WO2004110034A1 - Mobilfunkgerät - Google Patents
Mobilfunkgerät Download PDFInfo
- Publication number
- WO2004110034A1 WO2004110034A1 PCT/EP2004/050448 EP2004050448W WO2004110034A1 WO 2004110034 A1 WO2004110034 A1 WO 2004110034A1 EP 2004050448 W EP2004050448 W EP 2004050448W WO 2004110034 A1 WO2004110034 A1 WO 2004110034A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mobile radio
- radio device
- camera
- circuit board
- printed circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/16—Connectors or connections adapted for particular applications for telephony
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a mobile radio device with a circuit board arranged in the mobile radio device house, on which electronic components of the mobile radio device are arranged, and with a built-in camera.
- the object of the present invention is to provide a mobile radio device of the type mentioned at the outset, in which the connection between the camera and the circuit board of the mobile radio device can be established in a simple manner.
- This object is achieved according to the invention for the mobile radio device mentioned at the outset by the camera being soldered directly onto the circuit board of the mobile radio device and by an opening being provided in front of the camera in the mobile radio device house in the assembled state of the mobile radio device.
- circuit board with the components to be arranged thereon, including the camera is automatically populated. This can e.g. B. by means of an SMD process ge. The assembled circuit board can then be reflowed
- the mounting of the camera is therefore very simple and inexpensive. It goes without saying that such a method for mounting a camera is not only limited to mobile radio devices. So it is z. B. conceivable that such a method can also be used for example in PDAs.
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10326286A DE10326286A1 (de) | 2003-06-11 | 2003-06-11 | Mobilfunkgerät |
DE10326286.5 | 2003-06-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004110034A1 true WO2004110034A1 (de) | 2004-12-16 |
Family
ID=33494954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/050448 WO2004110034A1 (de) | 2003-06-11 | 2004-04-05 | Mobilfunkgerät |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10326286A1 (de) |
WO (1) | WO2004110034A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2197252A2 (de) | 2008-12-15 | 2010-06-16 | AMPHENOL-TUCHEL ELECTRONICS GmbH | Skalierbarer Kamerakontaktblock, Verfahren zur Herstellung des Kamerakontakblocks und Verfahren zum Einbau insbesondere einer SMD-Kamera in das Gehäuse eines Mobiltelefons |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1213924A1 (de) * | 2000-11-30 | 2002-06-12 | Mitsubishi Denki Kabushiki Kaisha | Mit Bildaufnahmevorrichtung versehene tragbare Fernsprecheinrichtung |
JP2002185826A (ja) * | 2000-12-15 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 基板実装用カメラおよび基板実装用カメラの実装方法 |
JP2002185827A (ja) * | 2000-12-15 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 基板実装用カメラ |
US20020130568A1 (en) * | 2001-03-15 | 2002-09-19 | Ludwig Angerpointner | Slip ring unit with a printed circuit board |
US20020154239A1 (en) * | 2001-04-24 | 2002-10-24 | Hisayoshi Fujimoto | Image sensor module and method of making the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19917438A1 (de) * | 1999-04-17 | 2000-10-19 | Bosch Gmbh Robert | Schaltungsanordnung und Verfahren zu ihrer Herstellung |
DE19934507A1 (de) * | 1999-07-22 | 2001-02-08 | Siemens Ag | Mobiles Bildtelefon |
-
2003
- 2003-06-11 DE DE10326286A patent/DE10326286A1/de not_active Ceased
-
2004
- 2004-04-05 WO PCT/EP2004/050448 patent/WO2004110034A1/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1213924A1 (de) * | 2000-11-30 | 2002-06-12 | Mitsubishi Denki Kabushiki Kaisha | Mit Bildaufnahmevorrichtung versehene tragbare Fernsprecheinrichtung |
JP2002185826A (ja) * | 2000-12-15 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 基板実装用カメラおよび基板実装用カメラの実装方法 |
JP2002185827A (ja) * | 2000-12-15 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 基板実装用カメラ |
US20020130568A1 (en) * | 2001-03-15 | 2002-09-19 | Ludwig Angerpointner | Slip ring unit with a printed circuit board |
US20020154239A1 (en) * | 2001-04-24 | 2002-10-24 | Hisayoshi Fujimoto | Image sensor module and method of making the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2197252A2 (de) | 2008-12-15 | 2010-06-16 | AMPHENOL-TUCHEL ELECTRONICS GmbH | Skalierbarer Kamerakontaktblock, Verfahren zur Herstellung des Kamerakontakblocks und Verfahren zum Einbau insbesondere einer SMD-Kamera in das Gehäuse eines Mobiltelefons |
EP2197252A3 (de) * | 2008-12-15 | 2010-09-29 | Amphenol-Tuchel Electronics GmbH | Skalierbarer Kamerakontaktblock, Verfahren zur Herstellung des Kamerakontakblocks und Verfahren zum Einbau insbesondere einer SMD-Kamera in das Gehäuse eines Mobiltelefons |
Also Published As
Publication number | Publication date |
---|---|
DE10326286A1 (de) | 2005-01-13 |
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