WO2003044817A1 - Commutateur a commutation par circuit - Google Patents

Commutateur a commutation par circuit Download PDF

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Publication number
WO2003044817A1
WO2003044817A1 PCT/JP2002/012043 JP0212043W WO03044817A1 WO 2003044817 A1 WO2003044817 A1 WO 2003044817A1 JP 0212043 W JP0212043 W JP 0212043W WO 03044817 A1 WO03044817 A1 WO 03044817A1
Authority
WO
WIPO (PCT)
Prior art keywords
flow path
working fluid
electrode
internal pressure
piezoelectric
Prior art date
Application number
PCT/JP2002/012043
Other languages
English (en)
Japanese (ja)
Inventor
Yukihisa Takeuchi
Nobuo Takahashi
Iwao Ohwada
Yuki Bessho
Original Assignee
Ngk Insulators, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators, Ltd. filed Critical Ngk Insulators, Ltd.
Priority to AU2002354058A priority Critical patent/AU2002354058A1/en
Publication of WO2003044817A1 publication Critical patent/WO2003044817A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B15/00—Fluid-actuated devices for displacing a member from one position to another; Gearing associated therewith
    • F15B15/08—Characterised by the construction of the motor unit
    • F15B15/084—Characterised by the construction of the motor unit the motor being of the rodless piston type, e.g. with cable, belt or chain
    • F15B15/086—Characterised by the construction of the motor unit the motor being of the rodless piston type, e.g. with cable, belt or chain with magnetic coupling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
    • F16K99/0011—Gate valves or sliding valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0042—Electric operating means therefor
    • F16K99/0048—Electric operating means therefor using piezoelectric means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0055—Operating means specially adapted for microvalves actuated by fluids
    • F16K99/0057—Operating means specially adapted for microvalves actuated by fluids the fluid being the circulating fluid itself, e.g. check valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H57/00—Electrostrictive relays; Piezoelectric relays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0082—Microvalves adapted for a particular use
    • F16K2099/0084—Chemistry or biology, e.g. "lab-on-a-chip" technology
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0082—Microvalves adapted for a particular use
    • F16K2099/0092—Inkjet printers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H57/00—Electrostrictive relays; Piezoelectric relays
    • H01H2057/006—Micromechanical piezoelectric relay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H36/00—Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding

Definitions

  • the present invention relates to a circuit switching switch that switches an electric path by using a driving device that moves a moving body using a working fluid.
  • micro-micrometer with a size of several millimeters to several tens of microns.
  • microsensors microswitches, etc.
  • These component devices include, for example, inkjet printer heads, microvalves, flow sensors, pressure sensors, recording heads, actuators for tracking sensors, on-chip biochemical analysis, microreactors, and high-frequency components.
  • electrostatic force is often used as driving force.
  • various types such as those that use distortion deformation caused by voltage application of piezoelectric material, those that use shape deformation of shape memory alloy, and those that use volume change caused by phase transformation of liquid by heating.
  • driving sources are being considered. However, as the mechanism becomes finer, the power generated by the drive source and the drive stress become extremely small.Therefore, it is necessary to combine a mechanical amplifying mechanism like a lever for some applications. It has become.
  • a circuit switching switch that functions as an electrical switch (or relay) is a mercury that realizes a switching operation by moving a mercury droplet.
  • Microrelays that use the pressure at the moment of bubble generation due to heating of a microheater as a driving force to move a mercury droplet have been studied (for example, J. Kim et al., Proc. 46th). Annual Int. Relay Conf, Oak Brook, II, Apr. 1998, pp.19-19-8.)
  • This switch has various features such as a wide frequency range from DC to 10 GHz, low insertion loss and high insulation resistance in the GHz band, and no signal bounce. It has been reported.
  • the above-described bulb-generating type mercury micro relay has problems in that heat is stored by a heating operation and power consumption is large.
  • an object of the present invention is to provide a device using a working fluid, which does not have a mechanical amplification mechanism inherent in the problem of wear and sticking while maintaining the small size and low power consumption characteristics of a micromachine.
  • An object of the present invention is to provide a circuit switching switch that is easy to mass-produce and that does not easily cause leakage of working fluid due to fluctuations in the ambient temperature.
  • Another object of the present invention is to provide a circuit switching switch capable of performing a high-speed switching operation without a problem of heat storage.
  • a circuit switching switch of the present invention accommodates a non-compressible working fluid, and also accommodates a moving body made of a substance different from the working fluid. Compartments in a pair of working chambers A flow path forming part that forms a flow path; a pump chamber that communicates with each of the pair of working chambers and is filled with the working fluid; and a pump chamber that is provided for each of the pump chambers.
  • a pair of pumps having an actuator and a diaphragm deformed by the actuator, and a pair of pumps for pressurizing or reducing the working fluid in the pump chamber by the deformation of the diaphragm; and Internal pressure buffer chamber constituting an internal pressure buffer chamber accommodating a fluid having an internal pressure buffer, communicating the flow path of the flow path configuring section with the internal pressure buffer chamber of the internal pressure buffer chamber configuring the same. Exhibits a large flow resistance that makes passage of the working fluid substantially impossible against a sudden pressure fluctuation of the working fluid in the flow path, and a slow pressure fluctuation of the working fluid in the flow path. In effect, the passage of the working fluid And a fine flow path section that forms a fine flow path exhibiting a small flow resistance that is possible.
  • the fine flow path may directly connect the flow path of the flow path constituent part and the internal pressure buffer chamber of the internal pressure buffer chamber constituent part.
  • the flow path of the flow path component and the internal pressure buffer chamber of the internal pressure buffer chamber component may be connected via a connection passage or a pump chamber that connects the two. Further, a plurality of pumps may be provided.
  • the diaphragm is deformed by the actuation, and the working fluid in the flow path is pressurized or depressurized.
  • the fine flow path exhibits a large flow resistance that substantially makes the passage of the working fluid impossible. Is transmitted to the moving object, and the moving object moves.
  • the flow path exhibits a small flow resistance substantially enabling the passage of the same working fluid, the working fluid moves to the internal pressure buffer chamber containing the compressible pressure buffering fluid via the fine flow path. .
  • the actuator includes a piezoelectric element made of a piezoelectric electrostrictive film or an antiferroelectric film and an electrode, and the diaphragm is a ceramic diaphragm.
  • the circuit switching switch according to the present invention includes a first switching electrode exposed to a part of the flow path of the flow path component, and a first switching electrode exposed to another part of the flow path of the flow path component.
  • a second switching electrode electrically insulated from the first switching electrode, and opposing the first switching electrode and the second switching electrode with the flow path of the flow path forming unit interposed therebetween (
  • an electrode (common electrode) exposed to the flow path is preferably configured so that at least the surface is made of a conductive material. It is. In this case, the working fluid needs to be non-conductive.
  • the circuit switching switch includes a first switching electrode exposed to a part of the flow path of the flow path component, and a first switching electrode exposed to another part of the flow path of the flow path component.
  • a second switching electrode electrically insulated from the switching electrode, and facing the first switching electrode across the flow path of the flow path component (connected by a moving body in the flow path).
  • the number of switching electrodes may be at least two or more.
  • the position of the moving body is moved between the first switching electrode and the second switching electrode by the pump composed of the membrane piezoelectric element and the diaphragm made of ceramic. Since the electric circuit (electric path) is switched, there is no problem of heat storage due to heating of the micro-heater, and a circuit switching switch with low power consumption can be provided. Also, such pumps can operate at high speed and have excellent durability. Thus, an appropriate circuit switching switch can be provided to a portable information terminal or the like.
  • each diaphragm of the pump is arranged so as to form a part of a wall of each pump chamber and to have a membrane surface in the same plane, Is configured to be a space having a longitudinal direction in a plane parallel to the membrane surface of the diaphragm, and the fine flow path of the fine flow path portion extends in a direction parallel to the film surface of the diaphragm;
  • the internal pressure buffer chamber of the internal pressure buffer chamber constituting portion is configured to be a space having a longitudinal direction in a plane parallel to the membrane surface of the diaphragm, and the flow path configuration is provided through a fine flow path of the fine flow path section. It is preferable to arrange so as to be communicated with the flow path of the section.
  • each pump chamber of the pump is configured so that a diaphragm formed of a plate body such as a single deformable ceramic sheet is a part of the wall, the operation of each actuator is performed.
  • the volume of each pump chamber is directly changed, the working fluid can be efficiently pressurized or depressurized. Therefore, it is preferable that each diaphragm of the pump constitutes a part of the wall of each pump chamber and is arranged so as to have a membrane surface in the same plane.
  • the fine flow path in order for the fine flow path to exhibit flow resistance having the above characteristics, it is necessary that the flow path cross section be reduced. Accuracy is required and the manufacturing cost of circuit switching switches increases.
  • the fine flow path can exhibit flow path resistance having the above characteristics by securing (lengthening) the length of the flow path.
  • the thickness of the circuit switching switch becomes large.
  • the fine flow channel of the fine flow channel portion extends in a direction parallel to the membrane surface of the diaphragm, and each has a longitudinal direction in a plane parallel to the membrane surface of the diaphragm.
  • the flow path of the flow path component which is a space, and the internal pressure buffer chamber of the internal pressure buffer chamber component are connected through the fine flow path. If arranged and configured so that they can communicate with each other, the same flow path, the same internal pressure buffer chamber, and the fine flow path can be formed within a certain thickness.
  • a switch driving device
  • such a thin circuit switching switch can increase the surface area of the circuit switching switch with respect to the entire volume of the circuit switching switch, so that heat generated during operation can be easily externally generated. And stable operation can be performed.
  • FIG. 1 is a cross-sectional view of a drive device that is a part of the circuit switching switch according to the first embodiment of the present invention.
  • FIG. 2 is a plan view of the driving device shown in FIG.
  • FIG. 3 is a cross-sectional view of the drive device shown in FIG. 1 cut along a plane along the line 2-2 in FIG.
  • FIG. 4 is a cross-sectional view showing an initial state of the driving device shown in FIG.
  • FIG. 5 is an aerial view showing the operating state of the drive device shown in FIG.
  • FIG. 6 is a cross-sectional view showing another operation state of the drive device shown in FIG.
  • FIG. 7 is a cross-sectional view showing the flow of the working fluid when the ambient temperature of the drive device shown in FIG. 1 rises.
  • FIG. 8 is a cross-sectional view showing the flow of the working fluid when the ambient temperature of the drive device shown in FIG. 1 is lowered.
  • FIG. 9 is a diagram for explaining the operation when finely adjusting the position of the moving body of the driving device shown in FIG.
  • FIG. 10 is a timing chart showing a voltage waveform applied to the piezoelectric film of the driving device shown in FIG. 1 in order to finely adjust the position of the moving body of the driving device.
  • Fig. 11 shows the fine adjustment of the position of the moving body of the drive device shown in Fig. 1. It is a figure for explaining operation at the time of.
  • FIG. 12 is a diagram for explaining the operation when finely adjusting the position of the moving body of the drive device shown in FIG.
  • FIG. 13 is a cross-sectional view of a modified example of the drive device shown in FIG.
  • FIG. 14 is a cross-sectional view of the drive device shown in FIG. 1, illustrating a variation of the flow channel of the drive device.
  • FIG. 15 is a cross-sectional view of a drive device that is a part of the circuit switching switch according to the second embodiment of the present invention.
  • FIG. 16 is a plan view of the driving device shown in FIG.
  • FIG. 17 is a conceptual diagram illustrating a manufacturing process of the piezoelectric / electrostrictive device of the drive device shown in FIG.
  • FIG. 18 is a conceptual diagram illustrating another manufacturing process of the piezoelectric / electrostrictive factor of the drive device shown in FIG.
  • FIG. 19 is a conceptual diagram illustrating the manufacturing process of the drive device shown in FIG.
  • FIG. 20 is a conceptual diagram illustrating the manufacturing process of the drive device shown in FIG.
  • FIG. 21 is a cross-sectional view of a drive device that is a part of the circuit switching switch according to the third embodiment of the present invention.
  • FIG. 22 is a cross-sectional view of a drive device that is a part of the circuit switching switch according to the fourth embodiment of the present invention.
  • FIG. 23 is a cross-sectional view of a drive device that is a part of the circuit switching switch according to the fifth embodiment of the present invention.
  • FIG. 24 is a plan view of the driving device shown in FIG.
  • FIG. 25 is a cross-sectional view showing an operation state of the drive device shown in FIG.
  • FIG. 26 is a plan view of a modified example of the driving device that is a part of the circuit switching switch according to the fifth embodiment of the present invention.
  • FIG. 27 is a cross-sectional view showing an initial state of an embodiment of a circuit switching switch according to the present invention.
  • Fig. 28 shows the driving state of the circuit switching switch shown in Fig. 27.
  • FIG. 29 is a block diagram of a system in which the circuit switching switch shown in FIG. 27 is applied to a portable information terminal.
  • FIG. 30 is a cross-sectional view showing an initial state of another embodiment of the circuit switching switch according to the present invention.
  • FIG. 31 is a conceptual diagram illustrating a manufacturing process of the circuit switching switch shown in FIG.
  • FIG. 32 is a conceptual diagram illustrating a manufacturing process of the circuit switching switch shown in FIG.
  • FIG. 33 is a sectional view showing an initial state of another embodiment of the circuit switching switch according to the present invention.
  • FIG. 34 is a plan view of a drive device that is a part of the circuit switching switch according to the sixth embodiment of the present invention.
  • FIG. 35 is a cross-sectional view of the driving device cut along a plane along the line A5—A5 in FIG.
  • FIG. 36 is a plan view of a drive device that is a part of the circuit switching switch according to the seventh embodiment of the present invention.
  • FIG. 37 is a cross-sectional view of the driving device cut along a plane along line A 6 —A 6 in FIG.
  • FIG. 38 is a plan view of a drive device that is a part of the circuit switching switch according to the eighth embodiment of the present invention.
  • FIG. 39 is a cross-sectional view of the driving device cut along a plane along the line A7-A7 in FIG.
  • FIG. 40 is a plan view of a drive device that is a part of the circuit switching switch according to the ninth embodiment of the present invention.
  • FIG. 41 is a cross-sectional view of the driving device cut along a plane along line A8-A8 in FIG.
  • FIG. 42 is a plan view of a drive device that is a part of the circuit switching switch according to the tenth embodiment of the present invention.
  • FIG. 43 is a cross-sectional view of the driving device cut along a plane along line A9-A9 in FIG.
  • FIG. 44 is a plan view of a drive device that is a part of the circuit switching switch according to the eleventh embodiment of the present invention.
  • FIG. 45 is a cross-sectional view of the driving device 550 cut along a plane along the line AA-AA in FIG.
  • FIG. 46 is a plan view of a drive device that is a part of the circuit switching switch according to the 12th embodiment of the present invention.
  • FIG. 47 is a cross-sectional view of the driving device 560 cut along a plane along the line AB-AB in FIG.
  • FIG. 48 is a plan view of a drive device that is a part of the circuit switching switch according to the thirteenth embodiment of the present invention.
  • FIG. 49 is a cross-sectional view of the driving device cut along a plane along the line AC-AC in FIG.
  • FIG. 50 is a cross-sectional view of the driving device cut along a plane along the line AD-AD in FIG.
  • FIG. 51 is a plan view of a drive device that is a part of the circuit switching switch according to the fourteenth embodiment of the present invention.
  • FIG. 52 is a cross-sectional view of the driving device 580 cut along a plane along the line AE-AE in FIG.
  • FIG. 53 shows a modification of the piezoelectric / electrostrictive film type actuator applied to the drive device shown in Fig. 34, and the same drive in the plane along line A5-A5 in Fig. 34
  • FIG. 2 is an enlarged cross-sectional view of the same piezoelectric / electrostrictive film type actuating device obtained by cutting the device.
  • Fig. 54 shows a modified example of the piezoelectric / electrostrictive film type actuator applied to the drive device shown in Fig. 34, and the drive device is shown in a plane along the AF-AF line in Fig. 34.
  • FIG. 2 is an enlarged cross-sectional view of the same piezoelectric / electrostrictive film type actuator.
  • FIG. 1 is a longitudinal sectional view of a drive device 10 which is a part of a circuit switching switch according to a first embodiment of the present invention
  • FIG. 2 is a plan view of the drive device 10.
  • FIG. 1 is a cross-sectional view of the driving device 10 cut along a plane along the line 11 in FIG.
  • the drive device 10 includes a substrate 11 made of a substantially rectangular parallelepiped ceramic having sides extending along the X-axis, Y-axis, and Z-axis orthogonal to each other, and a pair of piezoelectric films (piezoelectric Z electrostriction). Element) 12 a and 12 b.
  • the base body 11 includes therein a flow path component 13, a pair of pump chambers 14 a, 14 b, an internal pressure buffer chamber component 15, and a pair of fine flow channels 16 a, 16b.
  • the flow path component 13 has a major axis in the X-axis direction, and is a cross-sectional view of the base 11 cut along a plane (plane parallel to the YZ plane) along the line 2-2 in FIG. As shown in FIG. 3, the cross section constitutes a flow path 13a having a substantially rectangular shape. Taking the specific dimensions of the flow path 13a as an example, the width (length in the Y-axis direction) W of the substantially rectangular cross section is 100 m, and the depth (the length in the Z-axis direction, that is, the height) H Is 50 m, and the length in the longitudinal direction (length in the X-axis direction) L is 1 mm.
  • an incompressible working fluid for example, a liquid such as water or oil
  • a liquid material such as a magnetic material or a gallium alloy
  • a moving body 110 made of a substance different from the working fluid 100 covered with a conductive material is accommodated therein, and the flow path 13 a is substantially formed by the moving body 110. It is divided into a pair of working chambers 13a1 and 13a2.
  • the moving body 110 exists as one lump (liquid mass (vacuum), air bubble, or micro solid) in the flow channel 13a, and as shown in FIG.
  • An extremely small gap S through which the working fluid 100 can pass is formed at the four corners of the rectangle having the above-mentioned cross section.
  • the pump chamber 14 a is a cylindrical space filled with the working fluid 100 and having a central axis in the Z-axis direction, and a part of the lower surface thereof is a flow path 1. This is a space formed above the same flow path 13a so as to communicate with the end of 3a in the negative direction of the X-axis. Illustrating the specific dimensions of the pump chamber 14a, the radius R of the bottom and top surfaces of the cylinder is 0.5 mm, and the depth (height) h is lOm. On the upper surface of the pump chamber 14a, a diaphragm (diaphragm portion) 17a made of a ceramic having a thickness (height) d of 10 m is formed.
  • the pump chamber 14b has the same shape as the pump chamber 14a, and is located above the flow path 13a such that a part of the lower surface communicates with the end of the flow path 13a in the positive direction of the X-axis. And the working fluid 100 is filled. Further, on the upper surface of the pump chamber 14b, a diaphragm 17b made of ceramic having the same shape as the diaphragm 17a is formed.
  • the piezoelectric film 12a forms a ceramic pump 18a together with the pump chamber 14a and the diaphragm 17a, and has a thickness D of 20 microns, and a radius r in plan view of the pump. It has a circular thin plate shape slightly smaller than the radius R of the chamber.
  • the piezoelectric film 12a is positioned above the pump chamber 14a such that the center of the circular bottom coincides with the center of the upper surface of the pump chamber 14a in plan view.
  • a voltage is applied to a pair of electrodes (not shown) fixed to the upper surface of the piezoelectric film 12a and sandwiching the piezoelectric film 12a, the diaphragm 17a is deformed to form the pump chamber 14a.
  • the volume is increased or decreased to increase or decrease the working fluid 100 inside the pump chamber 14a.
  • the polarization direction of the piezoelectric film 12a is the positive direction of the Z axis.
  • the piezoelectric film 12b is the same as the piezoelectric film 12a, and forms a ceramic pump 18b together with the pump chamber 14b and the diaphragm 17b. That is, the piezoelectric film 12 b is fixed to the upper surface of the diaphragm 17 b at a position above the pump chamber 14 b, and deforms the diaphragm 1 ⁇ b when a voltage is applied to an electrode (not shown). Thus, the volume of the pump chamber 14b is increased or decreased, and the working fluid 100 in the pump chamber 14b is pressurized or decompressed.
  • the polarization direction of the piezoelectric film 12b is also the positive direction of the Z axis.
  • the internal pressure buffer chamber component 15 has a major axis along the X-axis direction in plan view.
  • the length in the X-axis direction is longer than the length of the flow path 13a, and the length in the Y-axis direction, which is its short axis, is greater than the width W of the flow path 13a.
  • it is a long part and constitutes the internal pressure buffer chamber 15a whose section is a substantially rectangular space.
  • the internal pressure buffer chamber 15a is formed in the base body 11 below the flow path 13a (in the negative direction of the Z axis) such that its major axis coincides with the central axis of the flow path 13a in plan view.
  • the working fluid 100 is filled in a substantially central portion of the inner portion in the X-axis direction, and the compressive (compressibility is much lower than the working fluid 100) pressure is provided in the peripheral portion.
  • Buffer fluid hereinafter also referred to as “compressible fluid”
  • the compressible fluid 120 is the vapor of the working fluid 100, but a predetermined amount of an inert gas may be mixed with this vapor, and the vapor may not contain the vapor. You may.
  • the fine flow path section 16a is a hollow cylindrical fine flow path extending in the Z-axis direction that communicates the working chamber 13a1 on the left side of the flow path 13a with the internal pressure buffer chamber 15a.
  • the microfluidic channel 16a1 is also filled with a working fluid 100.
  • the radius of the cylinder is 15 m
  • the length in the Z-axis direction (height of the cylinder) is 100 m.
  • the shape of the fine channel 16a1 is selected so as to increase the fluid resistance as compared with the channel 13a. That is, the fine flow path 16 a 1 is provided with a pressure fluctuation of the working fluid 100 in the flow path 13 a.
  • the fine flow channel portion 16b is a portion forming a fine flow channel 16b1 having the same shape as the fine flow channel 16a1, and the fine flow channel 16b1 is a portion of the flow channel 13a.
  • the right working chamber 13a2 communicates with the internal pressure buffer chamber 15a, and the working fluid 100 is filled.
  • the fine flow path 16b1 also has a throttle function similar to that of the fine flow path 16a1. JP02 / 12043
  • the working fluid 100 is continuously filled in a part of the internal pressure damping chamber 15a communicated with the flow path 13a through 16a1 and 16b1.
  • the space of the internal pressure buffer chamber 15a that is not filled with the working fluid 100 is filled with the steam 120 of the working fluid 100.
  • FIG. 4 shows an initial state of the drive device 10 in which a drive voltage is not applied to any of the electrodes of the piezoelectric films 12a and 12b.
  • the working fluid 10 0 filled in both pump chambers 14a and 14b and the flow path 13a Is not pressurized or depressurized.
  • the moving body 110 accommodated in the flow path 13a is stationary at the initial position (substantially the center of the flow path 13a in the X-axis direction).
  • the piezoelectric film 12a installed on the diaphragm 17a of the pump chamber 14a has a positive electrode on the upper electrode and a negative electrode on the lower electrode.
  • the voltage applied to the piezoelectric film 12 b installed on the diaphragm 17 b in the pump chamber 14 b is opposite to the negative voltage applied to the upper electrode and the positive voltage applied to the lower electrode. Is applied.
  • the piezoelectric film 12a contracts in the horizontal direction (that is, in a plane substantially parallel to the XY plane, that is, in the direction perpendicular to the thickness D direction of the piezoelectric film 12a).
  • the diaphragm 17a on the pump chamber 14a is bent downward to reduce the volume of the pump chamber 14a.
  • the working fluid 100 in the pump chamber 14a is pressurized and the pressure increases, and the working fluid 100 is pushed out into the working chamber 13a1 of the flow path 13a. .
  • the piezoelectric film 12 b expands in the lateral direction (that is, in a plane substantially flat in the XY plane), the diaphragm 17 b is bent upward and deformed, and the volume of the pump chamber 14 b is increased. Increase. As a result, the pressure of the working fluid 100 in the pump chamber 14 b is reduced, and the pressure is reduced. 100 is sucked from the working chamber 13a2 of the flow path 13a. Therefore, due to the pressure difference between the two pump chambers 14a and 14b, the moving body 110 stored in the flow path 13a becomes the working chamber 13a1 (pump chamber 14a). Move from to the working chamber 13a2 (pump chamber 14b) (that is, in the positive direction of the X axis).
  • a negative voltage is applied to the upper electrode and a positive polarity voltage is applied to the lower electrode with respect to the piezoelectric film 12a, and at the same time, a positive and lower voltage is applied to the piezoelectric film 12a with the upper electrode.
  • a negative voltage is applied to the electrode, the working fluid 100 in the pump chamber 14b is pressurized, and the working fluid 100 in the pump chamber 14a is depressurized.
  • the moving body 110 moves from the working chamber 13a2 (pump chamber 14b) to the working chamber 13al (pump chamber 14a) (that is, in the negative X-axis direction) due to the pressure difference. Move.
  • the pump chambers 14a, 14a, 12a, 12b are changed by rapidly changing the voltage applied to the piezoelectric films 12a, 12b (increase or decreasing the applied voltage). Pressurize and depressurize 14 b at high speed. As a result, the flow resistance of the microchannels 16a1 and 16b1 is sufficiently large, and the working fluid 100 in and out of the channels 13a enters and exits the channels 16al and 16bl. Pressure difference between the working chamber 13a1 of the flow path 13a and the working chamber 13a2 without lowering.
  • the device that does not have the microchannels 16a1 and 16b1 and the internal pressure buffer chamber 15a does not work.
  • the pressure of the working fluid 100 becomes excessive, the volume of the pump chambers 14a, 14b increases, and the diaphragms 17a, 17b are pushed up and damaged, and the base body 11 is damaged. If configured as an adhesive assembly of the ceramics sheet, the adhesive
  • the driving device 10 of the present invention has a fine channel 16 a 1, It has 16 bl and an internal pressure buffer chamber 15a, and the temperature of the working fluid 100 rises slowly, so that the pressure of the working fluid 100 also rises slowly. Therefore, as indicated by the arrow in FIG. 7, the expansion due to the temperature rise of the working fluid 100 is a very small flow resistance that exhibits an extremely low flow resistance against such a slow pressure rise of the working fluid 100. It flows out to the internal pressure buffer chamber 15a via the flow paths 16a1 and 16b1. In the internal pressure buffer chamber 15a, the vapor 120 of the working fluid 100 is compressed and the pressure rises, but the compression rate of the gas is lower than that of the liquid, so the pressure rise of the working fluid 100 is Minor.
  • the diaphragms 17a and 17b on the upper surface of the pump chambers 14a and 14b are pushed up and damaged, and the seal of the adhesive assembly part is damaged and liquid leakage of the working fluid 100 occurs. The situation does not occur. Also, when the working fluid 100 contracts due to a decrease in the environmental temperature of the driving device 100, the temperature of the working fluid 100 also decreases slowly, and as shown by the arrows in FIG. The working fluid 100 returns from the internal pressure buffer chamber 15a to the flow path 13a via the fine flow paths 16a1 and 16bl.
  • the drive device 10 since the drive device 10 includes the fine channels 16a1 and 16b1 and the internal pressure buffer chamber 15a, the drive device 10 can be used in a wide temperature range, and the drive device 10 has high reliability. , And a highly durable drive device.
  • FIG. 9 it is assumed that the moving body 110 is stationary at a position biased toward the piezoelectric film 12a in the initial state. Such a state may occur in a process of storing the moving body 110 in the flow path 13a in a manufacturing process described later, within a range of manufacturing variation, or due to an operation error or the like.
  • the applied voltage Va is, for example, a drive voltage whose absolute value increases from 0 V to 50 V in 1 to 20 seconds, and is a voltage in which the upper electrode has a positive polarity and the lower electrode has a negative polarity.
  • the applied voltage Vb is, for example, a drive voltage whose absolute value is increased from 0 V to 50 V in 1 to 20 ⁇ seconds, and is a voltage at which the upper electrode is negative and the lower electrode is positive. is there. As a result, as shown in FIG.
  • the working fluid is pressurized by the pump chamber 14a and the working fluid 100 is depressurized by the pump chamber 14b. Move to a position from the center (toward pump chamber 14b). In this case, since the rate of change of the applied voltages V a and V b is large, the flow resistance of the fine channels 16 al and 16 bl becomes sufficiently large, and the flow channels 16 al and 16 b 1 The working fluid 100 in the flow path 13a does not enter or leave. Next, as shown at times t2 to t3 in FIG.
  • the applied voltages Va and Vb are kept constant for a short time, and thereafter, as shown at times t3 to t4, the applied voltage
  • the absolute values of Va and Vb are slowly reduced to 0 V, for example, in about 0.1 to 1 second.
  • the flow resistance of the fine flow passages 16a1 and 16b1 becomes small. Therefore, as shown in FIG. 12, the working fluid 100 is supplied to the working chamber on the right side of the flow passage 13a. From 13 a 2 flows into the internal pressure buffer chamber 15 a via the fine channel 16 b 1, and from the internal pressure buffer chamber 15 a to the left side of the channel 13 a via the micro channel 16 b 1 Into the working chamber 1 3 a 1.
  • the pressure change of the working fluid 100 becomes slow enough to cause pressure relief via the fine channels 16a1 and 16b1, and the pump chamber 14a , 14b, and the internal pressure of the flow path 13a hardly change, so that the moving body 110 can be kept almost stationary.
  • the initial position of the moving body 110 can be set to a desired position.
  • the peak values V p, — V p of the applied voltages V a, V b illustrated in FIG. 10 and the voltage changes when the applied voltages V a, V b are changed to the peak values V p, — V p Velocity, the applied voltage Va and Vb are changed from the peak value Vp, one Vp to 0 V, and the voltage application speed is selected.
  • the position can be controlled to a desired position.
  • the direction of the electric field applied to the piezoelectric films 12 a and 12 b by the voltage applied to the piezoelectric films 12 a and 12 b is defined as the positive direction (in this case, the Z-axis positive direction). ), And the negative direction (Z-axis negative direction), but the electric field in the opposite direction to the polarization of the piezoelectric films 12 a and 12 b is not desirable because the same polarization is resolved when the coercive electric field is exceeded. There is. Therefore, if the state in which the bias voltage is applied in advance is set as the initial state of the driving device 10, the driving device 10 can be driven only by the electric field in the same direction as the polarization.
  • the potential of the lower electrode is set to a reference potential of 0 (V)
  • a bias voltage of 25 (V) is applied to the upper electrode
  • this state is set as an initial state.
  • the potential of one of the upper electrodes of the piezoelectric films 12a and 12b is set to 50 (V) from this state, an electric field in the same direction as the polarization direction is applied to the piezoelectric film.
  • the diaphragm 17a or 17b below it flexes downward and one of the corresponding pump chambers 14a or 14b pressurizes the working fluid 100.
  • the drive device 10-1 according to this modified example is different from the drive device 10 shown in FIG. 1 in that the base 11 of the drive device 10 is provided with a pair of fine channels 16a1 and 16b1.
  • the only difference is that the substrate 11-1 has only one fine channel 16a1.
  • This is a form that can be adopted when the cross-sectional area of the gap (gap S shown in FIG. 3) between the moving body 110 and the flow path 13a can be secured to a certain value or more. Since the labor and time required for processing the fine channel are reduced to half, the drive device 10-1 can be manufactured at lower cost.
  • the drive depth 10 of the first embodiment is superior.
  • a fine groove M is formed on the inner surface of the flow path 13a.
  • the groove M can be applied to other embodiments of the present invention, and the number and shape of the groove M can be appropriately selected.
  • the piezoelectric films 12 2, 12 13, the diaphragms 17 a, 17 b, and the pump chamber 1 of the drive devices 10, 10-1 are provided.
  • a piezoelectric Z electrostrictive film type actuator for a display device disclosed in Japanese Patent Application Laid-Open No. 10-78549 can be applied.
  • This actuator is suitable for the drive device of the present invention because it is compact and can obtain a large pressing force.
  • it is important to select a material having a large coercive electric field as the piezoelectric material for the piezoelectric films 12a and 12b.
  • the volume of the pump chambers 14a and 14b is desirable to reduce the volume of the pump chambers 14a and 14b to the minimum necessary.
  • a method disclosed in Japanese Patent Application Laid-Open No. Hei 9-22913 may be used. It is suitable. This is because according to the disclosed method, it is possible to reduce the depth of the pump chambers 14a and 14b to a minimum of about 5 to 10 ⁇ m.
  • FIG. 15 is a longitudinal sectional view of the driving device 20, and FIG. 2 is a plan view of the driving device 20.
  • FIG. FIG. 15 shows a cross section of the driving device 20 cut along a plane along the line 3-3 in FIG.
  • the drive device 20 is composed of a base 21 formed so that the flow path 13a is exposed on the upper surface, and a connecting plate (communication substrate) 2 of a ceramic thin plate formed on the base 21. 2 and a pair of ceramic pumps 23 a and 23 b disposed above the connection plate 22.
  • connection plate 22 includes a pair of left and right channel communication holes 22 a and 22 b formed in a hollow cylindrical shape at positions separated in the X-axis direction.
  • the bottom surfaces of the flow passage holes 22a and 22b are connected to the flow passage 13a at both ends in the X-axis direction of the flow passage 13a.
  • the ceramic pumps 23a and 23b are thin plates made of ceramics, and have pump chamber components 24a and 24b each having a substantially square shape in plan view, and pump chamber components 24a and 24b.
  • the piezoelectric films 25a and 25b are respectively fixed to the upper surfaces of b.
  • the pump chamber components 24 a and 24 b have the same shape as the pump chambers 14 a and 14 b of the drive device 10 of the first embodiment.
  • a thin plate-like diaphragm 26a, 26b formed thereon and a part of each bottom surface of the pump chambers 24a1, 24bl are connected to the flow passage communication holes 22a, 22b. It has a hollow cylindrical pump chamber communication hole 24a2 and 24b2 communicating with each upper surface of b.
  • the pump chambers 24a1 and 24b1 and the pump chamber communication holes 24a2 and 24b2 are the same as the channel communication holes 22a and 22b and the channel 13a. , Filled with working fluid 100.
  • the ceramic pumps 23a and 23b are manufactured using the methods and configurations disclosed in Japanese Patent Application Laid-Open Nos. 10-78549 and 7-214779.
  • This is a piezoelectric electrostrictive film type actuator, which is formed by laminating on a substrate 21 as a flow path substrate and a connecting plate 22.
  • the operation for driving (moving) the moving body 110 of the driving device 20 is the same as that of the driving device 10.
  • Pump room 2 4 a 1, 2 4 bl, thermal expansion and contraction of the working fluid 100 filled in the pump chamber communication holes 24a2, 24b2, the flow passage holes 22a, 22b, and the flow passage 13a The operation for absorbing the accompanying internal pressure change is the same as that of the drive device 10 described above.
  • the manufacturing process of the ceramic pumps 23a and 23b which are piezoelectric electrostrictive membrane type actuators, will be described.
  • FIG. Prepare 01, 202, and 203.
  • a window section 202 for forming a pump chamber 24a1 (24b1) is formed in the green sheet 202, and a pump chamber 24 is formed in the dust sheet 203.
  • Each of the holes 203 a to be b 2) is formed by machining such as punching.
  • the green sheets 201, 202, and 203 are laminated under pressure and heat, and are fired to be integrated to obtain a diaphragm substrate 204.
  • a lower electrode 205 and an auxiliary electrode 206 as disclosed in Japanese Patent Application Laid-Open No. 5-267642 are respectively provided with a high melting point. It is formed of a metal by a thick film forming technique such as screen printing, and is subjected to heat treatment such as baking if necessary.
  • a piezoelectric film 207 is formed thereon by the same thick film forming method, and finally, an upper electrode 208 is formed.
  • the upper electrode 208 a thin film forming method such as sputtering can be appropriately selected in addition to the thick film method.
  • the parts corresponding to the ceramic pumps 23a and 23b are manufactured.
  • FIG. 18 shows another manufacturing method for manufacturing a portion corresponding to the ceramic pumps 23a and 23b.
  • a spacer layer 202b is provided on the upper surface of the green sheet 203 in the pump chamber 24a1 (24). It is formed by screen printing so as to have a window portion 202a for forming b1).
  • Others are the same as the manufacturing method described with reference to FIG. 17 above.
  • the details of this production method are described in The technique disclosed in Japanese Patent Application Publication No. 29013 can be suitably used, whereby the depth of the pump chamber 24a1 (24b1) (in the Z-axis direction of the hollow cylinder in the assembled state) is reduced. Height) can be reduced to about 1 O ⁇ m, so that a diaphragm substrate (ie, ceramic pumps 23a, 23b) having a small volume pump chamber 24a1 (24b1) is obtained. be able to.
  • the base (flow path substrate) 21 select the appropriate material from plastic, glass, metal, ceramics, etc. to manufacture the substrates 21 1, 21 2, 21 3. 16 a 1, 16 b 1, and an internal pressure buffer chamber.
  • a working fluid injection hole 2 13 a penetrating from the lower surface of the internal pressure buffer chamber 15 a formed in the substrate 2 13 to the lower surface of the substrate 2 13 is formed.
  • the processing for forming the flow path and the like for the substrates 211 to 213 is performed by selecting an appropriate processing method from punching, etching, laser processing, coining, sandblasting, and the like.
  • the substrates 21 11 to 21 3 thus obtained are laminated and adhered with an epoxy resin or the like, whereby the substrate 21 is manufactured.
  • the material of the substrates 21 1 to 21 3 is such that the coefficient of thermal expansion is as close as possible to that of the ceramic pumps 23 a and 23 b, which are piezoelectric Z-electrostrictive film type actuators. Glass or a ceramic substrate having a close ratio is suitable.
  • etching or coining for the processing of the flow path 13a and the processing of the concave part for forming the internal pressure buffer chamber 15a having a depth of 200 microns.
  • the flow path 13 a or the internal pressure buffer chamber 15 is joined.
  • Substrates 2 1 1 and 2 13 on which a is formed can also be obtained.
  • the fine channels 16a1 and 16b1 that require high-aspect ratio processing are processed by laser processing or by using a high-aspect ratio ceramic green sheet. The method of firing after punching out the holes is suitable.
  • a pair of flow passage holes 22 a and 22 b are formed in the connection board 2 14 that becomes the connection plate 22 in the same manner as the board 2 11.
  • the ceramic pumps 23a, 23b piezoelectric Z-electrostrictive film type actuator
  • the connection substrate 214, and the substrate 21 are laminated by bonding means such as pressure bonding, diffusion bonding, etc. Integrate.
  • the moving body 110 is stored in a predetermined position of the flow path 13a. If the moving body 110 is a vacuole (a mass of liquid), the working fluid 100 selects a material that is insoluble in the vacuole and flows the moving body 110 using a dispenser or the like. Store in a predetermined position in road 13a. If the moving body is a bubble, an injection hole for gas injection is separately provided from the flow path 13a, and the bubble and the working fluid 100 are injected therefrom, and then the injection hole is sealed.
  • the moving body 110 is a vacuole (a mass of liquid)
  • the working fluid 100 selects a material that is insoluble in the vacuole and flows the moving body 110 using a dispenser or the like. Store in a predetermined position in road 13a. If the moving body is a bubble, an injection hole for gas injection is separately provided from the flow path 13a, and the bubble and the working fluid 100 are injected therefrom, and then the injection hole is sealed.
  • the obtained laminate is placed under vacuum in a vacuum chamber or the like, and a predetermined amount of the working fluid 100 is injected into the internal pressure buffer chamber 15 a from the injection hole 2 13 a by a measuring means such as a dispenser. .
  • a measuring means such as a dispenser.
  • the pressure in the flow path is increased to a predetermined pressure by a sealing gas 120, which is a compressible fluid such as gas, working fluid 100 vapor, or a mixture thereof, and finally, the injection hole 2 13a is opened.
  • the drive device 20 of the present invention is obtained.
  • the depth (height in the Z-axis direction) of the internal pressure buffer chamber 15a be greater than the depth of each of the pump chambers 24a1, 241> and the flow path 13a. Accordingly, when the working fluid 100 is a liquid, the curvature of the gas-liquid interface of the liquid in the internal pressure buffering chamber 15a is reduced by the pump chambers 24al, 24bl and the flow Since the curvature can be made larger than the curvature of the gas-liquid interface formed in the passage 13a, the filling can be performed more smoothly.
  • FIG. 21 shows a longitudinal section.
  • the driving device 30 has a ceramic pump (piezoelectric / electrostrictive film type actuator) 23a, which is divided into two in the driving device 20 of the second embodiment shown in FIG. Only in the point that a pump chamber component 24c formed by integrating the pump chamber components 24a and 24b of 23b is provided, and the connecting plate 22 provided in the drive device 20 is omitted.
  • the driving device is different from the driving device 20. According to the driving device 30, the number of bonded parts and the number of parts are reduced, and thus there is an effect that the manufacturing cost can be reduced.
  • connection plate 22 could be a transparent glass or a metal plate material that can also serve as an electrode, as shown in FIG. 21.
  • the connecting plate 22 does not exist, and therefore, the material of the pump chamber constituent part 24 c is limited to the ceramic / electrostrictive film type actuator substrate material.
  • the base 41 is the fine channel 16 a1, 16 of the drive device 20 of the second embodiment shown in FIG.
  • a porous body 16c is provided, and the flow path 13a and the internal pressure buffer chamber 15a are connected via the porous body 16c.
  • Providing the porous body 16c has the same effect as forming a large number of extremely fine channels 16a1 and 16b1.
  • the porous body 16 c is preferably tapered or provided with a step on the side surface in order to improve the assembling property and the sealing property.
  • FIG. 23 is a longitudinal sectional view of the driving device 50
  • FIG. 24 is a plan view of the driving device 50.
  • FIG. 23 shows a cross section of the driving device 50 cut along a plane along the line 44 in FIG.
  • This drive device 50 is a ceramic pump having a pair of piezoelectric films 25 c 1 and 25 c 2 instead of the piezoelectric film 25 b of the ceramic pump 23 b included in the drive device 30 shown in FIG. 21. 2 3 c is provided.
  • These piezoelectric films 25 c 1 The polarization direction of 25 c 2 is the positive direction of the Z-axis, similarly to the piezoelectric film 25 a.
  • Each of the piezoelectric films 25c1 and 25c2 has an oblong shape having a major axis in the Y-axis direction in plan view, and a predetermined distance in the X-axis direction such that the major axes are parallel to each other. It is fixed on a diaphragm 26 b, which is a ceramic thin plate, with a space therebetween.
  • the pump chamber 27 formed below the diaphragm 26 b has an oval shape having a long axis in the Y-axis direction in plan view, like the piezoelectric films 25 c 1 and 25 c 2. ing.
  • Each of the piezoelectric films 25 c 1 and 25 c 2 has a flat surface sandwiching the pump chamber 27 in a plan view, and about half of the piezoelectric films 25 c 1 and 25 c 2.
  • the pump chambers 27 are arranged so as to overlap with each other visually.
  • the pump chamber 25a of this example is also formed to have an oval shape having a major axis in the Y-axis direction in plan view.
  • a voltage is applied to the piezoelectric films 25c1, 25c2 and the piezoelectric film 25a with the same polarity. That is, a drive voltage having a positive polarity and a negative polarity to the upper electrode and having a large voltage change speed is applied to the lower electrode.
  • the diaphragm 26a is bent downward by the contraction of the piezoelectric film 25a.
  • the piezoelectric films 25c1 and 25c2 contract, so that the central portion thereof is displaced upward.
  • the working fluid 100 is pressurized in the pump chamber 24a1 and decompressed in the pump chamber 27, so that the moving body 110 is moved from the pump chamber 24a1 to the pump chamber. 2 Move toward 7 (positive X-axis).
  • the piezoelectric / electrostrictive film type actuating device (ceramic pump) that performs such an operation
  • the one disclosed in Japanese Patent Application Laid-Open No. H07-220284 can be used.
  • the polarity of the voltage applied to the piezoelectric films 25 cl, 25 c 2, and 25 a is always constant.
  • the piezoelectric films 25c1, 25c2, 25a can always be driven with the same polarity as the polarization electric field of each of the piezoelectric films 25cl, 25c2, 25a.
  • the driving device is configured such that one of the pair of pumps can only pressurize or both can increase and decrease the pressure, and the other pump can only reduce the pressure. In some cases, the required functions and performance may be sufficiently satisfied even when operated in such a manner.
  • the film of the electrostrictive material is previously formed as a piezoelectric film of the pump capable of performing only the pressure reduction. It cannot be used without driving measures such as applying a bias voltage.
  • the electrostrictive material contracts in the direction perpendicular to the applied electric field, but does not expand regardless of the direction of the electric field, and therefore cannot flexurally displace the diaphragm upward.
  • the piezoelectric films 25 c 1 and 25 c 2 of the pump 23 c of the drive device 50 according to the fifth embodiment cause the diaphragm 26 b to bend upward by the contraction action, and the pump Since the pressure in the chamber 27 can be reduced, the film of the electrostrictive material can be used as it is as the piezoelectric films 25c1 and 25c2.
  • each pump depending on the performance of each device, even if the required number of pumps 23d similar to the above-mentioned pump 23c with a pump chamber of an appropriate shape are installed good. Also, in this case, by configuring each pump so that it can be driven independently, for example, the number of pumps to be driven is appropriately changed to adjust the differential pressure applied to the moving body 110, and thus the moving body 1 The moving amount and / or the moving speed of 10 may be controlled.
  • the circuit switching switch 60 shown in FIG. 27 includes the above-described drive device 10 and a common electrode 61 made of platinum, gold, nickel, etc., and a pair of switching made of platinum, gold, nickel, etc. Electrodes 62a and 62b.
  • the common electrode 61 is provided on the lower wall surface (wall surface on the negative side of the Z-axis) 13 a 1, which is one of the walls constituting the flow channel 13 a, with the fine flow channel 16 At the position between a 1 and the fine flow path 16 b 1, the same flow path 13 a I is formed, and the potential is switched by a connection line (terminal electrode) (not shown). It is taken out of the switching switch 60 and is electrically connected to other electric components outside the switching switch 60.
  • the switching electrodes 62 a and 62 b have the same shape as each other, and the upper wall surface (the positive direction of the Z-axis) which is the other one of the wall surfaces constituting the flow path 13 a On the side wall surface 13a2, it is exposed to the same flow path 13a and is formed so as to face the common electrode 61 at a distance from each other in the X-axis direction.
  • the switching electrodes 62 a and 62 b are electrically insulated from each other, and each potential is taken out of the switching switch 60 by a connection wire (terminal electrode) (not shown). It is designed to be electrically connected to other electrical components outside the 60.
  • the switching electrode 62a is referred to as a first switching electrode 62a
  • the switching electrode 62b is referred to as a second switching electrode 62b.
  • the moving body 110 is a conductive liquid metal made of mercury, a Ga-based alloy, or the like, and is abbreviated as the first switching electrode 62 a (or the second switching electrode 62 b) in a side view. It has the same size, moves in the flow path 13a while always in contact with the common electrode 61, and selectively with the first switching electrode 62a or the second switching electrode 62b. It comes into contact with. In other words, the first switching electrode 62a and the second switching electrode 62b are formed so as to electrically contact the common electrode 61 via the moving body 110.
  • a control circuit applies a voltage of plus polarity to the upper electrode of the piezoelectric film 12a and a voltage of minus polarity to the lower electrode thereof, and A negative voltage is applied to the upper electrode of the piezoelectric film 12b, and a positive polarity voltage is applied to the lower electrode.
  • the pump chambers 14a and 14b are operated by this drive voltage, and the moving body 110 is moved to the operating chamber 13al (pump chamber 14a) by the pressure difference of the working fluid 100 generated thereby.
  • control circuit eliminates the drive voltage applied to each electrode of the piezoelectric films 12a and 1'2b from this state.
  • the moving body 110 is moved from the working chamber 13a2 by the pressure difference of the working fluid 100 generated at the time of the return. It moves toward the working chamber 13 a 1 (that is, in the negative direction of the X-axis) to a position where it comes into contact with the first switching electrode 62 a, and the first switching electrode 62 a and the common electrode 61 Is electrically connected again.
  • the switching switch 61 selectively moves the first switching electrode 62 a and the second switching electrode 62 b to the common electrode 61 by moving the moving body 110. Is connected in a conductive manner.
  • the moving body 110 has good wettability with each of the first switching electrode 62 a and the second switching electrode 62 b, and the first switching electrode 62 a and the second switching electrode. Since the wettability with the wall surface of the flow path 13 a where the switching electrode 6 2 b is not provided is not good, the first switching electrode 6 2 a and the second switching electrode 6 in the initial state and during driving. Maintain reliable contact with 2b.
  • the system shown in Fig. 29 has two circuit switching switches similar to the above-mentioned switching switch 60, and these switches are called PDA (Personal Digital Assistant) configured to enable wireless communication. Diversity of portable information terminals Used as an antenna switching switch and a transmission Z reception switching switch.
  • PDA Personal Digital Assistant
  • this system is composed of a diversity antenna switch 303, which has the same structure as the main antenna 301, the diversity antenna 302, and the switching switch 60,
  • the transmission Z reception switching switch 304 which has the same structure as the switching switch 60, no. It consists of a power amplifier 305, an RF-IF processor 306, an IF modem 307, and a baseband processor 308.
  • the main antenna 301 and the diversity antenna 302 are respectively provided with a first switching electrode 303 a and a second switching electrode 303 b of the diversity antenna switching switch 303. It is electrically connected. Also, the common electrode 303c of the diversity / antenna switching switch 303 is electrically connected to the common electrode 304c of the transmission Z reception switching switch 304. The first switching electrode 304 a of the transmission / reception switching switch 304 is electrically connected to the RF-IF converter (radio frequency-to-intermediate frequency converter) 303 for the second switching. The electrode 304b is electrically connected to the power amplifier 305.
  • RF-IF converter radio frequency-to-intermediate frequency converter
  • the baseband processor 308 is electrically connected to the RF-IF converter 306 via the IF modem 307, and is also electrically connected to the power amplifier 305.
  • the power amplifier 305 is also connected to the RF-IF converter 306.
  • the upper and lower electrodes of the piezoelectric films of the diversity / antenna switching switch 303 and the transmission / reception switching switch 304 are connected to a control circuit (not shown).
  • the control circuit When the system is in a “reception standby state” in which the system waits for reception of an external radio wave, the control circuit operates each of the diversity / antenna switching switches 303. No drive voltage is applied to the upper and lower electrodes of the piezoelectric film. As a result, the diversity / antenna switching switch 303 keeps the initial state, and the moving body 303 d stays at the position shown in FIG. 29. Thus, the connection state between the first switching electrode 303a and the common electrode 303c is maintained.
  • control circuit does not apply any driving voltage to the upper electrode and the lower electrode of each piezoelectric film of the transmission / reception switching switch 304 in the reception standby state.
  • the transmission / reception switching switch 304 maintains the initial state, and the moving body 304 d remains at the position shown in FIG. 29, and the first switching electrode 304 a and the common electrode Maintain connection with 304c.
  • the power is not consumed at all by the diversity / antenna switching switch 303 and the transmission / reception switching switch 304, and the main circuit is not consumed.
  • the antenna 301 and the RF-IF converter 306 are electrically connected.
  • the control circuit determines which one of the main antenna 301 and the diversity antenna 302 is appropriate for reception (for example, the antenna with the highest received radio wave intensity).
  • the determined antenna is the main antenna 301
  • no driving voltage is applied to the upper electrode and the lower electrode of each piezoelectric film of the diversity / antenna switching switch 303.
  • the diversity / antenna switching switch 303 maintains the initial state, and the moving body 303 d stays at the position shown in FIG. 29, and the first switching electrode 303 a And the common electrode 303 c is maintained in a connected state.
  • the control circuit applies a drive voltage to the upper electrode and the lower electrode of each piezoelectric film of the diversity / antenna switching switch 303.
  • the moving object 303 d of the diper- ity 'antenna switching switch 303 moves rightward in Fig. 29, and the second switching electrode 303 b and the common electrode 303 c And are electrically connected.
  • the diversity antenna 304 can be electrically connected to the RF-IF converter 300 or the power amplifier 305.
  • the control circuit is provided with a switch for transmission / reception switching 304 if necessary.
  • a drive voltage is applied to the upper electrode and the lower electrode of each of the piezoelectric films, thereby moving the moving body 304 d to the left in FIG. 29, and switching the moving body 304 d to the second moving body 304 d.
  • the common electrode 304c and the power amplifier 305 are connected via the electrode 304b. As a result, signal amplification of the received signal is performed appropriately.
  • When receiving always keep the drive voltage from being applied to the upper and lower electrodes of each piezoelectric film of the transmission Z reception switching switch 304, and keep the switch 304 in the initial state. You may do it.
  • an appropriate antenna may be selected as in the reception. Even with this configuration, if at least the main antenna 301 is determined (selected) to be an appropriate antenna, power is consumed by the diversity antenna switching switch 303. Instead, the reception standby state is maintained.
  • the control circuit does not apply any driving voltage to the upper electrode and the lower electrode of each piezoelectric film of the diversity * antenna switching switch 303, and the diversity / antenna switching switch 3
  • the main antenna 3 0 1 is selected as the transmitting antenna by 0 3.
  • the control circuit applies a driving voltage to the upper electrode and the lower electrode of each piezoelectric film of the transmission / reception switching switch 304, whereby the moving body 304 d and the second switching electrode 304 are applied.
  • the common electrode 304c and the power amplifier 305 are connected via b. As a result, the transmission signal amplified by the noise amplifier 305 is transmitted from the main antenna 301.
  • a driving voltage is also applied to the upper and lower electrodes of each piezoelectric film of the diversity / antenna switching switch 303, and the diversity / antenna switching switch 303 is used.
  • Diversity ⁇ Antenna 302 may be appropriately selected.
  • a circuit switching switch 70 including a driving device 20 'similar to the driving device 20 will be described with reference to FIG.
  • the switching switch 70 is connected to the driving device 20 ′ by a common electrode 71 similar to the switching switch 60 and a first switching electrode. It is provided with a pole 72a and a second switching electrode 72b.
  • the operation of the switching switch 70 is the same as the operation of the switching switch 60.
  • the manufacturing method of the switching switch 70 will be described.
  • the ceramic pump 23, which is a piezoelectric electrostrictive film type actuator, is described. , 23b are manufactured by the method shown in FIG. 17 or FIG.
  • the base 21 ′ is manufactured by the manufacturing method shown in FIG.
  • the manufacturing method shown in FIG. 31 is different from the manufacturing method shown in FIG.
  • the terminal electrode 71a for extracting the potential of the common electrode 71 and the terminal for extracting the potential of the first switching electrode 72a on the upper surface of the substrate 211' is formed by a thick film forming technique such as screen printing.
  • the switching switch 70 is manufactured by the manufacturing method shown in FIG.
  • the manufacturing method shown in FIG. 32 is different from the manufacturing method shown in FIG. 20 in that the first switching electrode 72 a and the second switching electrode are provided on the lower surface of the substrate 214 ′ corresponding to the substrate 214.
  • the electrode 72b for forming is formed by a thick film forming method such as screen printing, and the ceramic pumps 23a and 23b, the connecting substrate 214 'and the base 21' are bonded and pressed.
  • the layers are integrated by a bonding means such as diffusion bonding, the first switching electrode 72 a and the second switching electrode 72 b are connected to the terminal electrode 72 a 1 and the terminal electrode 72 b 1. And that they are electrically connected using a conductive adhesive or the like. In this way, the switching switch 70 is manufactured.
  • the driving device includes a plurality of electrodes 6 2a connected to the outside by conducting and wires on the wall of the flow path 13a, using the moving body 110 as liquid metal droplets. , 62b, etc., a small switch or a small relay can be constructed.
  • Such a switch is a mercury micro relay that realizes a switching operation by moving a mercury droplet.
  • a type that uses instantaneous pressure at the time of generation of a bubble due to heating of a micro-heater as a driving force for moving a micro- heater for example,
  • This switch has various characteristics, such as a wide frequency range from DC to 10 GHz, low input loss and high insulation resistance in the GHz band, and no signal bounce. As reported.
  • the above-described circuit switching switch according to the present invention uses a piezoelectric electrostrictive film type actuator as a driving force of the moving body 110 which is a liquid metal droplet.
  • the circuit switching switch according to the present invention can be used for both reception and transmission (transmission) in a PDA, for example, which has recently been advanced in function and wireless communication. It can be suitably used as an antenna switching switch for switching an antenna, a circuit switching switch for switching and connecting one of a transmission (transmission) circuit and a reception circuit to an antenna, or the like.
  • the circuit switching switch according to the present invention when used for the above-mentioned applications, etc., unlike a conventional semiconductor switch, ( a ) no standby power is required when no transmission / reception is performed, which reduces power consumption of the entire system, Battery operation time can be extended, and (b) there is no degradation at all for transmission and reception signals in high frequency bands such as 1 GHz or more and 5 GHz or more. Also, compared with a mercury wet type reed switch, the circuit switching switch according to the present invention has no restriction on the inclination angle when used, and the drive unit (movable parts such as the pump chamber) is integrated with ceramics. It has the advantage of having a much higher longevity.
  • the circuit switching switch according to the present invention is suitably used as a DC switching switch. That is, the circuit switching switch according to the present invention is not limited to a switch for a high frequency band.
  • the common electrode 61 (71) is integrated, but as shown in FIG. 33, the common electrode is switched in the first switching mode. Electrode 6 2 a (72 a) and the second switching electrode 62 b (72 b) (that is, the electrode 61a opposed to the first switching electrode 62a). And an electrode 61b facing the second switching electrode 62b), and electrically connect the divided electrodes 61a and 61b outside the drive switch 60 (70). It is more preferable to adopt a configuration that performs the above.
  • the first and second switching electrodes and the common electrode may be exposed on any wall surface (upper surface, lower surface, side wall surface) of the flow path as long as they are insulated from each other.
  • FIG. 34 is a plan view of the driving device 500
  • FIG. 35 is a cross-sectional view of the driving device 500 cut along a plane along the line A5—A5 in FIG. .
  • the internal pressure buffer chamber is provided at a position having the same height as the flow path, and the fine flow path extends along the Y axis (maintaining the same height). Mainly different from the drive device 10 of the first embodiment in that the flow path communicates with the internal pressure buffer chamber.
  • the drive device 500 is composed of a base 501 made of a substantially rectangular parallelepiped ceramic having sides extending along the X-axis, the Y-axis, and the Z-axis orthogonal to each other, and a pair of piezoelectric films. (Piezoelectric Z electrostrictive element) 502 a and 502 b.
  • the substrate 501 is made of a ceramic thin plate (hereinafter referred to as a "ceramic sheet").
  • the flow path forming section 503 is a part that forms a flow path 503 a similar to the flow path 13 a of the drive device 10 according to the first embodiment.
  • This channel 5 0 3 a is the side wall surface of the substantially rectangular parallelepiped through-hole provided in the ceramic sheet 500 1-2, the upper surface of the ceramic sheet 501-1, and the ceramic sheet 500 1-3
  • channel 1 In channel 5 03 a, channel 1
  • a working fluid 100 and a moving body 110 are accommodated, and the same flow path 503a is substantially formed by a pair of working chambers 50 by the moving body 110. It is divided into 3a1, 503a2.
  • the moving body 110 exists as a single block in the channel 503a, and the working fluid 100 passes through four corners of a rectangle which is a cross section of the channel 503a. The resulting very small gap S is formed (see Fig. 3).
  • a groove similar to the groove M shown in FIG. 14 may be formed in the flow path 503a.
  • the pump chambers 504 a and 504 b are the pump chambers 1 of the drive device 10.
  • the side wall surface of the through hole provided in the ceramic sheet 501-3, the upper surface of the ceramic sheet 501-2, and the ceramic sheet 501-1 4 is a cylindrical space defined by the lower surface.
  • ceramic diaphragms 507a and 507b made of a thin plate-like ceramic sheet 501--4, respectively.
  • the diaphragm 507a and the diaphragm 507b constitute the walls (upper wall) of the pump chamber 504a and the pump chamber 504b, respectively (the pump chamber 504a and the pump chamber 504b).
  • a piezoelectric film 502 a is formed on the upper surface of the diaphragm 507 a, and the piezoelectric film 502 a forms a ceramic pump 508 a together with the pump chamber 504 a and the diaphragm 507 a. Make up. Further, a piezoelectric film 502 b is formed on the upper surface of the diaphragm 507 b, and the piezoelectric film 502 b is formed by the pump chamber 504 b and the diaphragm 500. 7b and ⁇ : A ceramic pump 508b is constructed.
  • the ceramic pumps 508a and 508b have the same configuration as the ceramic pumps 18a and 18b of the driving device 10, respectively, and the piezoelectric films 502a and 502
  • a voltage is applied to each pair of electrodes (not shown) of b, the diaphragms 507 a and 507 b are deformed, thereby increasing or decreasing the volume of the pump chambers 504 a and 504 b, respectively.
  • the working fluid 100 in the pump chambers 504a and 504b is pressurized and decompressed.
  • the polarization directions of the piezoelectric films 502 a and 502 b are all in the positive direction of the Z axis.
  • the internal pressure buffer chamber 505 is a part that constitutes the internal pressure buffer chamber 505a.
  • the internal pressure buffer chamber 505 a is provided with the side wall surface of the through hole of the ceramic sheet 501, the upper surface of the ceramic sheet 501 -1, and the ceramic box similarly to the flow path 503 a.
  • a space having a long axis that is parallel and has the same height is formed at a position separated from the flow path 503a in the negative Y-axis direction.
  • the length of the internal pressure buffer chamber 505a in the X-axis direction is longer than the length of the flow path 503a in the X-axis direction, and the length (width) in the Y-axis direction is the flow path 503a. Is longer than the length (width) in the Y-axis direction, and the length (height) in the Z-axis direction is the same as the length (height) in the Z-axis direction of the channel 503a.
  • a substantially central portion in the X-axis direction inside the internal pressure buffer chamber 505a is filled with the working fluid 100, and a peripheral portion is filled with the pressure buffering fluid 120.
  • the fine flow path section 506a is a part constituting the fine flow path 506a1. Similar to the pump chambers 504 a and 504 b, the fine flow channel 506 al is formed on the side wall surface of the slit-shaped through hole formed in the ceramic sheet 501-3 and the ceramic sheet 5. A substantially rectangular parallelepiped space defined by the upper surface of 0 1 — 2 and the lower surface of ceramic sheet 50 1 — 4 and having a long axis along the Y-axis direction, Left side work The working chamber 503 al (the upper part of the working chamber 503 al) and the internal pressure buffer chamber 505 a (the upper part of the internal pressure buffer chamber 505 a) communicate with each other.
  • the microchannel 506 al extends only in the direction ( ⁇ -axis direction) parallel to the XY plane where the membrane surfaces of the diaphragms 507 a and 507 b exist.
  • the passage 503a communicates with the internal pressure buffer chamber 505a.
  • the working flow fluid 100 is also filled in the micro flow path 500 a 1.
  • the specific dimensions of the micro flow path 506 a 1 are as follows.
  • the height (length in the Z-axis direction) and width (length in the X-axis direction) of a rectangular cross section cut along a plane perpendicular to the axis (that is, the X-Z plane) are each 10 xm, and are in the Y-axis direction.
  • the length (the length of the portion excluding the upper part of the flow path 503a and the internal pressure buffer chamber 505a) is 500 m.
  • the shape and dimensions of the micro flow channel 506 a 1 are substantially the same as those of the flow channel 13 a with respect to sudden pressure fluctuations of the working fluid 100 in the flow channel 503 a. It shows a large flow path resistance that makes it impossible for the working fluid 100 to pass (move) to the internal pressure buffer chamber 505 a, and the working fluid 100 in the same flow path 503 a is relaxed. In order to exhibit a small flow resistance that allows the same working fluid 100 to substantially pass (move) into the same internal pressure buffer chamber 505a against a sudden pressure fluctuation (that is, it has a throttle function). Is set.
  • the fine flow channel section 506b is separated from the fine flow channel 506a1 by a predetermined distance in the X-axis direction from the fine flow channel 506b1 having the same shape as the fine flow channel 506a1. It is a part formed at the position.
  • the micro flow path 506 b 1 extends only in a direction (Y-axis direction) parallel to the X—Y plane where the membrane surfaces of the diaphragms 507 a and 507 b exist.
  • Work chamber 503a2 (upper part of working chamber 503a2) on the right side of 3a communicates with internal pressure buffer chamber 505a (upper part of internal pressure buffering chamber 505a). Fluid 100 is full.
  • the micro flow path 506 b 1 also extends only in a direction (Y-axis direction) parallel to the XY plane in which the membrane surfaces of the diaphragms 507 a and 507 b exist.
  • 503a communicates with the internal pressure buffer chamber 505a, and has the same throttle function as the fine flow path 506a1.
  • the working fluid 100 is continuously filled in a part of the internal pressure buffer chamber 505a that is communicated with the flow path 503a by the fine flow paths 506a1 and 506b1 ing. Further, the space of the internal pressure buffer chamber 505a that is not filled with the working fluid 1000 is filled with the pressure buffering fluid 120.
  • the operation for driving (moving) the moving body 110 of the driving device 500 is the same as that of the driving device 10, and the internal pressure of the flow path 503 a due to the thermal expansion and contraction of the working fluid 100.
  • the operation in absorbing the change is the same as that of the driving device 10.
  • the drive device 500 of the sixth embodiment includes micro flow channels 506 al and 506 bl having a long axis along the Y-axis direction, and has the same height (in the same plane, It has a flow path 503 a formed in the ceramic sheet 500 1-2) and an internal pressure buffer chamber 505 a, and the upper parts thereof are connected to each other in a fine flow path 506 a 1, 50.
  • the device is configured to communicate with 6b1, so the device thickness can be reduced (the length (height) in the Z-axis direction can be reduced).
  • the drive device 500 becomes compact. Furthermore, the drive device 500 can easily dissipate the heat generated by its operation to the outside because its thickness is small and the surface area of the device with respect to Z or the volume of the device can be increased. be able to. Therefore, in the driving device 500, since the entire device is easy to equalize the temperature (in other words, the temperature difference between each part of the device is small), the operation is stabilized by equalizing the temperature and the durability against heat is high. Device.
  • FIG. 36 is a plan view of the drive device 5 10
  • FIG. 37 is a view taken along line A 6 —A 6 in FIG.
  • FIG. 3 is a cross-sectional view of the driving device 510 cut along a flat plane.
  • the drive device 5 10 is composed of a ceramic sheet 5 1 1-2 in which the flow path 5 13 a is formed and a ceramic sheet 5 1 in which the pump chambers 5 1 a and 5 14 b are formed.
  • a pair of fine channels 5 16 a 1 and 5 16 bl and a pair of pump chamber communication holes 5 19 a and 5 19 b are formed in the ceramic sheet 5 11 13 between It is mainly different from the driving device 500 in that it is formed.
  • the driving device 5110 is composed of a base 511 made of a substantially rectangular parallelepiped ceramic having sides extending along the X-axis, the Y-axis, and the Z-axis orthogonal to each other, and a pair of piezoelectric films. (Piezoelectrostrictive element) 512a and 512b.
  • the substrate 511 is formed by sequentially laminating the ceramic sheets 511-1 to 511-1-5 and integrally firing them. 13, an internal pressure buffer chamber constituting section 5 15, a pair of pump chambers 5 14 a, 5 14 b, and a pair of fine flow path sections 5 16 a, 5 16 b .
  • the flow path forming part 513 is a part that forms a flow path 513a similar to the flow path 503a of the drive device 500, and the flow path 513a is a ceramic sheet.
  • X is a space defined by the side wall surface of the through hole provided in 5 1 1-2, the upper surface of the ceramic sheet 5 1 1-1, and the lower surface of the ceramic sheet 5 1 1-1 3. It is a space that has a longitudinal direction in the axial direction (has a long axis extending along the X axis).
  • the working fluid 100 and the moving body 110 are accommodated in the flow path 5 13 a similarly to the flow path 500 3 a. By 10, it is practically divided into a pair of working chambers 5 13 al and 5 13 a 2.
  • the pump chambers 514a and 514b are the same as the pump chambers 504a and 504b, respectively.
  • the side walls of the through-holes provided in the ceramic sheet 511-114 This is a cylindrical space defined by the upper surface of ceramic sheet 5 1 1-3 and the lower surface of ceramic sheet 5 1 1-5.
  • ceramic diaphragms 517a and 517b composed of ceramic sheets 511-5 are formed, respectively.
  • Diaphragms 5 17 a and 5 17 b are diaphragms
  • Each of the pump chambers 514a and 514b has a part (upper wall) of the same structure as the pump chambers 507a and 507b. They are located in the same XY plane.
  • Piezoelectric films 5 12 a and 5 12 b are formed on the upper surfaces of the diaphragms 5 17 a and 5 17 b, respectively, and the piezoelectric films 5 12 a and 5 12 b are It has the same configuration as 2a and 502b, respectively.
  • a ceramic pump 518a is constituted by the pump chamber 514a, the diaphragm 517a, and the piezoelectric film 521a, and the pump chamber 514b, the diaphragm 517b
  • the ceramic pump 518b is constituted by the piezoelectric film 511b.
  • These ceramic pumps 518a and 518b have the same configuration as the ceramic pumps 508a and 508b.
  • the internal pressure buffer chamber constituting section 515 is a section that constitutes the internal pressure buffer chamber 515a.
  • the inner pressure buffer chamber 5 15 a is formed by the side wall surface of the through hole of the ceramic sheet 5 1 1-2, the upper surface of the ceramic sheet 5 1 1-1, and the lower surface of the ceramic sheet 5 1 1-13. And a hollow space having the same configuration as the internal pressure buffer chamber 505a and having a longitudinal direction in the X-axis direction (having a long axis extending along the X-axis). .
  • the internal pressure buffer chamber 515a is also formed at a position separated from the flow path 513a on the Y axis negative direction side.
  • the size of the internal pressure buffer chamber 5 15 a with respect to the flow path 5 13 a is, like the size of the internal pressure buffer chamber 5 0 5 a with respect to the flow path 5 3 a, smaller than that of the flow path 5 13 a. It is getting bigger.
  • the working fluid 100 is filled at a substantially central portion in the X-axis direction inside the internal pressure buffer chamber 515a, and the pressure buffering fluid 120 is filled at a peripheral portion.
  • the fine flow channel portion 5 16 a and the fine flow channel portion 5 16 b are portions that constitute the fine flow channel 5 16 a 1 and the fine flow channel 5 16 b 1, respectively, which have the same shape and are parallel to each other. It is.
  • the fine channels 5 16 a 1 and 5 16 b 1 respectively correspond to the side wall surface of the slit-shaped through-hole formed in the ceramic sheet 5 1 1 3 and the ceramic sheet 5 1 1 2 It is a substantially rectangular parallelepiped space that is defined by the upper surface of the ceramic and the lower surface of the ceramic sheet 5 1 1 — 4 and has a long axis along the Y-axis direction.
  • This fine channel 5 1 6 a 1 and the fine flow path 5 1 6 b 1 are respectively connected from the upper part of the working chamber 5 1 3 a 1 on the left side of the flow path 5 13 a and the upper part of the working chamber 5 1 3 a 2 on the right side to the internal pressure buffer chamber 5
  • the working chamber 5 13 a 1 and the working chamber 5 13 a 2 communicate with the internal pressure buffer chamber 5 15 a, respectively.
  • the working fluid 100 is also filled in the fine flow paths 5 16 a 1 and 5 16 b 1.
  • the micro channel 5 16 al is defined by a plane perpendicular to the long axis (that is, the X-Z plane).
  • the height (length in the Z-axis direction) and width (length in the X-axis direction) of the rectangular cross section cut in step are 15 zm each, and the length in the Y-axis direction (flow path 5 13 a and internal pressure buffer chamber).
  • the length of the part excluding the upper part of 5 15 a) is 500 m.
  • the shape and dimensions of the fine flow channel 5 16 al (5 16 1) are similar to those of the fine flow channel 5 06 a 1, and the sudden pressure fluctuation of the working fluid 100 in the flow channel 5 13 a Shows a large flow path resistance that substantially disables the passage (movement) of the working fluid 100 to the internal pressure relaxation chamber 5 15 a, and the flow rate in the flow path 5 13 a It is set to have a throttle function that allows the working fluid 100 to substantially pass (move) into the same internal pressure buffer chamber 5 15 a against the slow pressure fluctuation of the working fluid 100. .
  • the communication holes 5 19 a and 5 19 b of the pump chamber are formed in the ceramic sheet 5 1 1-3, similarly to the fine flow channels 5 16 a 1 and 5 16 b 1. It is a cylindrical space consisting of The pump chamber communication hole 5 19 a communicates the upper part of the working chamber 5 13 a 1 on the left side of the flow path 5 13 a with the pump chamber 5 14 a, and the pump chamber communication hole 5 19 b is a flow path. The upper part of the working chamber 5 13 a 2 on the right side of 5 13 a communicates with the pump chamber 5 14 b.
  • the pump chamber communication holes 5 19 a and 5 19 b are also filled with the working fluid 100.
  • the flow path 5 13 a and the inside of the pair of pump chambers 5 14 a and 5 14 b and the pair of fine flow paths 5 16 al and 5 16 bl inside the pump chamber Part of the internal pressure buffer chamber 5 15 a inside the holes 5 19 a, 5 19 b and the same pair of micro channels 5 16 a 1, 5 16 bl connected to the channel 5 13 a Is filled with working fluid 100 continuously.
  • Ma The space not filled with the working fluid 100 of the internal pressure buffer chamber 515a is filled with the pressure buffering fluid 120.
  • the operation for driving (moving) the moving body 110 of the driving device 5 ⁇ 0 is the same as that of the driving device 10, and the internal pressure of the flow path 513a associated with the thermal expansion and contraction of the working fluid 100
  • the operation in absorbing the change is the same as that of the driving device 10.
  • the drive device 510 of the seventh embodiment includes fine channels 516al and 516bl having a long axis along the Y-axis direction, and has the same height (in the same plane, It has a flow path 5 13 a formed in the ceramic sheet 5 11 1-2) and an internal pressure buffer chamber 5 15 a, and the upper part of them is connected to the fine flow path 5 16 al, 5 16 Since it is configured to communicate with b1, the thickness of the device can be reduced (the length (height) in the Z-axis direction can be reduced).
  • the volume of the space relative to the volume of the base body 5 11 (flow path 5 13 a, pump chambers 5 14 a, 5 14 b, internal pressure buffer chamber 5 15 a, fine flow path 5 16 al, 5 1 6 bl, and the sum of the volumes of the spaces formed by the pump chamber communication holes 5 19 a and 5 19 b) is large, so that the drive device 5 10 is small.
  • the driving device 5100 since the driving device 5100 has a small thickness and / or can increase the surface area of the device with respect to the volume of the device, it is possible to easily dissipate heat generated during operation to the outside. Can be. Therefore, in the driving device 5100, since the entire device is likely to be uniform in temperature (in other words, the temperature difference between each part of the device is small), the operation is stabilized by uniforming the heat and the durability against heat is maintained. Is a high device.
  • FIG. 38 is a plan view of the driving device 52 0, and FIG. 39 is a cross-sectional view of the driving device 5 20 cut along a plane along the line A 7 —A 7 in FIG. .
  • the driving device 52 0 has a pair of fine channels in the ceramic sheet 5 2 1-1 of the ceramic sheets 5 2 1-1 and 5 2 1-2 forming the flow path and the internal pressure buffer chamber. It is mainly different from the driving device 500 in that it is formed. Therefore, hereinafter, the same as the drive device 500
  • the components are denoted by the same reference numerals, detailed description thereof will be omitted, and the description will focus on the differences.
  • the drive device 520 is obtained by laminating the ceramic sheets 510-2 and 501-3 of the drive device 500 in this order on the ceramic sheet 500-1 and integrally firing. It is replaced with a ceramic sheet 5 2 1 — 1 to 5 2 1 — 3 and includes a base 5 2 1 and a pair of piezoelectric films (piezoelectric Z electrostrictive elements) 502 a and 502 b. I have.
  • the base body 52 1 has therein a flow path component 503, an internal pressure buffer chamber component 505, a pair of pump chambers 52 4 a, 52 4 b, and a pair of fine channels. Parts 5 2 6a and 5 2 6b.
  • the flow path constituent part 503 includes a side wall surface of a substantially rectangular parallelepiped through hole provided in the ceramic sheet 5 2 1-1, 5 2 1-2, an upper surface of the ceramic sheet 5 0 1-1, and a ceramic sheet. This is a part that constitutes the flow path 503a defined by the lower surface of the worksheet 521-1-3.
  • the pump chambers 524a and 524b are the same as the pump chambers 504a and 504b, respectively.
  • the side walls of the through holes provided in the ceramic sheet 521-13 and the ceramic chamber This is a cylindrical space defined by the upper surface of the lock sheet 5 2 1-2 and the lower surface of the ceramic sheet 5 0 1-4.
  • the ceramic sheets 50 1 — 4 that form part of the wall (upper wall) of the pump chambers 52 4 a and 52 4 b
  • the diaphragms 507a and 507b of the following ceramics are respectively formed.
  • Piezoelectric films 502a and 502b are formed on the upper surfaces of the diaphragms 507a and 507b, respectively.
  • a ceramic pump 528a is constituted by the pump chamber 524a, the diaphragm 507a, and the piezoelectric film 502a, and the pump chamber 524b, the diaphragm 507b, and A ceramic pump 528b is constituted by the piezoelectric film 502b.
  • These ceramic pumps 528a and 528b have the same configuration as the ceramic pumps 508a and 508b.
  • the internal pressure buffer chamber constituent part 505 is provided with a side wall surface of a substantially rectangular parallelepiped through-hole provided in the ceramic sheets 5211 and 5211-12.
  • Top view of ceramic sheet 5 0 1 — 1 and ceramic box This is a part that constitutes the internal pressure buffer chamber 505a defined by the lower surface of the first part 5 2 1 1 3.
  • the fine flow channel portion 526a is a portion constituting the fine flow channel 526a1.
  • the micro-channels 5 2 6 a 1 are formed of a ceramic sheet 5 2 1 —: U side wall surface of the slit-shaped through-hole formed, an upper surface of the ceramic sheet 5 0 1 — 1, and a ceramic sheet 5 2 A substantially rectangular parallelepiped space having a long axis along the Y-axis direction and defined by the lower surface of the first and second working chambers 50 3 al (operating chamber) Chamber 50 3 al ceramic sheet 52 1-1) (side wall formed in 1) and internal pressure buffer chamber 50
  • the dimension of 6a1 is the same as that of the microchannel 506a1.
  • the fine flow channel portion 526b is a portion constituting the fine flow channel 526b1.
  • the fine flow path 5 2 6 b 1 has the same shape as the fine flow path 5 2 6 a 1, and the side wall surface of the slit-shaped through-hole formed in the ceramic sheet 5 2 1-1, the ceramic sheet Y is defined by the upper surface of 5 0 1-1 and the lower surface of ceramic sheet 5 2 1-2, and at a predetermined distance in the X-axis positive direction with respect to the fine channel 5 2 6 a 1.
  • This is a substantially rectangular parallelepiped space having a major axis along the axial direction.
  • the fine flow path 5 2 6 bl is formed by the working chamber 503 a 2 (the side wall formed in the ceramic sheet 5 2 1 — 1 of the working chamber 503 a 1) on the right side of the flow path 503 a and the internal pressure. It communicates with the buffer chamber 505a (the side wall formed on the ceramic sheet 521-1 of the internal pressure buffer chamber 505a).
  • the shape and dimensions of these fine channels 5 2 6 a 1, 5 2 6 b 1 are the same as those of channels 5 0 6 al, 5 0 6 bl, etc.
  • the inside of the flow path 50 3 a The inside of the pump chambers 5 2 4 a and 5 2 4 b, the pair of micro channels 5 2 6 al and 5 2 6 b 1, and the same pair of micro channels 5 2 6 a 1 and 5 2 6 1 A part of the internal pressure buffer chamber 505a communicated with 503a is continuously filled with the working fluid 100. The space not filled with the working fluid 100 in the internal pressure buffer chamber 505 a is filled with the pressure buffer fluid 120.
  • the operation for driving (moving) the moving body 110 of the driving device 520 is the same as that of the driving device 10, and the internal pressure of the flow path 503 a due to the thermal expansion and contraction of the working fluid 100.
  • the operation in absorbing the change is the same as that of the driving device 10.
  • the driving device 500 has the same advantages as the driving device 500.
  • the driving device 502 is a small (thin) device, like the driving device 500, and thus has the same effect as the driving device 500.
  • FIG. 40 is a plan view of the drive device 530
  • FIG. 41 is a cross-sectional view of the drive device 530 cut along a plane along the line A8-A8 in FIG. is there.
  • the drive device 530 is obtained by laminating the ceramic sheets 5 2 1 — 1 and 5 2 1 — 2 of the drive device 5 20 in this order on the ceramic sheet 5 0 1 1 1 and integrally firing. It differs from the drive device 520 only in that it replaces the ceramic sheet 531-1 and 531-2. Therefore, hereinafter, the same components as those of the driving device 520 will be denoted by the same reference numerals, detailed description thereof will be omitted, and the description will be focused on the differences.
  • 5 05 a is the side wall surface of the through holes of ceramic sheets 5 3 1-1, 5 3 1-2, the top surface of ceramic sheet 5 0 1-1, and the ceramic sheet 5 2 1 1 3 And the lower surface of
  • the fine flow channel 536a1 is formed by the side wall surface of the slit-shaped through hole formed in the ceramic sheet 531-2, the upper surface of the ceramic sheet 531-1 and the ceramic sheet. 5 2 1 1 3 And a substantially rectangular parallelepiped space having a long axis along the Y-axis direction, and a working chamber 503 al on the left side of the flow path 503 a (the ceramic sheet 5 of the working chamber 503 a1).
  • the side wall formed on the 312) and the inner pressure buffer chamber 505a (the side wall formed on the ceramic sheet 5311a of the inner pressure buffer chamber 505a) come into communication. ing.
  • the dimensions of the fine channel 536 al are the same as those of the fine channel 506 al.
  • the fine flow path 536b1 has the same shape as the fine flow path 536a1 and has a side wall surface of a slit-like through-hole formed in the ceramic sheet 531-2, and a ceramic sheet. 5 3 1-1 and the lower surface of the ceramic sheet 5 2 1 1 3 and at a position separated by a predetermined distance in the X-axis positive direction with respect to the fine channel 5 36 a 1 A substantially rectangular parallelepiped space having a long axis along the Y-axis direction.
  • the fine flow path 536b1 is the working chamber 503a2 on the right side of the flow path 503a (the side wall formed on the ceramic sheet 531-1-2 of the working chamber 503a2).
  • the inner pressure buffer chamber 505a (the side wall formed on the ceramic sheet 531_1 of the inner pressure buffer chamber 505a) communicates with the inner pressure buffer chamber 505a.
  • the functions of the microchannels 536a1 and 536b1 are the same as those of the microchannels 526a1 and 526b1.
  • the drive device 5300 accommodates the moving body 110, the working fluid 100, and the pressure buffering fluid 120 in the same manner as the drive device 500, and has the same operation and advantages as the drive device. Similar to 520, it is a small and highly reliable device.
  • FIG. 42 is a plan view of the drive device 540
  • FIG. 43 is a cross-sectional view of the drive device 540 cut along a plane along line A9-A9 in FIG. .
  • the drive device 540 is composed of a ceramic sheet 5 21-1, 5 2 1-1 2 of the drive device 5 20, which is sequentially laminated on the ceramic sheet 5 0 1-1 and integrally fired. It differs from the drive device 5 20 only in that it is replaced with the lock sheet 5 4 1-1, 5 4 1-2, 5 4 1 1 3. Therefore, hereinafter, the same components as those of the driving device 5200 are the same.
  • the flow path 503a and the internal pressure buffer chamber 505a are formed in through holes formed in the ceramic sheets 541-1-3, 54-1-2, 54-1-3. Of the ceramic sheet '501--1, and the lower surface of the ceramic sheet 521-1-3.
  • the microchannels 546a1 are formed by the side wall surface of the slit-shaped through-hole formed in the ceramic sheet 541_1, the upper surface of the ceramic sheet 541_1, and the ceramic sheet.
  • G is a substantially rectangular parallelepiped space that is defined by the lower surface of 541-1 and has a major axis along the Y-axis direction, and the working chamber 503 al (operating The side wall formed in the ceramic sheet 54 1-2 of the chamber 503 a 1) and the internal pressure buffer chamber 505 a (the ceramic sheet 54 1-2 of the internal pressure buffer chamber 505 a) are formed. Side wall).
  • the height of a rectangular cross section of the microchannel 546a1 cut along a plane perpendicular to the major axis (ie, the X_Z plane) (Length in the Z-axis direction) is 30 im
  • width (length in the Z-axis direction) is 15 zzm
  • length in the Y-axis direction flow path 503 a and internal pressure buffer chamber 505 a
  • the length of the part not including) is 500 ⁇ m.
  • the fine flow path 546 b 1 has the same shape as the fine flow path 546 a 1, and has a side wall surface of a slit-like through-hole formed in the ceramic sheet 541-2, and a ceramic sheet. It is defined by the upper surface of 5 4 1 — 1 and the lower surface of ceramic sheet 5 4 1 _ 3, and at a position separated from the same fine channel 5 4 6 a 1 by a predetermined distance in the positive X-axis direction.
  • a substantially rectangular parallelepiped space having a long axis along the Y-axis direction.
  • the fine flow path 5 4 6 b 1 is formed in the working chamber 5 0 3 a 2 on the right side of the flow path 5 0 3 a (the side wall formed in the ceramic sheet 5 4 1 — 2 of the working chamber 5 0 3 a 2). ) And the internal pressure buffer chamber 505a (the side wall formed in the ceramic sheet 541-2 of the internal pressure buffer chamber 505a).
  • the functions of the microchannels 546a1 and 546b1 are the same as the functions of the microchannels 526a1 and 526bl.
  • the driving device 540 accommodates the moving body 110, the working fluid 100, and the pressure buffering fluid 120 in the same manner as the driving device 520, and has the same operation and advantages as the driving device. Similar to 520, it is a small and highly reliable device.
  • FIG. 44 is a plan view of such a drive device 55
  • FIG. 45 is a cross-sectional view of the drive device 5 50 cut along a plane along the line AA-AA in FIG.
  • the drive device 550 is composed of a ceramic sheet 551 which is formed by stacking the ceramic sheets 521-1 and 521-2 of the drive device 520 on the ceramic sheet 501-1. It differs from the drive device 520 only in that it is replaced by 1. Accordingly, hereinafter, the same components as those of the driving device 520 will be denoted by the same reference numerals, detailed description thereof will be omitted, and the description will be focused on the differences.
  • the flow path 503a and the internal pressure buffer chamber 505a are formed by the side wall surface of the through-hole formed in the ceramic sheet 551-1 and the ceramic sheet 501-1. And the lower surface of the ceramic sheet 52-1-3.
  • the fine channels 556-1a are formed on the side wall surface of the slit-shaped through-hole formed in the ceramic sheet 551-1, the upper surface of the ceramic sheet 501-1-1, and the ceramic sheet 551-1.
  • Work space defined by the lower surface of the worksheet 5 2 1 1 3 and having a long axis along the Y-axis direction and having a substantially rectangular parallelepiped shape, and a working chamber 503 a 1 on the left side of the flow path 503 a.
  • the height of a rectangular section obtained by cutting the microchannel 556al along a plane perpendicular to the major axis (that is, the XZ plane)
  • the length in the Z-axis direction is 50 xm
  • the width (length in the X-axis direction) is 15 ⁇ m
  • the length in the Y-axis direction (including the flow path 503 a and the internal pressure buffer chamber 505 a).
  • the length of the missing part) is 500 m.
  • the fine channel 556-1b1 has the same shape as the fine channel 556-1a, and has a side wall surface of the slit-shaped through hole formed in the ceramic sheet 551-1, and the ceramic sheet.
  • the fine channel 556 b1 is the working chamber 503a2 on the right side of the channel 503a (the side wall formed in the ceramic sheet 551-1 of the working chamber 503a2).
  • the internal pressure buffer chamber 505a (the side wall formed in the ceramic sheet 551-1 of the internal pressure buffer chamber 505a) communicates with the internal pressure buffer chamber 505a. Note that the functions of the micro flow channels 556-1a, 556-b1 are the same as the functions of the fine flow channels 526-a1,526-b1.
  • the driving device 550 accommodates the moving body 110, the working fluid 100, and the pressure buffering fluid 120 in the same manner as the driving device 500, and has the same operation and advantages as the driving device. Similar to 520, it is a small and highly reliable device. Also, compared to the drive devices 520, 530, 540, etc., the side wall of the flow path 503a and the internal pressure buffer chamber 505a can be formed by one ceramic sheet 551-1. Therefore, it is possible to manufacture the driving device 550 easily and at low cost.
  • FIG. 46 is a plan view of the driving device 560
  • FIG. 47 is a cross-sectional view of the driving device 560 cut along a plane along the line AB-AB in FIG.
  • the drive device 560 is composed of the ceramic sheet 52 1-1 and 52 1-2 of the drive device 52 0 stacked on the ceramic sheet 50 1-1 and integrally fired.
  • the difference from the drive device 5200 is only in that it is changed to 5 6 1 1 1 and 5 6 1-2. Therefore, hereinafter, the same components as those of the driving device 520 will be denoted by the same reference numerals, detailed description thereof will be omitted, and the description will be focused on the differences.
  • the flow path 503a and the internal pressure buffer chamber 505a are located on the side of the through-hole formed in the ceramic sheet 5611-2. It is formed by the wall surface, the upper surface of the ceramic sheet 5 6 1-1, and the lower surface of the ceramic sheet 5 2 1-3.
  • the fine flow path 566a1 is formed on the side wall surface of the slit-shaped through hole formed in the ceramic sheet 561-1, the upper surface of the ceramic sheet 501-1, and the ceramic sheet.
  • G is a substantially rectangular parallelepiped space defined by the lower surface of 561-2 and having a long axis along the Y-axis direction, and the working chamber 503 a1 ( The lower part of the working chamber 503a1) communicates with the inner pressure buffer chamber 505a (the lower part of the inner pressure buffer chamber 505a).
  • the dimensions of the fine flow path 556 a1 are the same as those of the fine flow path 506 a1 shown in FIG.
  • the micro flow path 566 b 1 has the same shape as the micro flow path 566 a 1, and the side wall surface of the slit-shaped through-hole formed in the ceramic sheet 561-1, Is defined by the upper surface of the ceramic sheet 5 0 1-1 and the lower surface of the ceramic sheet 5 6 1-2, and is separated from the same micro channel 5 66 a 1 by a predetermined distance in the positive X-axis direction. It is a substantially rectangular parallelepiped space having a major axis along the Y-axis direction at the position.
  • the fine channel 566 bl is composed of the working chamber 503 a 2 (the lower part of the working chamber 503 a 2) on the right side of the channel 503 a and the internal pressure buffering chamber 505 a (the internal pressure buffering chamber 50). (The lower part of 5a). Note that the functions of the microchannels 5666a1 and 5666b1 are the same as those of the microchannels 526a1 and 526b1.
  • Such a driving device 560 accommodates the moving body 110, the working fluid 100, and the pressure buffering fluid 120 in the same manner as the driving device 520, and has the same operation and advantages as the driving device. Similar to 520, it is a small and highly reliable device.
  • FIG. 48 is a plan view of the drive device 570
  • FIG. 49 is a cross-sectional view of the drive device 570 cut along a plane along the AC-AC line in FIG. 48
  • FIG. FIG. 50 is a cross-sectional view of the driving device 570 cut along a plane along the AD-AD line in FIG.
  • This drive device 570 replaces the ceramic sheet 5 0 1 — 1, 5 6 1 — 1 of the drive device 5 6 0 with a ceramic sheet 5 7 1 — 1, and the ceramic sheet 5 6 1 — 2 Is replaced by a ceramic sheet 571-1-2, which is different from the driving device 560 in that it has only one fine channel. Therefore, hereinafter, the same components as those of the driving device 560 will be denoted by the same reference numerals, and detailed description thereof will be omitted.
  • the flow path 503a and the internal pressure buffer chamber 505a are formed by a side wall surface of a through hole formed in the ceramic sheet 571-2 and a ceramic sheet 571-1. And the lower surface of the ceramic sheet 5 2 1-3.
  • a groove 570M is formed on the upper surface of the ceramic sheet 571-1.
  • the groove 570M has a long axis extending in the X-axis direction, and is disposed on the lower surface of the flow path 503a and substantially at the center of the flow path 503a in the X-axis direction, It achieves the same function as the groove M shown in FIG.
  • the micro channel 566 al is formed by the concave groove wall provided by laser processing on the upper surface of the ceramic sheet 571-1 and the lower surface of the ceramic sheet 571-2. And a substantially rectangular parallelepiped space having a long axis along the Y-axis direction, the lower part of the working chamber 503 a1 on the left side of the flow path 503 a and the groove 570 M And the internal pressure buffer chamber 505a (the lower part of the internal pressure buffer chamber 505a).
  • the dimensions of the fine flow path 556 a1 are the same as those of the fine flow path 506 a1 shown in FIG. 35, and the functions thereof are the same as those of the fine flow path 506 a1.
  • the driving device 570 accommodates the moving body 110, the working fluid 100, and the pressure buffering fluid 120 in the same manner as the driving device 520, and the operation is performed in the first embodiment.
  • This is the same as the drive device 10-1 shown in FIG. 13 which is a modified example of FIG.
  • the drive device 570 becomes a small and highly reliable device like the drive device 520 and has only one fine flow path 576a1.
  • Micro channel The device requires only half the labor and time of processing, and is an inexpensive device.
  • a drive device 580 which is a part of the circuit switching switch according to the fourteenth embodiment of the present invention will be described.
  • FIG. 51 is a plan view of the drive device 580
  • FIG. 52 is a cross-sectional view of the drive device 580 cut along a plane along the AE-AE line in FIG.
  • This drive device 580 is obtained by replacing the ceramic sheet 510 13 of the drive device 500 according to the sixth embodiment shown in FIGS. 34 and 35 with a ceramic sheet 581-1.
  • the driving device is different from the driving device 500 in that the fine channel is bent. Therefore, hereinafter, the same components as those of the driving device 500 will be denoted by the same reference numerals, and detailed description thereof will be omitted.
  • the fine channels 586a1 and 586bl correspond to the side walls of the slit-shaped through-holes formed in the ceramic sheet 581-1 and the ceramic sheet 5. It is defined by the upper surface of 0 1-2 and the lower surface of ceramic sheet 5 0 1-4.
  • the fine flow path 586 a1 communicates with the upper part of the working chamber 503 a1 on the left side of the flow path 503 a, and from the upper part of the working chamber 503 a1 in the negative Y-axis direction.
  • the base 581 is bent in the negative X-axis direction substantially at the center of the base 581 in the Y-axis direction, and then extends again in the negative Y-axis direction to communicate with the upper part of the internal pressure buffer chamber 505a. ing.
  • the microchannel 586b1 communicates with the upper part of the working chamber 503a2 on the right side of the channel 503a, and the Y-axis extends from the upper part of the working chamber 503a2.
  • the shape of the cut surface by a plane orthogonal to the axial direction of the pair of microchannels 586a1 and 586b1 is substantially rectangular, and the dimensions of the section extending in the negative Y-axis direction are exemplified.
  • the height (length in the Z-axis direction) of a rectangular cross section of the same section cut in a plane perpendicular to the axis (that is, the X-Z plane) is 10 m
  • the width (length in the X-axis direction) is 1 0 m.
  • the total length in the axial direction (excluding the upper part of the flow path 503a and the internal pressure buffer chamber 505a) Of the entire flow path is 700 zm.
  • the driving device 580 accommodates the moving body 110, the working fluid 100, and the pressure buffering fluid 120 in the same manner as the driving device 500, and has the same operation and advantages as the driving device. Similar to 500, it is a small and highly reliable device.
  • the drive device 580 reduces the cross-sectional area of the flow path by increasing the axial length (flow path length) as the flow path and / or by bending the flow path. Thus, the same effect as the flow path resistance increasing effect is obtained.
  • the micro flow paths 586 a1 and 586 b1 are cut off. Since it is not necessary to make the area extremely small, it is not necessary to make the processing accuracy for forming fine slits in the ceramic sheet 581-1-1 so high, and as a result, it can be manufactured at low cost. Can be.
  • a ceramic pump is used in comparison with the drive device 500 of the sixth embodiment shown in FIGS. 34 and 35.
  • a description will be given using an example in which the piezoelectric Z electrostrictive film type actuator of the same modified example is employed instead of 508b (508a).
  • Such a piezoelectric electrostrictive film type actuating device is a type of actuating device having a multi-layered piezoelectric film of a pump, and is not limited to ceramic pumps 508a and 508b, but may also be used in other embodiments. Naturally, it can be used as an overnight pump.
  • FIGS. 53 and 54 show the piezoelectric / electrostrictive film type actuator 300 of this modification applied to the drive device 500 shown in FIGS. 34 and 35.
  • the drive device 500 was cut at normal times along the A5_A5 line and AF-AF line, and the piezoelectric / electrostrictive film type actuator 300 was enlarged.
  • FIG. 53 shows the piezoelectric / electrostrictive film type actuator 300 of this modification applied to the drive device 500 shown in FIGS. 34 and 35.
  • the drive device 500 was cut at normal times along the A5_A5 line and AF-AF line, and the piezoelectric / electrostrictive film type actuator 300 was enlarged.
  • the piezoelectric / electrostrictive film type actuator 300 is placed on the upper surface of the ceramic diaphragm 507b formed by the ceramic sheet 501-4.
  • the first electrode film 310-1-1, the first piezoelectric electrostrictive film 302--1, the second electrode film 310-1-2, and the second pressure It is composed of an electro-Z electrostrictive film 302-2, a third electrode film 301-3, a third piezoelectric / 302-2-3, and a fourth electrode film 301-4.
  • the first electrode film 301-1 and the third electrode film 310-13 are connected so as to be maintained at the same potential to form a first electrode portion
  • the second electrode film 310-2 and The fourth electrode films 310 to 14 are connected so as to be maintained at the same potential to form a second electrode portion.
  • the first electrode portion and the second electrode portion are insulated by the piezoelectric Z electrostrictive film, and potentials having different polarities are applied similarly to the above-described upper electrode and lower electrode (a drive voltage is applied). It is like that.
  • the material of the first electrode film 301-1 to the fourth electrode film 301-4 is a solid at room temperature, and is about the firing temperature in the manufacturing process of the piezoelectric Z electrostrictive film type actuator 300. It is preferably made of a metal that can withstand an oxidizing atmosphere at a high temperature and has excellent conductivity. For example, aluminum, titanium, chromium, iron, cobalt, nickel, copper, zinc, niobium, molybdenum, ruthenium, palladium, rhodium, silver, tin, evening, tungsten, iridium, platinum, gold, lead, etc. A simple metal or an alloy thereof can be used as a material for each electrode film.
  • a piezoelectric Z electrostrictive film or a cermet material in which the same material as the base 501 is dispersed may be used.
  • a material such as a gold resin paste, a platinum resin paste, or a silver resin paste which can form a denser and thinner electrode film may be used.
  • the electrode film 301-2 and the third electrode film 301-3) are used as electrode materials mainly composed of platinum or the like, and for example, additives such as zirconia oxide, cerium oxide, or titanium oxide are contained. It is also preferable to use a material made of such a material. Although the reason is not clear, the separation between the electrode and the piezoelectric / electrostrictive film can be prevented by forming the lowermost electrode and the intermediate electrode with such a material.
  • the above additives are preferably contained in the entire electrode material in an amount of 0.01 to 20% by mass, from the viewpoint that the desired effect of preventing peeling can be obtained.
  • the electrode film becomes thicker, the displacement of the piezoelectric / electrostrictive film actuator may decrease. Therefore, in order to maintain the displacement at a large value, the electrode film is desirably thin. Therefore, usually, the thickness of each electrode film is desirably 15 / zm or less, and more desirably 5 m or less.
  • the material of the first piezoelectric electrostrictive film 302-1 to the third piezoelectric / electrostrictive film 302-3 may be any material that generates an electric field-induced strain such as a piezoelectric effect or an electrostrictive effect. It does not matter whether it is crystalline or amorphous. Semiconductor, ferroelectric ceramics, or antiferroelectric ceramics can also be used.
  • piezoelectric / electrostrictive films include, for example, lead zirconate, lead titanate, lead magnesium niobate, lead nickel niobate, lead zinc niobate, lead manganese niobate, lead antimonate stannate Ceramics containing manganese lead, lead ubensteate, lead cobalt niobate, barium titanate, sodium bismuth sodium titanate, sodium sodium niobate, strontium bismuth tantalate, etc., alone or as a mixture Can be mentioned.
  • each layer (layer) of the first piezoelectric Z-electrostrictive film 302-1 to the third piezoelectric Z-electrostrictive film 302-3 is such that a large displacement can be obtained at a lower voltage.
  • it is as thin as possible.
  • the thickness is designed to be 100 m or less, more preferably about 3 to 30 m.
  • the thickness of the upper layer film becomes gradually smaller.
  • the thickness of the nth piezoelectric / electrostrictive film counted from the piezoelectric / electrostrictive film of the lowest layer is t where n
  • each piezoelectric / electrostrictive film it is preferable to form each piezoelectric / electrostrictive film so as to satisfy the following.
  • the thickness of the piezoelectric / electrostrictive film is made smaller as it goes to the upper layer.
  • the amount of strain of the piezoelectric / electrostrictive film increases as the magnitude of the applied electric field increases (in other words, the same driving force is applied to the piezoelectric / electrostrictive film).
  • the piezoelectric / electrostrictive film becomes thinner). Therefore, as described above, if the thickness of the piezoelectric / electrostrictive film is made smaller in the upper layer, the piezoelectric / electrostrictive film formed on the upper portion is larger than the piezoelectric / electrostrictive film formed on the lower portion. This is because the diaphragm becomes distorted, and as a result, the bending efficiency of the diaphragm increases, so that the bending displacement of the diaphragm can be increased.
  • This piezoelectric / electrostrictive film type actuator 300 can be manufactured by the same method as the manufacturing method described with reference to FIG. 17 or FIG. 18. Specifically, first, the diaphragm 5 The first electrode film 301-1 is formed on the upper surface of the ceramic body 501-141 to be 07b by the same method as the method for forming the lower electrode 205 described above, and the upper surface is formed on the upper surface. The first piezoelectric / electrostrictive film 302-1 is formed in the same manner as the method for forming the piezoelectric film 207. Next, the second electrode film 301 is formed on the upper surface of the first piezoelectric / electrostrictive film 302-1 in the same manner as the method of forming the lower electrode 205 or the upper electrode 208.
  • the second piezoelectric Z electrostrictive film 302-2 is formed in the same manner as the method of forming the piezoelectric film 207 on the upper surface thereof. Thereafter, the third electrode film 301 is formed on the upper surface of the second piezoelectric Z electrostrictive film 302-2 in the same manner as the method of forming the lower electrode 205 or the upper electrode 208. Then, the third piezoelectric / electrostrictive film 302-3 is formed in the same manner as the method of forming the piezoelectric film 207 on the upper surface thereof. Finally, the fourth electrode film 301-4 is formed by the same method as the method of forming the upper electrode 208.
  • a piezoelectric / electrostrictive film type actuator 300 comprising: a piezoelectric electrostrictive element comprising: (a) deforming the diaphragm 507b by displacement (deformation) of the piezoelectric electrostrictive element; In the piezoelectric Z electrostrictive element, the electrode film and the piezoelectric electrostrictive film are alternately laminated, and the uppermost layer and the lowermost layer are each an electrode film (a first electrode film 301-1, a fourth electrode film). 3 0 1 — 4) Piezoelectric / electrostrictive film type actuator.
  • the actuator 300 has a plurality of piezoelectric electrostrictive layers, each of which generates a force, so that between the electrodes (in this case, between the first electrode part and the second electrode part). Even if the same potential difference as the potential difference applied between the electrodes (in this case, the upper electrode and the lower electrode) between the electrodes of the piezoelectric / electrostrictive film type actuator having only one piezoelectric Z electrostrictive layer is larger. It can generate driving force (force to deform the diaphragm).
  • the piezoelectric electrostrictive film type actuator 300 a plurality of piezoelectric electrostrictive layers are laminated, so that the vertical direction (Z-axis direction) is perpendicular to the horizontal direction (X-Y plane direction).
  • a piezoelectric element having a high height ratio that is, a piezoelectric element having a high aspect ratio can be easily formed.
  • the stiffness of a portion that bends and displaces increases, so that the response speed of the element increases. Therefore, a drive device with high responsiveness can be obtained by using Actuator Itsuyo 300.
  • the piezoelectric / electrostrictive film type Actuator 300 has a three-layer piezoelectric Z electrostrictive film. (And four layers of electrode films), the number of layers of the piezoelectric Z electrostrictive film is not limited as long as it is plural, and is not limited to this. According to the embodiment and the modified example thereof, a drive device which is easy to mass-produce without having a mechanical amplification mechanism inherent in the problem of wear and sticking while maintaining the features of the small size and low power consumption of the micromachine, and A circuit switching switch using the same driving device could be provided. Also, even when the ambient temperature increases, the device (switch) is not damaged, so that a highly reliable and durable drive device (circuit switching switch) can be provided.
  • the present invention is not limited to the above embodiment, and various modifications can be adopted within the scope of the present invention.
  • the number of switching electrodes is two, but the number of switching electrodes may be two or more.
  • Switching electrode As long as the,, and common electrodes are exposed to the flow path 13a and the mutual insulation is maintained, for example, the switching electrode and the common electrode are provided on the opposed side wall surface, or the switching electrode is provided on the side wall surface.
  • the common electrode may be provided on any wall surface of the same channel 13a, such as being provided on a low wall surface or an upper wall surface.
  • each drive device disclosed in the present invention it is possible to replace the piezoelectric / electrostrictive material film that deforms the diaphragm with an antiferroelectric material film (antiferroelectric film). It can. Furthermore, the electrostatic force generated between the electrodes facing each other through the gap, and the deformation force generated in the shape memory alloy by energized heating, which has been actively studied in micromachine research, are applied to the deformation force of the piezoelectric film. Alternatively, the diaphragm may be deformed by these forces.
  • the environmental temperature can be reduced.
  • the drive device can be prevented from being damaged due to the change, and the position of the moving body in the initial state can be controlled by controlling the drive voltage (applied voltage).
  • the drive device can be used, for example, as a device for micromachining a so-called rodless cylinder.
  • the rodless cylinder has a completely sealed cylinder moving part, and the moving part moves in a sealed space.
  • the working part which is connected to the body by magnetic force, reciprocates outside the sealed space, and the movement of the movable part can be applied to the outside of the rodless cylinder.
  • the moving body 110 of the present invention is formed of a magnetic material and an externally formed operating portion is connected to the moving body 110 by magnetic force, the micro rodless series to which the driving device according to the present invention is applied is provided. Underground.
  • minute electrodes detection electrodes
  • the moving body 110 is formed of a conductive magnetic material. It can be detected by “ON (closed)” or “OFF (open)”, which can be used to control the stroke position of the microphone opening and rodless cylinder. You.
  • the drive device according to the present invention can be applied not only to a micromotor for the purpose of simply moving a mechanical object but also to a wide range of applications such as those found in various micromachines.
  • a material having translucency on a part or the whole of the wall forming the flow path 13a is selected, and the moving body 110 is made of a bubble, a colored liquid, or a vacuole of a fluorescent liquid.
  • An optical display element can also be obtained by using a light-reflective minute metal body or the like.
  • the drive device according to the present invention can be used as one memory element by detecting the position of the moving body 110 from outside by magnetic, optical, or electrical means.
  • a sensor such as a gyro is formed by sensing the influence of an external force such as a corioliser on the movement of the moving body 110 by vibrating motion by means of electric or optical means. You can also.
  • circuit switching switch circuit switching switch
  • a film-type piezoelectric element comprising a piezoelectric / electrostrictive film or an antiferroelectric film and an electrode and a ceramic diaphragm are provided.
  • a ceramic pump 23a, 23b, 23c
  • the flow path is formed in a shape connecting the ceramic pumps, and is a bubble, a vacuole or a fine solid to be moved.
  • the body (110) and the liquid (100) are stored, and the flow rate of the fluid in the flow path is low when the pressure is not increased or reduced by the ceramic pump at a high speed.
  • the microfluidic flow exhibits a reduction effect on pressurization or depressurization with a time lag, while the fluid flows in or out at low speed pressurization or low speed depressurization, which has a buffering effect that suppresses the pressure fluctuation in the flow path to substantially zero.
  • Roads (16 a 1, 16 b 1, 16 c) and others Having an end in a buffer space (1 5 a) can be referred to as those characterized by.

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Abstract

L'invention concerne un commutateur à commutation par circuit (60) possédant un dispositif d'entraînement (10), qui comprend des pompes céramiques (18a) et (18b), dans lesquelles un corps mobile conducteur (110) est déplacé dans un passage d'écoulement (13a) alternativement par mise sous pression et mise hors pression, par les pompes, d'un fluide de travail (100) se trouvant dans le passage d'écoulement (13a) sur les côtés droit et gauche du corps mobile (110) en vue d'entraîner électriquement les électrodes de commutation (62a) et (62b) vers une électrode commune (61), le corps mobile étant déplacé de façon sûr tant que les passages d'écoulement fin (16a) et (16b) fournissent une grande résistance de passage d'écoulement lorsque la pression du fluide de travail est augmentée rapidement et abaissée par les pompes afin de prévenir la libération de la pression interne des passages dans une chambre d'amortissement à pression intérieure (14a) jusqu'à ce que les passages fins fournissent une petite résistance de passage d'écoulement face à l'augmentation modérée de pression entraînée par l'expansion thermique du fluide de travail. Les passages d'écoulement fins conduisent la quantité expansée de fluide de travail dans la chambre d'amortissement à pression intérieure à supprimer l'augmentation de pression du fluide de travail, ainsi un dispositif d'entraînement permet d'empêcher à un corps de pompe ou des scellements d'être endommagés même si le fluide de travail est thermiquement expansé.
PCT/JP2002/012043 2001-11-19 2002-11-19 Commutateur a commutation par circuit WO2003044817A1 (fr)

Priority Applications (1)

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AU2002354058A AU2002354058A1 (en) 2001-11-19 2002-11-19 Circuit switching switch

Applications Claiming Priority (2)

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JP2001353749A JP2005139901A (ja) 2001-11-19 2001-11-19 回路切換えスイッチ
JP2001-353749 2001-11-19

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CN107636784A (zh) * 2015-05-21 2018-01-26 诺基亚技术有限公司 提供时变电压的装置和方法

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US7012354B2 (en) * 2003-04-14 2006-03-14 Agilent Technologies, Inc. Method and structure for a pusher-mode piezoelectrically actuated liquid metal switch
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