WO2003094586A1 - Carte de circuits imprimes a composant smd et dissipateur thermique - Google Patents

Carte de circuits imprimes a composant smd et dissipateur thermique Download PDF

Info

Publication number
WO2003094586A1
WO2003094586A1 PCT/DE2003/000133 DE0300133W WO03094586A1 WO 2003094586 A1 WO2003094586 A1 WO 2003094586A1 DE 0300133 W DE0300133 W DE 0300133W WO 03094586 A1 WO03094586 A1 WO 03094586A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat sink
printed circuit
metallic
conductor tracks
Prior art date
Application number
PCT/DE2003/000133
Other languages
German (de)
English (en)
Inventor
Gert MÜLLER
Thomas SCHÜPPLER
Wolfgang Daubitz
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2003094586A1 publication Critical patent/WO2003094586A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Definitions

  • the invention relates to a printed circuit board with printed conductors running on a surface of the printed circuit board, at least one electronic component in an SMD version mounted thereon and at least one metallic heat sink mounted on the surface of the printed circuit board in the immediate vicinity of the electronic component to be cooled in the region of the printed conductors.
  • Such a circuit board is known, for example, from German published patent application DE 43 32 115 AI.
  • Electronic components in SMD design and metallic heat sinks for cooling the electronic components are applied to the surface of the known printed circuit board.
  • the heat sinks are applied over a number of conductor tracks running on the surface of the known printed circuit board, regardless of their respective potential.
  • the heat sinks on the underside with which they are mounted on the surface of the known circuit board are provided with an electrically insulating film.
  • This film can also be designed as an adhesive film, so that the heat sink can be connected to the surface of the known printed circuit board via the adhesive film.
  • the heat sinks designed in this way can be assembled immediately after the known printed circuit board has been fitted with the electronic SMD components.
  • the invention has for its object a circuit board with electronic To further simplify components in the SMD version and metallic heat sinks for the electronic components with regard to their structure.
  • the heat dissipation from the electronic component to be cooled takes place here by means of heat conduction from the electronic component through the metallic fastening surface which is thermally connected to it into the heat sink, where further heat is emitted by convection and radiation.
  • the lack of an electrically insulating layer on the underside of the heat sink further reduces the thermal resistance.
  • the metallic fastening surface can advantageously be a metallic cooling surface next to the conductor tracks.
  • Such an additional metallic fastening surface can be easily positioned in the vicinity of a component to be cooled. With a correspondingly large design of such a cooling surface, the thermal resistance can still can be further reduced. Furthermore, the cooling surface can be easily adapted to the shape of the heat sink,
  • the metallic fastening surface can advantageously also be part of one of the conductor tracks. In this way, the design of a circuit board according to the invention can be carried out in a particularly space-saving manner, since no separate areas have to be reserved for mounting the heat sink on the circuit board.
  • An advantageous embodiment of the printed circuit board according to the invention further provides that the heat sink consists of copper with an at least partially tinned surface and is soldered onto the metallic fastening surface.
  • the production of the heat sink from copper ensures extremely good thermal conductivity within the heat sink. By tinning the surface of the heat sink, it can be easily soldered onto the metal mounting surface.
  • the heat sink is also essentially in the form of a U-profile, only little effort and low costs are incurred for the production of the heat sink.
  • the heat sink has two mutually opposite parallel cooling plates which are connected to one another on one side by a web which is narrower than the width of the cooling plates.
  • the heat sink according to the invention essentially a U-profile with enlarged cooling plates. Only a small amount of production is required, while the enlarged cooling plates improve the heat transfer to the environment compared to a simple U-profile. If the heat sink with its narrow web on the
  • Printed circuit board is applied, there is also only a small space requirement on the circuit board. If necessary, the space next to the web (i.e. under the cooling plates) can also be used for other electronic components. Due to the wide cooling plates of the heat sink according to the invention, a relatively low overall height of the heat sink can also be achieved, so that an automatic assembly can take place simultaneously with the electronic components.
  • Figure 1 is a plan view of a circuit board according to the invention, in
  • Figure 2 is a side view of the circuit board of Figure 1 according to the invention, in
  • Figure 3 shows an embodiment of a heat sink for the circuit board according to the invention.
  • Figure 4 shows another embodiment of a heat sink of the circuit board according to the invention
  • Components 2, 3, 4a and 4b run on the printed circuit board 1 metallic conductor tracks 5. To cool the electronic components 4a and 4b are also on the surface la
  • Circuit board 1 heat sink 6a and 6b on metallic
  • Mounting surfaces 7a and 7b are in thermal
  • FIG. 1 The reference numerals already used in FIG. 1 serve to designate the individual components. It can be seen here in particular in the case of heat sinks 6b that the simplest possible construction (here shown a U-profile construction) is used for the heat sinks. In this way, manufacturing effort and costs can be minimized.
  • FIG. 4 show two different embodiments of heat sinks for the circuit board. While the heat sink 11 is designed as a simple U-profile, the heat sink 12 according to FIG. 4 consists of two cooling plates 13a and 13b which are located opposite one another in parallel and which on one side have a comparison with the cooling plates 13a and 13b narrower web 14 are interconnected.
  • the heat sink 11 is designed as a simple U-profile
  • the heat sink 12 according to FIG. 4 consists of two cooling plates 13a and 13b which are located opposite one another in parallel and which on one side have a comparison with the cooling plates 13a and 13b narrower web 14 are interconnected.
  • U-profile also has the advantage of a low height and a possibly reduced space requirement if the heat sink with its narrow web 14 on the metallic
  • the heat sinks 11 and 12 consist of copper with a surface tinned at least on their underside 11a and 12a.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une carte de circuits imprimés (1) qui comporte des pistes conductrices (5) s'étendant sur une surface (1a) de ladite carte de circuits imprimés (1), au moins un composant électronique SMD (4a, 4b) installé sur cette dernière et au moins un dissipateur thermique (6a, 6b) monté sur la surface (1a) de la carte de circuits imprimés (1) à proximité directe du composant électronique à refroidir (4a, 4b) dans la zone des pistes conductrices (5). L'objectif de cette invention est de simplifier la structure d'une carte de circuits imprimés (1) de ce type. A cet effet, ce dissipateur thermique (6a, 6b) est placé directement sur une seule surface de fixation métallique (7a, 7b), en liaison thermique avec ledit composant électronique (4a, 4b). Cette invention concerne en outre un dissipateur thermique (12) pour composants SMD (4a, 4b), prévu pour un montage direct sur une carte de circuits imprimés (1) et présentant une structure la plus simple possible tout en garantissant un bon transfert de chaleur vers le milieu extérieur.
PCT/DE2003/000133 2002-04-29 2003-01-14 Carte de circuits imprimes a composant smd et dissipateur thermique WO2003094586A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10220941.3 2002-04-29
DE10220941 2002-04-29

Publications (1)

Publication Number Publication Date
WO2003094586A1 true WO2003094586A1 (fr) 2003-11-13

Family

ID=29285281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000133 WO2003094586A1 (fr) 2002-04-29 2003-01-14 Carte de circuits imprimes a composant smd et dissipateur thermique

Country Status (1)

Country Link
WO (1) WO2003094586A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007039800B3 (de) * 2007-08-23 2008-12-11 Festo Ag & Co. Kg Kühlanordnung und damit ausgestattetes elektronisches Gerät
EP2323465A1 (fr) 2009-11-10 2011-05-18 OSRAM Gesellschaft mit beschränkter Haftung Circuit éléctrique avec dissipateur thermique
WO2014204982A2 (fr) * 2013-06-19 2014-12-24 SMART Storage Systems, Inc. Système électronique à extraction de chaleur et son procédé de fabrication
US9158349B2 (en) 2013-10-04 2015-10-13 Sandisk Enterprise Ip Llc System and method for heat dissipation
US9348377B2 (en) 2014-03-14 2016-05-24 Sandisk Enterprise Ip Llc Thermal isolation techniques
US9470720B2 (en) 2013-03-08 2016-10-18 Sandisk Technologies Llc Test system with localized heating and method of manufacture thereof
US9485851B2 (en) 2014-03-14 2016-11-01 Sandisk Technologies Llc Thermal tube assembly structures
US9519319B2 (en) 2014-03-14 2016-12-13 Sandisk Technologies Llc Self-supporting thermal tube structure for electronic assemblies
US9549457B2 (en) 2014-02-12 2017-01-17 Sandisk Technologies Llc System and method for redirecting airflow across an electronic assembly
US9848512B2 (en) 2014-02-27 2017-12-19 Sandisk Technologies Llc Heat dissipation for substrate assemblies
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US10013033B2 (en) 2013-06-19 2018-07-03 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4332115A1 (de) * 1993-09-22 1995-03-23 Philips Patentverwaltung Anordnung zur Entwärmung einer mindestens einen Kühlkörper aufweisenden Leiterplatte
EP0812015A1 (fr) * 1996-06-04 1997-12-10 MAGNETI MARELLI S.p.A. Dissipateur de chaleur pour circuits intégrés
US6222732B1 (en) * 1991-09-21 2001-04-24 Robert Bosch Gmbh Electrical device, in particular a switching and control unit for motor vehicles
US6377462B1 (en) * 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222732B1 (en) * 1991-09-21 2001-04-24 Robert Bosch Gmbh Electrical device, in particular a switching and control unit for motor vehicles
DE4332115A1 (de) * 1993-09-22 1995-03-23 Philips Patentverwaltung Anordnung zur Entwärmung einer mindestens einen Kühlkörper aufweisenden Leiterplatte
EP0812015A1 (fr) * 1996-06-04 1997-12-10 MAGNETI MARELLI S.p.A. Dissipateur de chaleur pour circuits intégrés
US6377462B1 (en) * 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007039800B3 (de) * 2007-08-23 2008-12-11 Festo Ag & Co. Kg Kühlanordnung und damit ausgestattetes elektronisches Gerät
EP2323465A1 (fr) 2009-11-10 2011-05-18 OSRAM Gesellschaft mit beschränkter Haftung Circuit éléctrique avec dissipateur thermique
US9470720B2 (en) 2013-03-08 2016-10-18 Sandisk Technologies Llc Test system with localized heating and method of manufacture thereof
WO2014204982A2 (fr) * 2013-06-19 2014-12-24 SMART Storage Systems, Inc. Système électronique à extraction de chaleur et son procédé de fabrication
WO2014204982A3 (fr) * 2013-06-19 2015-02-26 SMART Storage Systems, Inc. Système électronique à extraction de chaleur et son procédé de fabrication
US9313874B2 (en) 2013-06-19 2016-04-12 SMART Storage Systems, Inc. Electronic system with heat extraction and method of manufacture thereof
US10013033B2 (en) 2013-06-19 2018-07-03 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US9898056B2 (en) 2013-06-19 2018-02-20 Sandisk Technologies Llc Electronic assembly with thermal channel and method of manufacture thereof
US9158349B2 (en) 2013-10-04 2015-10-13 Sandisk Enterprise Ip Llc System and method for heat dissipation
US9549457B2 (en) 2014-02-12 2017-01-17 Sandisk Technologies Llc System and method for redirecting airflow across an electronic assembly
US9848512B2 (en) 2014-02-27 2017-12-19 Sandisk Technologies Llc Heat dissipation for substrate assemblies
US9348377B2 (en) 2014-03-14 2016-05-24 Sandisk Enterprise Ip Llc Thermal isolation techniques
US9519319B2 (en) 2014-03-14 2016-12-13 Sandisk Technologies Llc Self-supporting thermal tube structure for electronic assemblies
US9485851B2 (en) 2014-03-14 2016-11-01 Sandisk Technologies Llc Thermal tube assembly structures

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