WO2004040949A1 - Carte de circuits imprimes pour des telephones mobiles - Google Patents

Carte de circuits imprimes pour des telephones mobiles Download PDF

Info

Publication number
WO2004040949A1
WO2004040949A1 PCT/DE2003/003617 DE0303617W WO2004040949A1 WO 2004040949 A1 WO2004040949 A1 WO 2004040949A1 DE 0303617 W DE0303617 W DE 0303617W WO 2004040949 A1 WO2004040949 A1 WO 2004040949A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
frame
mobile telephones
components
Prior art date
Application number
PCT/DE2003/003617
Other languages
German (de)
English (en)
Inventor
Matthias Stockel
Rene Crain
Klaus Kroesen
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2004040949A1 publication Critical patent/WO2004040949A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)

Abstract

L'invention concerne une carte de circuits imprimés pour des téléphones mobiles. La carte de circuits imprimés selon l'invention présente, sur au moins une face, des composants à grande surface qui sont reliés à la carte imprimée par liaison de forme ou de matière. Afin de stabiliser la carte de circuits imprimés, au moins un cadre (2) recevant un composant à grande surface (4) est relié de manière fixe à la carte de circuits imprimés (1).
PCT/DE2003/003617 2002-10-31 2003-10-30 Carte de circuits imprimes pour des telephones mobiles WO2004040949A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002150907 DE10250907A1 (de) 2002-10-31 2002-10-31 Leiterplatte für Mobiltelefone
DE10250907.7 2002-10-31

Publications (1)

Publication Number Publication Date
WO2004040949A1 true WO2004040949A1 (fr) 2004-05-13

Family

ID=32185294

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/003617 WO2004040949A1 (fr) 2002-10-31 2003-10-30 Carte de circuits imprimes pour des telephones mobiles

Country Status (2)

Country Link
DE (1) DE10250907A1 (fr)
WO (1) WO2004040949A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691593A1 (fr) * 2005-02-11 2006-08-16 Research In Motion Limited Châssis pour un dispositif monté au-dessus d'une carte à circuit imprimé dans un appareil électronique
US7362585B2 (en) 2005-02-11 2008-04-22 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
EP1746809A3 (fr) * 2005-07-19 2012-08-08 LG Electronics Inc. Module d'affichage et terminal mobile comprenant un tel module d'affichage

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010028164B4 (de) * 2010-04-23 2022-05-05 BSH Hausgeräte GmbH Bedieneinrichtung für ein Haushaltsgerät

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173198A (ja) * 1989-11-30 1991-07-26 Matsushita Electric Ind Co Ltd リモコン送信器
US5157723A (en) * 1991-02-21 1992-10-20 Northern Telecom Limited Mounts for articles
DE4405578A1 (de) * 1994-02-22 1995-08-24 Vdo Schindling Elektronische Baueinheit
JPH11153782A (ja) * 1997-11-19 1999-06-08 Matsushita Electric Ind Co Ltd 液晶表示装置およびその組立方法
EP1054549A2 (fr) * 1999-05-19 2000-11-22 DeTeWe - Deutsche Telephonwerke Aktiengesellschaft & Co. Dispositif de montage et de fixation d'un élément d'affichage optique dans un appareil de télécommunication
US6248957B1 (en) * 1998-08-10 2001-06-19 Fujitsu Limited Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member
EP1217807A1 (fr) * 2000-12-19 2002-06-26 Telefonaktiebolaget L M Ericsson (Publ) Assemblage de cartes de circuits imprimés

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20009217U1 (de) * 2000-05-22 2000-08-24 Lu Ping Chang Batteriesatz für Mobiltelefone

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173198A (ja) * 1989-11-30 1991-07-26 Matsushita Electric Ind Co Ltd リモコン送信器
US5157723A (en) * 1991-02-21 1992-10-20 Northern Telecom Limited Mounts for articles
DE4405578A1 (de) * 1994-02-22 1995-08-24 Vdo Schindling Elektronische Baueinheit
JPH11153782A (ja) * 1997-11-19 1999-06-08 Matsushita Electric Ind Co Ltd 液晶表示装置およびその組立方法
US6248957B1 (en) * 1998-08-10 2001-06-19 Fujitsu Limited Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member
EP1054549A2 (fr) * 1999-05-19 2000-11-22 DeTeWe - Deutsche Telephonwerke Aktiengesellschaft & Co. Dispositif de montage et de fixation d'un élément d'affichage optique dans un appareil de télécommunication
EP1217807A1 (fr) * 2000-12-19 2002-06-26 Telefonaktiebolaget L M Ericsson (Publ) Assemblage de cartes de circuits imprimés

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 417 (E - 1125) 23 October 1991 (1991-10-23) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691593A1 (fr) * 2005-02-11 2006-08-16 Research In Motion Limited Châssis pour un dispositif monté au-dessus d'une carte à circuit imprimé dans un appareil électronique
US7362585B2 (en) 2005-02-11 2008-04-22 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US8233282B2 (en) 2005-02-11 2012-07-31 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
US8824152B2 (en) 2005-02-11 2014-09-02 Blackberry Limited Cover for a frame for a device mounted above a printed circuit board in an electronic device
US9052870B2 (en) 2005-02-11 2015-06-09 Blackberry Limited System and frame for mounting a device above a printed circuit board in an electronic device
EP1746809A3 (fr) * 2005-07-19 2012-08-08 LG Electronics Inc. Module d'affichage et terminal mobile comprenant un tel module d'affichage

Also Published As

Publication number Publication date
DE10250907A1 (de) 2004-06-03

Similar Documents

Publication Publication Date Title
DE102006028066A1 (de) Flüssigkristallanzeigeeinrichtung
DE19710514A1 (de) Steckkarte für elektronische Geräte
EP3569042B1 (fr) Module électronique et base de montage comportant un module électronique
WO2004040949A1 (fr) Carte de circuits imprimes pour des telephones mobiles
DE2812332B2 (de) Vielfachsteckverbindung für Karten mit gedruckter Schaltung
EP0838989B1 (fr) Baie électronique blindée
DE102006008011A1 (de) Tragbarer elektronischer Zeitmesser
DE3048765C2 (de) Gehäuse für Fernsprechgeräte
DE8616888U1 (de) Haltevorrichtung für ein elektronisches Display
EP1441579B1 (fr) Elément de couvercle ou de fond d'une baie électronique
DE3410983A1 (de) Montageelement zur befestigung einer lcd-anzeige auf einer leiterplatte
DE10152214A1 (de) Leiterplatte für Mobiltelefone
DE19631886C2 (de) Anschlußfeld an einer Gehäusewand eines Rechnergehäuses
DE3706739C2 (fr)
AT500305A1 (de) Abstützelement für eine auf einer ersten leiterplatte angeordnete zweite leiterplatte
DE10322973B3 (de) Anordnung zur Ableitung von Überspannungen
DE202017102246U1 (de) Schutzstruktur eines Bildaufnahmemoduls
DE2645116A1 (de) Gehaeuse, insbesondere einschubgehaeuse fuer elektrische oder elektronische o.dgl. baugruppen
DE19548557C2 (de) Anordnung aus einer flexiblen Leiterplatte und einem hiermit zu verbindenden Bauteil
DE3301568A1 (de) Vorrichtung zum gegenseitigen ausrichten zweier steckverbinderteile
DE3108788A1 (de) Gestelleinsatz fuer geraete der nachrichtentechnik
DE102011076290A1 (de) Stern-Dreieck-Verdrahtung, insbesondere für eine Schützschaltung auf einer Montageplatte
DE102006048644B3 (de) Slotfeld für einen Rechner
DE60305956T2 (de) Verstärkungsband
DE202018102547U1 (de) Tastenaufbau mit einem Anzeigemodul

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CN JP KR

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Ref document number: JP

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)