WO2004017688A1 - Depot de matieres solides - Google Patents

Depot de matieres solides Download PDF

Info

Publication number
WO2004017688A1
WO2004017688A1 PCT/GB2003/003375 GB0303375W WO2004017688A1 WO 2004017688 A1 WO2004017688 A1 WO 2004017688A1 GB 0303375 W GB0303375 W GB 0303375W WO 2004017688 A1 WO2004017688 A1 WO 2004017688A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductive
deposition
component
electrodes
Prior art date
Application number
PCT/GB2003/003375
Other languages
English (en)
Inventor
Daniel Robert Johnson
William Norman Damerell
Original Assignee
Qinetiq Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinetiq Limited filed Critical Qinetiq Limited
Priority to AU2003252969A priority Critical patent/AU2003252969A1/en
Publication of WO2004017688A1 publication Critical patent/WO2004017688A1/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1607Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Definitions

  • the present invention relates to the deposition of solid materials. It provides a method of doing so, and a printer for doing so.
  • PCBs printed circuit boards
  • Electroless deposition is used to coat whole surfaces, and the formation of metal patterns requires additional and costly processing such as photolithography and etching.
  • Existing PCB technology uses lithographic techniques to obtain a resolution of 50 m, but this is an optimal outcome that is not typically available over the whole of a large PCB.
  • the process is also limited by inherent flaws such as errors arising from faulty or damaged lithographs, scatter of light, and possible undercutting of metal tracks during etching.
  • the present invention seeks to provide a 'solid' printer which can deposit electrical components, and/or a process for doing so. This needs to be able to deposit an essentially solid material and/or a material which can subsequently interact and/or change its properties, for example to produce another material that may solidify or change its physical state.
  • Another method uses finely divide or even nanometric size particles of conductive metals or similar. This too has many problems, one being the cost of such finely divided materials. Another is keeping the particles from settling and/or clogging of any picolitre dosing device such as used in ink jet or bubble jet methods. Also particles of metal making occasional physical contact are inferior as a conductor as compared to continuous metal. Furthermore, while this conductivity can be improved by heating, the temperatures required ( ⁇ 300°C) are too high for most substrates, and the extra process adds cost and complexity.
  • One objective of the present invention is to deposit material directly onto the substrate by using a fluid applicator such as an inkjet printer to apply at least two fluids which react to yield the material whose deposition is required, particularly where a conductive metal is needed.
  • a fluid applicator such as an inkjet printer to apply at least two fluids which react to yield the material whose deposition is required, particularly where a conductive metal is needed.
  • a conductive area is formed, covered with a thin non-conductive layer, and further covered with a conductive layer. This will form a capacitor as part of the PCB or other substrate itself.
  • Other single or multi-component devices such as oxide coatings, capacitors and multifunctional multilayer composite structures can be formed in this way.
  • Cells can be formed by suitable galvanic or electrochemical layered structures.
  • a significant advantage of the present invention comes from the ability to meter exact quantities through the printing process, thereby achieving a high level of control over the type of materials fabricated and the yield and cost of production processes. For example, exact quantities of expensive materials may be deposited, layers may be built to precise thicknesses and materials of known stoichiometry and density may be prepared.
  • the present invention therefore provides a deposition apparatus, comprising a printhead adapted to deposit fluid agents on a substrate, reservoirs associated with the printhead containing reagents for deposition on the substrate, including at least one reagent capable of reaction on the surface to produce a conductive deposit.
  • the components to be deposited can be batteries or cells, such as electrochemical, bimetallic or other galvanic cells.
  • an electrochemical cell can be constructed using electrodes on either side of a porous substrate in which is provided the electrolyte.
  • Capacitors can be provided by means of a parallel plate with a deposited dielectric between the plates, or by way of a parallel plate with the substrate forming the insulating layer. Where the substrate is porous it can again be treated to provide a dielectric layer.
  • Fuel cells can also be provided by appropriate design of the structure.
  • Conductors can be electronic or ionic in nature.
  • the reagent is preferably non- conductive prior to reaction.
  • a wide variety of reactions are suitable, including catalytic and auto-catalytic deposition.
  • the device can be encapsulated, for example by depositing a two-phase adhesive over at least the active area.
  • a pair of electrodes can be deposited in an interlacing arrangement such as a pair of interlocking comb-shapes. This will maximise the length over which they are adjacent. An electrolyte between such electrodes will therefore experience a large surface area but with minimal use of space.
  • the component can include plated layers, which can be deposited in place as described herein or which can be electrochemically plated in a selective fashion onto areas of the substrate which have been pre-treated using a deposition apparatus.
  • all of the layers of the electrical component are formed by the deposition method set out herein, but significant advantages can still be obtained if only selected layers are deposited by this method.
  • This route offers significant advantages in particular, it is a low temperature process capable of operating below 300°C and preferably below 100°C, and it operates via a non-contact process.
  • Figure 1 shows a typical battery electrode fabrication methodology using inkjet printing.
  • Figure 2 shows how the formed electrodes are combined to form a battery or capacitor.
  • Figure 3 shows how the properties of an electrode such as adhesion and surface area can be enhanced by the porosity of the substrate material.
  • This invention describes the principle of using inkjet printing to deposit materials fabricated into electrodes for electrochemical power sources or the "battery” as herein defined. Additionally, methods are described for the formation of other electrical storage devices such as capacitors, for example, super capacitors. Accordingly, the objective of the present invention is to use print transfer mechanisms to deposit patterns and textures of materials that may be fabricated into electrodes for use in the "battery” and "capacitor".
  • the battery is a device that enables energy liberated from a chemical reaction to be converted directly into electricity. It is invariably a portable source of power and in many circumstances may be needed to store electrical energy from an external source for later use.
  • the battery comprises two electrodes, one the anode and the other the cathode, both of which have a metal electrical collector and an "active material" herein defined as materials that enter into the electrochemical reaction.
  • the metal collector itself can be an active material as in the case of for example the lithium battery or lead/acid battery. Otherwise, the collector metal may conveniently contain additional active material for example an oxide coating or a stored gas.
  • Many cell types exist based upon dissimilar anode and cathode materials which form a redox couple.
  • the electrochemical reaction between the electrodes may be irreversible (primary cells) or reversible (secondary or rechargeable cells).
  • primary cells primary cells
  • secondary or rechargeable cells reversible cells
  • a new generation of fuel cells that employ electrodes to synthesise, store and/or convert hydrogen or organic molecules directly into electrical power.
  • Batteries are useful for a wide range of applications from vehicle propulsion, energy load levelling of utility electricity, and backup supplies to equipment from computers to memory chips.
  • the battery substrate is a thin sheet of material, e.g. a polymer or synthetic inkjet paper
  • the power source may be integrated into a powered device on the same sheet, or may equally be easily laminated to the sheet.
  • Examples include electronic paper, visual displays such as liquid crystal displays and proprietary systems such as Zenithal Bistable Display (ZBD), or light emitting materials such as electrolumiscents and other light emitting polymers.
  • the devices may also be used to power "active" radio frequency emitters and readers such as those employed in security tagging, anticounterfeiting and other fields e.g. hygiene, food safety etc.
  • the battery may be thus disposable (primary type) or rechargeable allowing the device it powers to be reactivated and not wasted.
  • the re-charger may also include other remote power sources such as thin film solar cells, integrated into the structure.
  • electrodes that are separated by a dielectric layer form the basis of the capacitor.
  • the surface area of the electrodes essentially governs the capacity of these as storage devices and with super capacitors the electrodes are designed to exploit this fact.
  • the electrodes described herein will also have their properties affected using the inkjet printing method, for example materials may be incorporated into the printed layer such as particle fillers and material binders, to improve robustness and/or increase the surface area of active materials.
  • the inkjet is also proposed as the most cost-effective way or providing such surfaces onto and into electrode materials.
  • the final device can be substantially fabricated using inkjet printing, for example by deposition of electrolyte materials, as liquids, or formed from liquids into gels and solids.
  • Equally the whole device can then be encapsulated using adhesives and sealant printed by said method.
  • inkjet printing is a novel prototyping and manufacturing process for the fabrication of the battery and capacitor.
  • the utilisation of materials and low waste make the process cost- effective and easy to integrated into CAD/CAM.
  • a number of electrodes may be fabricated on a range of substrates to produce designs of batteries and capacitors suitable for a particular application.
  • the electrodes can operate as charge collection materials for electrical connection and termination and include active materials as defined above.
  • metal electrodes are fabricated by first inkjet printing patterns of inks that are able to sponsor electroless metal deposition.
  • the inks may contain fine dispersions of catalytic or autocatalytic metals, or alternatively these may be formed by inkjet printing precursor reagents from separate devices such that they react near or on the substrate to produce the same.
  • the resulting pattern of printed material is thus able to sponsor electroless deposition of the same metal (autocatalytic) or a range of less noble metals (catalytic).
  • the metals can then form the basis of battery electrodes. These may be used directly as electrodes of differing electroless metals to form a redox couple i.e. galvanic cell in an electrolyte.
  • active battery materials may be formed on these layers as oxides or chalcogenides, by chemical reaction or alternatively, inkjet coated with the same active materials.
  • the electroless metal electrode may also be electroplated with another metal to of a higher redox potential than itself to generate other electrode configurations.
  • the electroless metal can be deposited using a platinum series catalyst to sponsor deposition e.g. Pt or Pd materials by inkjet printing. Where necessary, the electroless metal deposit can once more be inkjet printed with the same or different platinum series catalysts onto and into it, the resulting surface-catalysed metal, e.g. Platinum or Nickel can then be fabricated into an electrode used in a hydrogen or hydrocarbon fuel cell where the catalyst material is able to sponsor chemical reaction.
  • metal ion-containing materials can be inkjet printed either as electrode materials themselves, for example lithium intercalated graphitic carbon particles, or as intercalated oxide materials which maybe also be deposited onto metal layers, formed using the aforementioned electroless methods, and acting as electrical connections.
  • textural effects are exploited in the aforementioned inkjet methods.
  • the surface area of a porous substrate material e.g. ceramics, gels, membranes, foams, fabrics or porous synthetic inkjet paper, may increase electrode surface area, improve electrode binding and contain electrolyte within its pores.
  • the same effects may also be achieved using binders and fillers in the inkjet printing inks used to deposit materials into patterns herein before described.
  • the inks described in this patent can be formulated to change their penetration depth into porous substrates and hence the materials contained within them, by changing the drying rate through temperature processes or through the choice of solvent employed in the ink.
  • an ink may comprise materials used to form the electrolyte in the battery.
  • the ink may be printed and kept in the liquid phase, lose a volatile component to become a gel or lose all solvent to become a solid.
  • Other materials that maybe be inkjet printed include porous electrode separator layers and encapsulating and adhesive layers.
  • batteries by inkjet include the Copper/Nickel battery, Nickel/Iron battery, the fuel cell and the lithium ion battery. To one skilled in the art, it should be possible to transfer these ideas to other battery types.
  • the examples first describe a method of forming metal electrodes that are needed either for electrical charge collectors in a battery containing active ingredients or are themselves the sources of these materials.
  • the process described to form metal electrodes is based upon the principles of electroless deposition. Examples of these are nickel, cobalt, copper and tin.
  • the substrate that will house the electrodes first needs to be treated with a deposition promoting material herein described.
  • said material is either formulated directly into an ink or formed by co-deposition and subsequent reaction of two co-incident inks.
  • One may deposit the inks from a single or greater number of print transfer mechanisms, for example an inkjet printing system.
  • a deposition promoting material may be formed as a printed pattern by using one of the following three ink formulations:
  • Formulation 1 comprises a single ink that contains deposition promoting material which is catalytic to electroless metal deposition. It contains:
  • a reduced complex of palladium or platinum series metal made from mixing together solutions of the dissolved metal compound and a tin(ll) compound.
  • Binders and fillers if necessary, to change the chemical, mechanical and physical properties of the ink and the printed layer.
  • Formulation 2 comprises two inks that are co-deposited and co-incident on the printing surface that react to form deposition-promoting material which is catalytic to electroless metal deposition.
  • Ink 1 comprises the following:
  • Ink 1 differs from ink 2 in that the palladium compound is replaced by a tin (II) compound.
  • Formulation 3 comprises two inks, that are co-deposited and co-incident on the printing surface that react to form a deposition promoting material that is autocatalytic to electroless metal deposition.
  • Ink 1 contains a metal which in the present example comprises.
  • Binders and fillers if necessary, to change the chemical, mechanical and physical properties of the ink and the printed layer.
  • Ink 2 differs from ink 1 in that the copper compound is replaced by a reducing agent, for example dimethylamineborane, DMAB.
  • a reducing agent for example dimethylamineborane, DMAB.
  • the dispersion of copper metal that is formed by reacting the two inks is thus autocatalytic to electroless copper deposition.
  • the printed and dried patterned ink layer containing one of the aforementioned deposition promoting materials is then placed in an appropriate electroless metal bath solution and the desired metal plated only onto the printed area.
  • electroless copper to form a number of electrodes and electroless Nickel to form others.
  • the simplest electrochemical battery is one comprising electrodes of dissimilar metals. Therefore by placing copper and nickel electrodes into an electrolyte it is possible to produce one or more galvanic cells that become a battery with sufficient voltage and capacity that may be used to power devices.
  • the Nickel/Iron battery requires two electrodes to be formed, one of Ni with a coating of Ni(O) OH and the other electrode of Iron, electroplated onto a current collector, again Nickel.
  • a pattern of the hereinbefore described ink and its subsequent electroless coating of nickel is performed.
  • One of the nickel electrodes was placed as the anode in an aqueous solution of potassium hydroxide and any electrical conductor, for example, in this case Ti0 2 electrode coating Ti sheet (Ebonex), was the cathode.
  • the nickel is anodised in the range 0.2 to 1 volt with respect to a Ag/AgCI reference electrode.
  • a second nickel electrode is placed as the cathode in a solution of iron (II) sulphate in the concentration range 0.1 to 1 molar and any conductor is used as the anode, e.g. Ebonex. Iron is electroplated onto the nickel.
  • the two pieces of anodised and Iron plated nickel electrodes are then immersed into a potassium hydroxide solution and a rechargeable Nickel-Iron cell results, which can thus be made into a battery of cells to power electronic devices and store electrical charge from an outside source.
  • a metal "collector” electrode is used in combination with a platinum group catalyst to activate the battery reaction.
  • the surface area of these electrodes and utilisation of the catalyst are key factors in the rate of reaction, and hence the current density of the fuel cell.
  • the present example uses a porous substrate material, such as a microporous membrane filter, ceramic sheet or porous synthetic inkjet paper, onto and into which the ink hereinbefore described is printed into a user-defined pattern.
  • the ink in the present example is chosen to contain a platinum group metal catalyst that will not only sponsor electroless deposition of a chosen metal but also act as the catalyst used to sponsor reaction on the resulting fuel cell electrodes.
  • the electrode After printing of the catalyst and electroless deposition of, for example nickel, the electrode is suitable as an electrode in said fuel cell, for example, a polymer or solid oxide, hydrogen fuel cell.
  • a substrate material being porous increases the surface area of the deposited electroless metal electrodes by virtue of its high surface area.
  • the porosity of the substrate also enables the initial catalyst layer, used to sponsor the electroless metal deposition, to remain exposed and be useful in the resulting fuel cell to catalyse reaction.
  • the user-defined pattern described in this example can be made to comprise a high density of continuous features that are sufficiently small to increase the surface area of the final metal electrode yet more.
  • Very fine patterns of nickel having a 16 ⁇ m nickel features could be achieved using inkjet printing to pattern the substrate with the deposition promoting material.
  • the ink could be formulated to change the penetration depth of the sponsoring material.
  • the porous substrate may be employed in the final fuel cell as a separator of electrodes perhaps on separate sides of the substrate and also to contain electrolyte materials where appropriate.
  • the capacitor is an electrical charge storage device with a capacity solely dependent upon the surface area of its electrodes. In the present example, methods are employed to maximise this surface area.
  • the ink hereinbefore described is printed onto and absorbed into a porous substrate, to form a user-defied pattern with small feature sizes.
  • Electroless nickel is coated onto the pattern to produce an electrode.
  • the fine continuous pattern of metal combined with its high surface area electrode is suited to capacitor application.
  • Very fine patterns of nickel having nickel features of the order of 20 ⁇ m could be achieved using inkjet printing to pattern the substrate with the deposition promoting material.
  • the ink could be formulated to change the penetration depth of the Nickel layer.
  • the porous substrate may also be employed as the dielectric layer separating two such electrodes deposited onto opposing sides of the substrate.
  • Example 5 The Lithium ion battery
  • a number of lithium ion-containing electrodes are formed by permanent (primary battery) or reversible electrode reactions of lithium with associated cathode materials.
  • cathode materials include thionyl chloride, copper oxide, manganese oxide, and poly(carbon monofluoride)
  • secondary or rechargeable cathodes include transition metal oxides and chalcogenides, for example vanadium oxides, cobalt oxide and variants of this with nickel and titanium disulphide.
  • the rechargeable batteries reversible intercalation of lithium ions provided from the counter electrode (anodes) either as a foil of the metal or more preferably one containing lithium intercalated ions in, say carbon.
  • the lithium ion containing carbon electrode can thus be printed into a user-defined pattern onto and into a suitable substrate material.
  • the substrate can for example be porous to increase the surface area of the electrode and to allow greater adhesion of the electrode. Once the ink has dried out the electrode is thus the anode of a lithium battery. Equally this material may be printed onto a metal coated substrate hereinbefore described.
  • the cathode material is prepared by printing an ink containing an autocatalytic or catalytic material, hereinbefore described, into a user defined pattern on a substrate material, so that an electroless metal of cobalt and cobalt-nickel are deposited onto said substrate.
  • the substrate may comprise a porous material onto and into which the ink and thereafter electroless metal or metals are deposited.
  • the resulting metal pattern has then its surface substantially oxidised using a suitable reagent or oxidising ambient.
  • the resulting electrodes thus contain metal or metals as electrodes with an active oxide coating for use in the lithium ion battery.
  • the substrate may indeed be used as a separator and contain electrolyte and opposing sides of the substrate may have the anode and cathode materials fabricated onto them by said processes.
  • a metal electrode is fabricated into' a user-defined pattern using a catalytic or autocatalytic ink deposited from one or more inkjet heads 1.
  • the printed and dried pattern 2 on substrate 3, which may be porous or non-porous, is placed into an electroless bath solution 4 and a chosen metal deposited onto and into the pattern 5 and not its surrounding area.
  • one or more inkjet heads 6 may print an active battery material, such as a metal ion containing material and/or catalyst onto the metal pattern 5, or alternatively this material may be printed into a pattern without the metal backing layer provided it has suitable electrical conductivity as a battery terminal.
  • the metal backing layer may also have been formed by another metal deposition process 7 and the inkjet then employed to deposit the active battery material.
  • the electroless metal 5 may itself by changed chemically for example oxidised in solution 7 or another suitable medium to produce a battery material 8 on the pattern. Instead, the metal pattern 5 can become the cathode 10 of an electroplating solution 11 , where another material such as a metal can be plated onto it to form another battery electrode on the pattern 5.
  • electrodes made by one or more of the processes in figure 1 are combined as the anode 13 and cathode 14 in an electrolyte 15, to produce a battery power source or capacitor.
  • FIG 3 it is possible to put a battery or capacitor electrode material 16 onto and into a porous substrate material 17 and produce a textured electrode surface that may enhance the properties of the electrode by virtue of its greater effective surface area.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Inert Electrodes (AREA)

Abstract

Afin de produire un composant électrique, on forme une zone conductrice, on la revêt d'une fine couche non conductrice, puis d'une couche conductrice. Cela permet de former un condensateur ou une cellule faisant partie intégrante de la carte à circuit imprimé, ou un autre substrat. Des couches d'oxyde, des condensateurs et des structures composites multicouches multifonctionnelles peuvent être formés de cette façon. Des cellules peuvent être formées au moyen de structures stratifiées galvaniques ou électrochimiques appropriées. La présente invention concerne donc un appareil de dépôt, un procédé de dépôt d'un composant, et ledit composant lui-même. L'appareil de dépôt comprend une tête d'impression à jet d'encre (1) déposant n fluide (2) contenant au moins un réactif, lequel peut réagir pour produire un dépôt conducteur (5) sur le substrat (3). En cas de substrat poreux, une cellule électrochimique ou un condensateur peuvent être fabriqués au moyen d'électrodes placées de part et d'autre du substrat poreux, dans lequel est placé l'électrolyte ou le diélectrique. Des piles à combustible peuvent également être produites par une conception appropriée de la structure. Le dispositif peut être encapsulé, par exemple par le dépôt d'un adhésif à double phase sur au moins la zone active.
PCT/GB2003/003375 2002-08-16 2003-08-04 Depot de matieres solides WO2004017688A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003252969A AU2003252969A1 (en) 2002-08-16 2003-08-04 Depositing solid materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0219091A GB2391871A (en) 2002-08-16 2002-08-16 Depositing conductive solid materials using reservoirs in a printhead
GB0219091.6 2002-08-16

Publications (1)

Publication Number Publication Date
WO2004017688A1 true WO2004017688A1 (fr) 2004-02-26

Family

ID=9942437

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2003/003375 WO2004017688A1 (fr) 2002-08-16 2003-08-04 Depot de matieres solides

Country Status (3)

Country Link
AU (1) AU2003252969A1 (fr)
GB (1) GB2391871A (fr)
WO (1) WO2004017688A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7347533B2 (en) 2004-12-20 2008-03-25 Palo Alto Research Center Incorporated Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics
CN107851825A (zh) * 2015-08-11 2018-03-27 戴姆勒股份公司 制造用于燃料电池的膜电极组的方法
US11806142B2 (en) 2019-12-13 2023-11-07 Heraeus Deutschland GmbH & Co. KG Method for the manufacture of precious metal electrodes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080091241A (ko) * 2006-01-25 2008-10-09 프라운호퍼-게젤샤프트 추르 푀르데룽 데어 안제반텐 포르슝 에 파우 솔라셀의 금속 접촉구조의 제조방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668003A (en) * 1969-11-26 1972-06-06 Cirkitrite Ltd Printed circuits
DE2757029A1 (de) * 1977-12-21 1980-01-31 Guenther Dr Ing Herrmann Verfahren zur herstellung einer schaltungsplatte
EP0132677A1 (fr) * 1983-07-22 1985-02-13 Bayer Ag Procédé pour l'activation de surfaces de substrat pour la métallisation partielle directe de supports
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
NL8700833A (nl) * 1987-04-09 1988-11-01 Philips Nv Werkwijze voor het vervaardigen van een gedrukte bedradingspaneel.
EP0484808A2 (fr) * 1990-11-05 1992-05-13 Heraeus Noblelight GmbH Procédé et dispositif de métallisation sélective
GB2330451A (en) * 1997-10-14 1999-04-21 Thin Film Technology Forming devices by drop-on-demand printing
WO2000010736A1 (fr) * 1998-08-21 2000-03-02 Sri International Impression de circuits et composants electroniques

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639736A (en) * 1985-07-09 1987-01-27 Iris Graphics, Inc. Ink jet recorder
US4635073A (en) * 1985-11-22 1987-01-06 Hewlett Packard Company Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same
US4680859A (en) * 1985-12-06 1987-07-21 Hewlett-Packard Company Thermal ink jet print head method of manufacture
JP3041952B2 (ja) * 1990-02-23 2000-05-15 セイコーエプソン株式会社 インクジェット式記録ヘッド、圧電振動体、及びこれらの製造方法
BE1007879A3 (fr) * 1994-01-05 1995-11-07 Blue Chips Holding Resine polymerique a viscosite ajustable pour le depot de palladium catalytique sur un substrat, son procede de preparation et son utilisation.
US5742313A (en) * 1994-10-31 1998-04-21 Spectra, Inc. Efficient ink jet head arrangement
GB2369087B (en) * 1997-10-14 2002-10-02 Patterning Technologies Ltd Method of forming a circuit element on a surface
WO1999038176A1 (fr) * 1998-01-22 1999-07-29 Matsushita Electric Industrial Co., Ltd. Encre pour composant electronique, procede de production d'un composant electronique au moyen de cette encre pour composant electronique, et dispositif a jet d'encre
US6076723A (en) * 1998-08-19 2000-06-20 Hewlett-Packard Company Metal jet deposition system
US6344309B2 (en) * 1998-10-22 2002-02-05 Shin-Etsu Chemical Co., Ltd. Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
GB9925637D0 (en) * 1999-10-29 1999-12-29 Neopost Ltd Housing for digital print head
AU2001253524A1 (en) * 2000-04-14 2001-10-30 Case Western Reserve University Ink-jet based methodologies for the fabrication of microbatteries
DE10032500A1 (de) * 2000-07-04 2002-01-17 Voith Paper Patent Gmbh Auftragsvorrichtung

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668003A (en) * 1969-11-26 1972-06-06 Cirkitrite Ltd Printed circuits
DE2757029A1 (de) * 1977-12-21 1980-01-31 Guenther Dr Ing Herrmann Verfahren zur herstellung einer schaltungsplatte
EP0132677A1 (fr) * 1983-07-22 1985-02-13 Bayer Ag Procédé pour l'activation de surfaces de substrat pour la métallisation partielle directe de supports
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
NL8700833A (nl) * 1987-04-09 1988-11-01 Philips Nv Werkwijze voor het vervaardigen van een gedrukte bedradingspaneel.
EP0484808A2 (fr) * 1990-11-05 1992-05-13 Heraeus Noblelight GmbH Procédé et dispositif de métallisation sélective
GB2330451A (en) * 1997-10-14 1999-04-21 Thin Film Technology Forming devices by drop-on-demand printing
WO2000010736A1 (fr) * 1998-08-21 2000-03-02 Sri International Impression de circuits et composants electroniques

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
TENG K F ET AL: "Liquid ink jet printing with MOD inks for hybrid microcircuits", IEEE TRANSACTIONS ON COMPONENTS,HYBRIDS,AND MANUFACTURING TECHNOLOGY, IEEE INC. NEW YORK, US, vol. 12, no. 4, December 1987 (1987-12-01), pages 545 - 549, XP002114337, ISSN: 0148-6411 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7347533B2 (en) 2004-12-20 2008-03-25 Palo Alto Research Center Incorporated Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics
CN107851825A (zh) * 2015-08-11 2018-03-27 戴姆勒股份公司 制造用于燃料电池的膜电极组的方法
US11387477B2 (en) 2015-08-11 2022-07-12 Cellcentric Gmbh & Co. Kg Method for the production of a membrane electrode assembly for a fuel cell
US11806142B2 (en) 2019-12-13 2023-11-07 Heraeus Deutschland GmbH & Co. KG Method for the manufacture of precious metal electrodes

Also Published As

Publication number Publication date
GB0219091D0 (en) 2002-09-25
GB2391871A (en) 2004-02-18
AU2003252969A1 (en) 2004-03-03

Similar Documents

Publication Publication Date Title
Zheng et al. The road towards planar microbatteries and micro‐supercapacitors: from 2D to 3D device geometries
US10961631B2 (en) Microwave assisted synthesis of metal oxyhydroxides
CN111933912B (zh) 具有锌离子电导性界面修饰层的锌负极、电池以及制备方法
US7745033B2 (en) Polymer electrolyte fuel cell and separator for polymer electrolyte fuel cell
US9761882B2 (en) Manufacturing of high capacity prismatic lithium-ion alloy anodes
Zamarayeva et al. Fabrication of a High‐Performance Flexible Silver–Zinc Wire Battery
Yu et al. Laser sintering of printed anodes for al-air batteries
KR0146568B1 (ko) 특이 음극을 갖는 재충전식 배터리 및 그의 제조 방법
US7875387B2 (en) Electrode for use in electrochemical device, solid electrolyte/electrode assembly, and production method thereof
Ferris et al. 3D interdigitated microsupercapacitors with record areal cell capacitance
US20130118912A1 (en) Compositions, Electrodes, Methods, and Systems for Water Electrolysis and Other Electrochemical Techniques
US20050282062A1 (en) Fuel cell electrode, fuel cell and their production processes
WO2001099217A1 (fr) Procede de fabrication d'electrode poreuse catalysee en carbone pour pile combustible
JP2009502011A (ja) 軟質および硬質電解質層付き薄膜電池および方法
KR20010072835A (ko) 전기 회로 및 구성요소의 프린팅
AU2003292418B2 (en) Electrochemical cell
CN100514735C (zh) 燃料电池及其制造方法
Zhang et al. Microwave‐assisted synthesis of CuO/MnO2 nanocomposites for supercapacitor application
WO1998009003A1 (fr) Procede de production d'une feuille de metal electrolytique poreuse
Ma et al. Zn microbatteries explore ways for integrations in intelligent systems
WO2004017688A1 (fr) Depot de matieres solides
JP5927755B2 (ja) リチウムイオン電池およびリチウムイオン電池の製造方法
KR20040047780A (ko) 베터리 구조, 자기 조직화 구조 및 관련 방법
JPH02121384A (ja) 電池内蔵型プリント配線板
CA2430515C (fr) Procede de precipitation d'un catalyseur

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP