WO2004077901A3 - Carte de circuits imprimes et procede pour fixer des composants cables sur cette carte de circuits imprimes - Google Patents

Carte de circuits imprimes et procede pour fixer des composants cables sur cette carte de circuits imprimes Download PDF

Info

Publication number
WO2004077901A3
WO2004077901A3 PCT/EP2004/001983 EP2004001983W WO2004077901A3 WO 2004077901 A3 WO2004077901 A3 WO 2004077901A3 EP 2004001983 W EP2004001983 W EP 2004001983W WO 2004077901 A3 WO2004077901 A3 WO 2004077901A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
soldering
wired parts
during
Prior art date
Application number
PCT/EP2004/001983
Other languages
German (de)
English (en)
Other versions
WO2004077901A2 (fr
Inventor
Dietmar Birgel
Karl-Peter Hauptvogel
Original Assignee
Endress & Hauser Gmbh & Co Kg
Dietmar Birgel
Karl-Peter Hauptvogel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress & Hauser Gmbh & Co Kg, Dietmar Birgel, Karl-Peter Hauptvogel filed Critical Endress & Hauser Gmbh & Co Kg
Publication of WO2004077901A2 publication Critical patent/WO2004077901A2/fr
Publication of WO2004077901A3 publication Critical patent/WO2004077901A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Abstract

Les composants câblés posent souvent un problème lors du transport aérien des cartes de circuits imprimés équipées. S'ils ne sont ni collés, ni fixés sur la carte de circuits imprimés par des étriers de retenue ou des dispositifs d'encliquetage, ils peuvent tomber des alésages de passage. Cette invention permet de résoudre ce problème au moyen d'une carte de circuits imprimés et d'un procédé pour fixer des composants câblés sur cette carte de circuits imprimés. La carte de circuits imprimés (10) présente respectivement une cavité (24, 24') dans une zone périphérique des alésages de passage (20). Des extrémités libres courbées (22) des broches de connexion ou des fils de connexion (18) du composant câblé (16) sont placées dans ces cavités (24; 24''). Cette invention permet d'améliorer la qualité de la soudure, notamment dans le cas d'une soudure aérienne dans un four de soudage par refusion, en ce que la soudure (32) entre dans les cavités (24 ou 24') et dans les alésages de passage (20) lors d'une opération de soudage aérien. La longueur des fils de connexion (18) effectivement mouillée par la soudure (32) est supérieure à celle dans le cas d'une soudure classique, ce qui rend la soudure elle-même plus fiable.
PCT/EP2004/001983 2003-02-27 2004-02-27 Carte de circuits imprimes et procede pour fixer des composants cables sur cette carte de circuits imprimes WO2004077901A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10308817A DE10308817A1 (de) 2003-02-27 2003-02-27 Leiterplatte und Verfahren zur Fixierung von bedrahteten Bauteilen auf der Leiterplatte
DE10308817.2 2003-02-27

Publications (2)

Publication Number Publication Date
WO2004077901A2 WO2004077901A2 (fr) 2004-09-10
WO2004077901A3 true WO2004077901A3 (fr) 2004-10-28

Family

ID=32842026

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/001983 WO2004077901A2 (fr) 2003-02-27 2004-02-27 Carte de circuits imprimes et procede pour fixer des composants cables sur cette carte de circuits imprimes

Country Status (2)

Country Link
DE (1) DE10308817A1 (fr)
WO (1) WO2004077901A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825720B2 (ja) 2007-04-19 2011-11-30 矢崎総業株式会社 プリント配線板
DE102012112100A1 (de) * 2012-12-11 2014-06-12 Endress + Hauser Gmbh + Co. Kg Verfahren zur Herstellung von mischbestückten Leiterplatten
CN104064485B (zh) * 2014-06-30 2016-11-02 南通富士通微电子股份有限公司 半导体器件的导线焊点强化方法
CN104064540B (zh) * 2014-06-30 2017-01-04 南通富士通微电子股份有限公司 半导体器件的导线焊点强化结构
CN104078374B (zh) * 2014-06-30 2017-01-04 南通富士通微电子股份有限公司 半导体器件的导线焊接点强化方法
CN104244572A (zh) * 2014-07-15 2014-12-24 杭州华三通信技术有限公司 Pcb板结构
DE102015118626A1 (de) 2015-10-30 2017-05-04 Smiths Heimann Gmbh Oberflächenmontage bedrahteter bauelemente
WO2017216411A1 (fr) * 2016-06-13 2017-12-21 Coriant Oy Système de carte de circuit imprimé

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3228091A (en) * 1960-12-30 1966-01-11 Bendix Corp Method of making printed circuit board
GB2176942A (en) * 1983-11-10 1987-01-07 Donald Fort Sullivan Making printed circuit boards
US4696105A (en) * 1986-10-30 1987-09-29 Tektronix, Inc. Mounting method for electrical components having connections both on and off a circuit board
US4851614A (en) * 1987-05-22 1989-07-25 Compaq Computer Corporation Non-occluding mounting hole with solder pad for printed circuit boards
EP0341458A1 (fr) * 1988-05-13 1989-11-15 Pioneer Electronic Corporation Panneau à circuit double face
EP0367076A1 (fr) * 1988-10-27 1990-05-09 Salora Oy Connexion de traversée d'un panneau à circuit double face et procédé de fabrication d'une telle connexion
EP0618757A1 (fr) * 1993-04-02 1994-10-05 Siemens Aktiengesellschaft Arrangement de plaque à circuit imprimé et procédé de fabrication d'une plaque à circuit imprimé
US5455741A (en) * 1993-10-26 1995-10-03 Pulse Engineering, Inc. Wire-lead through hole interconnect device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238091A (ja) * 1988-03-18 1989-09-22 Hitachi Ltd プリント基板
GB9722305D0 (en) * 1997-10-23 1997-12-17 Alphr Technology Limited Method and apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3228091A (en) * 1960-12-30 1966-01-11 Bendix Corp Method of making printed circuit board
GB2176942A (en) * 1983-11-10 1987-01-07 Donald Fort Sullivan Making printed circuit boards
US4696105A (en) * 1986-10-30 1987-09-29 Tektronix, Inc. Mounting method for electrical components having connections both on and off a circuit board
US4851614A (en) * 1987-05-22 1989-07-25 Compaq Computer Corporation Non-occluding mounting hole with solder pad for printed circuit boards
EP0341458A1 (fr) * 1988-05-13 1989-11-15 Pioneer Electronic Corporation Panneau à circuit double face
EP0367076A1 (fr) * 1988-10-27 1990-05-09 Salora Oy Connexion de traversée d'un panneau à circuit double face et procédé de fabrication d'une telle connexion
EP0618757A1 (fr) * 1993-04-02 1994-10-05 Siemens Aktiengesellschaft Arrangement de plaque à circuit imprimé et procédé de fabrication d'une plaque à circuit imprimé
US5455741A (en) * 1993-10-26 1995-10-03 Pulse Engineering, Inc. Wire-lead through hole interconnect device

Also Published As

Publication number Publication date
WO2004077901A2 (fr) 2004-09-10
DE10308817A1 (de) 2004-09-09

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