WO2004023515A1 - Zerstäubungskatode, herstellverfahren sowie katode hierzu - Google Patents
Zerstäubungskatode, herstellverfahren sowie katode hierzu Download PDFInfo
- Publication number
- WO2004023515A1 WO2004023515A1 PCT/CH2003/000580 CH0300580W WO2004023515A1 WO 2004023515 A1 WO2004023515 A1 WO 2004023515A1 CH 0300580 W CH0300580 W CH 0300580W WO 2004023515 A1 WO2004023515 A1 WO 2004023515A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- friction
- reducing layer
- target
- layer
- cathode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004533148A JP2005537391A (ja) | 2002-09-03 | 2003-08-27 | スパッタ陰極、製造方法およびこれに関する陰極 |
AU2003250728A AU2003250728A1 (en) | 2002-09-03 | 2003-08-27 | Sputtering cathode, production method and corresponding cathode |
EP03793554A EP1537597A1 (de) | 2002-09-03 | 2003-08-27 | Zerst ubungskatode, herstellverfahren sowie katode hierzu |
US10/525,993 US20060163059A1 (en) | 2002-09-03 | 2003-08-27 | Sputtering cathode, production method and corresponding cathode |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1501/02 | 2002-09-03 | ||
CH15012002 | 2002-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004023515A1 true WO2004023515A1 (de) | 2004-03-18 |
Family
ID=31954544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CH2003/000580 WO2004023515A1 (de) | 2002-09-03 | 2003-08-27 | Zerstäubungskatode, herstellverfahren sowie katode hierzu |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060163059A1 (de) |
EP (1) | EP1537597A1 (de) |
JP (1) | JP2005537391A (de) |
AU (1) | AU2003250728A1 (de) |
TW (1) | TW200404103A (de) |
WO (1) | WO2004023515A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8123107B2 (en) * | 2004-05-25 | 2012-02-28 | Praxair S.T. Technology, Inc. | Method for forming sputter target assemblies |
US9831072B2 (en) * | 2011-06-30 | 2017-11-28 | View, Inc. | Sputter target and sputtering methods |
DE102013011074A1 (de) * | 2013-07-03 | 2015-01-08 | Oerlikon Trading Ag | An eine indirekte Kühlvorrichtung angepasstes Target mit Kühlplatte |
RU2717129C1 (ru) * | 2019-09-16 | 2020-03-18 | федеральное государственное бюджетное образовательное учреждение высшего образования "Ульяновский государственный технический университет" | Способ получения многослойного покрытия для режущего инструмента |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4209375A (en) * | 1979-08-02 | 1980-06-24 | The United States Of America As Represented By The United States Department Of Energy | Sputter target |
DE4015388A1 (de) * | 1990-05-14 | 1991-11-21 | Leybold Ag | Kathodenzerstaeubungsvorrichtung |
WO1992017622A1 (en) * | 1991-04-08 | 1992-10-15 | Tosoh Smd, Inc. | Thermally compatible sputter target and backing plate assembly |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3815457A1 (de) * | 1988-05-06 | 1989-11-16 | Sipra Patent Beteiligung | Strickmaschine |
JPH01290765A (ja) * | 1988-05-16 | 1989-11-22 | Toshiba Corp | スパッタリングターゲット |
US6071389A (en) * | 1998-08-21 | 2000-06-06 | Tosoh Smd, Inc. | Diffusion bonded sputter target assembly and method of making |
US6831221B2 (en) * | 2000-09-05 | 2004-12-14 | Tara Investments, Llc | System and method for power generation |
-
2003
- 2003-08-27 JP JP2004533148A patent/JP2005537391A/ja not_active Withdrawn
- 2003-08-27 US US10/525,993 patent/US20060163059A1/en not_active Abandoned
- 2003-08-27 EP EP03793554A patent/EP1537597A1/de not_active Withdrawn
- 2003-08-27 WO PCT/CH2003/000580 patent/WO2004023515A1/de not_active Application Discontinuation
- 2003-08-27 AU AU2003250728A patent/AU2003250728A1/en not_active Abandoned
- 2003-09-01 TW TW092124086A patent/TW200404103A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4209375A (en) * | 1979-08-02 | 1980-06-24 | The United States Of America As Represented By The United States Department Of Energy | Sputter target |
DE4015388A1 (de) * | 1990-05-14 | 1991-11-21 | Leybold Ag | Kathodenzerstaeubungsvorrichtung |
WO1992017622A1 (en) * | 1991-04-08 | 1992-10-15 | Tosoh Smd, Inc. | Thermally compatible sputter target and backing plate assembly |
Also Published As
Publication number | Publication date |
---|---|
JP2005537391A (ja) | 2005-12-08 |
EP1537597A1 (de) | 2005-06-08 |
US20060163059A1 (en) | 2006-07-27 |
TW200404103A (en) | 2004-03-16 |
AU2003250728A1 (en) | 2004-03-29 |
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