WO2005008780A1

WO2005008780A1 - Image sensor, method for fabricating the image sensor, and mold for fabricating micro condenser element array used in the same

Info

Publication number: WO2005008780A1
Application number: PCT/KR2004/000728
Authority: WO
Inventors: Shinill Kang
Original assignee: Optomecha Co., Ltd.
Priority date: 2003-07-19
Filing date: 2004-03-30
Publication date: 2005-01-27
Also published as: KR100541027B1; KR20050010343A

Abstract

A method for fabricating an image sensor, includes: a preparation step for preparing an image sensor element array wafer on which a photoelectric circuit has been formed; an applying step for applying a micro condenser element array material on the image sensor element array wafer; and a molding step for micro molding the micro condenser element array material applied on the image sensor element array wafer by using a mold for fabricating a micro condenser element array. A mold for fabricating a micro condenser element array is comprised of an ultraviolet transparent material for transmitting ultraviolet light, and includes an ultraviolet barrier in the region corresponding to bond pads.

Description

IMAGE SENSOR, METHOD FOR FABRICATING THE IMAGE SENSOR, AND MOLD FOR FABRICATING MICRO CONDENSER ELEMENT ARRAY USED IN THE SAME

TECHNICAL FIELD The present invention relates to an image sensor, a method for fabricating an image sensor and a mold for fabricating a micro condenser element array used in the method, and more particularly to, a method for fabricating an image sensor which can reduce a processing time, improve productivity, increase a yield and raise optical efficiency, an image sensor fabricated according to the method, and a mold for fabricating a micro condenser element array used in the method.

BACKGROUND ART In general, an image sensor such as a CCD or CMOS has a micro lens over each photodiode. The micro lens condenses light to the photodiodes so that light incident through an external optical system can be efficiently irradiated to the photodiodes. A method using a photoresist reflow process and a method for transferring patterned micro lens shapes to a flat layer using a reactive ion etching process have been used in order to fabricate the micro lens array. For example, USP 6,137,634 has disclosed a method for fabricating a micro lens array of an image sensor. Fig. 1 illustrates the conventional method for fabricating the image sensor, especially the process for fabricating the micro lens array using the reflow process. A flat layer 4 forming a space between photodiodes 5 and micro lenses 7 is patterned according to a photolithography process on an image sensor element array wafer 1 in which a photoelectric circuit including the photodiodes 5, align marks 2 and bond pads 3 for wiring have been formed. A color image sensor includes a color filter for transmitting a specific wavelength of light. Photoresist pedestals 6 of square or other shapes for forming the micro lenses 7 are formed on the flat layer 4. The photoresist pedestals 6 are reflowed on an oven or hot plate. The photoresist pedestals 6 are molten, to form the micro lenses 7 due to surface tension. The image sensor element array wafer 1 is diced into a plurality of image sensor chips 8. Then, the image sensor is obtained after a packaging process. On the other hand, in the method for forming the micro lens array using the reactive ion etching process, lens shaped photoresist patterns are formed in the same manner as the aforementioned method. Then, the photoresist patterns are transferred onto a thick flat layer according to the reactive ion etching process, to fabricate a micro lens array. However, the conventional methods for fabricating the image sensor have the following problems. The micro lens array of the image sensor is a hyperfine structure. In the conventional methods for fabricating the micro lens array, the initial photoresist patterns are formed by using a stepper to improve precision, and then the reflow process and other processes are performed. Even though using the stepper guarantees higher precision than using an aligner, it requires many repetitive steps per wafer, which increases the processing time and the unit cost of production. Moreover, in the methods for fabricating the micro lens array based on the reflow process and the reactive ion etching process, strict processing conditions have to be maintained because those processes are very sensitive to the processing conditions. It is also difficult to obtain a high yield due to low reproducibility of products. Especially, the number of pixels tends to increase in the image sensor of high quality, which increases a size of the image sensor. Accordingly, possible defects during the process are increased, which has the detrimental effects on the yield. In addition, taking performance into consideration, the bottom surfaces of the micro lenses of the image sensor are not formed in the circular shape but the square shape to increase a fill factor during the production of the micro lenses. However, in the method using the reflow process, rotation symmetrical shapes to the central axis cannot be formed. Furthermore, the reflow process requires at least a minimum interval between the lenses, to decrease the fill factor. As a result, efficiency of the image sensor is reduced. Recently, a size of an object lens may be smaller than a size of the image sensor due to miniaturization of a camera and image equipment having the image sensor. Therefore, an incident angle on the peripheral pixel of the image sensor increases, and thus images are not efficiently condensed to the photodiodes 5. In general, the micro lens array of the image sensor is designed in consideration of light vertically incident on the micro lenses 7. However, as shown in Fig. 2, light is incident on the peripheral pixel of the image sensor not in the vertical direction but at an inclination angle. Thus, the incident light is not condensed to the photodiodes 5. Accordingly, the micro lenses 7 in the peripheral pixels must be differently designed from those in the central pixels. However, the conventional method for fabricating the micro lens array using the photoresist reflow process cannot control heights of the photoresist pedestals differently in one micro lens array, and thus controls the shape of the micro lenses merely based on the size of the bottom surfaces of the photoresist pedestals. As a result, a wanted lens shape is not obtained.

DISCLOSURE OF THE INVENTION An object of the present invention is to provide a method for fabricating an image sensor which can reduce the processing time and the unit cost of production by micro molding a micro condenser element array directly on an image sensor element array wafer, or adhering a micro condenser element array thin plate previously fabricated according to the micro molding process to the image sensor element array wafer. In accordance with the present invention, once a mold is precisely fabricated, a single process including a step of aligning the mold on a wafer can fabricate a micro condenser element array at a time, to remarkably reduce the processing time and the unit cost of production. That is, the mass production of precise image sensors can be achieved. As described above, the conventional method for fabricating the image sensor uses the stepper. Here, many processes are required in a unit wafer, and such processes are repeated in every wafer, which inevitably generates defects. However, in accordance with the present invention, once a precise mold is fabricated, precise patterns of the mold can simply be transferred to a micro condenser element array, to considerably reduce defects.

Another object of the present invention is to provide a very precise but simple method for opening bond pads for wiring. It is thus possible to more reduce the whole processing time and the unit cost of production of an image sensor. Especially, these advantages of the invention can be maximized by using a mold having an ultraviolet barrier discussed later. Opening the bond pads was an obstacle to use conventional micro molding methods for producing the image sensor. Among the devices having micro lens arrays, the image sensor such as a CCD or CMOS is a hyperfine device as compared with an LCD or optical fiber. Accordingly, even if the micro lens array is very precisely aligned and molded on an image sensor element array wafer, precision of the image sensor can not be maintained without the precise process for opening the bond pads. In this regard, the precise but very simple process for opening the bond pads according to the present invention has a lot of advantages. Yet another object of the present invention is to improve efficiency of an image sensor by increasing a fill factor. Yet another object of the present invention is to improve efficiency of an image sensor by forming different lens shapes on one image sensor. That is, not only a spherical or aspheric micro lens array but also other possible shaped micro condenser elements can be employed on the image sensor so as to improve condensation efficiency. Furthermore, the combination of various shapes of micro condenser elements can be used. The present invention provides effective solutions for fabricating the various shapes of micro condenser elements. In this regard, the present invention preferably fabricates a master by using a gray scale mask, fabricates a mold by using the master, and fabricates a micro condenser element array by using the mold. This is one of characteristics of the present invention. There are limits to introduce a photolithography process using a gray scale mask directly to the micro molding process of the invention. In the photolithography process using the gray scale mask, convex or concave patterns of the micro condenser element array are made of a photoresist. However, the photoresist does not have sufficient durability for the repeated uses. In order to solve the foregoing problem, in accordance with the present invention, the product fabricated by using the gray scale mask is not used as a mold but a master. A highly durable mold (or another master) is separately fabricated by using the master and used for molding, which make it possible to achieve the mass production of image sensors by the molding method. To achieve the above-described objects of the invention, there is provided a method for fabricating an image sensor, including: a preparation step for preparing an image sensor element array wafer on which a photoelectric circuit has been formed; an applying step for applying a micro condenser element array material on the image sensor element array wafer; and a molding step for micro molding the micro condenser element array material applied on the image sensor element array wafer by using a mold for fabricating a micro condenser element array. Here, the micro condenser element array is formed in various shapes, such as a micro lens array, a micro prism array, a micro mirror array, and so on. Preferably, a master is fabricated and patterns of the master are transferred to a mold, and the mold is used for the micro molding. Preferably, the master is fabricated according to a photolithography process using a gray scale mask, and the mold (or another master) is fabricated by using the master. Preferably, a reactive ion etching process or electroforming molding process is used to fabricate the mold by using the master. In addition to direct molding methods such as a UV-molding method, a thermocuring molding method and a hot embossing method, a method for fabricating an image sensor by adhering a micro condenser element array thin plate to an image sensor element array wafer can be used to fabricate the image sensor by using the mold. In accordance with the present invention, the micro condenser element array is molded on one image sensor element array wafer through a single process using one mold. Preferably, a groove for collecting air bubbles is used to remove air bubbles generated during the molding step. The present invention provides a method for opening bond pads for wiring. For example, using a mold having an ultraviolet barrier in the UV-molding method or performing an etching process after coating a protective barrier is suggested as a useful method for opening bond pads. According to another aspect of the invention, a mold for fabricating a micro condenser element array which molds the micro condenser element array on an image sensor element array wafer including bond pads for wiring is comprised of an ultraviolet transparent material for transmitting ultraviolet light, and includes an ultraviolet barrier in the region corresponding to the bond pads. According to another aspect of the invention, a method for fabricating an image sensor includes the steps of: forming a micro condenser element array on an image sensor element array wafer on which bond pads for wiring and a photoelectric circuit have been formed; patterning a protective barrier on a region of the micro condenser element array which does not correspond to the bond pads; removing a protective barrier non-coated region of the micro condenser element array according to an etching process; and removing the protective barrier.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 illustrates a conventional method for fabricating an Image sensor using a photoresist reflow process; Fig. 2 illustrates differences of condensation efficiency between a central micro lens and a peripheral micro lens in the image sensor of Fig. 1 ; Figs. 3a to 3c respectively illustrate a method for fabricating an image sensor in accordance with preferred embodiments of the present invention; Figs. 4a to 4c respectively illustrate a process for fabricating a master in accordance with preferred embodiments of the present invention; Figs. 5a and 5b respectively illustrate a process for fabricating a mold for fabricating a micro lens array in accordance with preferred embodiments of the present invention; Figs. 6a and 6b respectively illustrate a process for forming an ultraviolet barrier on a mold for fabricating a micro lens array in accordance with preferred embodiments of the present invention; Fig. 7 illustrates a process for collecting air bubbles generated during the micro molding process; and Fig. 8a illustrates higher condensation efficiency of an image sensor including an array of micro condenser elements having various shapes in respective positions than the image sensor of Fig. 2, and Fig. 8b illustrates one example of the micro condenser element array in accordance with the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION An image sensor, a method for fabricating the image sensor, and a mold for fabricating a micro condenser element array used in the method in accordance with the present invention will now be described in detail with reference to the accompanying drawings. Figs. 3a to 3c respectively illustrate a method for fabricating an image sensor in accordance with preferred embodiments of the present invention. In the method of Fig. 3a, a micro lens array is formed on an image sensor element array wafer 1 according to a direct molding process using UV-molding. A photopolymer 11 cured by ultraviolet ght is applied on the image sensor element array wafer 1 having a photoelectric ci ri cuit including photodiodes 5, align marks 2, bond pads 3 and other electronic circui it structures. A concave ultraviolet transparent mold 10 on which a metal ultraviolet barrier 9 including align mark 2 has been formed is aligned to contact the lower image sensor element array wafer 1. Ultraviolet light 12 transmitting the ultraviolet transparent mold 10 are irradiated to the photopolymer 11 under an appropriate pressure. When the photopolymer 11 is exposed to the ultraviolet light 12, it is turned into a solid polymer state by forming chain molecular structures. Here, a predetermined region of the photopolymer 11 is not exposed to ultraviolet light due to the ultraviolet barrier 9 of the ultraviolet transparent mold 10. Thus, this region is not cured. When curing of the photopolymer 11 is finished, a solvent for selectively dissolving the non-cured photopolymer 11 is used to remove the non-cured photopolymer 11. Accordingly, a polymer micro lens array 13 is formed on the image sensor element array wafer 1. Image sensor chips 8 are obtained through a dicing process, and an image sensor is completed by a packaging process. The aforementioned process does not need the flat layer 4 required in the conventional reflow process, which simplifies the whole process. The photopolymer 11 for UV-molding may have adhesiveness to glass group materials or a releasing property therefrom according to composition and constituents of a photopolymer material. In order to form the micro lens array 13 of the image sensor according to the UV-molding method, the photopolymer 11 requires a high releasing property from the ultraviolet transparent mold 10 and high adhesiveness to the image sensor element array wafer 1. For this, if necessary, a releasing material is coated on the ultraviolet transparent mold 10 according to a spin coating process or dipping process, and a material for improving adhesiveness is coated on the image sensor element array wafer 1. The image sensor chip 8 on which the micro lens array 13 has been formed can be completed according to various packaging processes. For example, in the case of a packaging process using wire bonding, the ultraviolet transparent mold 10 is so designed, by using the ultraviolet barrier 9, that the photopolymer 11 on the metal bond pads 3 for wire bonding cannot be cured. However, a chip size packaging process does not require external wiring, and thus does not use the ultraviolet barrier 9. In the process of Fig. 3b, a thermocurable polymer 14a or thermoplastic polymer 14b is molded directly on an image sensor element array wafer 1 , to fabricate a micro lens array 13. A metal mold 15 or the ultraviolet transparent mold 10 of Fig. 3a of a concave micro lens shape having align marks 2 is aligned on the image sensor element array wafer 1 by using the align marks 2, and the thermocurable polymer 14a or thermoplastic polymer 14b is molded directly on the image sensor element array wafer 1 , to obtain the micro lens array 13. in the case of the thermocurable polymer 14a, a liquid phase thermocurable polymer 14a is filled between the mold 15 or 10 and the image sensor element array wafer 1 , and cured at an appropriate temperature. In the case of the thermoplastic polymer 14b, a powder or film type material is inserted between the mold 15 or 10 and the image sensor element array wafer 1 , maintained at a temperature over a glass transition temperature of the thermoplastic polymer 14b and an appropriate pressure, and cooled, to fabricate the polymer micro lens array 13 on the image sensor element array wafer 1. A protective barrier 16 against a reactive ion etching or wet etching is patterned on the region of the micro lens array 13. The polymer 14a or 14b applied on metal bond pads 3 for wiring is removed from the image sensor element array wafer 1 according to the reactive ion etching process or wet etching process, and then the protective barrier 16 is stripped. Image sensor element chips 8 are obtained according to a dicing process, and a succeeding packaging process is performed thereon. Fig. 3c illustrates a process for fabricating an image sensor using a micro lens array thin plate 17 formed according to a micro molding method. The micro lens array thin plate 17 is fabricated according to micro molding methods such as a microinjection molding method, a hot embossing method, an UV-molding method and a thermocuring molding method. The micro lens array thin plate 17 is aligned and then adhered on an image sensor element array wafer 1 on which an adhesive 18 has been coated by using align marks 2. When bond pads 3 need to be opened for wiring, the method using the protective barrier 16 against a reactive ion etching and wet etching as shown in Fig. 3b is used. The direct molding method of Fig. 3a or 3b and the method of Fig. 3c adhering the polymer micro lens array thin plate 17 formed according to the micro molding method need to fabricate a mold having micro lens array shaped concave patterns so as to fabricate the micro lens array. Figs. 4a to 4c respectively illustrate a process for fabricating a master for a mold for fabricating a micro lens array in accordance with preferred embodiments of the present invention. Fig. 4a shows a process for fabricating a convex pattern master 22 using gray scale mask lithography. A photoresist 20 is applied on a substrate 19, and patterned by using a gray scale mask 23 to fabricate a convex pattern master 22. After a developing process, the convex pattern master 22 having micro lens shaped convex photoresist patterns 21 is obtained. The gray scale mask 23 can be obtained by writing a gray scale pattern in a high-energy beam photosensitive glass (HEBS glass) by using high-energy electron beams. Light transmittance of the written sensitive glass is determined according to an amount and time of irradiated high-energy beams, to control an amount of energy of ultraviolet light irradiated to the photoresist 20. A height of the photoresist 20 removed during the developing process is determined according to an amount of irradiated ultraviolet light and developing conditions. Accordingly, various shapes of photoresist patterns 21 can be obtained by using an appropriate gray scale mask 23. The photolithography process using the gray scale mask 23 can be performed by using an aligner or a stepper. However, it should be recognized that the stepper is used merely to fabricate the master. Once the master and mold are precisely fabricated, a very precise micro condenser element arrays for image sensor can be easily fabricated in the succeeding process including the molding process, without using the stepper. The photoresist patterns 21 can form free-formed surfaces according to the design of the gray scale mask 23. Even if the bottom surfaces of the micro lenses are square shaped differently from the reflow process, spherical micro lenses being rotationally symmetrical to the central axis can be fabricated. In addition, the micro lenses can be molded without space between themselves, to improve a fill factor. In addition, aspheric micro lenses can be formed. Furthermore, a micro condenser element array can be fabricated in various shapes (for example, prism shape) suitable for condensation according to a single lithography process. Especially, as shown in Fig. 8b, the micro condenser elements 39 can be fabricated to have different shapes in one image sensor according to positions of respective pixels. A silicon wafer is generally used as the substrate 19. However, when an ultraviolet transparent substrate is needed in the succeeding process for fabricating the image sensor, the ultraviolet transparent substrate such as a quartz or soda lime glass can be used. In addition to the method for fabricating the master using the gray scale mask of Fig. 4a, the master can be fabricated according to the reflow process. To put it concretely, a photoresist is applied on a silicon wafer or ultraviolet transparent substrate, and patterned by using a mask to form a photoresist pedestals. Thereafter, micro lens array shaped photoresist patterns are obtained by applying heat to the photoresist pedestals, to fabricate the master. However, this method may not achieve the objects of the invention, for example, improvements in the fill factor, and improvements in the condensation efficiency which can be achieved by fabricating various micro condenser elements. Fig. 4b shows a process for fabricating a concave pattern master 26 using gray scale mask lithography. A photoresist 20 is applied on a substrate 19, and patterned by using a gray scale mask 24 for fabricating a concave pattern master 26. After a developing process, the concave pattern master 26 having concave photoresist patterns 25 is fabricated according to the design of the gray scale mask 24. The method of Fig. 4b also individually controls shapes of respective micro condenser elements, and thus advantageously forms different shapes of micro condenser elements in one image sensor. Fig. 4c illustrates a process for fabricating another convex pattern master 22 by transferring the convex pattern of the master 22 of Fig. 4a to a substrate 19 according to a reactive ion etching process. The convex pattern master 22 of Fig. 4c is fabricated by reactive ion etching the master 22 of Fig. 4a which has the photoresist patterns 21 formed on the silicon or ultraviolet transparent substrate 19 by using gray scale mask lithography process (or reflow process). The reactive ion etching process can adjust an etching ratio between the polymer and the substrate 19 by controlling kinds of gases and compositions, and thus control shapes of micro lenses. Fig. 4d shows a process for fabricating a convex pattern master 22 by electroforming the concave pattern master 26 of Fig. 4b. As illustrated in Fig. 4b, a conductive layer for electroforming is deposited on the concave pattern master 26 fabricated by the gray scale mask lithography. The electroforming process is performed to fabricate a metal master 28 having convex patterns. As the conductive layer for electroforming, nickel or other metals can be deposited according to a sputtering or evaporation method. Eletroless plating can also be used. Fig. 4e shows a process for fabricating a concave pattern master 26 according to an ultraviolet molding method using the convex pattern master 22 as shown in Figs. 4a, 4c and 4d. According to the process using the ultraviolet molding method, a photopolymer 11 cured by ultraviolet light is applied on the convex pattern master 22 fabricated according to the methods of Figs. 4a, 4c and 4d, and then an ultraviolet transparent substrate 29 transmitting ultraviolet light is positioned on the photopolymer. The concave pattern master 26 having concave polymer patterns 31 is fabricated on a substrate 29 by curing the photopolymer 11 by applying an appropriate pressure and irradiating ultraviolet light. Here, an adhesive and a releasing compound can be used according to material properties of the photopolymer 11. The convex pattern master 22 in Fig. 4e is fabricated in various ways. Especially, the silicon, glass or metal master 22 fabricated according to the methods of Figs. 4c and 4d advantageously shows sufficient durability to replicate many concave pattern masters 26 according to the UV-molding method. That is, once one convex pattern master 22 having high durability is fabricated, many concave pattern masters can be replicated, and then a mold can be fabricated by using these concave masters, which remarkably cuts down the unit cost of production of the mold. The above-described process is applied in the same manner to the method using the thermocurable polymer 14a or thermoplastic polymer 14b. Figs. 5a and 5b respectively illustrate a process for fabricating a mold for fabricating a micro lens array in accordance with preferred embodiments of the present invention. Fig. 5a shows a process for fabricating an ultraviolet transparent mold 10 according to an ultraviolet curing molding method. The ultraviolet transparent mold 10 having concave patterns is fabricated by reactive ion etching the concave pattern master 26 which has concave polymer patterns fabricated according to the methods of Figs. 4b and 4c on an ultraviolet transparent substrate. Shapes of concave patterns can be controlled according to the reactive ion etching conditions. Fig. 5b shows a process for fabricating a metal mold 15 using electroforming. A conductive layer is deposited on the convex pattern master 22 fabricated according to the methods of Figs. 4a, 4c and 4d, and then the electroforming process is performed to fabricate the metal mold 15 having concave patterns. An appropriate back polishing process can be succeeded. Figs. 6a and 6b respectively illustrate a process for forming an ultraviolet barrier on the mold for fabricating the micro lens array in accordance with preferred embodiments of the present invention. Fig. 6a shows a process for forming a metal ultraviolet barrier 9 on the mold according to a lift off process not to form a polymer layer on bond pads 3 for wiring during the production of the image sensor using the ultraviolet curing molding method of Fig. 3a. The bond pads 3 are formed in the peripheral region in each image sensor chip 8 for wiring in the packaging process. The bond pads 3 transmit/receive signals to/from external electrodes through wires. Identically to the mold for fabricating the image sensor according to the UV-molding method of Fig. 3a, the mold 10 of Fig. 6a requires the ultraviolet barrier 9 not to expose the polymer applied on the bond pads 3 to ultraviolet light. For this, a photoresist is coated on the ultraviolet transparent mold 10 fabricated according to the reactive ion etching process (Fig. 5a), and patterned to serve as a sacrificial layer 33 for forming a metal layer 35. The metal layer 35 is deposited according to a sputtering or evaporation method. Various materials including chrome and aluminum can be used as the metal layer 35. In addition, an adhesive can be deposited before forming the metal layer 35 to improve adhesiveness between the ultraviolet transparent mold 10 and the metal layer 35. The metal layer 35 deposited on the photoresist sacrificial layer 33 is removed according to a developing process, to obtain the wanted ultraviolet barrier 9. Fig. 6b shows another example of the process for fabricating the ultraviolet barrier 9. A metal layer 35 used as an ultraviolet barrier is deposited and patterned on an ultraviolet transparent substrate 29 before the reactive ion etching process of Fig. 5a. A concave pattern layer 34 is formed according to the method of Fig. 4b or 4c, and an ultraviolet transparent mold 10 on which the ultraviolet barrier 9 has been formed is fabricated according to the reactive ion etching process of Fig. 5a. Fig. 7 illustrates a process for collecting air bubbles generated during the process for fabricating the image sensor according to the molding method of Fig. 3a or 3b. The photopolymer 11 , the thermocurable polymer 14a or the thermoplastic polymer 14b is applied on the image sensor element array wafer 1. Here, the polymer 11 , 14a or 14b is applied centering on photodiodes 5 so that more polymer may be applied thereon. When the moid 10 or 15 having concave patterns moves downwardly to the image sensor element array wafer 1 , the central polymer 11 , 14a and 14b to form a micro lens firstly contact the mold 10 or 15 and fill the concave parts of the mold 10 or 15. As the mold 10 or 15 further moves, it contacts the peripheral polymer 11 , 14a and 14b. Lastly, the mold 10 or 15 and the polymer 11 , 14a or 14b contact each other at a groove 38 for collecting air bubbles. Therefore, the air bubbles can move toward the groove 38 and be collected in the groove 38. The groove 38 for collecting the air bubbles is formed in the region corresponding to a space between the image sensor chips 8 which will be diced out in a dicing process, the last step for fabricating the image sensor chips 8. Fig. 8a shows that an image sensor including a micro condenser element array 39 having various shapes in each position has higher condensation efficiency than the image sensor of Fig. 2, and Fig. 8b illustrates one example of the micro condenser element array 39 in accordance with the present invention. Results of research by the inventor verify that the image sensors of Figs. 8a and 8b show much higher optical efficiency than the image sensor of Fig. 2, and another patent application for such results was filed in the name of the applicant. Referring to Fig. 8a, the micro condenser elements 39 in the peripheral region of the image sensor has different shape from those in the central region. Accordingly, light slantingly incident on the peripheral region of the image sensor is efficiently condensed and incident on the photodiodes, to improve efficiency of the image sensor. Fig. 8b shows the micro condenser element array 39 having different shapes in each pixel. In general, a micro lens array has been used as the condenser element array

39 of the image sensor. However, a prism, combinations of lens and prism, and other variously shaped condenser element can be used in each position in order to improve optical efficiency. The micro condenser element array molding method of the present invention can individually form all possible patterns on the image sensor element array wafer 1 according to shapes of molds. A mold having concave patterns corresponding to a wanted condenser element shape is necessary to fabricate a condenser element array 39 having combinations of prism shape and aspheric lens shapes. Such a mold can be fabricated by using the gray scale mask 23 or 24. In accordance with the present invention, the processing time can be reduced, productivity can be improved and the yield can be increased in the process for fabricating the micro condenser element array of the image sensor. Moreover, optical efficiency can be improved by forming various shapes of micro condenser elements in each pixel of the image sensor. Although the preferred embodiments of the present invention have been described, it is understood that the present invention should not be limited to these preferred embodiments but various changes and modifications can be made by one skilled in the art within the spirit and scope of the present invention as hereinafter claimed.

Claims

What is claimed is:

1. A method for fabricating an image sensor, comprising: a preparation step for preparing an image sensor element array wafer in which a photoelectric circuit has been formed; an applying step for applying a micro condenser element array material on the image sensor element array wafer; and a molding step for micro molding the micro condenser element array material applied on the image sensor element array wafer by using a mold for fabricating a micro condenser element array.

2. The method of claim 1 , wherein the mold for fabricating the micro condenser element array is fabricated by: a master fabrication step for fabricating a master according to a photolithography process using a gray scale mask; and a mold fabrication step for fabricating the mold by transferring patterns of the master to the mold.

3. The method of claim 1 , wherein the mold for fabricating the micro condenser element array is fabricated by: a master fabrication step for fabricating a master having concave patterns of the micro condenser element array on an ultraviolet transparent substrate; and a mold fabrication step for fabricating the mold having the concave patterns of the micro condenser element array transferred onto the ultraviolet transparent substrate by reactive ion etching the master.

4. The method of claim 1 , wherein the mold for fabricating the micro condenser element array is fabricated by: a master fabrication step for fabricating a master having convex patterns of the micro condenser element array; and a mold fabrication step for fabricating the mold having concave patterns by electroforming the master.

5. The method of one of claims 1 to 4, wherein the micro condenser element array material is a photopolymer, the mold for fabricating the micro condenser element array is an ultraviolet transparent mold for transmitting ultraviolet light, and the molding step cures the micro condenser element array material by irradiating ultraviolet light transmitting through the mold for fabricating the micro condenser element array, the mold for fabricating the micro condenser element array pressurizing the micro condenser element array material.

6. The method of claim 5, wherein the image sensor element array wafer comprises bond pads for wiring, the mold for fabricating the micro condenser element array comprises an ultraviolet barrier in the region corresponding to the bond pads, and the molding step performs a step for removing the photopolymer in the region to which the ultraviolet light have not been irradiated due to the ultraviolet barrier after the irradiation of the ultraviolet light.

7. The method of one of claims 1 to 4, wherein the micro condenser element array material is a thermocurable or thermoplastic polymer, and the molding step is performed by pressing the micro condenser element array material with the mold for fabricating the micro condenser element array, with heat applied to the micro condenser element array material.

8. The method of claim 7, wherein the image sensor element array wafer comprises bond pads for wiring, the method comprising the steps of: patterning a protective barrier on the region of the micro condenser element array which does not correspond to the bond pads; removing the micro condenser element array material in the protective barrier non-coated region according to an etching process; and removing the protective barrier after the molding step.

9. The method of one of claims 1 to 4, wherein a single mold for one image sensor element array wafer is used as the mold for fabricating the micro condenser element array to mold the micro condenser element array on the image sensor element array wafer at a time, and the molding step previously performs a step for aligning the mold for fabricating the micro condenser element array on the image sensor element array wafer.

10. The method of one of claims 1 to 4, wherein the micro condenser element array is selected from the group consisting of a micro lens array, a micro prism array and a micro mirror array.

11. The method of one of claims 1 to 4, wherein a groove for collecting air bubbles is formed in the region of the mold for fabricating the micro condenser element array which will be diced out during a process for dicing the image sensor element array wafer into chips after the molding step, and air bubbles generated during the molding step are collected in the groove.

12. A method for fabricating an image sensor, comprising the steps of: forming a micro condenser element array on an image sensor element array wafer on which bond pads for wiring and a photoelectric circuit have been formed; patterning a protective barrier on a region of the micro condenser element array which does not correspond to the bond pads; removing a protective barrier non-coated region of the micro condenser element array according to an etching process; and removing the protective barrier.

13. The method of claim 12, wherein the step for forming the micro condenser element array on the image sensor element array wafer aligns and adheres a micro condenser element array thin plate fabricated according to a micro molding process on the image sensor element array wafer.

14. An image sensor which is fabricated according to the method for fabricating the image sensor as recited in one of claims 1 to 4, the image sensor comprising micro condenser elements having individual shapes in each pixel.

15. The image sensor of claim 14, wherein the micro condenser element array material is a photopolymer, the mold for fabricating the micro condenser element array is an ultraviolet transparent mold for transmitting ultraviolet light, and the molding step cures the micro condenser element array material by irradiating ultraviolet light transmitted through the mold for fabricating the micro condenser element array, the mold for fabricating the micro condenser element array pressurizing the micro condenser element array material.

16. The image sensor of claim 14, wherein the micro condenser element array material is a thermocurable or thermoplastic polymer, and the molding step is performed by pressing the micro condenser element array material with the mold for fabricating the micro condenser element array, with heat applied to the micro condenser element array material.

17. A mold for fabricating a micro condenser element array which molds the micro condenser element array on an image sensor element array wafer including bond pads for wiring, the mold being comprised of an ultraviolet transparent material for transmitting ultraviolet light, and comprising an ultraviolet barrier in the region corresponding to the bond pads.

18. The mold of claim 17, wherein the ultraviolet barrier is fabricated by patterning a sacrificial layer in the region of the mold for fabricating the micro condenser element array which does not require the ultraviolet barrier, coating an ultraviolet barrier material on the micro condenser element array on which the sacrificial layer has been patterned, and removing the sacrificial layer according to a stripping process.

19. The mold of claim 17, which is fabricated by patterning the ultraviolet barrier on an ultraviolet transparent mold substrate, forming a pattern layer having concave micro condenser element array patterns on the mold substrate on which the ultraviolet barrier has been patterned, and transferring the concave micro condenser element array patterns to the mold substrate according to a reactive ion etching process.