WO2003096419A3 - Integrierte leiterbahnanordnung - Google Patents
Integrierte leiterbahnanordnung Download PDFInfo
- Publication number
- WO2003096419A3 WO2003096419A3 PCT/EP2003/050070 EP0350070W WO03096419A3 WO 2003096419 A3 WO2003096419 A3 WO 2003096419A3 EP 0350070 W EP0350070 W EP 0350070W WO 03096419 A3 WO03096419 A3 WO 03096419A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductor arrangement
- strip conductor
- integrated strip
- integrated
- strip conductors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
- Waveguides (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/514,145 US7550854B2 (en) | 2002-05-08 | 2003-03-19 | Integrated interconnect arrangement |
EP03749895A EP1520297A2 (de) | 2002-05-08 | 2003-03-19 | Integrierte leiterbahnanordnung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10220653.8 | 2002-05-08 | ||
DE10220653A DE10220653A1 (de) | 2002-05-08 | 2002-05-08 | Integrierte Leiterbahnanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003096419A2 WO2003096419A2 (de) | 2003-11-20 |
WO2003096419A3 true WO2003096419A3 (de) | 2004-07-22 |
Family
ID=29285226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/050070 WO2003096419A2 (de) | 2002-05-08 | 2003-03-19 | Integrierte leiterbahnanordnung |
Country Status (5)
Country | Link |
---|---|
US (1) | US7550854B2 (de) |
EP (1) | EP1520297A2 (de) |
CN (1) | CN100420016C (de) |
DE (1) | DE10220653A1 (de) |
WO (1) | WO2003096419A2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7462038B2 (en) * | 2007-02-20 | 2008-12-09 | Qimonda Ag | Interconnection structure and method of manufacturing the same |
DE102007040871A1 (de) * | 2007-08-29 | 2009-03-12 | Osram Gesellschaft mit beschränkter Haftung | Verbindungselement |
US9305992B2 (en) * | 2011-06-16 | 2016-04-05 | Altera Corporation | Integrated circuit inductors with intertwined conductors |
DE102021112455A1 (de) | 2021-05-12 | 2022-11-17 | Technische Universität Dresden, Körperschaft des öffentlichen Rechts | Spulenanordnungen und Verfahren zum Herstellen einer Spulenanordnung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5559360A (en) * | 1994-12-19 | 1996-09-24 | Lucent Technologies Inc. | Inductor for high frequency circuits |
WO1998043258A2 (en) * | 1997-03-20 | 1998-10-01 | Micro Analog Systems Oy | Stripe-line inductor |
DE19727758A1 (de) * | 1997-04-17 | 1998-10-22 | Alsthom Cge Alcatel | Mehrfachparallelleiter für Wicklungen elektrischer Geräte und Maschinen |
WO2003005381A1 (de) * | 2001-07-06 | 2003-01-16 | Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung, E.V. | Leitfähige struktur mit verbesserten wechselstromeigenschaften |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0862218B1 (de) * | 1997-02-28 | 2007-02-28 | Telefonaktiebolaget LM Ericsson (publ) | Induktor mit verbesserten Q-Wert |
US6049308A (en) * | 1997-03-27 | 2000-04-11 | Sandia Corporation | Integrated resonant tunneling diode based antenna |
EP0872858A3 (de) * | 1997-04-17 | 1999-02-24 | Alcatel | Mehrfachparallelleiter für Wicklungen elektrischer Geräte und Maschinen |
US6388188B1 (en) * | 1997-06-20 | 2002-05-14 | Ixos Limited | Electrical cable and method of manufacturing the same |
US6569757B1 (en) * | 1999-10-28 | 2003-05-27 | Philips Electronics North America Corporation | Methods for forming co-axial interconnect lines in a CMOS process for high speed applications |
US6987307B2 (en) * | 2002-06-26 | 2006-01-17 | Georgia Tech Research Corporation | Stand-alone organic-based passive devices |
-
2002
- 2002-05-08 DE DE10220653A patent/DE10220653A1/de not_active Withdrawn
-
2003
- 2003-03-19 CN CNB038103362A patent/CN100420016C/zh not_active Expired - Fee Related
- 2003-03-19 EP EP03749895A patent/EP1520297A2/de not_active Withdrawn
- 2003-03-19 US US10/514,145 patent/US7550854B2/en not_active Expired - Lifetime
- 2003-03-19 WO PCT/EP2003/050070 patent/WO2003096419A2/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5559360A (en) * | 1994-12-19 | 1996-09-24 | Lucent Technologies Inc. | Inductor for high frequency circuits |
WO1998043258A2 (en) * | 1997-03-20 | 1998-10-01 | Micro Analog Systems Oy | Stripe-line inductor |
DE19727758A1 (de) * | 1997-04-17 | 1998-10-22 | Alsthom Cge Alcatel | Mehrfachparallelleiter für Wicklungen elektrischer Geräte und Maschinen |
WO2003005381A1 (de) * | 2001-07-06 | 2003-01-16 | Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung, E.V. | Leitfähige struktur mit verbesserten wechselstromeigenschaften |
Also Published As
Publication number | Publication date |
---|---|
US7550854B2 (en) | 2009-06-23 |
CN100420016C (zh) | 2008-09-17 |
EP1520297A2 (de) | 2005-04-06 |
WO2003096419A2 (de) | 2003-11-20 |
US20060202338A1 (en) | 2006-09-14 |
DE10220653A1 (de) | 2003-11-27 |
CN1698201A (zh) | 2005-11-16 |
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