WO2003033771A3 - Method and system for selective electro-coating of the surfaces of metals - Google Patents

Method and system for selective electro-coating of the surfaces of metals Download PDF

Info

Publication number
WO2003033771A3
WO2003033771A3 PCT/DE2002/003833 DE0203833W WO03033771A3 WO 2003033771 A3 WO2003033771 A3 WO 2003033771A3 DE 0203833 W DE0203833 W DE 0203833W WO 03033771 A3 WO03033771 A3 WO 03033771A3
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric
micrometers
metals
flat
coating
Prior art date
Application number
PCT/DE2002/003833
Other languages
German (de)
French (fr)
Other versions
WO2003033771A2 (en
Inventor
Uwe Landau
Rainer Wiedenbeck
Original Assignee
Otb Oberflaechentechnik Berlin
Uwe Landau
Rainer Wiedenbeck
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Oberflaechentechnik Berlin, Uwe Landau, Rainer Wiedenbeck filed Critical Otb Oberflaechentechnik Berlin
Priority to DE50203040T priority Critical patent/DE50203040D1/en
Priority to AT02779151T priority patent/ATE294880T1/en
Priority to AU2002342532A priority patent/AU2002342532A1/en
Priority to EP02779151A priority patent/EP1468127B1/en
Publication of WO2003033771A2 publication Critical patent/WO2003033771A2/en
Publication of WO2003033771A3 publication Critical patent/WO2003033771A3/en
Priority to HK05103400A priority patent/HK1072787A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)

Abstract

Disclosed is a method for selective electro-coating of the surfaces of metals, wherein the surface areas which not are to be coated are initially masked by contactless application of a liquid dielectric and, subsequently, the non-masked surface areas are electroplated. The dielectric is applied in a very precise manner in very fine droplets (14) having a substantially identical droplet size of between 3 and 70 micrometers and a contour acuity of less or equal to 80 micrometers. The droplets (14) are initially electrically charged and are then controlled according to requirements upon application by an electric field. The dielectric can be applied in at least one continuous interruption-free strip (16) or in a controlled discontinuous manner, enabling masking layers (16) of almost all conceivable forms to be produced, especially for flat, flat-stamped or embossed metal strips (10). After electroplating has occurred, the applied dielectric (16) is removed in a residue-free state in an aqueous solution with microdisperse additives. The invention also relates to an electroplating system for carrying out the above-mentioned method.
PCT/DE2002/003833 2001-10-11 2002-10-11 Method and system for selective electro-coating of the surfaces of metals WO2003033771A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE50203040T DE50203040D1 (en) 2001-10-11 2002-10-11 METHOD AND METHOD FOR SELECTIVE GALVANIC COATING OF METAL SURFACES
AT02779151T ATE294880T1 (en) 2001-10-11 2002-10-11 METHOD AND SYSTEM FOR SELECTIVE GALVANIC COATING OF METAL SURFACES
AU2002342532A AU2002342532A1 (en) 2001-10-11 2002-10-11 Method and system for selective electro-coating of the surfaces of metals
EP02779151A EP1468127B1 (en) 2001-10-11 2002-10-11 Method and system for selective electro-coating of the surfaces of metals
HK05103400A HK1072787A1 (en) 2001-10-11 2005-04-20 Method and system for selective electro-coating ofthe surfaces of metals

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10149998A DE10149998C2 (en) 2001-10-11 2001-10-11 Process and system for the selective electroplating of metal surfaces
DE10149998.1 2001-10-11

Publications (2)

Publication Number Publication Date
WO2003033771A2 WO2003033771A2 (en) 2003-04-24
WO2003033771A3 true WO2003033771A3 (en) 2003-12-24

Family

ID=7702054

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003833 WO2003033771A2 (en) 2001-10-11 2002-10-11 Method and system for selective electro-coating of the surfaces of metals

Country Status (6)

Country Link
EP (1) EP1468127B1 (en)
AT (1) ATE294880T1 (en)
AU (1) AU2002342532A1 (en)
DE (2) DE10149998C2 (en)
HK (1) HK1072787A1 (en)
WO (1) WO2003033771A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8246808B2 (en) * 2008-08-08 2012-08-21 GM Global Technology Operations LLC Selective electrochemical deposition of conductive coatings on fuel cell bipolar plates
DE102010050106A1 (en) * 2010-11-03 2012-05-03 Manfred Band Partial electroplating of substrate, comprises applying electrically non-conductive coating material comprising ink jet module on regions of electrically conductive substrate, which is not to be coated

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947851A (en) * 1974-06-27 1976-03-30 International Business Machines Corporation Drop charging method for liquid drop recording
US4409071A (en) * 1982-12-27 1983-10-11 International Business Machines Corporation Masking for selective electroplating jet method
JPH0987887A (en) * 1995-09-21 1997-03-31 Riidomitsuku Kk Partial plating method
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
GB2352688A (en) * 1999-05-27 2001-02-07 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
US6299749B1 (en) * 1999-10-25 2001-10-09 Molex Incorporated Method of fabricating an electrical component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4839665A (en) * 1987-07-20 1989-06-13 Carl Hellmuth Hertz Method and apparatus for controlling the electrical charging of drops in an ink jet recording apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947851A (en) * 1974-06-27 1976-03-30 International Business Machines Corporation Drop charging method for liquid drop recording
US4409071A (en) * 1982-12-27 1983-10-11 International Business Machines Corporation Masking for selective electroplating jet method
JPH0987887A (en) * 1995-09-21 1997-03-31 Riidomitsuku Kk Partial plating method
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
GB2352688A (en) * 1999-05-27 2001-02-07 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
US6299749B1 (en) * 1999-10-25 2001-10-09 Molex Incorporated Method of fabricating an electrical component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) *

Also Published As

Publication number Publication date
HK1072787A1 (en) 2005-09-09
DE10149998A1 (en) 2003-04-30
ATE294880T1 (en) 2005-05-15
EP1468127B1 (en) 2005-05-04
WO2003033771A2 (en) 2003-04-24
EP1468127A2 (en) 2004-10-20
DE10149998C2 (en) 2003-08-14
DE50203040D1 (en) 2005-06-09
AU2002342532A1 (en) 2003-04-28

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