WO2003041159A1

WO2003041159A1 - Wafer observation position designating apparatus, and wafer display position designating method

Info

Publication number: WO2003041159A1
Application number: PCT/JP2001/009679
Authority: WO
Inventors: Hiroyuki Yasutomi; Mikio Sakuma; Hirofumi Shimoda
Original assignee: Tokyo Seimitsu Co., Ltd.
Priority date: 2000-07-31
Filing date: 2001-11-06
Publication date: 2003-05-15
Also published as: JP2002050671A; JP3979484B2

Abstract

A wafer observation position designating apparatus and a wafer display position designating method for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.

Description

Wafer observation position specifying device and display position specifying method

Technical field

The present invention relates to an eighteenth observation position designating device and a eighteenth display position designation method, and more particularly, to displaying an image of an aerial surface with a microscope camera or the like and displaying an image of the aerial surface.

A projector for observing a pattern on an aerial surface, an observation position specifying device and a display, and a display position indicator.

Related to the setting method.

Background art

2. Description of the Related Art Conventionally, there has been known an “Eno” surface observation device that magnifies and images a work mounted on a loading table with a microscope camera or the like, and sets a processing reference and observes a processing result. Since the display range on the screen displayed on an enlarged scale with a conventional wafer surface observation device is limited to a very small area on the screen, the operator is not required to change the observation position when changing the observation position. However, by operating the axis drive button or the joystick, the respective axes were driven to move the relative position between the force lens and the camera, and moved the imaging range of the camera to the target position.

However, in a conventional wafer surface observation device that moves the wafer surface observation position using a conventional shaft drive button or joystick as an input means, the input means is a means for inputting a speed vector. In addition, there has been a problem that it is difficult to quickly position an observation position on a fine pattern formed on a wafer surface.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and has an observation position designating device and a display position capable of quickly and easily moving a microscope camera to a desired observation position. It is intended to provide a designation method.

Disclosure of the invention

In order to achieve the above object, the observation position specifying device according to the present invention has the following features. In a wafer observation position designating device for observing a surface pattern, an image pickup means for picking up an image of the surface, a display means for displaying an image picked up by the image pickup means, and the display means displaying the image. Input means for inputting position information by designating an arbitrary position on the display as a position on the display; converting means for converting the input position information to position information on the aerial surface; (C) moving means for moving the display position based on positional information on the surface, wherein the display means displays an image of the display position after the movement. ADVANTAGE OF THE INVENTION According to the wafer observation position designation apparatus of this invention, when observing a wafer surface, it becomes possible to move quickly to a desired display position. BRIEF DESCRIPTION OF THE FIGURES

1 is a perspective view of a dicing apparatus to which the present invention is applied;

FIG. 2 is a plan view of a dicing apparatus to which the present invention is applied;

Figure 3 is a block diagram of the information processing unit of the dicing device;

Figure 4 is a flow chart of the standard $ 18W alignment model registration process;

FIG. 5 is a diagram showing the display contents of the initial display displayed on the display means; FIG. 6 is a diagram showing the display contents displayed in the direct sunset mode; FIG. 7 is a display by the screen sunset switch 5 is a flowchart showing a method for specifying a position. BEST MODE FOR CARRYING OUT THE INVENTION

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments and preferred embodiments of a viewing position specifying device and a display position specifying method according to the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a dicing apparatus to which a display position specifying apparatus and a display position specifying method according to the present invention are applied, and FIG. 2 is a plan view thereof. -This dicing machine is equipped with a cutting unit 10 that observes the surface of the wafer (work) W and cuts the wafer W in the direction perpendicular to it and finally cuts it like a grid. Cleaning unit 20 for cleaning W, and wafer W before and after processing The cassette unit 30 and the pre-processed wafer W are drawn out of the cassette unit 30 at a desired position to perform brialignment on the stage, and the post-processed wafer set on the stage 18 An elevator unit 40 for storing W at a desired position in the cassette unit 30 and a transport device 50 for transporting a wafer through the above-described steps are configured.

As shown in FIG. 2, there are four positions P1, P2, P3, and P4 as the transfer positions of 180 W by the transfer device 50, and these positions P1 to P4 are The squares are arranged at the top of each square. The position P1 is a position for preloading ゥヱ 18 W, and the position P2 is for loading and unloading the wafer W to a cutting table for conveying ゥヱ 18 W to the cutting portion 10. The position P 3 is a position for loading and unloading the wafer W into the spinate table of the washing unit 20, and the position P 4 is for loading the wafer W before processing, and after processing (washing). This is the position for unloading W.

The cutting section 10 is composed of one spindle 16 A, 16 B having blades 14 A, 14 B, and an imaging means 1 for performing fine alignment by imaging a pattern on the wafer W with a camera and recognizing the image. 8 and 19, and a display means 1 which displays captured images and various information and has input means 11 typified by an evening screen. The spindles 16A and 16B and the imaging means 18 and 19 of the cutting section 10 are movable in the directions of arrows A and B (Y-axis direction) in FIG. In addition, the cutting table on which the W is mounted is movable in the directions of arrows C and D (X-axis direction) and rotatable (in the Θ direction). Image processing to perform fine alignment for cutting.

The wafer W fine-tuned in this manner is cut by the blades 14A and 14B which are rotated by the spindles 16A and 16B as the cutting table moves. Then, by successively performing the above cutting, W is cut like a grid.

The cleaning unit 20 is for cleaning the cut wafer W. First, the spinner table on which the wafer W is mounted is lowered, and then washed with a spinner and clean water. Dry by air blow and raise the spinner table again.

The transfer device 50 includes a slide arm movably attached to a rail guided in the Y-axis direction, a swing arm slidably attached to the tip of the slide arm, and an end of the swing arm. And a plurality of check units. The sliding door is moved back and forth along a rail by a motor, and the position of the tip moves between a position P2 and a position P3. The pivot arm is pivoted about its end by a motor, and the end of the pivot arm moves to positions P1, P2, P3 and P4 according to the position of the slide arm. Each of the above-mentioned chucks is rotatably provided at the end of the turning arm, and holds the eighteen watts by four claws moving in the radial direction and the vertical direction. FIG. 3 shows a block diagram of the information processing unit of the dicing apparatus.

As shown in FIG. 3, the information processing section of the dicing device includes input means 11 for the operator to input commands such as starting, stopping, and moving the viewing position to the dicing device. On the other hand, there are provided a display means 12 for displaying a processing mode, a processing state, and an image obtained by capturing an image of the 18th surface, and imaging means 18 and 19.

The information processing section of the dicing device includes an X drive means 100 for moving a force-setting table on which a wafer W is mounted in the X-axis direction, and spindles 16 A and 16 of the cutting section 10. Y drive means 102 for moving B and imaging means 18 and 19 in the Y-axis direction, and spindles 16A and 16B of cutting section 10 and imaging means 18 and 19 for the Z-axis direction. It is necessary to output the drive command to each of the driving means such as the driving means 106 and the like, and to rotate the cutting table on which the Z-drive means 104 and the wafer W are mounted. Control means 110 for monitoring the drive position, drive speed and error information according to the input means 11, the display means 11, the imaging means 18, 19, and the control means 110. And information processing means 1 1 2 for transmitting and receiving information and controlling the entire dicing apparatus. .

The information processing means 112 receives position information on the screen on which the operator inputs a desired position to move on the image of the surface 18 displayed by the display means 122. A function of conversion means for converting the input position information into position information on the surface, and It has a function of a moving means for moving the display position based on the position information of the obtained 18 surface, and a function of a moving means for moving the display position to the reference position of the 18 pattern shape. Further, the information processing means 112 includes a function of a shape detecting means for detecting reference information of a street pattern formed on the surface of the wafer, a hard disk or a non-volatile memory for storing the reference information and the like. It has storage means.

Further, the information processing means 112 receives the position information on the screen where the operator has input the position desired to be moved with respect to the image of the surface of the wafer displayed by the display means 122, and the input is performed. A function of a position calculating means for calculating a position or a reference position of a street pattern shape on a display present at a position closest to the position information; and the storage means storing the calculated information on the street position on the display. It also has the function of conversion means for converting the information on the wafer surface into position information based on the reference information of the street shape.

Fig. 4 shows a flow chart of the registration process of the standard wafer W alignment model by the dicing machine.

If it is necessary to register the wafer W alignment model during the wafer W cutting process by the dicing device, the processing program of the information processing means 111 will be used to register the alignment model registration shown in Fig. 4. Step S100 of the processing routine "Registration of alignment model" (hereinafter abbreviated as S100) is called. Then, the process proceeds to the next S 102 “workload” process.

In S102, the elevator unit 40 sequentially pulls out the wafers W before processing, which are stored in the cassette unit 30 in a plurality of sheets, and moves the wafers W to the position P shown in FIG. Set to 4. Then, the wafer W is placed on a work table (position P 2) (not shown) via the preload stage at position P 1 by the transfer device 50 and is suction-held.

Here, the pattern on the W surface which is conveyed to the work table and held by suction is imaged by the imaging means 18 or 19 which has automatically moved to the center of the work table, and is displayed on the display means 12. While being displayed, the image is recognized by the information processing means 111. Then, the process proceeds to the next S104 “manual alignment”.

In S104, 6 axes are aligned so that the work street is parallel to the X axis I do. At this time, the instruction to input the rotation of the Θ axis is made in the following procedure.

CH 1 side (first channel indicating axis parallel to the X axis) Align the center of the imaging means 18 or 19 with the street edge near the center of the work and register it in the internal memory of the information processing means 112 Center position). According to the present invention, the method of designating the display position (the “matching” method) for aligning the center of the imaging means 18 or 19 with a stream edge near the center of the work is performed by the operator as described below. It is only necessary to touch the position on the display means 12 with your finger and specify it.

Fig. 5 shows the display contents of the initial display displayed on the display means 12 and Fig. 6 shows the display contents displayed in the direct touch mode.

As shown in FIG. 5, the display means 1 I includes a start button 120 for inputting start of operation of the dicing apparatus, a stop button 122 for inputting stop of operation of the dicing apparatus, and imaging means 18 and 1. Enter the focus adjustment button 1 2 4 to adjust the focus of 9; the illumination adjustment button 1 2 6 to adjust the illumination brightness at the time of imaging; and the moving vector when moving the imaging position. 8 and a direct touch movement button 130 for instructing to switch to a mode in which the desired position (display position) of the displayed wafer W is specified by pressing it with a finger. ing.

FIG. 6 shows a display that changes when the direct touch movement button is pressed in the state of FIG. As shown in FIG. 6, the display means 12 has a cancel button 13 2 for inputting an instruction to exit from the direct touch movement mode, and an 18 map display showing the overall shape of the wafer W. 1 3 4 is newly displayed. It should be noted that instead of performing the first map display 134, an enlarged image obtained by imaging may be displayed.

FIG. 7 shows a flowchart illustrating a method of specifying a display position by a screen sunset. When the dicing apparatus is set to the direct touch mode, the processing program of the dicing apparatus calls the processing routine shown in FIG. 7 and branches to step S200 "Start processing by screen touch".

When the operator touches a desired position to be moved with a finger, the processing program proceeds to the next step S202 “Acquisition of X-coordinate (pixel size) (X coordinate / Υ coordinate)”. S 2 0 In step 2, the input position information on the screen of the touch screen (input means 11) (position information such as pixels on the screen or coordinate values based on the resolution of the touch screen) is transmitted via the communication means of the input means 11. Then, the information is transmitted to the information processing means 1 12, and the information processing means 1 12 acquires the Yuttu coordinates.

In the following S204 “Converting Yutzuchi coordinates to dicer device coordinates (pulse coordinates)”, the information processing means 112 of the dicing device displays the received positional information on the display. Processing to convert to surface position information (actual length unit or drive unit pulse number used by the drive means to drive) is performed. In this case, the position information on the display is automatically converted according to the size of ゥヱ 18 (5 inch, 8 inch, etc. size and shape), so the operator does not care about the size of ゥヱ 18. The user may input a desired position using the same operation method. In the next step S206 “Calculating the relative amount (movement amount) between the current pulse coordinate of the dicer device and the pulse coordinate converted above”, the information processing means 112 converts the position of the converted W surface. The information is converted into, for example, a relative movement amount (length information of each axis or the number of driving pulses) with respect to the current image position on the X axis and the Y axis.

In the next step S208, “the movement amount of the X-axis motor and the movement amount of the Y-axis motor calculated above are output to each axis driver.” Is output to the control means 110.

In the following S210 “Axis movement start & stop”, the control means 110 sets acceleration conditions, deceleration conditions and drive speed conditions based on the received movement amount information, and synchronizes each axis. Drive. The control means 110 monitors the driving state of each axis every moment and controls the driving speed of each axis. When the movement to the position specified by the information processing means 112 is completed, the control means 110 returns a response to the information processing means 112 indicating that the movement is completed. The position information on the screen input by the operator is generally different from accurate street position information (position of a predetermined pattern shape) due to the fact that a finger is used for input. In most cases, the dicing device specifies the street position when specifying the position of the 18 W surface due to its application. Therefore, in the present invention, even if the vague position is specified, the neighborhood obtained by image processing is used. Reference position such as street position existing in Is configured to move the display position.

The position information on the screen input by the operator is formed on the position closest to the street shape detected by the shape detection function of the information processing means 112 or on the wafer surface stored in the storage means. The position is converted to a position closest to one or more reference positions of the pattern shape, and a command to move to that position is output to the control means 110. Then, the display position is moved to the position where the stream closest to the position input by the operator exists.

When the movement to the specified position is completed, the program of the information processing means reflects the X- and Y-coordinate positions on the screen after the movement. Camera image screen: Redisplays the cross in the center of the camera. Display screen: Redisplay camera icon ", and when the driving of each driving means is completed, the display unit 12 displays the 18th surface of the specified display position. When the map display 1 3 4 is redisplayed, the camera icon indicating the imaging position is also redisplayed. In addition, when displaying the captured enlarged video, a + mark is displayed at the imaging center position of the imaging means. In the case where the imaging range of the captured video is wide and the resolution is high, instead of performing the driving for moving the display position by each of the driving units, the display position is determined using only the captured video data. You may move.

When the movement to the designated position and the redisplay are completed, the processing program proceeds to S214 "processing end" and returns to the original processing routine.

As described above, when the process of “adjustment” by the direct setting for moving the center or the display of the imaging means 18 or 19 to the street edge near the center of the work is completed, the X axis is automatically set. Move to the left (or right) end position of the work. Next, adjust the left (right) position with the direct evening switch to the same street edge as the position specified in the center position. Then, the rotation angle of the Θ axis is calculated from the coordinates of the center position and the left (right) position, and the Θ axis rotates and moves based on the angle.

After the left (right) position is determined, the X axis automatically moves to the vicinity of the opposite work edge. Then, in the same manner, a process of aligning the center of the imaging means 18 or 19 with the street edge by direct touch is performed, and after determining the right (left) position, the rotation angle of the Θ axis is automatically calculated. 回転 The axis is rotated and the X-axis automatically moves to the position opposite to the workpiece. This process is repeated until the X axis and the stream become parallel. At the end of the scan operation, the Θ coordinates at this time are recorded in the internal memory.

After this, the Θ axis automatically rotates 90 °, and the system waits for the input of the manual alignment on the CH2 side (the second channel indicating the axis perpendicular to the X axis). Similarly, alignment of the street and the X axis is performed by the direct evening switch to complete the operation of S104. In the next S106 “CH1 street cross position registration”, after the alignment, the mode automatically switches to the model registration mode and moves to the vicinity of the center of the imaging means work. The process of matching the imaging means 18 or 19 to the intersection (cross position) of the streets of both CHs is performed by the direct switch and registered.

In the next S108 “CH1 first (high magnification) model registration”, after the cross position is registered, the mode switches to the model pattern input mode, and the model frame is displayed on the screen. Perform the process of adjusting the position of the model frame to a position that is considered appropriate by direct touch and register.

In the following S110 “CH2 2nd (low magnification) model registration”, the imaging magnification of the imaging means 18 or 19 is automatically switched to low magnification, and the model registration is directly touched like the high magnification model. This is performed using the method described above. After registration, the Θ axis automatically rotates 90 °, and the imaging means 18 or 19 moves to the vicinity of the center of the work.

In the next S 1 1 2 “CH 2 street cross position registration”, the imaging magnification of the imaging means 18 or 19 is automatically switched to high magnification, and, like CH 1, the street intersection is set as the cross position and direct touch is performed. Register using the method described above.

In the next step S 1 1 4 “CH2 1st (high magnification) model registration”, the screen is automatically switched to the model deposit mode as in CH1, and the registration of the CH2 high magnification model is performed by direct touch. It is implemented using a method. The procedure is the same as for CH1.

When the process of “CH2 first (high magnification) model registration” is completed in S114, the process proceeds to S116 “Model registration completed” to end the alignment model registration process.

If the Pha W alignment model is registered as described above, The cutting process is performed by performing the alignment process as described above.

The 18-W street pattern sucked and held on the work table is imaged by the imaging means 18 and 19 and displayed on the display means 12, and image-recognized by the information processing means 112. A pattern matching process is performed based on this image information and a reference pattern registered in advance in the storage means, and a street is detected to adjust the cutting alignment. Then, the alignment-adjusted W is moved in two directions by movement in the Y-axis direction indicated by arrows A and B shown in FIG. 2 and movement in the X-axis direction indicated by arrows C and D in the worktable. Streets are cut at the same time. When the first two streets are cut, the spindles 16A and 16B of the cutting section 10 move in the Y-axis direction by the pitch of the streets. Then, the worktable moves again in the X-axis direction, thereby cutting the next two streets. This cutting operation is repeated to cut a predetermined stream in the direction (X direction).

When the cutting of the predetermined street is completed, the cut grooves are imaged by the imaging means 18 or 19, and the cut grooves are automatically kerfed. The kerf chip inspects the cutting results such as the degree of chipping (chipping) of the cutting groove wall and the positional deviation of the cutting groove from the street. If the chipping is large or the cut groove is large and deviates from the street, an operator call is issued to notify the operator of the problem. In addition, when the cutting groove is slightly deviated from the original cutting groove, the cutting position is automatically corrected, and when the chipping is slightly observed, the cutting condition is changed to perform correction processing. Thereafter, the cutting is continued a predetermined number of times. In addition, even when performing the manual check, if the direct setting method is used as a means for moving the display position to a desired observation position, the manual check operation can be quickly performed.

When all the streets in one direction (X direction) are cut, the work table rotates 90 °, and the streets in the direction orthogonal to the cut streets are cut sequentially. As a result, ゥヱ 18 W is finally cut in a grid pattern.

The cut 18 W is returned to the position P2 by the work table, and then transferred by the transfer device 50 to the spinner table of the cleaning section 2 at the position P3. And Here, after being washed with washing water, it is dried by air blow. After cleaning and drying, the wafer W is transported to the position P4 by the transport device 50, and then stored in the cassette unit 30 by the elevator unit 40.

In the above embodiment, a touch screen is used as a means for inputting position information by designating an arbitrary position displayed on the display means by a position on the display. However, the present invention is not limited to this. A pointing device such as a tablet, a trackball, or a tablet may be used as the input means. Industrial applicability

As described above, according to the first aspect, the observation position specifying device and the eighteenth display position specifying method according to the present invention, when observing the first surface, the user can quickly move to the desired display position. It can be moved.

Claims

The scope of the claims

1. In an eave observation position designating device for observing a pattern on an eave surface, an imaging means for imaging the surface of the ewafer;

Display means for displaying an image taken by the imaging means;

Input means for inputting position information by designating an arbitrary position displayed by the display means as a position on the display,

A conversion unit that converts the input position information into position information on the surface; and a movement unit that moves a display position based on the converted position information on the surface.

With

The display means displays an image at the display position after the movement.

2. The observation position specifying device according to claim 1, wherein the input unit has a touch screen.

3. The device for specifying an observation position for e-wafer according to claim 1, wherein the input means has a pointing device.

4. If the input position information is a position where penny 8 does not exist, the conversion means converts the input position information into p18 position information which is closest to the input position. 18. The observation position specifying device according to claim 1, wherein

5. The wafer observation position specifying device according to claim 4, wherein the input means has a touch screen.

6. The penino / observation position designation device according to claim 4, wherein the input means has a pointing device.

7. storage means for storing at least one reference position of the pattern shape formed on the wafer surface;

Display means for displaying the shape of the surface on the surface of the surface;

Input the position information by specifying the arbitrary position displayed by the display means as the position on the display Input means for

Position calculating means for calculating a reference position of a pattern shape on a display existing at a position closest to the input position information;

Moving means for moving the display position of the pattern to the reference position of the calculated pattern shape;

With

The display means displays an image at the display position after the movement.

8. The observation position specifying device according to claim 7, wherein the input means has a touch screen.

9. The observation position specifying device according to claim 7, wherein the input unit has a pointing device.

10. If the input position information is a position where there are no more than eighteen positions, the conversion means may calculate the position information of the eighteenth position that is closest to the input position. 8. The observation position specifying device according to claim 7, wherein the observation position designation device is converted into the following.

11. The observation position specifying device according to claim 10, wherein the input means has a touch screen.

12. The apparatus according to claim 10, wherein the input unit has a pointing device.

A storage unit for storing reference information of a pattern shape formed on the wafer surface; an imaging unit for imaging the surface of the wafer;

Display means for displaying an image taken by the imaging means;

Input means for designating an arbitrary position displayed by the display means as a position on the display and inputting a positional information;

Shape detection means for detecting pan shape information on a display formed on the wafer surface based on the image taken by the imaging means;

A predetermined pattern on the display at the position closest to the input position information Position calculating means for calculating a position,

Conversion means for converting the information on the calculated pattern-shaped position on the display into position information on the wafer surface based on the pattern-shaped reference information stored in the storage means; Moving means for moving a display position based on the converted position information of the surface;

With

The display means displays an image at the display position after the movement.

14. The observation position specifying device according to claim 13, wherein the input means has a touch screen.

15. The apparatus according to claim 13, wherein the input unit includes a pointing device.

16. If the input position information is a position where there is no position, the conversion means may determine that the position information is located closest to the input position. 14. The observation position specifying device according to claim 13, wherein the device is converted to a viewing position.

17. The viewing position specifying device according to claim 16, wherein the input unit has a touch screen.

18. The apparatus according to claim 16, wherein the input unit includes a pointing device.

1 9. In a wafer display position specifying method for observing a wafer surface pattern, a step of imaging an eighteenth surface;

Displaying the captured image;

A step of inputting position information by designating the arbitrary displayed position as a position on the display, and a step of converting the input position information into position information of a wafer surface,

A step of moving a display position based on the converted position information of the surface, and a step of displaying an image of the moved display position,

A method for designating a wafer display position, comprising: