WO2003100841A3 - Verfahren zum herstellen einer speicherzelle, speicherzelle und speicherzellen-anordnung - Google Patents

Verfahren zum herstellen einer speicherzelle, speicherzelle und speicherzellen-anordnung Download PDF

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Publication number
WO2003100841A3
WO2003100841A3 PCT/DE2003/001699 DE0301699W WO03100841A3 WO 2003100841 A3 WO2003100841 A3 WO 2003100841A3 DE 0301699 W DE0301699 W DE 0301699W WO 03100841 A3 WO03100841 A3 WO 03100841A3
Authority
WO
WIPO (PCT)
Prior art keywords
memory cell
insulating layer
gate
production
auxiliary substrate
Prior art date
Application number
PCT/DE2003/001699
Other languages
English (en)
French (fr)
Other versions
WO2003100841A2 (de
Inventor
Franz Hofmann
Richard Johannes Luyken
Michael Specht
Original Assignee
Infineon Technologies Ag
Franz Hofmann
Richard Johannes Luyken
Michael Specht
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Franz Hofmann, Richard Johannes Luyken, Michael Specht filed Critical Infineon Technologies Ag
Priority to EP03740036A priority Critical patent/EP1508165A2/de
Publication of WO2003100841A2 publication Critical patent/WO2003100841A2/de
Publication of WO2003100841A3 publication Critical patent/WO2003100841A3/de
Priority to US10/999,810 priority patent/US7195978B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H01L29/7883—Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0416—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and no select transistor, e.g. UV EPROM
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zum Herstellen einer Speicherzelle, eine Speicherzelle und eine Speicherzellen-Anordnung. Bei dem Verfahren zum Herstellen einer Speicherzelle wird auf einem Hilfs-Substrat eine erste Gate-isolierende Schicht ausgebildet und ein Floating-Gate auf der ersten Gate-isolierenden Schicht ausgebildet. Ferner wird eine elektrisch isolierende Schicht auf dem Floating-Gate ausgebildet und eine Speicher-Gateelektrode auf der elektrisch isolierenden Schicht ausgebildet. Ein Substrat wird an der Speicher-Gateelektrode befestigt, und das Hilfs-Substrat wird teilweise entfernt. Eine zweite Gate-isolierende Schicht wird auf einem Teil einer freiliegenden Oberfläche des Hilfs-Substrats ausgebildet und eine Lese-Gateelektrode wird auf der zweiten Gate-isolierenden Schicht ausgebildet. Auf einem freiliegenden Oberflächenbereich des verbleibenden Materials des Hilfs-Substrats werden zwei Source-/Drain-Bereiche zwischen einem Kanal-Bereich ausgebildet derart, dass der Kanal-Bereich mit dem Floating-Gate und mit der Lese-Gateelektrode jeweils zumindest teilweise lateral überlappt.
PCT/DE2003/001699 2002-05-27 2003-05-26 Verfahren zum herstellen einer speicherzelle, speicherzelle und speicherzellen-anordnung WO2003100841A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP03740036A EP1508165A2 (de) 2002-05-27 2003-05-26 Verfahren zum herstellen einer speicherzelle, speicherzelle und speicherzellen-anordnung
US10/999,810 US7195978B2 (en) 2002-05-27 2004-11-29 Method for the production of a memory cell, memory cell and memory cell arrangement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10223505A DE10223505A1 (de) 2002-05-27 2002-05-27 Verfahren zum Herstellen einer Speicherzelle, Speicherzelle und Speicherzellen-Anordnung
DE10223505.8 2002-05-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/999,810 Continuation US7195978B2 (en) 2002-05-27 2004-11-29 Method for the production of a memory cell, memory cell and memory cell arrangement

Publications (2)

Publication Number Publication Date
WO2003100841A2 WO2003100841A2 (de) 2003-12-04
WO2003100841A3 true WO2003100841A3 (de) 2004-03-25

Family

ID=29432341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/001699 WO2003100841A2 (de) 2002-05-27 2003-05-26 Verfahren zum herstellen einer speicherzelle, speicherzelle und speicherzellen-anordnung

Country Status (4)

Country Link
US (1) US7195978B2 (de)
EP (1) EP1508165A2 (de)
DE (1) DE10223505A1 (de)
WO (1) WO2003100841A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319651A (ja) 2003-04-14 2004-11-11 Seiko Epson Corp メモリの素子及びその製造方法
CN1707795A (zh) * 2004-06-01 2005-12-14 精工爱普生株式会社 存储单元及其制造方法
US8530952B2 (en) * 2007-08-23 2013-09-10 Micron Technology, Inc. Systems, methods and devices for a memory having a buried select line
US20090090913A1 (en) * 2007-10-03 2009-04-09 Walker Andrew J Dual-gate memory device with channel crystallization for multiple levels per cell (mlc)
US9941300B2 (en) 2015-12-16 2018-04-10 Globalfoundries Inc. Structure and method for fully depleted silicon on insulator structure for threshold voltage modification
KR102400951B1 (ko) 2017-05-08 2022-05-23 마이크론 테크놀로지, 인크 메모리 어레이
KR102241839B1 (ko) 2017-05-08 2021-04-20 마이크론 테크놀로지, 인크 메모리 어레이
US11043499B2 (en) 2017-07-27 2021-06-22 Micron Technology, Inc. Memory arrays comprising memory cells
US10950618B2 (en) 2018-11-29 2021-03-16 Micron Technology, Inc. Memory arrays

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446299A (en) * 1994-04-29 1995-08-29 International Business Machines Corporation Semiconductor random access memory cell on silicon-on-insulator with dual control gates
US5751037A (en) * 1995-07-27 1998-05-12 Sony Corporation Non-volatile memory cell having dual gate electrodes
US6136650A (en) * 1999-10-21 2000-10-24 United Semiconductor Corp Method of forming three-dimensional flash memory structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306935A (en) * 1988-12-21 1994-04-26 Texas Instruments Incorporated Method of forming a nonvolatile stacked memory
JP2877103B2 (ja) * 1996-10-21 1999-03-31 日本電気株式会社 不揮発性半導体記憶装置およびその製造方法
US6252275B1 (en) * 1999-01-07 2001-06-26 International Business Machines Corporation Silicon-on-insulator non-volatile random access memory device
US6271088B1 (en) * 2001-01-05 2001-08-07 United Microelectronics Corp. Method for fabricating a buried vertical split gate memory device with high coupling ratio

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446299A (en) * 1994-04-29 1995-08-29 International Business Machines Corporation Semiconductor random access memory cell on silicon-on-insulator with dual control gates
US5751037A (en) * 1995-07-27 1998-05-12 Sony Corporation Non-volatile memory cell having dual gate electrodes
US6136650A (en) * 1999-10-21 2000-10-24 United Semiconductor Corp Method of forming three-dimensional flash memory structure

Also Published As

Publication number Publication date
WO2003100841A2 (de) 2003-12-04
US20050157583A1 (en) 2005-07-21
DE10223505A1 (de) 2003-12-11
EP1508165A2 (de) 2005-02-23
US7195978B2 (en) 2007-03-27

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