GB0219091D0 - Depositing solid materials - Google Patents

Depositing solid materials

Info

Publication number
GB0219091D0
GB0219091D0 GB0219091A GB0219091A GB0219091D0 GB 0219091 D0 GB0219091 D0 GB 0219091D0 GB 0219091 A GB0219091 A GB 0219091A GB 0219091 A GB0219091 A GB 0219091A GB 0219091 D0 GB0219091 D0 GB 0219091D0
Authority
GB
United Kingdom
Prior art keywords
solid materials
depositing solid
depositing
materials
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0219091A
Other versions
GB2391871A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qinetiq Ltd
Original Assignee
Qinetiq Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qinetiq Ltd filed Critical Qinetiq Ltd
Priority to GB0219091A priority Critical patent/GB2391871A/en
Publication of GB0219091D0 publication Critical patent/GB0219091D0/en
Priority to AU2003252969A priority patent/AU2003252969A1/en
Priority to PCT/GB2003/003375 priority patent/WO2004017688A1/en
Publication of GB2391871A publication Critical patent/GB2391871A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Inert Electrodes (AREA)
GB0219091A 2002-08-16 2002-08-16 Depositing conductive solid materials using reservoirs in a printhead Withdrawn GB2391871A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0219091A GB2391871A (en) 2002-08-16 2002-08-16 Depositing conductive solid materials using reservoirs in a printhead
AU2003252969A AU2003252969A1 (en) 2002-08-16 2003-08-04 Depositing solid materials
PCT/GB2003/003375 WO2004017688A1 (en) 2002-08-16 2003-08-04 Depositing solid materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0219091A GB2391871A (en) 2002-08-16 2002-08-16 Depositing conductive solid materials using reservoirs in a printhead

Publications (2)

Publication Number Publication Date
GB0219091D0 true GB0219091D0 (en) 2002-09-25
GB2391871A GB2391871A (en) 2004-02-18

Family

ID=9942437

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0219091A Withdrawn GB2391871A (en) 2002-08-16 2002-08-16 Depositing conductive solid materials using reservoirs in a printhead

Country Status (3)

Country Link
AU (1) AU2003252969A1 (en)
GB (1) GB2391871A (en)
WO (1) WO2004017688A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7347533B2 (en) 2004-12-20 2008-03-25 Palo Alto Research Center Incorporated Low cost piezo printhead based on microfluidics in printed circuit board and screen-printed piezoelectrics
EP1987543A1 (en) * 2006-01-25 2008-11-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a metal contact structure of a solar cell
DE102015010422A1 (en) 2015-08-11 2017-02-16 Daimler Ag Method for producing a membrane electrode assembly for a fuel cell
DE102019219615A1 (en) 2019-12-13 2021-06-17 Heraeus Deutschland GmbH & Co. KG Manufacturing process for precious metal electrodes

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668003A (en) * 1969-11-26 1972-06-06 Cirkitrite Ltd Printed circuits
DE2757029A1 (en) * 1977-12-21 1980-01-31 Guenther Dr Ing Herrmann Circuit board prodn. by tracing pattern on substrate with ink - contg. metal nuclei and metallising in chemical copper plating bath
DE3326508A1 (en) * 1983-07-22 1985-02-07 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR THE DIRECT PARTIAL METALIZATION OF CARRIER MATERIALS
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
US4639736A (en) * 1985-07-09 1987-01-27 Iris Graphics, Inc. Ink jet recorder
US4635073A (en) * 1985-11-22 1987-01-06 Hewlett Packard Company Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same
US4680859A (en) * 1985-12-06 1987-07-21 Hewlett-Packard Company Thermal ink jet print head method of manufacture
NL8700833A (en) * 1987-04-09 1988-11-01 Philips Nv Prodn. of printed circuit panel on insulating substrate - by forming pattern of material contg. metal nuclei, using spray head, followed by electroless metallising
JP3041952B2 (en) * 1990-02-23 2000-05-15 セイコーエプソン株式会社 Ink jet recording head, piezoelectric vibrator, and method of manufacturing these
DE4035080A1 (en) * 1990-11-05 1992-05-07 Abb Patent Gmbh METHOD AND DEVICE FOR PRODUCING PARTIAL METAL LAYERS
BE1007879A3 (en) * 1994-01-05 1995-11-07 Blue Chips Holding Polymer resin viscosity adjustable for filing on palladium catalyst substrate, method of preparation and use.
US5742313A (en) * 1994-10-31 1998-04-21 Spectra, Inc. Efficient ink jet head arrangement
GB2376566B (en) * 1997-10-14 2003-02-05 Patterning Technologies Ltd Method of forming an electronic device
GB2369087B (en) * 1997-10-14 2002-10-02 Patterning Technologies Ltd Method of forming a circuit element on a surface
WO1999038176A1 (en) * 1998-01-22 1999-07-29 Matsushita Electric Industrial Co., Ltd. Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device
US6076723A (en) * 1998-08-19 2000-06-20 Hewlett-Packard Company Metal jet deposition system
US6855378B1 (en) * 1998-08-21 2005-02-15 Sri International Printing of electronic circuits and components
US6344309B2 (en) * 1998-10-22 2002-02-05 Shin-Etsu Chemical Co., Ltd. Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
GB9925637D0 (en) * 1999-10-29 1999-12-29 Neopost Ltd Housing for digital print head
AU2001253524A1 (en) * 2000-04-14 2001-10-30 Case Western Reserve University Ink-jet based methodologies for the fabrication of microbatteries
DE10032500A1 (en) * 2000-07-04 2002-01-17 Voith Paper Patent Gmbh applicator

Also Published As

Publication number Publication date
GB2391871A (en) 2004-02-18
WO2004017688A1 (en) 2004-02-26
AU2003252969A1 (en) 2004-03-03

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)