WO2003087426A3 - Beschichtungsanlage - Google Patents

Beschichtungsanlage Download PDF

Info

Publication number
WO2003087426A3
WO2003087426A3 PCT/DE2003/001216 DE0301216W WO03087426A3 WO 2003087426 A3 WO2003087426 A3 WO 2003087426A3 DE 0301216 W DE0301216 W DE 0301216W WO 03087426 A3 WO03087426 A3 WO 03087426A3
Authority
WO
WIPO (PCT)
Prior art keywords
coating installation
substrate side
cathode side
gas admission
gas
Prior art date
Application number
PCT/DE2003/001216
Other languages
German (de)
English (en)
French (fr)
Other versions
WO2003087426A2 (de
Inventor
Michael Geisler
Albert Kastner
Bernd Szyszka
Andreas Pflug
Niels Malkomes
Original Assignee
Applied Films Gmbh & Co Kg
Michael Geisler
Albert Kastner
Bernd Szyszka
Andreas Pflug
Niels Malkomes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Films Gmbh & Co Kg, Michael Geisler, Albert Kastner, Bernd Szyszka, Andreas Pflug, Niels Malkomes filed Critical Applied Films Gmbh & Co Kg
Priority to JP2003584359A priority Critical patent/JP2005522584A/ja
Priority to AU2003232604A priority patent/AU2003232604A1/en
Priority to US10/511,389 priority patent/US20050145487A1/en
Priority to EP03746233A priority patent/EP1495152A2/de
Publication of WO2003087426A2 publication Critical patent/WO2003087426A2/de
Publication of WO2003087426A3 publication Critical patent/WO2003087426A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0089—Reactive sputtering in metallic mode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0068—Reactive sputtering characterised by means for confinement of gases or sputtered material, e.g. screens, baffles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Fuel Cell (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
PCT/DE2003/001216 2002-04-15 2003-04-11 Beschichtungsanlage WO2003087426A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003584359A JP2005522584A (ja) 2002-04-15 2003-04-11 被覆装置
AU2003232604A AU2003232604A1 (en) 2002-04-15 2003-04-11 Coating installation
US10/511,389 US20050145487A1 (en) 2002-04-15 2003-04-11 Coating installation
EP03746233A EP1495152A2 (de) 2002-04-15 2003-04-11 Beschichtungsanlage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002116671 DE10216671A1 (de) 2002-04-15 2002-04-15 Beschichtungsanlage
DE10216671.4 2002-04-15

Publications (2)

Publication Number Publication Date
WO2003087426A2 WO2003087426A2 (de) 2003-10-23
WO2003087426A3 true WO2003087426A3 (de) 2004-02-19

Family

ID=29224490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/001216 WO2003087426A2 (de) 2002-04-15 2003-04-11 Beschichtungsanlage

Country Status (6)

Country Link
EP (1) EP1495152A2 (ru)
JP (1) JP2005522584A (ru)
CN (1) CN1662672A (ru)
AU (1) AU2003232604A1 (ru)
DE (1) DE10216671A1 (ru)
WO (1) WO2003087426A2 (ru)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101410931B (zh) * 2006-03-28 2011-02-16 贝卡尔特股份有限公司 涂覆设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4392939A (en) * 1982-03-05 1983-07-12 U.S. Philips Corporation Magnetron cathode sputtering system
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate
EP0701270A1 (en) * 1994-09-06 1996-03-13 The Boc Group, Inc. Methods and apparatus for vacuum sputtering
EP0795623A1 (de) * 1996-03-14 1997-09-17 Leybold Systems GmbH Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat
EP0860513A2 (en) * 1997-02-19 1998-08-26 Canon Kabushiki Kaisha Thin film forming apparatus and process for forming thin film using same
EP0908531A2 (en) * 1997-10-08 1999-04-14 Canon Kabushiki Kaisha Apparatus and method for forming a thin film of a compound

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428811A (en) * 1983-04-04 1984-01-31 Borg-Warner Corporation Rapid rate reactive sputtering of a group IVb metal
DE3331707A1 (de) * 1983-09-02 1985-03-21 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern
JPS62287074A (ja) * 1986-06-04 1987-12-12 Sumitomo Bakelite Co Ltd ロ−ルコ−タ−装置
JPH042771A (ja) * 1990-04-18 1992-01-07 Fujitsu Ltd スパッタリング装置
JPH05132774A (ja) * 1991-11-12 1993-05-28 Fujitsu Ltd スパツタ装置
JPH0641733A (ja) * 1992-07-28 1994-02-15 Matsushita Electric Ind Co Ltd 反応性スパッタリング装置
JP3094050B2 (ja) * 1992-12-09 2000-10-03 東京エレクトロン株式会社 マグネトロンスパッタリング装置及びスパッタリングガン
DE4413378A1 (de) * 1994-04-19 1995-10-26 Leybold Ag Einrichtung zum Beschichten eines Substrats

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4392939A (en) * 1982-03-05 1983-07-12 U.S. Philips Corporation Magnetron cathode sputtering system
US5427665A (en) * 1990-07-11 1995-06-27 Leybold Aktiengesellschaft Process and apparatus for reactive coating of a substrate
EP0701270A1 (en) * 1994-09-06 1996-03-13 The Boc Group, Inc. Methods and apparatus for vacuum sputtering
EP0795623A1 (de) * 1996-03-14 1997-09-17 Leybold Systems GmbH Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat
EP0860513A2 (en) * 1997-02-19 1998-08-26 Canon Kabushiki Kaisha Thin film forming apparatus and process for forming thin film using same
EP0908531A2 (en) * 1997-10-08 1999-04-14 Canon Kabushiki Kaisha Apparatus and method for forming a thin film of a compound

Also Published As

Publication number Publication date
JP2005522584A (ja) 2005-07-28
AU2003232604A1 (en) 2003-10-27
WO2003087426A2 (de) 2003-10-23
CN1662672A (zh) 2005-08-31
EP1495152A2 (de) 2005-01-12
DE10216671A1 (de) 2003-12-18
AU2003232604A8 (en) 2003-10-27

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