WO2004038766A3 - Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging - Google Patents

Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging Download PDF

Info

Publication number
WO2004038766A3
WO2004038766A3 PCT/IB2003/004652 IB0304652W WO2004038766A3 WO 2004038766 A3 WO2004038766 A3 WO 2004038766A3 IB 0304652 W IB0304652 W IB 0304652W WO 2004038766 A3 WO2004038766 A3 WO 2004038766A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrostatic chuck
top plate
wafer
gas scavenging
wafer port
Prior art date
Application number
PCT/IB2003/004652
Other languages
French (fr)
Other versions
WO2004038766A2 (en
Inventor
Peter L Kellerman
Kevin T Ryan
Robert J Mitchell
Original Assignee
Axcelis Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc filed Critical Axcelis Tech Inc
Priority to AU2003274407A priority Critical patent/AU2003274407A1/en
Priority to JP2004546285A priority patent/JP2006504239A/en
Priority to EP03758388A priority patent/EP1556884A2/en
Publication of WO2004038766A2 publication Critical patent/WO2004038766A2/en
Publication of WO2004038766A3 publication Critical patent/WO2004038766A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

An apparatus for processing a semiconductor wafer. The apparatus according to the present invention comprises a wafer port flange including an electrostatic chuck and a top plate including a lip. The electrostatic chuck defines a circumferential gas distribution groove and a gas gap positioned between a backside of a semiconductor wafer and the electrostatic chuck. The lip is positioned to shield an outside band of the wafer. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
PCT/IB2003/004652 2002-10-23 2003-10-22 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging WO2004038766A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2003274407A AU2003274407A1 (en) 2002-10-23 2003-10-22 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
JP2004546285A JP2006504239A (en) 2002-10-23 2003-10-22 Electrostatic chuck wafer port and top plate for edge shield and gas discharge
EP03758388A EP1556884A2 (en) 2002-10-23 2003-10-22 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/278,640 2002-10-23
US10/278,640 US20040079289A1 (en) 2002-10-23 2002-10-23 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging

Publications (2)

Publication Number Publication Date
WO2004038766A2 WO2004038766A2 (en) 2004-05-06
WO2004038766A3 true WO2004038766A3 (en) 2004-07-22

Family

ID=32106584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2003/004652 WO2004038766A2 (en) 2002-10-23 2003-10-22 Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging

Country Status (8)

Country Link
US (1) US20040079289A1 (en)
EP (1) EP1556884A2 (en)
JP (1) JP2006504239A (en)
KR (1) KR20050051713A (en)
CN (1) CN1706026A (en)
AU (1) AU2003274407A1 (en)
TW (1) TW200409274A (en)
WO (1) WO2004038766A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7633305B2 (en) * 2004-09-13 2009-12-15 Shin-Etsu Handotai Co., Ltd. Method for evaluating semiconductor wafer and apparatus for evaluating semiconductor wafer
EP1993128A3 (en) * 2007-05-17 2010-03-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing soi substrate
US20090084988A1 (en) * 2007-09-27 2009-04-02 Varian Semiconductor Equipment Associates, Inc. Single wafer implanter for silicon-on-insulator wafer fabrication
WO2020068254A1 (en) 2018-09-25 2020-04-02 Applied Materials, Inc. Methods and apparatus to eliminate wafer bow for cvd and patterning hvm systems
US11670483B2 (en) * 2019-05-01 2023-06-06 Axcelis Technologies, Inc. High power wafer cooling
CN114959600B (en) * 2022-05-31 2023-08-18 北京北方华创微电子装备有限公司 Process chamber and semiconductor process equipment

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555145A (en) * 1991-08-27 1993-03-05 Hitachi Ltd Substrate heater
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
EP0660378A1 (en) * 1993-12-20 1995-06-28 International Business Machines Corporation Electrostatic chuck with oxide insulator
EP0847085A2 (en) * 1996-12-04 1998-06-10 Applied Materials, Inc. Method and apparatus for both mechanically and electrostatically clamping a wafer
US6051122A (en) * 1997-08-21 2000-04-18 Applied Materials, Inc. Deposition shield assembly for a semiconductor wafer processing system
US6149730A (en) * 1997-10-08 2000-11-21 Nec Corporation Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor
US6378600B1 (en) * 1997-09-26 2002-04-30 Cvc Products, Inc. Thermally conductive chuck with thermally separated sealing structures
JP2002261157A (en) * 2001-02-27 2002-09-13 Kyocera Corp Electrostatic chuck and treating device

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Publication number Priority date Publication date Assignee Title
US4261762A (en) * 1979-09-14 1981-04-14 Eaton Corporation Method for conducting heat to or from an article being treated under vacuum
US4514636A (en) * 1979-09-14 1985-04-30 Eaton Corporation Ion treatment apparatus
US4599135A (en) * 1983-09-30 1986-07-08 Hitachi, Ltd. Thin film deposition
US5292399A (en) * 1990-04-19 1994-03-08 Applied Materials, Inc. Plasma etching apparatus with conductive means for inhibiting arcing
US5447570A (en) * 1990-04-23 1995-09-05 Genus, Inc. Purge gas in wafer coating area selection
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
US5436790A (en) * 1993-01-15 1995-07-25 Eaton Corporation Wafer sensing and clamping monitor
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
TW357404B (en) * 1993-12-24 1999-05-01 Tokyo Electron Ltd Apparatus and method for processing of plasma
US5548470A (en) * 1994-07-19 1996-08-20 International Business Machines Corporation Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity
US5805408A (en) * 1995-12-22 1998-09-08 Lam Research Corporation Electrostatic clamp with lip seal for clamping substrates
US6284093B1 (en) * 1996-11-29 2001-09-04 Applied Materials, Inc. Shield or ring surrounding semiconductor workpiece in plasma chamber
US5922133A (en) * 1997-09-12 1999-07-13 Applied Materials, Inc. Multiple edge deposition exclusion rings
US6120607A (en) * 1998-12-03 2000-09-19 Lsi Logic Corporation Apparatus and method for blocking the deposition of oxide on a wafer
US6373679B1 (en) * 1999-07-02 2002-04-16 Cypress Semiconductor Corp. Electrostatic or mechanical chuck assembly conferring improved temperature uniformity onto workpieces held thereby, workpiece processing technology and/or apparatus containing the same, and method(s) for holding and/or processing a workpiece with the same
US6206976B1 (en) * 1999-08-27 2001-03-27 Lucent Technologies Inc. Deposition apparatus and related method with controllable edge exclusion
US6377437B1 (en) * 1999-12-22 2002-04-23 Lam Research Corporation High temperature electrostatic chuck
JP5165817B2 (en) * 2000-03-31 2013-03-21 ラム リサーチ コーポレーション Electrostatic chuck and manufacturing method thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555145A (en) * 1991-08-27 1993-03-05 Hitachi Ltd Substrate heater
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
EP0660378A1 (en) * 1993-12-20 1995-06-28 International Business Machines Corporation Electrostatic chuck with oxide insulator
EP0847085A2 (en) * 1996-12-04 1998-06-10 Applied Materials, Inc. Method and apparatus for both mechanically and electrostatically clamping a wafer
US6051122A (en) * 1997-08-21 2000-04-18 Applied Materials, Inc. Deposition shield assembly for a semiconductor wafer processing system
US6378600B1 (en) * 1997-09-26 2002-04-30 Cvc Products, Inc. Thermally conductive chuck with thermally separated sealing structures
US6149730A (en) * 1997-10-08 2000-11-21 Nec Corporation Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor
JP2002261157A (en) * 2001-02-27 2002-09-13 Kyocera Corp Electrostatic chuck and treating device
US6643115B2 (en) * 2001-02-27 2003-11-04 Kyocera Corporation Electrostatic chuck

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 353 (E - 1393) 5 July 1993 (1993-07-05) *
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 01 14 January 2003 (2003-01-14) *

Also Published As

Publication number Publication date
WO2004038766A2 (en) 2004-05-06
EP1556884A2 (en) 2005-07-27
JP2006504239A (en) 2006-02-02
KR20050051713A (en) 2005-06-01
CN1706026A (en) 2005-12-07
TW200409274A (en) 2004-06-01
AU2003274407A1 (en) 2004-05-13
US20040079289A1 (en) 2004-04-29

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