WO2004050256A1 - Düsenanordnung - Google Patents
Düsenanordnung Download PDFInfo
- Publication number
- WO2004050256A1 WO2004050256A1 PCT/EP2003/013421 EP0313421W WO2004050256A1 WO 2004050256 A1 WO2004050256 A1 WO 2004050256A1 EP 0313421 W EP0313421 W EP 0313421W WO 2004050256 A1 WO2004050256 A1 WO 2004050256A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid
- housing
- nozzle arrangement
- arrangement according
- longitudinal direction
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims abstract description 201
- 230000007423 decrease Effects 0.000 claims abstract description 15
- 238000009826 distribution Methods 0.000 claims description 25
- 238000003860 storage Methods 0.000 claims description 14
- 239000003351 stiffener Substances 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 abstract description 2
- 238000009825 accumulation Methods 0.000 abstract 1
- 238000011144 upstream manufacturing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
- B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
- B05B1/205—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor characterised by the longitudinal shape of the elongated body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Definitions
- the present invention relates to a nozzle arrangement as can be used for treating a workpiece with a treatment liquid or for flooding a corresponding treatment bath with a treatment liquid.
- the present invention relates to a surge nozzle arrangement which can be used, for example, in continuous systems for the wet-chemical treatment of printed circuit boards.
- Nozzle arrangements of the type mentioned are widely known.
- such nozzle arrangements are used in continuous systems for the wet chemical treatment of printed circuit boards in order to achieve the fastest and most uniform treatment of the continuous printed circuit boards.
- several such nozzle arrangements are arranged above and / or below the throughput plane of the printed circuit boards and transversely to the throughflow direction of the printed circuit boards, from which the corresponding treatment liquid is blasted onto or removed from the printed circuit board surface in order to ensure a constant and uniform exchange of the treatment liquid along the surface of the printed circuit boards.
- EP 1 187 515 A2 proposes a large number of different nozzle arrangements.
- Essentially round tubes with different nozzle shapes are used.
- these nozzle arrangements can have obliquely arranged slot nozzles, round nozzles arranged side by side in a plurality of rows, or else axially extending slot nozzles arranged side by side in a plurality of rows.
- DE 37 08 529 A1 also suggests the use of slot nozzles, the flow rate and the spray pressure of the respective medium being able to be set by means of a variable slot width of the corresponding nozzle.
- a nozzle for cleaning, activating and / or metallizing boreholes in horizontally continuous circuit boards, a nozzle is used which is arranged below the pass plane and perpendicular to the pass direction and from which a liquid treatment agent in the form of a standing wave is applied to the underside of the pass through PCB is promoted.
- the nozzle is arranged in the upper part of a nozzle housing, which is formed from a prechamber with an inlet connection, the prechamber in turn being separated from an upper part of the nozzle interior by means of a perforated mask.
- a distribution of the flow of the liquid treatment agent to the nozzle is achieved with the aid of the shadow mask.
- the interior of the nozzle in front of the actual (slit) nozzle serves as a prechamber for a uniform formation of the surge of the liquid treatment agent.
- EP 0 280 078 B1 discloses a nozzle arrangement for cleaning or chemical treatment of workpieces, in particular printed circuit boards, by means of a corresponding treatment liquid.
- the nozzle arrangement comprises a lower inlet box and a housing box, the treatment liquid being led through the lower inlet box into the interior of the housing box through bores located in the bottom of the housing box.
- the housing box in turn has a central partition in combination with two perforation levels and slots arranged above, which means that the treatment liquid flows to the two slots and two uniform, sinusoidal surge wave profiles are formed above them, which form the workpieces, in particular the drill holes of Flow through printed circuit boards and ensure an intensive mass transfer due to the venturi effect.
- the present invention is therefore based on the object of proposing a nozzle arrangement for dispensing a treatment liquid in which a largely uniform flow rate and flow rate of the treatment liquid can be achieved in the longitudinal direction of the nozzle arrangement. Further requirements which are preferably to be met are a high degree of compactness of the nozzle cross section in order to use as little space as possible in systems of the type mentioned above. In addition, the number of components and thus the manufacturing costs should be kept low. In addition, the jet or surge geometry and the jet direction should preferably always be the same at all outlet openings.
- the nozzle arrangement according to the invention has an elongated housing with at least one liquid supply opening for supplying a treatment liquid and with at least one liquid outlet opening formed in the housing for delivering the treatment liquid to the workpiece to be treated.
- a liquid channel for supplying the treatment liquid from the liquid supply opening to the at least one liquid outlet opening is formed in the housing.
- the at least one outlet opening can be designed in the form of a slot or as a series of round bores arranged one behind the other and evenly spaced from one another.
- the cross section of the liquid channel decreases from the liquid supply opening in the longitudinal direction of the housing, it being possible in particular to continuously reduce the cross section of the liquid channel in the longitudinal direction and along the at least one liquid outlet opening.
- an elongated insert in a housing with the same cross-section in the longitudinal direction, can be provided, the cross-section of which increases in the longitudinal direction starting from the liquid supply opening, so that the cross-section of the liquid channel decreases accordingly. Use is preferred over the.
- Liquid outlet openings arranged so that all liquid outlet openings have outlet channels of the same length.
- the thickness of the housing wall may increase on one or more sides in the longitudinal direction of the housing, starting from the liquid supply opening.
- the use inside the nozzle arrangement can, for. B. also be formed from individual sections or segments in large numbers. These can be displacement bodies or perforated bodies. So z. B. 60 pieces per nozzle arrangement according to the desired length, with different cross-section, or lined up with discs with different inner diameter.
- the individual sections can be glued, welded, held together with tie rods or with stiffening.
- the passage cross section for the liquid continuously decreases from section to section from the first segment at the liquid inlet to the end of the nozzle arrangement. If e.g. B. a section each has an outlet opening, the storage space in the cut be cylindrical and not conical. This creates a step-like liquid channel at very low manufacturing costs.
- the liquid channel is connected via a plurality of distributor openings spaced apart from one another in the longitudinal direction of the housing and having different lengths. If the length of these distributor openings is increasingly changed starting from the liquid supply opening in the longitudinal direction of the housing, the flow velocity of the treatment liquid can also be matched to the nozzle or liquid outlet openings over the entire length of the nozzle arrangement.
- the bores or distributor openings of different lengths result in different flow resistances, which lead to an equalization of the flow velocity.
- the previously mentioned distributor openings can all have the same diameter. However, it is also conceivable to design the distributor openings with different diameters. Decisive for the change in diameter is a different flow rate in the feed channel and the resulting different total pressure conditions.
- the above distributor openings can be designed in the form of corresponding bores in an insert of the type already mentioned above.
- the insert can be held in the housing with the aid of a preferably U-shaped stiffener.
- a storage space is provided between the at least one liquid outlet opening and the liquid channel, for example in the form of a corresponding milling or recess in the aforementioned insert, which serves for further pressure distribution and for reducing the dynamic forces.
- the distributor openings are arranged in such a way that the emerging liquid jet strikes the wall in which the liquid outlet openings are located. Then the jet is deflected at an angle and impinges against the wall of the milled insert, in order to then flow through the liquid outlet opening against the material to be treated or workpiece once again.
- the liquid supply opening or the inlet for the treatment liquid can be formed on a long side of the housing. Of course, however, it is also conceivable to arrange this liquid supply opening in a central section of the housing.
- the liquid outlet openings are preferably designed in the form of a plurality of slots spaced apart from one another in the longitudinal direction of the housing, all of which can have identical dimensions or also different dimensions. It is particularly advantageous if the liquid outlet openings are designed in the form of a plurality of rows of slots which are offset from one another and each run in the longitudinal direction of the housing. However, offset rows of holes can also be used instead of the offset rows of slots. In both cases there is an even flow of the material to be treated.
- Material to be treated is always the same. It should thus be avoided that the nozzle arrangement bends due to the back pressure or jet pressure of the treatment liquid. Even at higher temperatures or through the manufacturing process (e.g. Deformations caused by welding should be avoided.
- the required stability can in particular be achieved in that longitudinal stiffening parts made of metal are present on or in the nozzle arrangement.
- the nozzle arrangement according to the invention can in turn have a cross-section of the liquid channel that is preferably continuously reduced on both sides, a cover or a cover being attached to the housing in a liquid-tight manner on one side of the housing and defining the liquid outlet openings together with the housing.
- the liquid outlet openings are formed in particular by a plurality of slots which are arranged at a distance from one another in the longitudinal direction of the nozzle arrangement and which are arranged transversely to the longitudinal direction, i.e. run in the width direction of the nozzle arrangement, the liquid outlet openings being arranged on both sides of the nozzle arrangement.
- Each slot or connection channel is thus on the one hand connected to the liquid channel of the housing and on the other hand opens into two liquid outlet openings.
- This embodiment is particularly well suited for completely uniform flooding of treatment baths with a treatment liquid or a treatment medium.
- the flooding must be carried out as far as possible without the formation of rays or swirls which could increase the surface of the treatment liquid.
- the nozzle arrangement according to the exemplary embodiment described above fulfills this task by a uniform, slow flow speed over the entire effective length of the nozzle arrangement.
- the nozzle arrangement according to the invention is preferably suitable for use as a surge nozzle in wet chemical plants with a horizontal pass through
- the present invention is not limited to this preferred area of application. It can be used wherever a workpiece is to be flowed through with a treatment liquid via a nozzle arrangement, for example also for cleaning or chemical treatment etc. of the workpiece, or where a treatment bath with such a treatment liquid should be flooded as evenly as possible. In its most general form, the invention can therefore be used wherever the most uniform possible delivery of a treatment liquid is desired.
- FIG. 1 shows a side view of a nozzle arrangement according to the invention in a simple form in partial cross section along a section line B-B 'shown in FIG. 4,
- FIG. 2 shows a side view of a nozzle arrangement according to the invention as an alternative to FIG. 1 in a partial cross section along the section line B-B ′ shown in FIG. 4,
- FIG. 3 shows a side view of a nozzle arrangement according to the invention in a preferred embodiment with additional storage space for pressure distribution in the partial cross section along the section line B-B ′ shown in FIG. 4,
- FIG. 4 shows a plan view of the nozzle arrangement shown in FIG. 3 in partial cross section along a section line A-A 'shown in FIG. 3
- FIG. 5 shows a side view of an insert shown in FIGS. 3 and 4 and a stiffener for holding this insert in the nozzle arrangement
- FIG. 6 shows a side view of a nozzle arrangement according to the invention in an alternative embodiment to FIG. 3 or FIG. 4 in partial cross section along the section line B-B ′ shown in FIG. 4,
- FIG. 7 shows a cross-sectional view of the nozzle arrangement from FIG. 3 along a section line C-C ⁇ shown in FIG.
- FIG. 8 shows a side view of a nozzle arrangement according to the invention in accordance with a further exemplary embodiment in the form of a partial cross section
- FIG. 9 shows a plan view of the nozzle arrangement shown in FIG. 8 in partial cross section.
- FIG. 10 shows a cross-sectional view of the nozzle arrangement of FIG. 8 and FIG. 9 along a section line C-C shown in FIG.
- a surge nozzle suitable for electroplating systems with a horizontal passage of printed circuit boards comprises an essentially cuboid housing 2. On one end face of the housing 2 there is a connection piece 1 coupled to a liquid supply opening of the housing for the supply of a treatment liquid. On a side surface of the housing 2 which is to be arranged opposite the workpiece to be treated or the material to be treated, rows of slots or bores which are offset from one another are arranged and form outlet openings 8 for the treatment liquid. In the exemplary embodiments shown, all slot-like outlet openings or bores 8 have the same dimensions and consequently the same length and width or diameter. However, different dimensions can also be selected in order to generate a predetermined spray or gush pattern.
- a wedge-shaped insert 3 which is preferably made of plastic, and a U-shaped stiffener 4 for stabilizing this insert 3, which is made of a metal resistant to the chemicals used, such as. B. stainless steel, titanium, niobium or the like.
- the insert 3 serves to even out the flow velocity in the liquid channel and thus to evenly distribute the treatment liquid over the entire length of the nozzle arrangement.
- the insert 3 is tapered in the longitudinal direction, so that it has the smallest thickness at its end arranged adjacent to the connecting piece 1 and the greatest thickness at its opposite end. Between the insert 3 and the stiffening 4 there is a cavity serving as a liquid channel 5 for the treatment liquid. At the end coupled to the connecting piece 1, the flow cross section of this liquid channel 5 is consequently the largest and decreases continuously towards the opposite end, where the flow cross section is lowest.
- the nozzle arrangement On the surface facing the material to be treated, the nozzle arrangement has, along its length, the preferably uniformly spaced outlet openings 8 in the form of through bores, all of which have the same diameter in the exemplary embodiment shown.
- the nozzle arrangement can also be used.
- the length of these outlet openings 8 is the same over the entire length of the nozzle arrangement.
- the treatment liquid is fed to the nozzle arrangement in the direction of the arrow via the connecting piece 1 into the liquid channel 5 and passed on in the longitudinal direction to the outlet openings 8. Since the wedge-shaped insert 3 means that the flow velocity is the same at all points in the liquid channel 5 and all the outlet openings 8 have the same dimensions, a very uniform spray pattern is produced.
- the wedge-shaped insert is arranged in the upper part of the nozzle arrangement.
- the outlet openings 8 are congruent in the housing 2 and in the insert 3. This creates outlet channels of different lengths with the same diameter of the outlet openings.
- the outlet channels of different lengths can be used to further adjust the spray pattern. In the longer bores at a greater distance from the liquid inlet, there is an increasing flow resistance towards the end, which ensures a further adjustment of the flow conditions.
- a milling or recess as well as distributor openings 7 spaced apart in the longitudinal direction of the insert 3 are formed in an insert 3.
- the milling or recess on the insert 3 creates a storage space 6 for the treatment liquid between the distributor openings 7 of the insert 3 and the slot-like outlet openings 8 (not shown in this figure) formed in the housing 2, which storage space 6 serves for further pressure distribution.
- the liquid jet emerging from each distributor opening 7 is first blasted against the upper housing wall, from there it is directed obliquely downwards against the insert wall 3 in order to emerge through the slit-like outlet opening 8 to the material to be treated 10 after another change of direction. This deflection systematically reduces the dynamic force of the moving liquid.
- Figure 7 shows as section C-C, shown in Figure 3, further details of the nozzle arrangement.
- the distributor openings 7 are of different lengths due to the wedge-shaped insert 3. If this difference in length is disturbing, the bores for adapting the flow conditions can be provided with counterbores 9 of different lengths according to section D (shown in FIG. 3).
- a combination of the continuously decreasing liquid channel 5 from the feed opening to the opposite end of the nozzle arrangement in connection with the storage space 6 and the multiple deflection of the liquid flow before the outlet from the outlet openings 8 (e.g. a row of slots) ensures that the amount of the emerging Liquid per slot and the exit speed are the same.
- the stiffener 4 extends essentially over the entire length of the insert 3.
- the insert 3 is thickened by the wall thickness of the stiffener. This serves to seal the liquid channel 5 in the interior of the housing 2 of the nozzle arrangement (cf. also FIG. 3).
- the insert 3 is also thickened to the same extent along its upper side, so that it sits securely on the U-shaped stiffener 4, as can be seen in FIG.
- the thickening on the insert 3 can be omitted.
- the stiffening can additionally by means of z. B. screws attached to the housing. However, the screws should not protrude into the liquid channel 5.
- a uniform flow rate of the treatment liquid at the outlet openings 8 is realized in principle by two measures.
- the passage cross section for the treatment liquid in the interior of the nozzle arrangement that is to say in the liquid channel 5 decreases continuously from the connecting piece 1 to the end of the nozzle arrangement through the inclined insert 3.
- the distributor openings 7 do not direct the liquid jet directly to the material to be treated. Instead, it is deflected twice, only then to exit through the liquid outlet openings 8, in these examples these are rows of slots.
- the flow resistance in the distributor openings 7 increases continuously due to their continuously increasing length. So that this has no influence on the liquid distribution, the slope of the insert 3, in FIGS. and 5, preferably chosen to be somewhat flatter, so that a gap remains at the end of the nozzle arrangement. In the example in FIG. 3, the gap height at the end is approximately 4 mm.
- outlet openings 8 preferably all have the same widths or diameters, the same liquid volume per unit time also flows out at all outlet openings.
- FIG. 6 shows a further example of a nozzle arrangement with a storage space 6.
- the insert 3 is wedge-shaped and installed in the lower part of the nozzle arrangement.
- the insert 3 'in the upper part of the nozzle arrangement has the same cross section over the entire length.
- distributor holes 7. are all of the same length. Accordingly, the wedge-shaped liquid channel is more pointed at the end than shown in FIGS. 2, 3 and 5.
- connection piece 1 could be laid in the middle of the housing 2 of the nozzle arrangement, so that the treatment liquid is supplied in the center.
- the passage cross section of the liquid channel 5 in the interior of the housing 2 would decrease from the central connecting piece 1 to the two ends of the housing 2, that is to say on both sides, and the thickness of the insert 3 would increase accordingly widening starting from the central connecting piece 1 towards the two ends, so that the length of the distributor bores 7 in the insert 3 also increases on both sides.
- the continuously reducing passage cross section of the liquid channel 5 is realized solely by the increasing width of the insert 3.
- a plurality of side surfaces of the liquid channel 5 are increasingly widened in the longitudinal direction of the housing 2.
- the storage space 6 for further pressure distribution can optionally be dispensed with.
- the slit-like outlet openings 8 can also be provided with a different width, the width being able to decrease, in particular in the longitudinal direction of the housing 2, starting from the inlet connection 1. This usually leads to different volume flows, which can produce uneven results on the material to be treated.
- the distributor openings 7 can also be designed with different diameters, with a continuous reduction in the diameter of the distributor openings 7 being particularly conceivable for realizing a continuously increasing flow resistance, since the total pressure is highest towards the end of the nozzle arrangement.
- these countersinks 9 can be provided with a larger diameter (cf. FIG. 3).
- these countersinks can be provided with a different depth, in particular with a depth that increases continuously in the longitudinal direction of the housing 2.
- the stiffening 4 shown in the drawing can optionally also be dispensed with. It is also conceivable that the insert 3 and the housing 2 are configured in one piece.
- a plurality of outlet openings 8 spaced apart in the longitudinal direction of the housing 2 are provided, which are in particular evenly spaced apart and arranged in two rows of slots offset from one another, although in principle they function properly and satisfactorily the nozzle arrangement is guaranteed even with only one in particular elongated outlet opening 8, for example with only one outlet opening 8 extending in the longitudinal direction of the housing 2.
- FIG. 8-10 shows a further nozzle arrangement according to an exemplary embodiment of the present invention
- FIG. 8 a side view of the nozzle arrangement in partial cross section
- FIG. 9 a plan view of the nozzle arrangement in partial cross section
- FIG. 10 a cross sectional view of the nozzle arrangement along one shown in FIG Section line CC represents.
- the nozzle arrangement shown in FIGS. 8-10 is an exemplary embodiment which is particularly well suited for uniformly flooding treatment baths with a treatment liquid.
- the flooding must be carried out as far as possible without the formation of jets or swirls which could increase the surface of the treatment liquid. This is achieved by the nozzle arrangement shown in FIGS. 8-10 by a uniform, slow flow speed over the entire effective length of the nozzle arrangement.
- the nozzle arrangement shown in FIGS. 8-10 comprises a connecting piece 1 and an elongated, essentially cuboid-shaped housing 2, in which an insert 3 is installed, which has a liquid channel 5 in the longitudinal direction of the nozzle arrangement or the housing 2 continuously decreasing cross-section defined. From Figure 9 this is It can be seen that in particular the insert 3 reduces the cross section of the liquid channel 5 on both sides, the cross section of the liquid channel 5 being reduced continuously and uniformly from the connecting piece 1 to the end of the nozzle arrangement, so that the liquid channel 5 itself always has approximately the same flow rate Treatment liquid is present.
- a cover or a cover 11 is attached to the housing 2 in a liquid-tight manner by means of a suitable joining technique, such as, for example, by welding or gluing.
- a suitable joining technique such as, for example, by welding or gluing.
- the cover 11 has on its underside a multiplicity of transverse to
- the treatment liquid supplied via the connecting piece 1 of the nozzle arrangement can escape from the liquid channel 5 via the slots formed in the cover 11 at the liquid outlet openings 8 provided on both sides of the nozzle arrangement or the housing 2.
- FIGS. 8-10 can also be combined with the features of the nozzle arrangements previously described with reference to FIGS. 1-7.
- the description of the nozzle arrangement according to the invention relates in all exemplary embodiments to the conveying of the treatment liquid from the nozzle arrangement to the material to be treated.
- the nozzle arrangement also works in the same way for the suction of the treatment liquid from the material to be treated into the nozzle arrangement.
- This form of electrolyte delivery is particularly advantageous if degradation products are formed or solids are removed during the treatment. By sucking the treatment liquid into the shower senanowskiowskiowski the entrainment products or solids are entrained and thus get to a regeneration unit or z. B. a filter that removes the solids. An impairment of the treatment result by these substances is almost impossible.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nozzles (AREA)
- Percussion Or Vibration Massage (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Continuous Casting (AREA)
- Fuel-Injection Apparatus (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Surgical Instruments (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004556217A JP4331687B2 (ja) | 2002-11-29 | 2003-11-28 | ノズル配列構造 |
DE50303397T DE50303397D1 (de) | 2002-11-29 | 2003-11-28 | Düsenanordnung |
EP03785685A EP1565268B1 (de) | 2002-11-29 | 2003-11-28 | Düsenanordnung |
AU2003294745A AU2003294745A1 (en) | 2002-11-29 | 2003-11-28 | Nozzle arrangement |
US10/536,624 US7650897B2 (en) | 2002-11-29 | 2003-11-28 | Nozzle arrangement |
BR0316526-4A BR0316526A (pt) | 2002-11-29 | 2003-11-28 | Arranjo de bocal |
HK05107991A HK1075857A1 (en) | 2002-11-29 | 2005-09-12 | Nozzle arrangement |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10255884A DE10255884B4 (de) | 2002-11-29 | 2002-11-29 | Düsenanordnung |
DE10255884.1 | 2002-11-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004050256A1 true WO2004050256A1 (de) | 2004-06-17 |
Family
ID=32335852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/013421 WO2004050256A1 (de) | 2002-11-29 | 2003-11-28 | Düsenanordnung |
Country Status (15)
Country | Link |
---|---|
US (1) | US7650897B2 (de) |
EP (1) | EP1565268B1 (de) |
JP (1) | JP4331687B2 (de) |
KR (1) | KR100987400B1 (de) |
CN (1) | CN100352557C (de) |
AT (1) | ATE326283T1 (de) |
AU (1) | AU2003294745A1 (de) |
BR (1) | BR0316526A (de) |
DE (2) | DE10255884B4 (de) |
ES (1) | ES2263050T3 (de) |
HK (1) | HK1075857A1 (de) |
MY (1) | MY135613A (de) |
PL (1) | PL206436B1 (de) |
TW (1) | TWI276471B (de) |
WO (1) | WO2004050256A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3029721A1 (de) * | 2014-12-02 | 2016-06-08 | Tempress IP B.V. | Waferboot und dessen verwendung |
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DE102004002421A1 (de) * | 2004-01-16 | 2005-08-18 | Atotech Deutschland Gmbh | Düsenanordnung |
US9206514B2 (en) * | 2007-01-11 | 2015-12-08 | Peter Philip Andrew Lymn | Liquid treatment apparatus |
EP2234732B1 (de) * | 2007-12-17 | 2015-09-02 | Basf Se | Verfahren und vorrichtung zur herstellung von verbundelementen auf der basis von schaumstoffen auf isocyanatbasis |
IT1390869B1 (it) * | 2008-07-31 | 2011-10-19 | F M Srl | Unita' di erogazione di fluidi, in particolare smalti |
CN101865483B (zh) * | 2009-04-20 | 2013-12-11 | 王秀全 | 吸油烟机的喷淋器和引流器 |
CN102744224A (zh) * | 2012-07-12 | 2012-10-24 | 江苏尚能光伏精密设备有限公司 | 新型喷淋吹风装置 |
KR101966768B1 (ko) * | 2012-11-08 | 2019-04-08 | 엘지디스플레이 주식회사 | 기판 세정장치 |
EP2865502A1 (de) * | 2013-10-25 | 2015-04-29 | Applied Materials Switzerland Sàrl | Halbleiterdrahtsäge mit Düse zur Erzeugung eines Flüssigkeitsstrahls |
US9966281B2 (en) | 2013-11-15 | 2018-05-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and systems for chemical mechanical polish cleaning |
WO2016057425A1 (en) * | 2014-10-09 | 2016-04-14 | Usnr, Llc | Self-cleaning jet tube |
JP6385864B2 (ja) * | 2015-03-18 | 2018-09-05 | 株式会社東芝 | ノズルおよび液体供給装置 |
GB2564893B (en) * | 2017-07-27 | 2020-12-16 | Semsysco Gmbh | Distribution system for chemical and/or electrolytic surface treatment |
GB201713993D0 (en) * | 2017-08-31 | 2017-10-18 | Ge Healthcare Bio Sciences Ab | Air trapping device and nozzle therefore |
US11524191B2 (en) * | 2020-09-25 | 2022-12-13 | Susan Voggenthaler | Helicopter drizzle pipe |
KR20230025103A (ko) * | 2021-08-13 | 2023-02-21 | 삼성전자주식회사 | 성막 장치 |
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- 2002-11-29 DE DE10255884A patent/DE10255884B4/de not_active Expired - Fee Related
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2003
- 2003-11-26 TW TW092133235A patent/TWI276471B/zh not_active IP Right Cessation
- 2003-11-28 KR KR1020057007798A patent/KR100987400B1/ko active IP Right Grant
- 2003-11-28 AT AT03785685T patent/ATE326283T1/de active
- 2003-11-28 BR BR0316526-4A patent/BR0316526A/pt active Search and Examination
- 2003-11-28 CN CNB2003801028409A patent/CN100352557C/zh not_active Expired - Lifetime
- 2003-11-28 ES ES03785685T patent/ES2263050T3/es not_active Expired - Lifetime
- 2003-11-28 AU AU2003294745A patent/AU2003294745A1/en not_active Abandoned
- 2003-11-28 JP JP2004556217A patent/JP4331687B2/ja not_active Expired - Lifetime
- 2003-11-28 WO PCT/EP2003/013421 patent/WO2004050256A1/de active IP Right Grant
- 2003-11-28 MY MYPI20034561A patent/MY135613A/en unknown
- 2003-11-28 US US10/536,624 patent/US7650897B2/en active Active
- 2003-11-28 EP EP03785685A patent/EP1565268B1/de not_active Expired - Lifetime
- 2003-11-28 DE DE50303397T patent/DE50303397D1/de not_active Expired - Lifetime
- 2003-11-28 PL PL375201A patent/PL206436B1/pl unknown
-
2005
- 2005-09-12 HK HK05107991A patent/HK1075857A1/xx not_active IP Right Cessation
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US1971376A (en) * | 1932-10-29 | 1934-08-28 | United States Pipe Foundry | Apparatus for coating centrifugal pipe molds |
US5540247A (en) * | 1993-12-08 | 1996-07-30 | Dainippon Screen Mfg. Co., Ltd. | Immersion-type apparatus for processing substrates |
US5850841A (en) * | 1996-08-16 | 1998-12-22 | Lg Semicon Co., Ltd. | Cleaning apparatus of semiconductor device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3029721A1 (de) * | 2014-12-02 | 2016-06-08 | Tempress IP B.V. | Waferboot und dessen verwendung |
NL2013904B1 (en) * | 2014-12-02 | 2016-10-11 | Tempress Ip B V | Wafer boat and use thereof. |
Also Published As
Publication number | Publication date |
---|---|
ATE326283T1 (de) | 2006-06-15 |
KR100987400B1 (ko) | 2010-10-13 |
TWI276471B (en) | 2007-03-21 |
TW200427516A (en) | 2004-12-16 |
HK1075857A1 (en) | 2005-12-30 |
JP2006507929A (ja) | 2006-03-09 |
AU2003294745A1 (en) | 2004-06-23 |
ES2263050T3 (es) | 2006-12-01 |
DE10255884B4 (de) | 2006-05-11 |
DE10255884A1 (de) | 2004-06-24 |
KR20050084634A (ko) | 2005-08-26 |
US7650897B2 (en) | 2010-01-26 |
CN100352557C (zh) | 2007-12-05 |
PL206436B1 (pl) | 2010-08-31 |
MY135613A (en) | 2008-05-30 |
PL375201A1 (en) | 2005-11-28 |
US20060102213A1 (en) | 2006-05-18 |
CN1711140A (zh) | 2005-12-21 |
EP1565268B1 (de) | 2006-05-17 |
JP4331687B2 (ja) | 2009-09-16 |
EP1565268A1 (de) | 2005-08-24 |
DE50303397D1 (de) | 2006-06-22 |
BR0316526A (pt) | 2005-10-04 |
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