WO2003071200A1

WO2003071200A1 - Heat recovery unit and heat recovery system of building utilizing it

Info

Publication number: WO2003071200A1
Application number: PCT/JP2003/001058
Authority: WO
Inventors: Hideyo Yamamoto
Original assignee: Famm Co. Ltd.; Arude Engineering Co. Ltd.
Priority date: 2002-02-25
Filing date: 2003-02-03
Publication date: 2003-08-28
Also published as: US20050139692A1; CA2477332A1; EP1486743A4; AU2003246346A1; CN1643312A; EP1486743A1; CN1270147C; HK1080930A1

Abstract

A system for recovering the cooling/heating heat efficiently at the time of ventilation and is applicable even to a general house. A centralized fan (110) is coupled through a suction/exhaust pipe with a heat exchanger (120) and the heat of warmed exhaust gas from each room is recovered by means of the heat exchanger (120) before being discharged to the outside from the centralized fan (110) via the heat exchanger (120). On the other hand, the heat exchanger (120) is coupled with a tank (130) through a plumbing pipe and water pumped up from the tank (130) by means of the pump (140) is warmed through the heat exchanger (120) before being returned to the tank (130). The heat exchanger (120) cools exhaust gas from the centralized fan (110) using a Peltier element and heats up the water in the tank (130) so that the heat of air from each room transfers to water efficiently, as a whole. Since heat is transferred efficiently through a Peltier element, temperature of water from the heat exchanger can be set higher than that of the exhaust gas.

Description

TECHNICAL FIELD The present invention relates to a heat recovery device for recovering heat of air conditioning by ventilation of a building or the like without waste, and heat recovery of a building using the heat recovery device. About the system. Landscape technology Environmental problems are currently urgently required. In particular, after ratifying the Kyoto Protocol, the issue of reducing CO ₂ emissions has been renewed. In order to reduce co ₂ , it is necessary to promote energy conservation in all fields nationwide. For this reason, energy saving is also required for the cooling and heating of small buildings, especially ordinary houses.

On the other hand, in general housing, interest in ventilation in housing has increased due to health problems. When the ventilation is improved, the heat energy is wasted to the outside when the air in the air-conditioned house is replaced.

Therefore, there is a current demand for a system that efficiently recovers heat from the air conditioning during ventilation. DISCLOSURE OF THE INVENTION An object of the present invention is to provide a system that can efficiently recover the heat of air conditioning during ventilation and can be used in ordinary houses.

In order to achieve the above object, the present invention provides a heat recovery apparatus for ventilation, comprising: a heat sink; a Peltier element connected to the heat sink; a medium connected to the Peltier element; Power supply to the Peltier element It is characterized in that heat including cold is transferred from the ventilation to the medium.

The building heat recovery system of the present invention includes a centralized ventilation fan that concentrates and collects exhaust air from each room of the building, the heat recovery apparatus that transmits heat of the exhaust air from the central ventilation fan to a medium, And a high-efficiency heat conductive sheet for releasing heat transferred by the medium to each room.

As the medium, a high-efficiency heat conduction material is used, and heat can be conducted without moving the medium. With this configuration, temperature differences between the top and bottom of the room and between rooms can be eliminated. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a configuration of a heat recovery apparatus according to an embodiment.

FIG. 2 is a diagram showing a detailed configuration of a heat exchanger used in the heat recovery apparatus.

Figure 3 shows the BERCH used for heat exchangers! : It is a figure explaining an element.

Fig. 4 is a diagram showing an example in which the heat recovery device is applied to a general house.

FIG. 5 is a diagram showing a configuration of a house in which the building heat recovery system of the embodiment is installed.

FIG. 6 is a diagram showing a configuration of a heat radiation panel used in the building heat recovery system of the embodiment.

FIG. 7 is a diagram showing a configuration of another embodiment of a building heat recovery system.

Fig. 8 is a diagram for explaining the connection between the heat dissipation panel and the high-efficiency heat conduction material. BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings.

Figure 1 is an overall view of a heat recovery device that transfers heat from ventilation to the medium. The case of heating each room of the building using the equipment shown in Fig. 1 will be described. In addition, the heat recovery apparatus of the embodiment is an example in which water is used as a heat medium. As heat medium of heat recovery device Is a liquid such as oil, a gas such as air, a solid, or a mixture of these. Any fluid may be used. As will be described later, there is a case where a fluid is not used as a heat medium.

In FIG. 1, the air exhausted from each room for ventilation is collected through a central ventilation fan 110. The central ventilation fan 1 1 0 is connected to the heat exchanger 1 2 0 through an intake / exhaust pipe, and the air collected in the central ventilation fan 1 1 0 is heated by the heat exchanger 1 2 0 in the heat exhausted from the exhaust air. After recovery, it is discharged out of the heat recovery unit. On the other hand, the heat exchanger 1 2 0 is connected to the tank 1 3 0 through a suction / drain pipe, and the water pumped up from the tank 1 3 0 by the pump 1 4 0 is warmed by the heat exchanger 1 2 0 and again Water is being returned to tank 1 3 0.

The heat exchanger 1 2 0 cools the exhaust from the central ventilator 1 1 0 by means of a vortex element and heats the water in the tank 1 3 0 to make the heat of the air from each room efficient. Is moving. Since heat is efficiently transferred through the Peltier element, the temperature of the water from the heat exchanger can be made higher than the temperature of the exhaust. During cooling, Berchi :! : By reversing the current to the element, the exhaust from the central fan 1 1 0 can be heated and the water can be cooled through the heat exchanger 1 2 0 to obtain cold water. At this time, the cold water can be made cooler than the exhaust from the room because the Peltier element is used.

Thermometer 1 5 4 is the temperature of water entering heat exchanger 1 2 0, Thermometer 1 5 2 is the temperature of water exiting from heat exchanger 1 2 0, Thermometer 1 5 6 is tank 1 3 Each water temperature in 0 is measured. The power source 160 supplies power to the Peltier element and pump of the heat exchanger 120, and the power is measured by the wattmeter 16 2. Fig. 2 shows the structure of the heat exchanger 1 2 0 in Fig. 1 in detail. Fig. 2 (a) is a front view of the heat exchanger 1 2 0, Fig. 2 (b) is a plan view, Figure 2 (c) is a side view. The heat exchanger 1 2 0 includes a heat sink 2 1 0, a Peltier element 2 2 0, an intake / drain pipe 2 5 0, and a container part 2 3 0. The exhaust from the central ventilation fan 1 1 0 passes through the heat sink 2 1 0 and is discharged outside the heat exchanger. At that time, the heat of the exhaust is transmitted to the heat sink 2 1 0. The water passing through the heat exchanger 1 2 0 is the tank 1 3 0 From one side of the suction / drainage pipe 2 5 0, it enters the container part 2 3 0, exits from the other side and returns to the tank 1 3 0

The Peltier element 2 20 has one surface bonded to the flat surface of the heat sink 2 10, and the other surface bonded to one surface of the container portion 2 30. When a current is passed through the Peltier element 220, one surface becomes a cooling surface and the other surface becomes a heating surface, and when the direction of the current is reversed, the cooling surface and the heating surface are reversed.

Therefore, when the heat of the heating is recovered by a heat exchanger and the water in the container part 2 3 0 is heated, the surface of the Peltier element 2 2 0 on the heat sink 2 1 0 side is the cooling surface, and the container part 2 3 0 If an electric current is applied so that the surface on the side becomes a heating surface, the heat sink 2 1 0 side of the Peltier element 2 20 cools the exhaust, and the container part 2 3 0 side of the Peltier element 2 2 0 heats water. Conversely, when cooling air is recovered by cooling the cooling air, if the current flows through the Peltier element 2 2 0 in the direction opposite to that during heating, the heat sink 2 1 0 side of the Peltier element 2 2 0 heats the exhaust. The container part 2 3 0 side of the Peltier element 2 2 0 cools water. FIG. 3 illustrates a configuration example of the Peltier element 220 used in the above-described heat exchanger.

Fig. 3 (a) shows the appearance of the Peltier element 2 20 used in the heat exchanger. FIG. 3B shows an example of the internal configuration of the Peltier element. FIG. 3 (c) is a diagram illustrating the operation of each of the BERCH:!: Elements of FIG. 3 (b).

As shown in Fig. 3 (b), the large-area Peltier element shown in Fig. 3 (a) consists of multiple small Peltier elements connected electrically in series and thermally in parallel. . Figure 3 (c) is a diagram of a single Peltier element, and explains the function of the Peltier element. When the DC power source 3 2 0 is connected to the Peltier element, current flows from the lower side of the N-type semiconductor 3 14 through the upper electrode 3 1 6 to the lower side of the P-type semiconductor 3 1 2. Energy moves in the opposite direction of current with electrons. In the N-type semiconductor 3 1 4, the energy for electrons to move from the upper electrode 3 1 6 to the N-type semiconductor and the energy for moving the inside of the N-type semiconductor 3 1 4 to the lower electrode 3 1 5 Since it is obtained from the upper electrode 3 1 6 side, as a result, energy is insufficient on the upper electrode 3 1 6 side and the temperature drops. On the other hand, the lower electrode 3 1 5 side releases the energy taken by the electrons and the temperature rises. The In P-type semiconductors 3 1 2, holes transfer energy in the same way as electrons. As a result, the total amount of heat absorbed by the heat absorbing surface 3 1 8 is combined with the amount of heat corresponding to the total supplied power and is released to the heat radiating surface 3 19. This heating (cooling) effect is proportional to the magnitude of the current and the number of semiconductors. At this time, the use of solar cells as the power source for Peltier elements can make the system even more environmentally friendly. Fig. 4 shows an example in which the heat recovery device of Fig. 1 is used in a general house.

In Fig. 4, the central ventilation fan 4 2 0 and the heat exchanger 4 3 0 are connected by a pipe, for example, installed behind the ceiling, and the air for ventilation from each room is ventilated from the ventilation pipe 4 1 0. It is sent to 20 and exhausted through the heat exchanger 4 3 0 to the outside through the exhaust pipe 4 60. On the other hand, pumps and spare tanks 4 5 0 are installed outdoors, and intake and drain pipes 4 4 0 are passed through heat exchangers 4 3 0. Connect to pump 'spare tank 4 5 0 again. In this way, by using the foundation work part 4 70, a large heat capacity can be obtained and the amount of heat stored can be increased.

In the heat exchanger 4 30, an electric current is passed through the Peltier element so that the water is heated during heating and the water is cooled during cooling. The heated or cooled water circulates along the piping of the suction / drainage pipe 4 4 0 and returns to the pump ■ reserve tank 4 5 0 again.

Each room can also be heated (cooled) using the heat (cold heat) stored in water by this heat recovery device. In this case, as shown in FIG. 4, the water stored in each room may be sent through pipes 4 8 2 and 4 8 4 to assist the cooling and heating of each room with a heat exchanger. If a Peltier element is used for the heat exchanger as in Fig. 2, it is efficient. It can also be used for floor heating (floor cooling).

If the outside air is concentrated in order to ventilate the building, it may be used to warm (cool) the air intake. If the heat exchanger used in this case uses a Peltier element as shown in FIG. 2, the thermal efficiency is good.

In this system, the installation location of each device is not limited to the above. For example, the heat exchanger 43 0 may be installed outdoors. Also, the piping location of the suction and drainage pipes 4 4 0 For example, in addition to the above, piping may be provided on the floor, wall, or ceiling of each room. FIG. 5 is a diagram showing a configuration of a highly insulated << highly airtight panel house provided with the building heat recovery system according to the embodiment of the present invention. In Fig. 5, this house is highly insulated by using heat insulating material to prevent the heat inside the house from escaping to the outside. In this house, for example, an external heat insulating material is provided under the floor for high heat insulation.

The exhaust from each room of the house is collected in the centralized exhaust heat recovery device via the ventilation pipes 5 1 2 etc. provided in each room. Centralized exhaust ■ The heat recovery device is composed of a centralized ventilation fan 5 1 0 that collects exhaust from the ventilation pipe 5 1 2, and a heat exchanger 5 3 0 that recovers heat from the exhaust to the medium, and recovers heat from the exhaust to the medium At the same time, exhaust is exhausted outside the house through pipes 5 1 4. Centralized exhaust ■ The heat recovery device collects not only the heat during heating but also the cooling energy during cooling. The heat exchanger 5 3 0 is controlled by a control device 5 4 0 operated by an operation panel. The controller 5 40 also monitors the temperature with an intake air temperature sensor 5 4 3, an exhaust gas temperature sensor 5 4 5, an inlet water temperature sensor 5 4 4, and an outlet water temperature sensor 5 4 7. The heat exchanger 5 3 0 will be described in detail later.

Centralized exhaust · Heat recovered by the heat recovery device (including cold heat) is transferred to a heat-dissipating panel (high-efficiency heat conduction sheet affixed) in each room via a medium such as water and a heat exchanger. Board) From 5 6 0, return to the house again. As shown in FIG. 5, the heat dissipating panel 5 60 can be provided on the inner wall, ceiling, floor, or the like. The heat dissipation panel can be integrated with the inner wall. The structure of heat dissipation / nel (high efficiency heat conduction sheet pasting pad) 5 60 will be described later.

Centralized exhaust ■ The heat exchanger 5 3 0 used in the heat recovery device is the heat exchanger 5 3 0 using the Peltier element described above. In this heat exchanger 5 30, a heat sink installed in the exhaust and a Peltier element are connected, and heat (cold heat) is transferred from the exhaust gas to the medium to the Peltier element.

FIG. 6 is a diagram showing the configuration of the heat radiation panel 5 60 used in the heat recovery system of the embodiment.

Heat dissipation panel (High efficiency heat conduction sheet pasting board) 5 6 0 is a high efficiency heat conduction sheet (for example, Graphite sheet etc.) 5 6 6 Heat conduction between the heat exchanger 5 5 6 and the medium and the high efficiency heat conduction sheet 5 6 6 is performed by the same high efficiency heat conduction sheet 5 6 4. Since the medium in the heat exchanger 5 5 6 moves slowly, it is possible to sufficiently transfer heat to the high efficiency heat conductive sheet 5 6 4.

Since the heat dissipation panel is composed of a high-efficiency heat conduction sheet, it is possible to create a lightweight and efficient heat dissipation channel.

In addition, since the heat radiation panel 5 60 conducts heat with a high-efficiency heat conduction sheet installed on a part of the plate surface, it can be installed in a free place by nailing or the like. FIG. 7 is a diagram showing another embodiment of the heat recovery system for buildings of the present invention. FIG. 8 is a diagram for explaining the connection relationship between the heat recovery system and the heat radiating panel (high efficiency heat conductive sheet pasting board) 5 60 in FIG. 4 and the medium.

In this system, as shown in Fig. 7, the heat of ventilation from each room is transferred to a high-efficiency heat conduction material by heat exchangers 5 30. In the heat exchanger, high-efficiency heat-conducting material and Peltier elements are in direct contact to transfer the heat of ventilation. This high-efficiency heat-conducting material (for example, Graphite) is built into the pipe 5 72 and transfers the heat of ventilation to each room. Depending on the location, the pipe is selected to transfer heat from a highly efficient heat transfer material or to prevent heat dissipation. In each room, as shown in Fig. 8, the high-efficiency heat conduction material sheet 5 6 4 to the high-efficiency heat conduction material sheet 5 6 4 from the high-efficiency heat conduction material built-in pipe 5 7 4 The heat is conducted by heat, and heat is dissipated from the heat dissipating panel 5 60. At this time, a material with good heat conductivity (for example, copper) is used for the contact place between the high efficiency heat conductive material sheet 卜 5 6 4 and the pipe 5 7 4.

In this way, in this heat recovery system, heat is transferred using a high-efficiency heat conduction material, so no power is required to move the medium.

In addition, when a heat dissipation panel is used on the ceiling, floor, etc. of a room, if there is a temperature difference between the top and bottom of the room or between rooms, not the heat recovered from the exhaust, the heat of the temperature difference also increases the heat of the heat dissipation panel. Absorbed from the efficient heat conduction system, through the high efficiency heat conduction material in the pipe It can also be used to eliminate temperature disparities in the house. This is also effective when heat from the exhaust is not being recovered.

This is possible because the direction of heat transfer from the high-efficiency heat conduction sheet used in the heat dissipation panel and the high-efficiency heat conduction material in the pipe is bidirectional, and heat can be freely conducted. It is. Industrial Applicability By using the heat recovery apparatus of the present invention, it can be operated efficiently with low cost and easy maintenance. In addition, there is an energy saving effect due to low power consumption. In addition, it has the advantage of low noise.

Claims

The scope of the claims

1. Heat recovery device from ventilation,

A heat sink,

A Peltier element connected to the heat sink;

The belt: a medium connected to the L element;

A power supply to the Peltier element;

A heat recovery apparatus, wherein heat including cold is transferred from the ventilation to the medium through the Peltier element.

2. Building heat recovery system,

A centralized ventilation fan for concentrating and collecting ventilation exhaust from each room of the building; and a heat recovery device for ventilation for transferring heat of the exhaust of the centralized ventilation fan to a medium, comprising: a heat sink; and the heat sink A Peltier element connected; a medium connected to the Peltier element; and a power source to the Peltier element, for releasing heat transferred by the medium to each room. A high-efficiency heat conduction sheet.

3. In the building heat recovery system according to claim 2,

A high-efficiency heat conduction material is used as the medium,

A heat recovery system for a building which conducts heat without moving the medium.