JP2002050671A - Wafer observation position designating apparatus and wafer display position designating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer observation position designating apparatus and a wafer display position designating method, which can move the observation position to a desired position with a single operation, when a wafer surface is observed. SOLUTION: The apparatus includes image pick-up means 18 and 19 for photographing the surface of a wafer, a display means 12 for displaying an image photographed by the image pick-up means, an input means 11 for designating a given position displayed by the display means 12 with a position on the display to input positional information, a conversion means (information processing means 112) for converting the input positional information to positional information on the wafer surface, and a moving means (drive means X110 to θ106) for moving the display position on the basis of the converted positional information on the wafer surface, so as to display an image at the display position after the movement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer observation position designation apparatus and a wafer display position designation method, and in particular, to image a wafer surface with a microscope camera or the like to display an image of the wafer surface and observe a pattern on the wafer surface. The present invention relates to a wafer observation position specifying device and a wafer display position specifying method.

[0002]

2. Description of the Related Art Conventionally, there has been known a wafer surface observation apparatus for enlarging and imaging a work mounted on a loading table with a microscope camera or the like, and setting processing standards and observing processing results. Since the display range on the wafer that is enlarged and displayed by the conventional wafer surface observation device is limited to a very small area on the wafer, the user operates the axis drive button or joystick when changing the observation position. By driving each axis, the relative position between the camera and the wafer is moved, and the imaging range of the camera is moved to a target position.

[0003]

However, in a conventional wafer surface observation apparatus that moves the observation position on the wafer surface using a conventional axis drive button or joystick as input means, the input means is means for inputting a velocity vector. In addition, there has been a problem that it is difficult to quickly position an observation position with respect to a fine pattern formed on a wafer surface.

The present invention has been made in view of such circumstances, and a wafer observation position designation apparatus and a wafer display position designation method capable of quickly and easily moving a microscope camera to a desired observation position with one touch. It is intended to provide.

[0005]

According to the present invention, in order to achieve the above object, in a wafer observation position specifying device for observing a pattern on a wafer surface, an image pickup means for picking up an image of a wafer surface, and an image picked up by the image pickup means. Display means for displaying an image, input means for inputting position information by designating an arbitrary position displayed by the display means at a position on the display, and converting the input position information to position information on the wafer surface It is provided with a conversion means for converting, and a movement means for moving a display position based on the converted position information on the wafer surface, wherein the display means displays an image of the display position after the movement.

According to the present invention, imaging means for imaging the surface of a wafer, display means for displaying an image taken by the imaging means, and an arbitrary position displayed by the display means at a position on the display. Input means for designating and inputting position information, converting means for converting the input position information into position information on the wafer surface, and moving means for moving a display position based on the converted position information on the wafer surface And the display means displays the image at the display position after the movement, so that it is possible to quickly move to the desired display position with one touch.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a wafer observation position designation apparatus and a wafer display position designation method according to the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a dicing apparatus to which a wafer observation position specifying device and a wafer display position specifying method according to the present invention are applied, and FIG. 2 is a plan view thereof.

The dicing apparatus includes a cutting unit 10 for observing the surface of a wafer (work) W, cutting the wafer W in a direction perpendicular to the wafer W, and finally cutting the wafer W like a grid. Cleaning section 20 for cleaning
A cassette unit 30 for storing the wafers W before and after processing, and a wafer W before processing is pulled out from a desired position of the cassette unit 30 and pre-aligned on the stage, and after the processing set on the stage. An elevator unit 40 for storing the wafer W at a desired position in the cassette unit 30 and a transfer device 50 for transferring the wafer via the above-described steps.

The transfer positions of the wafer W by the transfer device 50 are four positions P1 and P, as shown in FIG.
2, P3, and P4, and these positions P1 to P4
Are arranged so as to be located at each vertex of the square.
The position P1 is a position for preloading the wafer W, the position P2 is a position for loading and unloading the wafer W on the cutting table for transferring the wafer W to the cutting unit 10, and the position P3 is a spinner table for the cleaning unit 20. The position P4 is a position where the wafer W before processing is loaded and the wafer W after processing (after cleaning) is unloaded.

The cutting unit 10 has two spindles 16A and 16B provided with blades 14A and 14B, imaging means 18 and 19 for performing fine alignment by imaging a pattern on the wafer W with a camera and recognizing the image. A display unit 12 that displays an image and various information and includes an input unit 11 represented by a touch panel. The spindle 16A of the cutting section 10,
16B and the imaging means 18 and 19 are movable in the directions of arrows A and B (Y-axis direction) in FIG. Further, since the cutting table on which the wafer W is mounted is movable in the directions of arrows C and D (X-axis direction) and is rotatable (θ direction), the surface of the wafer W is imaged and image processing is performed. Fine alignment for cutting can be performed.

The wafer W thus fine-aligned is moved along with the movement of the cutting table.
Blade 1 rotated by spindles 16A and 16B
It is cut by 4A and 14B. Then, by sequentially performing the above-described cutting, the wafer W is cut like a grid.

The cleaning unit 20 is for cleaning the cut wafer W. First, the spinner table on which the wafer W is mounted is lowered, where the wafer is cleaned with a spinner and clean water, and after cleaning, dried by air blow. Raise the spinner table again.

Further, the transfer device 50 includes a slide arm movably attached to a rail guided in the Y-axis direction, a swing arm swingably attached to a tip end of the slide arm, and a swing arm at an end of the swing arm. And a plurality of attached chuck units. This slide arm is moved back and forth along the rail by a motor,
The position of the tip moves between the position P2 and the position P3. The pivot arm pivots around its end by a motor, and the end of the pivot arm moves to positions P1, P2, P3 and P4 according to the position of the slide arm. The chuck portions are rotatably provided at the ends of the turning arms, respectively, and hold the wafer W by four claws moving in the radial direction and the vertical direction.

FIG. 3 shows a block diagram of an information processing section of the dicing apparatus.

According to FIG. 1, the information processing section of the dicing apparatus has input means 11 for the user to input commands such as starting, stopping, and moving the observation position to the dicing apparatus. A display unit 12 for displaying a processing mode, a processing state, and an image of the wafer surface
And imaging means 18 and 19.

Further, the information processing section of the dicing apparatus includes:
A driving unit X100 for driving the cutting table on which the wafer W is mounted in the X-axis direction, a driving unit Y102 for moving the spindles 16A and 16B of the cutting unit 10 and the imaging units 18 and 19 in the Y-axis direction, and a spindle for the cutting unit 10 A driving unit Z104 for moving the imaging units 18A and 19 in the Z-axis direction, and a driving unit θ for rotating the cutting table on which the wafer W is mounted in the θ direction.
106, etc., a control unit 110 which outputs a drive command to each of the drive units and monitors a drive position, a drive speed and error information as required, an input unit 11, the display unit 12, an image pickup unit There are provided information processing means 112 for transmitting and receiving information to and from the means 18, 19 and the control means 110 and for controlling the entire dicing apparatus.

The information processing means 112 receives position information on a screen on which a user has input a position desired to be moved with respect to the image of the wafer surface displayed by the display means 12, and receives the input information. Function of converting means for converting the converted position information into position information of the wafer surface, function of moving means for moving the display position based on the converted position information of the wafer surface, and display position at the reference position of the wafer pattern shape. And a function of a moving means for moving the object. The information processing means 112 includes a function of a shape detecting means for detecting reference information of a street pattern shape formed on the wafer surface, and a storage means such as a hard disk or a non-volatile memory for storing the reference information and the like. I have.

The information processing means 112 includes a display means 12
Receives the position information on the screen in which the user has input the position desired to be moved with respect to the image of the wafer surface displayed by the user, and displays the street pattern on the display closest to the input position information. The function of the position calculating means for calculating the position of the shape or the reference position, the information of the calculated street position on the display is converted into position information of the wafer surface based on the reference information of the street shape stored in the storage means. It also has the function of a conversion means for performing the conversion.

FIG. 4 shows a flowchart of a registration process of a standard alignment model of the wafer W by the dicing apparatus.

If it becomes necessary to register an alignment model of the wafer W during the cutting process of the wafer W by the dicing apparatus, the processing program of the information processing means 112 executes the steps of the alignment model registration processing routine shown in FIG. S100 “Registration of alignment model” (hereinafter abbreviated as S100) is called. Then, the process proceeds to the next S102 “workload” process.

In step S102, the elevator unit 40 sequentially pulls out the plurality of unprocessed wafers W stored in the cassette unit 30, and places the wafers W at a position P4 shown in FIG.
Set to. The wafer W is transferred to the transfer device 50
Is placed on a work table (position P2) (not shown) via the preload stage at position P1, and is suction-held.

Here, the pattern on the surface of the wafer W which has been conveyed to the work table and held by suction is picked up by the image pickup means 18 or 19 which has automatically moved to the center of the work table and displayed on the display means 12. ,
The image is recognized by the information processing means 112. Then, the process proceeds to the next S104 “manual θ alignment”.

In S104, the θ axis is aligned so that the work street is parallel to the X axis. At this time, the instruction of the rotation input of the θ axis is performed in the following procedure.

On the CH1 side (first channel indicating an axis parallel to the X axis), the center of the image pickup means 18 or 19 is aligned with a street edge near the center of the work, and the information processing means 11
2 is registered in the internal memory (center position is determined). According to the present invention, a method of designating a display position at which the center of the imaging unit 18 or 19 is aligned with a street edge near the center of the work (“alignment” method) is performed by the user as described below. You only need to specify the upper position by touching it with your finger.

FIG. 5 shows the display contents of the initial display displayed on the display means 12, and FIG. 6 shows the display contents displayed in the direct touch mode.

According to FIG. 5, the display means 12 has a start button 120 for inputting the start of the operation of the dicing apparatus.
And a stop button 122 for inputting a stop of the operation, a focus adjustment button 124 for adjusting the focus of the imaging units 18 and 19, an illumination adjustment button 126 for adjusting the illumination brightness during imaging, and a case where the imaging position is moved. An XY key 128 for inputting a movement vector to the camera and a direct touch movement button 130 for instructing switching to a mode in which a desired position (a position on the display) of the displayed wafer W is specified by pressing with a finger. Have been.

FIG. 6 shows a display that changes when the direct touch movement button is pressed in the state of FIG. According to the figure, the display means 12 has a cancel button 1 for inputting an instruction to exit from the direct touch movement mode.
32 and a wafer map display 134 showing the entire shape of the wafer W are newly displayed. Note that, instead of performing the wafer map display 134, an enlarged image obtained by imaging may be displayed.

FIG. 7 is a flowchart showing a method for specifying a display position by touching the screen.

When the dicing apparatus is set to the direct touch mode, the processing program of the dicing apparatus calls a processing routine shown in a flowchart, and a step S20 is executed.
0 The processing branches to “Start processing by touching the screen”.

When the user touches a desired position to be moved with a finger, the processing program proceeds to the next step S202 "Acquisition of touch coordinates (pixel size) (X coordinate / Y coordinate)". In S202, the input position information on the screen of the touch panel (input means 11) (position information such as coordinates on the screen or coordinates based on the resolution of the touch panel) is transmitted to the information processing means via the communication means of the input means 11. The information is transmitted to the information processing unit 112, and the information processing unit 112 acquires the touch coordinates.

In the next step S204 “converting the touch coordinates to the coordinates (pulse coordinates) of the dicer device”, the information processing means 112 of the dicing device converts the received position information into the position information of the surface of the displayed wafer W (actual information). Length unit or number of drive unit pulses used by the drive means to drive)
Is performed. Here, since the position information on the display is automatically converted according to the size of the wafer (size or shape such as 5 inches or 8 inches), the user can operate the same operation method without considering the size of the wafer. What is necessary is just to input the position of.

In the next step S206 “Calculate the relative amount (movement amount) between the current pulse coordinates of the dicer device and the converted pulse coordinates”, the information processing means 112 outputs the converted wafer W
The surface position information is converted into a relative drive amount (length information of each axis or the number of drive pulses) with respect to the current image position on the X axis and the Y axis, for example.

In the next step S208, "the calculated amount of movement of the X-axis motor and the amount of movement of the Y-axis motor are output to the respective axis drivers." A process for outputting to 110 is performed.

In the next step S210 "Start / stop axis movement",
The control unit 110 sets acceleration conditions, deceleration conditions, and driving speed conditions based on the received drive amount information, and drives the respective axes in synchronization. The control means 110 monitors the driving state of each axis every moment and controls the driving speed of each axis. When driving to the position designated by the information processing means 112 is completed, the control means 110 returns a response to the information processing means 112 indicating that the driving has been completed.

The position information on the screen input by the user is generally different from accurate street position information (position of a predetermined pattern shape), for example, because a finger is used for input. . In the dicing apparatus, the street position is almost always specified when the position of the surface of the wafer W is specified due to its use. Therefore, in the present invention, even when an ambiguous position is specified, the position exists in the vicinity obtained by the image processing. The display position is moved to a reference position such as a street position.

The position information on the screen input by the user is formed on the position closest to the street shape detected by the shape detection function of the information processing means 112 or on the wafer surface stored in the storage means. It is converted to a position closest to one or more reference positions of the pattern shape, and a command to drive to that position is output to the control means 110. Then, the display position is driven to the position where the street closest to the position input by the user exists.

When the drive to the designated position is completed, the program of the information processing means proceeds to S212 "X coordinate after movement,
Reflect the Y coordinate position on the screen. Camera video screen: Redisplay + character in the center of camera. Wafer map display screen: Redisplay camera icon. When the driving of each driving unit is completed, the display unit 12 displays the specified display position. Display the wafer surface. When redisplaying the wafer map display 134, the camera icon indicating the imaging position is also redisplayed. When displaying the captured enlarged video, a + mark is displayed at the imaging center position of the imaging means. In the case where the imaging range of the captured video is wide and the resolution is high, instead of performing the driving for moving the display position by each of the driving units, the display position is determined using only the captured video data. You may move.

When the drive to the designated position and the redisplay are completed, the processing program proceeds to S214 "processing end" and returns to the original processing routine.

As described above, the "alignment" by direct touch for moving the drive or display of the center of the imaging means 18 or 19 to the street edge near the center of the work as described above.
Is completed, the X-axis automatically moves to the left (or right) end position of the work. Next, the left (right) position is determined by directly touching the edge of the same street as the position specified by the center position by direct touch. Then, the rotation angle of the θ axis is calculated from the coordinates of the center position and the left (right) position, and the θ axis is rotationally moved based on the angle.

After the left (right) position is determined, the X-axis automatically moves to the vicinity of the opposite work edge. Then, similarly, a process of matching the center of the imaging means 18 or 19 to the street edge by direct touch is performed, and the right (left)
After the position is determined, the rotation angle of θ is automatically calculated and the θ axis is rotationally moved, and the X axis is automatically moved to the position on the opposite side of the work. This process is repeated until the X axis and the street become parallel, and at the end of the scanning operation, the θ coordinate at this time is recorded in the internal memory.

Thereafter, the θ axis is automatically rotated by 90 °, and CH
It is in a state of waiting for the input of the manual θ alignment on the second side (the second channel indicating the axis perpendicular to the X axis). Similarly, the street and the X-axis are aligned by direct touch, and the operation of S104 is completed.

In the next step S106 "CH1 street cross position registration", after the θ alignment, the mode is automatically switched to the model registration mode, and the image pickup means is moved to the vicinity of the work center. The process of aligning the imaging means 18 or 19 with the intersection (cross position) of the street of both CHs is performed by direct touch and registered.

In the next step S108 "CH1 first (high magnification) model registration", after the cross position is registered, the mode is switched to the model pattern input mode, and a model frame is displayed on the screen. A process of adjusting the position of the model frame to a position considered appropriate is performed by direct touch and registered.

In the next step S110 "CH2 second (low magnification) model registration", the imaging magnification of the imaging means 18 or 19 is automatically switched to low magnification, and the model registration is performed using the direct touch method as in the high magnification model. Do it. After registration, the θ axis is automatically rotated by 90 °, and the imaging unit 18 or 19 moves to the vicinity of the center of the work.

In the next step S112 "CH2 street cross position registration", the image pickup magnification of the image pickup means 18 or 19 is automatically switched to a high magnification, and, similarly to CH1, a street intersection is used as a cross position and a direct touch technique is used. register.

In the next step S114 “CH2 first (high magnification) model registration”, the screen is automatically switched to the model registration mode similarly to CH1, and the CH2 side high magnification model is registered using the direct touch technique. . The procedure is CH1
Is the same as

When the "CH2 first (high magnification) model registration" process is completed in S114, the process proceeds to S116 "Model registration end", and the alignment model registration process ends.

When the alignment model of the wafer W is registered as described above, an alignment process is performed as follows to perform a cutting process.

The street pattern of the wafer W sucked and held on the work table is picked up by the image pickup means 18 and 19 and displayed on the display means 12, and image-recognized by the information processing means 112. A pattern matching process is performed based on this image information and a reference pattern registered in advance in the storage means, and streets are detected to adjust the alignment of cutting.
Then, the wafer W after the alignment adjustment has two streets simultaneously moved by movement in the Y-axis direction indicated by arrows A and B shown in FIG. 2 and movement of the work table in the X-axis direction indicated by arrows C and D. Be cut off. When the first two streets are cut, the spindle 16A of the cutting section 10,
16B moves in the Y-axis direction by the pitch of the street. Then, the work table moves in the X-axis direction again,
Thereby, the next two streets are cut. This cutting operation is repeated to cut a predetermined street in one direction (X direction).

When the cutting of the predetermined street is completed, the cut groove is imaged by the image pickup means 18 or 19, and the kerf check of the cut groove is automatically performed. The kerf check inspects cutting results such as the degree of chipping (chipping) of the cutting groove wall and the positional deviation of the cutting groove from the street. If the chipping is large or the cut groove is largely off the street, an operator call is made to notify the user of the problem. In addition, when the cutting groove is slightly deviated from the original cutting groove, the cutting position is automatically corrected, and when a little chipping is observed, correction processing such as changing the cutting condition is performed. Thereafter, the cutting is continued a predetermined number of times. In addition, even when performing a kerf check manually, a kerf check operation can be quickly performed by using a direct touch method as a means of moving a display position to a desired observation position.

When all the streets in one direction (X direction) are cut, the work table rotates by 90 °, and the streets in the direction orthogonal to the cut streets are cut sequentially. Thereby, the wafer W is finally cut in a grid pattern.

The cut wafer W is returned to the position P2 by the work table.
Is transported to the spinner table of the cleaning unit 2 at the position P3. Then, after being washed with the washing water, it is dried by air blow. The washed and dried wafer W is transferred to the position P4 by the transfer device 50, and then the cassette unit 30 is moved by the elevator unit 40.
Is stored in.

[0054]

As described above, according to the wafer observation position specifying apparatus and the wafer display position specifying method according to the present invention, the image pickup means for picking up an image of the surface of the wafer and the image picked up by the image pickup means are displayed. Display means, input means for designating an arbitrary position displayed by the display means as a position on the display and inputting position information, and converting means for converting the input position information into position information on a wafer surface When,
And moving means for moving a display position based on the converted position information of the wafer surface, and the display means displays an image of the display position after the movement,
It is possible to quickly move to a desired display position with one touch.

[Brief description of the drawings]

FIG. 1 is a perspective view of a dicing apparatus to which the present invention is applied.

FIG. 2 is a plan view of a dicing apparatus to which the present invention is applied.

FIG. 3 is a block diagram of an information processing unit of the dicing apparatus.

FIG. 4 is a flowchart of a standard wafer W alignment model registration process.

FIG. 5 is a diagram showing display contents of an initial display displayed on a display means.

FIG. 6 is a diagram showing display contents displayed in a direct touch mode.

FIG. 7 is a flowchart showing a method of specifying a display position by touching a screen;

[Explanation of symbols]

10 cutting section, 18, 19 imaging means, 20 cleaning section,
30 cassette unit, 40 elevator unit, 100 driving means X, 102 driving means Y, 104 driving means Z, 1
06: driving means θ, 110: control means, 112: information processing means, 130: direct touch movement button

Continuation of the front page (72) Inventor Hiroshi Shimoda 9-7-1 Shimorenjaku, Mitaka-shi, Tokyo F-term (reference) 5F031 CA02 HA57 JA04 JA22 JA50 KA06 MA33 MA34

Claims (6)

[Claims] 1. An apparatus for designating a wafer observation position for observing a pattern on a wafer surface, wherein: an imaging means for imaging the surface of the wafer; a display means for displaying an image taken by the imaging means; Input means for designating an arbitrary position as a position on the display and inputting position information; converting means for converting the input position information into position information on the wafer surface; and the converted position information on the wafer surface. Moving means for moving a display position based on the display position, wherein the display means displays an image of the display position after the movement. 2. A storage means for storing one or a plurality of reference positions of a pattern shape formed on the wafer surface; a display means for displaying a pattern shape on the wafer surface; An input unit for inputting position information by designating a position of the display as a position on the display; a position calculation unit for calculating a reference position of a pattern shape on the display existing at a position closest to the input position information; Moving means for moving the display position of the pattern shape to the reference position of the calculated pattern shape, wherein the display means displays an image of the display position after the movement, and the wafer observation position designation device. . A storage unit configured to store reference information of a pattern shape formed on the wafer surface; an imaging unit configured to capture an image of a surface of the wafer; a display unit configured to display an image captured by the imaging unit; Input means for designating an arbitrary position displayed by the display means as a position on the display and inputting position information; and a pattern shape on the display formed on the wafer surface based on an image taken by the imaging means. Shape detection means for detecting information; position calculation means for calculating a position of a predetermined pattern shape on a display present at a position closest to the input position information; and position of the calculated pattern shape on the display. Converting means for converting the information of the wafer surface into position information of the wafer surface based on the reference information of the pattern shape stored in the storage means; and And a moving means for moving the display position on the basis of the information, the display means, wafer viewing position designating device and displaying the image of the display position after the movement. 4. The wafer observation position specifying device according to claim 1, wherein said input means is an input device using a pointing device such as a mouse, a trackball, a tablet or a touch panel. 5. When the input position information is a position where a wafer does not exist, the conversion unit converts the input position information into position information of a wafer located closest to the input position. 5. The method according to claim 1, wherein
The wafer observation position specifying device according to any one of the above. 6. A wafer display position specifying method for observing a pattern on a wafer surface, wherein: a step of imaging the surface of the wafer; a step of displaying the captured image; and displaying the displayed arbitrary position on a display. A step of inputting position information by designating the position, a step of converting the input position information into position information of the wafer surface, and a step of moving a display position based on the converted position information of the wafer surface. Displaying an image of the display position after the movement, a wafer display position specifying method.