are wide, and one of the wide portions is provided with a reference mark FM used for aligning the mask M and the substrate P with respect to a predetermined position.
  • a reference mark FM used for aligning the mask M and the substrate P with respect to a predetermined position.
  • Various sensors such as an illuminance sensor are also provided around the substrate P on the substrate stage PST.
  • the reference mark FM may be provided on the substrate stage PST separately from the force plate portion 30 provided on the plate portion 30 for arranging the reference mark FM.
  • the substrate holder PH has a V-shaped concave portion 71 corresponding to the outer peripheral shape of the substrate P at one edge on the Y side. More specifically, as shown in the enlarged view of the main part in FIG. 5, the outer periphery of the substrate P is cut out at the outer periphery for alignment of the substrate P, and a notch portion (notch portion) is formed in a SV-shaped PV force.
  • the outer periphery of the substrate holder PH has a V-shaped concave portion 71 formed inside the substrate P so as to be offset from the outer peripheral contour by a predetermined distance.
  • the substrate holder PH has a peripheral wall portion (holding portion) 33 that holds the back surface PC of the substrate P inside the outer periphery of the substrate P, and a plurality of holders that are disposed inside the peripheral wall portion 33 and hold the substrate P. And a support section (holding section) 34.
  • the peripheral wall portion 33 is also arranged in the concave portion 71 in a V-shape as in the outer periphery.
  • the support portions 34 are uniformly arranged inside the peripheral wall portion 33.
  • the peripheral wall portion 33 and the support portion 34 are provided on a substantially disk-shaped base portion 35 that constitutes a part of the substrate holder PH.
  • Each of the support portions 34 has a trapezoidal shape in cross section, and the back surface PC of the substrate P is held by the upper end surfaces 34A of the plurality of support portions 34.
  • FIG. 4 is an enlarged sectional view of a main part of the substrate stage PST holding the substrate P.
  • the substrate table 52 (plate portion 30) has a side wall portion 73 forming the concave portion 32.
  • the side wall portion 73 located on the Y side has a V-shaped convex portion 74 protruding toward the inner peripheral side corresponding to the concave portion 71 of the substrate holder PH.
  • the side wall 73 has a length B in a plane with the substrate P (outer periphery) held by the substrate holder PH so as to separate the gap C from the substrate holder PH including the projection 74. It is formed in an overlapping shape.
  • the top surface of the side wall portion 73 has a gap A (for example, with respect to the outer periphery (side surface PB) of the substrate P in plan view. (0.3-0.5 mm), and has a liquid-repellent surface 72 facing the outer periphery of the back surface PC of the substrate P held by the substrate holder PH in a cross-sectional view.
  • the liquid-repellent surface 72 is in a non-contact position with a gap of, for example, 0.2 mm between the back surface PC of the substrate P and the non-contact surface (i.e., the thickness of the substrate P plus the thickness of 0.2 mm from the flat surface 31). (Depth position).
  • a photoresist (photosensitive material) 90 is applied to the surface PA which is the exposed surface of the substrate P.
  • the photosensitive material 90 is a photosensitive material for ArF excimer laser (for example, TARF-P6100 manufactured by Tokyo Ohka Kogyo Co., Ltd.) and has liquid repellency (water repellency), and its contact angle is 70. It is about 80 °.
  • the side surface PB of the substrate P is subjected to a liquid-repellent treatment (water-repellent treatment).
  • a liquid-repellent treatment water-repellent treatment
  • the photosensitive material 90 having liquid repellency is also applied to the side surface PB of the substrate P.
  • the photosensitive material 90 is also applied to the back surface PC of the substrate P and subjected to liquid repellent treatment.
  • a part of the surface of the substrate table 52 is subjected to a liquid-repellent treatment to be liquid-repellent.
  • the flat surface 31, the lyophobic surface 72, and the step 36 between them have lyophobicity.
  • a liquid-repellent treatment of the substrate tape groove 52 (plate portion 30) for example, a liquid-repellent material such as a fluororesin material or an atalyl-resin material is applied, or the thin film having the liquid-repellent material is occupied by a shell I do.
  • the liquid repellent material for making the liquid repellent a material insoluble in the liquid 1 is used.
  • the substrate table 52 may be formed of a material having liquid repellency (such as a fluorine-based resin).
  • the substrate stage PST sucks the liquid 1 flowing into the second space 39 formed by the step portion 36, the side surface PB of the substrate P, and the liquid repellent surface 72 and communicating with the portion of the substrate P facing the back surface PC.
  • a collecting device (suction device) 60 for collecting is equipped with a collecting device (suction device) 60 for collecting.
  • the recovery device 60 includes a tank 61 capable of storing the liquid 1, a flow path 62 provided inside the substrate table 52 and connecting the space 39 and the tank 61, and a tank 63 through a valve 63. And a pump 64 connected thereto.
  • the inner wall surface of the flow path 62 is also subjected to a liquid repellent treatment.
  • the substrate stage PST includes a suction device 40 that makes the first space 38 surrounded by the peripheral wall 33 of the substrate holder PH a negative pressure.
  • the suction device 40 is located on the base 35 of the substrate holder PH.
  • a plurality of suction ports 41 provided on the substrate stage, a vacuum section 42 including a vacuum pump provided outside the substrate stage PST, and a connection between each of the plurality of suction ports 41 formed in the base section 35 and the vacuum section 42.
  • a flow channel 43 that communicates therewith.
  • the suction ports 41 are provided at a plurality of predetermined positions on the upper surface of the base portion 35 other than the support portion 34, respectively.
  • the suction device 40 sucks gas (air) inside the first space 38 formed between the peripheral wall portion 33, the base portion 35, and the substrate P supported by the support portion 34, and The substrate P is sucked and held on the support portion 34 by setting the pressure to a negative pressure.
  • the operations of the collecting device 60 and the suction device 40 are controlled by the control device CONT.
  • the liquid 1 in the immersion region AR2 is disposed on a part of the surface PA of the substrate P and a part of the flat surface 31 of the plate portion 30. Is done.
  • the edge region E to be exposed is not at the notch portion PV of the substrate P, but is located at the position, the side surface PB of the substrate P and the step portion 36 facing the side surface PB have been subjected to lyophobic treatment.
  • the gap between them is not large, as shown in Fig. 4, the liquid 1 in the liquid immersion area AR2 hardly penetrates into the gap A, and almost always flows into the gap A due to its surface tension.
  • the gap between the outer periphery of the substrate P and the step portion 36 of the plate portion 30 becomes large, for example, to about 2 mm. 6, the liquid 1 penetrates into the second space 39 between them as shown in FIG.
  • both the rear surface PC of the substrate P and the liquid repellent surface 72 have liquid repellency, and the gap between the rear surface PC and the liquid repellent surface 72 is very small.
  • the liquid 1 that has penetrated into the gap rarely flows into the recess 32 from the gap due to the surface tension that makes it difficult to enter the gap.
  • the liquid 1 that has flowed into the second space 39 is stored in the tank via the flow path 62 by the collection device 60 at a timing that does not hinder the vibrations caused by suction from being transmitted to the substrate P, for example, when replacing the substrate. Suctioned and collected at 61 (see Figure 4).
  • the tank 61 is provided with a discharge channel 61A, and when a predetermined amount of the liquid 1 is accumulated, the liquid 1 is discharged from the discharge channel 61A.
  • the lyophobic surface of the plate portion 30 faces the back surface PC of the substrate P. 72, the liquid 1 is prevented from flowing between the substrate P and the holder PH even when exposing the edge area E of the substrate P, and the liquid 1 is placed under the projection optical system PL. Immersion lithography can be performed while maintaining good conditions. Particularly, in the present embodiment, since the substrate holder PH and the plate portion 30 have the concave portion 71 and the convex portion 74 corresponding to the notch portion PV of the substrate P, the notch portion PV for alignment is formed. When the substrate P is used, the liquid 1 can be prevented from flowing around even at the notch portion PV, and good immersion exposure can be performed.
  • the substrate P acts as a light shielding member, and the exposure light is applied to the liquid-repellent surface 72 facing the substrate P. Do not reach. Therefore, it is possible to prevent the liquid repellency of the liquid repellent surface 72 from being impaired by the irradiation of the exposure light, and it is possible to maintain the liquid 1 intrusion prevention state for a long time. Further, in the present embodiment, since the liquid-repellent surface 72 is not in contact with the back surface PC of the substrate P, the deformation of the substrate P caused by the contact, and the heat transmitted to the substrate P via the plate portion 30 It can prevent adverse effects such as vibration and vibration.
  • the liquid 1 forming the liquid immersion region AR2 is prevented from being excessively spread to the outside of the plate portion 30, and the liquid immersion region AR2 is improved. And can prevent inconveniences such as outflow and scattering of the liquid 1.
  • the liquid 1 that has entered the second space 39 is collected by the collecting device 60, the liquid existing in the second space 39 is transferred to the concave portion 32 and the substrate holder PH when the substrate P is replaced. Spattering can be prevented.
  • the substrate holder PH and the plate portion 30 have the V-shaped concave and convex portions in accordance with the notch portion PV of the substrate P.
  • the present invention is not limited to this.
  • the side wall 73 of the plate portion 30 projects in a circular shape in plan view from the notch portion PV of the substrate P, and a circular shape with an outer diameter separating the side wall portion 74 and the gap C.
  • the substrate holder PH may be provided.
  • the substrate P can be held by the substrate holder PH irrespective of the position and presence of the notch, and it is possible to prevent the liquid from flowing to the back surface side, thereby improving versatility.
  • the liquid repellent surface 72 is configured to be in non-contact with the back surface PC of the substrate P.
  • the configuration is not limited to non-contact and may be in a contact state.
  • FIG. 8 is a diagram showing a second embodiment of the stage device of the present invention.
  • the liquid intrusion is prevented by the liquid-repellent surface 72 facing the rear surface of the substrate P.
  • the liquid intrusion is prevented by an elastic member abutting on the substrate P. I am taking it.
  • FIG. 8 the same components as those of the first embodiment shown in FIG. 4 and the like are denoted by the same reference numerals, and description thereof will be omitted.
  • a fitting groove 75 having a rectangular cross section is formed outside the peripheral wall portion 33 of the substrate holder PH and at a position facing the outer peripheral portion of the substrate P.
  • the mating groove 75 is curved inward from the outer periphery of the substrate P held by the substrate holder PH and, as shown in FIG. 9, at a position corresponding to the notch PV of the substrate P, inwardly of the notch PV. It is formed so that.
  • a sealing member (elastic member) 76 made of an elastic material having liquid repellency, which is preferable from the viewpoint of chemical clean such as fluoro rubber, is fitted and fixed in the fitting groove 75 in a press-fit state. .
  • the seal member 76 is provided with an elastic portion 77 that extends diagonally upward toward the outer periphery of the substrate P.
  • the upper end of the elastic portion 77 slightly protrudes from the upper end surfaces of the peripheral wall portion 33 and the support portion 34 (indicated by a two-dot chain line in FIG. 8), and when the substrate P is held by the substrate holder PH. It is elastically deformed and contacts the rear surface PC of the substrate P.
  • the urging force (elastic restoring force) on the substrate P due to the elastic deformation of the elastic portion 77 is set to a value that does not cause the substrate P to be deformed and is in a liquid-tight state that prevents liquid from entering. .
  • the collection device 60 in the present embodiment sucks the space 39 (the liquid that has entered the outside) of the contact portion between the seal member 76 and the substrate P.
  • Other configurations are the same as those in the first embodiment.
  • the back surface PC of the substrate P and the elastic portion 77 of the seal member 76 are in liquid-tight contact with each other. Liquids can be prevented from entering.
  • the seal member 76 since the seal member 76 has liquid repellency, it is possible to effectively prevent liquid from entering.
  • the liquid that has entered the second space 39 is suctioned and collected by the recovery device 60, it is possible to prevent the liquid from being scattered at the time of collecting the substrate or the like and the liquid pressure in the second space 39 being increased. .
  • the back surface PC of the substrate P is not necessarily required to be lyophobic.
  • the biasing force of the elastic portion 77 may fluctuate due to a change over time or the like, it is preferable that the rear surface PC also has a configuration having liquid repellency.
  • the fitting groove 75 and the sealing member 76 are arranged to be curved in accordance with the notch portion PV of the substrate P as shown in FIG. As shown by the dashed line, the substrate P may be arranged in a circular shape inside the notch portion PV.
  • the substrate P can be held by the substrate holder PH irrespective of the position and presence of the notch, and it is possible to prevent the liquid from flowing to the back surface side, thereby improving versatility.
  • a force in which the seal member 76 is provided on the substrate holder PH may be provided on the plate portion 30 as shown in FIG.
  • the seal member 76 is fitted into a fitting groove 75 opened on the upper surface of the plate portion 30, and the seal member 76 is fixed to the upper surface of the plate portion 30.
  • a holding member 78 for holding the seal member 76 can be provided.
  • the holding member 78 may be fixed from the back surface side of the plate portion 30 with a fastening member 79 such as a mounting screw. It is preferable that the upper surface 78a of the sandwiching member 78 be substantially flush with the surface PA of the substrate P to further impart liquid repellency.
  • the liquid-repellent surface 72 of the plate portion 30 in the above-described embodiment does not necessarily have to have liquid-repellency on the entire surface, and at least the position facing the rear surface PC of the substrate P has liquid-repellency. Just do it.
  • the entire surface of the flat surface 31 of the plate portion 30 also has liquid repellency. It is not necessary that at least the positions of the liquid recovery mechanism 20 facing the first and second recovery members 23 and 24 have liquid repellency.
  • the force S in which the photosensitive material 90 is applied for the liquid-repellent treatment to the entire surface of the front surface PA, the side surface PB, and the rear surface PC of the substrate P, and the region where the gap A is formed may be performed only on a region of the side surface PB of the substrate P and the back surface PC of the substrate P facing the liquid repellent surface 72 of the plate portion 30.
  • a photosensitive material 90 having liquid repellency is applied for the liquid repellent treatment of the side surface PB and the back surface PC of the substrate P.
  • the liquid repellency (water repellency) other than the photosensitive material 90 is applied to the side surface PB and the back surface PC.
  • a predetermined material having the following may be applied.
  • a protective layer called a top coat layer (a film that also protects the photosensitive material 90 with a liquid force) may be applied on the photosensitive material 90 coated on the surface PA, which is the exposed surface of the substrate P.
  • the material for forming the coat layer for example, a fluorine-based resin material
  • a material having liquid repellency other than the photosensitive material 90 and the material for forming the top coat layer may be applied.
  • the lyophobic treatment of the substrate stage PST and the substrate holder PH has been described as applying a fluorinated resin material or an acrylic resin material. Or the substrate holder PH, or conversely, apply the material used for the liquid repellent treatment of the substrate stage PST and the substrate holder PH to the side surface PB and the back surface PC of the substrate P. Moore.
  • the top coat layer is often provided to prevent the liquid 1 in the liquid immersion area AR2 from penetrating into the photosensitive material 90.
  • a trace of adhesion of the liquid 1 on the top coat layer (a so-called ⁇ Even if ()) is formed, by removing this top coat layer after the liquid immersion exposure, a predetermined process such as a development process can be performed after removing the watermark together with the top coat layer.
  • a predetermined process such as a development process can be performed after removing the watermark together with the top coat layer.
  • the top coat layer is formed of, for example, a fluorine-based resin material, it can be removed using a fluorine-based solvent.
  • the predetermined process can be satisfactorily performed after the removal of the mark.
  • the substrate P is cut out in a direction orthogonal to the radial direction of the force described as the notch having a V-shape in plan view is provided as a notch for positioning the substrate P.
  • the present invention can be applied to a substrate provided with a so-called orientation flat (orientation 'flat), and further to a substrate having no notch for alignment.
  • the liquid 1 is composed of pure water. Pure water has the advantage that it can be easily obtained in large quantities at a semiconductor manufacturing plant or the like, and that there is no adverse effect on the photoresist on the substrate P, optical elements (lenses), and the like. In addition, pure water has no adverse effect on the environment and has an extremely low impurity content. Therefore, it is expected that the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL are also cleaned. it can.
  • PFPE perfluorinated polyether
  • the refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is approximately 1.44
  • ArF excimer laser light (wavelength 193 nm) was used as the light source of the exposure light EL.
  • the wavelength is shortened to 1 / n, that is, about 134 nm on the substrate P, and a high resolution is obtained.
  • the depth of focus is expanded to about n times, that is, about 1.44 times as compared to that in the air, if it is sufficient to secure the same depth of focus as when using it in the air, the projection optics
  • the numerical aperture of the system PL can be further increased, and the resolution is improved in this respect as well.
  • the optical element 2 is attached to the tip of the projection optical system PL, and the lens is used to adjust the optical characteristics of the projection optical system PL, for example, aberrations (spherical aberration, coma, etc.). be able to.
  • the optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane-parallel plate that can transmit EL light.
  • the optical element When the pressure between the optical element at the tip of the projection optical system PL and the substrate P caused by the flow of the liquid 1 is large, the optical element is not replaced by the pressure, but the optical element is not replaced. However, it may be fixed firmly so as not to have power.
  • the space between the projection optical system PL and the surface of the substrate P is filled with the liquid 1, but, for example, a cover glass made of a parallel flat plate is attached to the surface of the substrate P.
  • a configuration in which the liquid 1 is filled in a dashed state may be employed.
  • the liquid 1 of the present embodiment is water, but may be a liquid other than water.
  • the light source of the exposure light EL is an F laser, this F laser light does not pass through water, so the liquid 1
  • Is a fluorine-based fluid such as a fluorine-based oil that can transmit F laser light.
  • liquid 1 other liquids which are transparent to the exposure light EL and have a refractive index as high as possible and which are stable to the photoresist applied to the surface of the substrate P or the substrate P (for example, Cedar) Oil) can also be used. Also in this case, the surface treatment is performed according to the polarity of the liquid 1 to be used.
  • the substrate P in each of the above embodiments not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin-film magnetic head, or a mask or a mask used in an exposure apparatus.
  • the original reticle synthetic quartz, silicon wafer etc. is applied.
  • the exposure apparatus EX includes a step of scanning and exposing the pattern of the mask M by synchronously moving the mask M and the substrate P.
  • the method can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is exposed collectively while the M and the substrate P are stationary, and the substrate P is sequentially moved step by step.
  • the present invention can be applied to a step-and-stitch type exposure apparatus that transfers at least two patterns on the substrate P while partially overlapping each other.
  • the present invention can also be applied to a twin-stage type exposure apparatus disclosed in JP-A-10-163099, JP-A-10-214783, and JP-T-2000-505958.
  • the type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a substrate P with a semiconductor element pattern, but may be an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin-film magnetic head, It can be widely applied to an exposure device for manufacturing an image pickup device (CCD), a reticle or a mask, and the like.
  • CCD image pickup device
  • a linear motor (USP No. 5, 623, 853 or If USP No. 5,528,118 is used, either an air levitation type using an air bearing or a magnetic levitation type using Lorentz force or reactance force may be used.
  • each stage PST and MST can be either a type that moves along the guide or a guideless type that does not have a guide.
  • a magnet unit having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil are opposed to each other to drive each stage PST, MST by electromagnetic force.
  • a flat motor may be used.
  • one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving surface side of the stages PST and MST.
  • the exposure apparatus EX of the present embodiment assembles various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, Adjustments are made to achieve electrical accuracy for various electrical systems.
  • the process of assembling the various subsystems into the exposure apparatus includes mechanical connections, wiring connections of electric circuits, and piping connections of pneumatic circuits among the various subsystems. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are ensured.
  • the manufacture of the exposure apparatus includes temperature and cleanliness. It is desirable to perform in a controlled clean room.
  • a step 201 for performing a function 'performance design of the micro device a step 202 for manufacturing a mask (reticle) based on this design step, Step 203 of manufacturing a substrate as a base material, exposure processing step 204 of exposing a mask pattern to the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing step, bonding step, and package step) 205 It is manufactured through the inspection step 206 and the like.
  • the liquid immersion region is favorably formed over a long period of time without impairing the liquid repellency, and the liquid is discharged to the outside of the substrate stage. Exposure can be performed in a state in which outflow of liquid is suppressed, and a device having desired performance can be manufactured.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne un appareil à étage (PST) doté, d'une part, d'un support (PH) servant à soutenir la surface arrière (PC) d'un substrat (P) et, d'autre part, d'un étage (52) se déplaçant tandis qu'il soutient le support (PH). Ledit support (PH) présente, sur le côté interne de la périphérie externe du substrat (P), des sections de support (33, 34) servant à soutenir la surface arrière (PC) du substrat (P). En outre, cet appareil à étage (PST) présente un élément répulsif au liquide (30) doté d'une capacité de répulsion de liquide, ledit élément répulsif de liquide (30) étant séparé du support (PH) au moins à une position opposée à la surface arrière (PC) du substrat (P). Par conséquent, le liquide ne peut s'introduire entre le substrat et le support, même lorsque le traitement par exposition est réalisé avec le liquide placé entre le système de projection optique et le substrat.
PCT/JP2004/018788 2003-12-16 2004-12-16 Appareil a etage, appareil et procede d'exposition WO2005059977A1 (fr)

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WO2006030908A1 (fr) * 2004-09-17 2006-03-23 Nikon Corporation Appareil de maintien de substrat, appareil d’exposition et procédé de fabrication de dispositif
WO2007007723A1 (fr) * 2005-07-08 2007-01-18 Nikon Corporation Substrat pour une exposition par immersion, procédé d'exposition et procédé pour fabriquer un dispositif
JP2007043145A (ja) * 2005-07-08 2007-02-15 Nikon Corp 液浸露光用基板、露光方法及びデバイス製造方法
JP2007194503A (ja) * 2006-01-20 2007-08-02 Toshiba Corp 基板処理方法および基板処理装置
JP2008172214A (ja) * 2006-12-08 2008-07-24 Asml Netherlands Bv 基板支持体およびリソグラフィプロセス
JP2009033201A (ja) * 2004-04-14 2009-02-12 Asml Netherlands Bv リソグラフィック装置及びデバイス製造方法
JP2009043879A (ja) * 2007-08-08 2009-02-26 Canon Inc 露光装置およびデバイス製造方法
JP2010153419A (ja) * 2008-12-24 2010-07-08 Ushio Inc ワークステージおよびこのワークステージを使った露光装置
JP2010171462A (ja) * 2010-04-26 2010-08-05 Nikon Corp 露光装置及びデバイス製造方法
JP2011228716A (ja) * 2006-12-13 2011-11-10 Asml Netherlands Bv テーブルおよびリソグラフィ方法
US9013683B2 (en) 2010-12-21 2015-04-21 Asml Netherlands B.V. Substrate table, a lithographic apparatus and a device manufacturing method
JP2021043450A (ja) * 2016-02-08 2021-03-18 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法
US11139196B2 (en) 2017-10-12 2021-10-05 Asml Netherlands B.V. Substrate holder for use in a lithographic apparatus

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JP2009033201A (ja) * 2004-04-14 2009-02-12 Asml Netherlands Bv リソグラフィック装置及びデバイス製造方法
JP4543767B2 (ja) * 2004-06-10 2010-09-15 株式会社ニコン 露光装置及びデバイス製造方法
JP2005353820A (ja) * 2004-06-10 2005-12-22 Nikon Corp 露光装置及びデバイス製造方法
WO2006030908A1 (fr) * 2004-09-17 2006-03-23 Nikon Corporation Appareil de maintien de substrat, appareil d’exposition et procédé de fabrication de dispositif
JPWO2006030908A1 (ja) * 2004-09-17 2008-05-15 株式会社ニコン 基板保持装置、露光装置、及びデバイス製造方法
US9341959B2 (en) 2004-09-17 2016-05-17 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US8102512B2 (en) 2004-09-17 2012-01-24 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
JP4618253B2 (ja) * 2004-09-17 2011-01-26 株式会社ニコン 基板保持装置、露光装置、及びデバイス製造方法
WO2007007723A1 (fr) * 2005-07-08 2007-01-18 Nikon Corporation Substrat pour une exposition par immersion, procédé d'exposition et procédé pour fabriquer un dispositif
JP2007043145A (ja) * 2005-07-08 2007-02-15 Nikon Corp 液浸露光用基板、露光方法及びデバイス製造方法
JP2007194503A (ja) * 2006-01-20 2007-08-02 Toshiba Corp 基板処理方法および基板処理装置
JP4718536B2 (ja) * 2006-12-08 2011-07-06 エーエスエムエル ネザーランズ ビー．ブイ． 基板支持体およびリソグラフィ装置
JP2008172214A (ja) * 2006-12-08 2008-07-24 Asml Netherlands Bv 基板支持体およびリソグラフィプロセス
JP2011228716A (ja) * 2006-12-13 2011-11-10 Asml Netherlands Bv テーブルおよびリソグラフィ方法
US8634052B2 (en) 2006-12-13 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and method involving a ring to cover a gap between a substrate and a substrate table
JP2009043879A (ja) * 2007-08-08 2009-02-26 Canon Inc 露光装置およびデバイス製造方法
US7630056B2 (en) 2007-08-08 2009-12-08 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
JP2010153419A (ja) * 2008-12-24 2010-07-08 Ushio Inc ワークステージおよびこのワークステージを使った露光装置
JP2010171462A (ja) * 2010-04-26 2010-08-05 Nikon Corp 露光装置及びデバイス製造方法
US9857696B2 (en) 2010-12-21 2018-01-02 Asml Netherlands B.V. Substrate table, a lithographic apparatus and a device manufacturing method
US9268238B2 (en) 2010-12-21 2016-02-23 Asml Netherlands B.V. Substrate table, a lithographic apparatus and a device manufacturing method
US9454089B2 (en) 2010-12-21 2016-09-27 Asml Netherlands B.V. Substrate table, a lithographic apparatus and a device manufacturing method
US9013683B2 (en) 2010-12-21 2015-04-21 Asml Netherlands B.V. Substrate table, a lithographic apparatus and a device manufacturing method
US10372044B2 (en) 2010-12-21 2019-08-06 Asml Netherlands B.V. Substrate table, a lithographic apparatus and a device manufacturing method
US10955757B2 (en) 2010-12-21 2021-03-23 Asml Netherlands B.V. Substrate table, a lithographic apparatus and a device manufacturing method
JP2021043450A (ja) * 2016-02-08 2021-03-18 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、基板をアンロードする方法、及び基板をロードする方法
US11664264B2 (en) 2016-02-08 2023-05-30 Asml Netherlands B.V. Lithographic apparatus, method for unloading a substrate and method for loading a substrate
US11139196B2 (en) 2017-10-12 2021-10-05 Asml Netherlands B.V. Substrate holder for use in a lithographic apparatus
US11749556B2 (en) 2017-10-12 2023-09-05 Asml Netherlands B.V. Substrate holder for use in a lithographic apparatus

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