WO2004067664A8 - Hitze-aktivierbare klebemasse für fpcb-verklebungen - Google Patents

Hitze-aktivierbare klebemasse für fpcb-verklebungen

Info

Publication number
WO2004067664A8
WO2004067664A8 PCT/EP2004/000679 EP2004000679W WO2004067664A8 WO 2004067664 A8 WO2004067664 A8 WO 2004067664A8 EP 2004000679 W EP2004000679 W EP 2004000679W WO 2004067664 A8 WO2004067664 A8 WO 2004067664A8
Authority
WO
WIPO (PCT)
Prior art keywords
agglutinations
fpcb
thermo
adhesive material
activated adhesive
Prior art date
Application number
PCT/EP2004/000679
Other languages
English (en)
French (fr)
Other versions
WO2004067664A1 (de
Inventor
Marc Husemann
Christian Ring
Dieter Zimmermann
Original Assignee
Tesa Ag
Marc Husemann
Christian Ring
Dieter Zimmermann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2003124737 external-priority patent/DE10324737A1/de
Priority claimed from DE10317403A external-priority patent/DE10317403A1/de
Application filed by Tesa Ag, Marc Husemann, Christian Ring, Dieter Zimmermann filed Critical Tesa Ag
Priority to EP04705391A priority Critical patent/EP1590415A1/de
Priority to US10/543,795 priority patent/US20060121272A1/en
Priority to JP2006501617A priority patent/JP2006517604A/ja
Publication of WO2004067664A1 publication Critical patent/WO2004067664A1/de
Publication of WO2004067664A8 publication Critical patent/WO2004067664A8/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Abstract

Klebstofffolie umfassend (i) mindestens ein thermoplastisches Polymer und/oder ein thermoplastisches Elastomer, (ii) mindestens ein Harz und (iii) mindestens ein organisch modifiziertes Schichtsilikat und/oder Betonit.
PCT/EP2004/000679 2003-01-29 2004-01-27 Hitze-aktivierbare klebemasse für fpcb-verklebungen WO2004067664A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04705391A EP1590415A1 (de) 2003-01-29 2004-01-27 Hitze-aktivierbare klebemasse für fpcb-verklebungen
US10/543,795 US20060121272A1 (en) 2003-01-29 2004-01-27 Thermo-activated adhesive material for fpcb agglutinations
JP2006501617A JP2006517604A (ja) 2003-01-29 2004-01-27 フレキシブルプリント基板接合のための熱活性化しうる接着剤

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE10303518 2003-01-29
DE10303518.4 2003-01-29
DE10317403.6 2003-05-30
DE2003124737 DE10324737A1 (de) 2003-05-30 2003-05-30 Hitze-aktivierbare Klebemass für FPCB-Verklebungen
DE10324737.8 2003-05-30
DE10317403A DE10317403A1 (de) 2003-01-29 2003-05-30 Verfahren zur Verklebung von FPCB's

Publications (2)

Publication Number Publication Date
WO2004067664A1 WO2004067664A1 (de) 2004-08-12
WO2004067664A8 true WO2004067664A8 (de) 2005-07-28

Family

ID=32830168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/000679 WO2004067664A1 (de) 2003-01-29 2004-01-27 Hitze-aktivierbare klebemasse für fpcb-verklebungen

Country Status (5)

Country Link
US (1) US20060121272A1 (de)
EP (1) EP1590415A1 (de)
JP (1) JP2006517604A (de)
KR (1) KR20050094048A (de)
WO (1) WO2004067664A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10361538A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper
DE10361537A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Thermoplastische Blends zur Implantierung von elektrischen Modulen in einen Kartenkörper
DE102006055093A1 (de) * 2006-11-21 2008-06-19 Tesa Ag Hitze-aktiviert verklebbares Flächenelement
JP2009029843A (ja) * 2007-07-24 2009-02-12 Sekisui Chem Co Ltd 半導体用接着剤及び半導体用接着テープ
DE102008046871A1 (de) * 2008-09-11 2010-03-18 Tesa Se Klebemasse mit hohem Repulsionswiderstand
EP2700683B1 (de) 2012-08-23 2016-06-08 3M Innovative Properties Company Haftstrukturfolie
DE102019207550A1 (de) * 2019-05-23 2020-11-26 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
DE102019209754A1 (de) 2019-07-03 2021-01-07 Tesa Se Thermisch härtender Klebstoff und daraus hergestelltes Klebeband

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52152585A (en) * 1976-06-10 1977-12-19 Katsuhiko Kanbayashi Method of producing oily resist printing material
US4465542A (en) * 1982-02-19 1984-08-14 Mitsui Petrochemical Industries, Ltd. Adhesive composition
US5026752A (en) * 1987-04-03 1991-06-25 Minnesota Mining And Manufacturing Company Amorphous-polypropylene-based hot melt adhesive
JPH01221236A (ja) * 1988-03-01 1989-09-04 Nitto Denko Corp 薄板補強用の接着性シート
DE69229262T2 (de) * 1992-03-16 2000-01-20 Raytheon Co Wärmetransferklebstoff
US5478885A (en) * 1994-04-15 1995-12-26 Shell Oil Company Composition of epoxy resin, epoxidized block polydiene and curing agent
CN1181139C (zh) * 1999-11-30 2004-12-22 大塚化学株式会社 树脂组合物和挠性印刷电路板
AU2002213585A1 (en) * 2000-04-10 2001-12-17 Henkel Kommanditgesellschaft Auf Aktien Impact-resistant epoxy resin compositions
DE10163859A1 (de) * 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe

Also Published As

Publication number Publication date
US20060121272A1 (en) 2006-06-08
WO2004067664A1 (de) 2004-08-12
JP2006517604A (ja) 2006-07-27
KR20050094048A (ko) 2005-09-26
EP1590415A1 (de) 2005-11-02

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