WO2003083952A3 - Dispositif et capteur servant a enregistrer des signaux lumineux et procede de production - Google Patents
Dispositif et capteur servant a enregistrer des signaux lumineux et procede de production Download PDFInfo
- Publication number
- WO2003083952A3 WO2003083952A3 PCT/DE2002/004655 DE0204655W WO03083952A3 WO 2003083952 A3 WO2003083952 A3 WO 2003083952A3 DE 0204655 W DE0204655 W DE 0204655W WO 03083952 A3 WO03083952 A3 WO 03083952A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor
- production
- light signals
- receiving light
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
L'invention concerne un dispositif (10) servant à enregistrer des signaux lumineux, un capteur (15) ainsi qu'un procédé de production d'un dispositif (10) et d'un capteur (15). Un détecteur (45) est ménagé sur une première plaquette (40) et un filtre (85) est disposé sur une seconde plaquette (80), la première plaquette (40) et la seconde plaquette (80) étant reliées l'une à l'autre de manière hermétique.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10214769.8 | 2002-04-03 | ||
DE10214769A DE10214769A1 (de) | 2002-04-03 | 2002-04-03 | Vorrichtung und Sensor zur Aufnahme von Lichtsignalen sowie Herstellungsverfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003083952A2 WO2003083952A2 (fr) | 2003-10-09 |
WO2003083952A3 true WO2003083952A3 (fr) | 2004-07-22 |
Family
ID=28051079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/004655 WO2003083952A2 (fr) | 2002-04-03 | 2002-12-19 | Dispositif et capteur servant a enregistrer des signaux lumineux et procede de production |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10214769A1 (fr) |
WO (1) | WO2003083952A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004002163B4 (de) | 2004-01-15 | 2019-12-24 | Robert Bosch Gmbh | Gassensormodul und ein Verfahren zu seiner Herstellung |
DE102004032176A1 (de) * | 2004-07-02 | 2006-01-26 | Robert Bosch Gmbh | Beschichteter mikromechanischer Strahler |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668374A (en) * | 1986-07-07 | 1987-05-26 | General Motors Corporation | Gas sensor and method of fabricating same |
EP0632508A2 (fr) * | 1993-07-01 | 1995-01-04 | Sharp Kabushiki Kaisha | Photodétecteur avec un filtre multi couche et méthode pour sa fabrication |
JPH0989773A (ja) * | 1995-09-20 | 1997-04-04 | Horiba Ltd | 赤外線ガス分析計 |
US5861545A (en) * | 1997-04-30 | 1999-01-19 | Honeywell Inc. | Micromachined inferential opto-thermal gas sensor |
US6124145A (en) * | 1998-01-23 | 2000-09-26 | Instrumentarium Corporation | Micromachined gas-filled chambers and method of microfabrication |
WO2001056921A2 (fr) * | 2000-02-02 | 2001-08-09 | Raytheon Company | Fabrication avec encapsulation sous vide de dispositifs de systeme mecanique microelectrique comprenant des composants de circuits integres |
-
2002
- 2002-04-03 DE DE10214769A patent/DE10214769A1/de not_active Ceased
- 2002-12-19 WO PCT/DE2002/004655 patent/WO2003083952A2/fr not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668374A (en) * | 1986-07-07 | 1987-05-26 | General Motors Corporation | Gas sensor and method of fabricating same |
EP0632508A2 (fr) * | 1993-07-01 | 1995-01-04 | Sharp Kabushiki Kaisha | Photodétecteur avec un filtre multi couche et méthode pour sa fabrication |
JPH0989773A (ja) * | 1995-09-20 | 1997-04-04 | Horiba Ltd | 赤外線ガス分析計 |
US5861545A (en) * | 1997-04-30 | 1999-01-19 | Honeywell Inc. | Micromachined inferential opto-thermal gas sensor |
US6124145A (en) * | 1998-01-23 | 2000-09-26 | Instrumentarium Corporation | Micromachined gas-filled chambers and method of microfabrication |
WO2001056921A2 (fr) * | 2000-02-02 | 2001-08-09 | Raytheon Company | Fabrication avec encapsulation sous vide de dispositifs de systeme mecanique microelectrique comprenant des composants de circuits integres |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 08 29 August 1997 (1997-08-29) * |
Also Published As
Publication number | Publication date |
---|---|
DE10214769A1 (de) | 2003-10-16 |
WO2003083952A2 (fr) | 2003-10-09 |
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