WO2003030604A1 - Support et contacts pour boitier a semi-conducteur - Google Patents

Support et contacts pour boitier a semi-conducteur Download PDF

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Publication number
WO2003030604A1
WO2003030604A1 PCT/US2002/031442 US0231442W WO03030604A1 WO 2003030604 A1 WO2003030604 A1 WO 2003030604A1 US 0231442 W US0231442 W US 0231442W WO 03030604 A1 WO03030604 A1 WO 03030604A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
socket
semiconductor package
upright piece
hole
Prior art date
Application number
PCT/US2002/031442
Other languages
English (en)
Inventor
Kiyoshi Adachi
Masanori Yagi
Original Assignee
Molex Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Incorporated filed Critical Molex Incorporated
Priority to US10/488,715 priority Critical patent/US7021944B2/en
Publication of WO2003030604A1 publication Critical patent/WO2003030604A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB

Definitions

  • the present invention relates to a socket of a semiconductor package provided with a plurality of contacts for contacting with a plurality of solder balls arranged in an array on one side of the semiconductor package, and such contacts.
  • the actual mounting system is changing from a through-hole type to a surface mounting type and the arrangement of terminals is changing from a peripheral arrangement to an array arrangement.
  • a ball grid array (BGA) in which solder balls are arranged in an array-like arrangement on a surface of a package is becoming a main type of a package on which the terminals may be mounted on the surface.
  • the socket may be actually mounted on the substrate for interchanging the integrated circuits in addition to the case where the integrated circuits are subjected to a burn-in test or a high frequency test by using a test socket.
  • the socket it is necessary to positively contact all the contacts with both terminals of the integrated circuits and terminals formed on the substrate to keep a sufficient electrical conductivity.
  • a socket of a semiconductor package having a plurality of solder balls arranged in an array is disclosed in Japanese Patent Application Laid-Open No.
  • the socket 300 of the publication is provided with a contact 305 as shown in FIGS. 12 to 16.
  • This contact 305 is formed by punching a metal plate out and is provided with a base body 302 having side walls 301 on both sides and having a substantially Urshaped cross- section, a substantially C-shaped contact piece 303 having elasticity, projecting toward the side walls 301 from a lower portion of the body 302 and extending above the body 302, a contact portion 303a provided in the vicinity of a tip end of the contact piece to be brought into contact with a solder ball S of an IC package 400, and a contact portion 304 projecting from the lower end portion of the body 302 in a direction opposite to that of the contact piece 303.
  • a socket shown in FIG. 16 is known.
  • a contact 310 formed substantially into a U-shape is press-fit and fixed to the socket body 311, and the portion of upright piece 313 except for a fixture region 312 can be elastically deformed.
  • the contact portions 314 are brought into contact with the solder ball 315, the upright pieces 313 are elastically deformed so as to avoid damaging the solder ball 315.
  • a height (thickness) of the socket can also be reduced.
  • An object of the present invention is to provide a technique for a socket and a contact of a semiconductor package, which may reduce self-inductance and enables high-density arrangement by reducing a height of the socket, and which also takes into consideration the contact reliability of a contact portion.
  • a socket of a semiconductor package according to the present invention is provided with a plurality of contacts for contacting with a plurality of solder balls arranged on one side of the semiconductor package, and a socket body in which a plurality of mounting holes are provided for mounting the respective contacts.
  • Each of the mounting holes is provided with a through-hole pierced in a height direction of the socket body and a contact support hole.
  • Each contact is provided with an upright piece extending through the through- hole and a support piece extending from the upright piece to be inserted into the through-hole.
  • a contact portion for contacting with the solder ball is formed at a tip end portion of the upright piece, and the support piece extends from a proximal end portion of the upright piece.
  • the mounting hole of the contact is provided with the through-hole and the support hole, and the contact is provided with the upright piece extending along the through-hole and the support piece extending from the upright piece to be inserted into the support hole. Accordingly, the upright piece is supported to the support piece so that it may be elastically deformed. As a result, it is possible to effectively utilize the full length of the upright piece as a portion that may be elastically deformed. Thus, it is possible to reduce the self-inductance by the further reduction in height of the socket. Also, since the upright piece extends along the through-hole, it is possible to realize high-density arrangement in comparison with the case where the contacts are arranged in a horizontal manner.
  • the through-hole is set to a size such that the upright piece may be shifted within its interior.
  • the upright piece can be shifted within the interior of the through-hole, it allows freedom as to, rather than restricts, the movement of the upright piece as a whole to thereby enhance the independency of the upright piece.
  • it is possible to form the contact that is durable by using the length of the effective spring portion as the full length of the upright piece.
  • a pull-off preventing projection for preventing pull-off of the support piece is provided between the support hole and the support piece.
  • the socket body is formed into a planar shape, the contact portion of each contact is arranged on its surface side, the proximal end portion of each contact is arranged on the back surface side and each proximal end portion projects from the back surface.
  • the proximal end of each contact projects from the back surface of the socket body, it is possible to directly utilize the proximal end portion as a terminal.
  • the socket is arranged on the circuit substrate and the proximal end portion of each contact is brought into contact with the terminal provided on the surface of the circuit substrate.
  • the proximal end portion of each contact is brought into contact with the terminal provided on the surface of the circuit substrate.
  • a recess portion having a uniform depth is provided on the top surface side of the socket body and at least the contact portion of each contact is exposed within the recess portion.
  • the recess portion is provided on the top surface side of the socket body so that the contact portion of each contact is exposed to thereby impart a large degree of freedom to the movement of each contact portion. As a result, it is possible to design a size of the through-hole to be smaller.
  • a first curved portion that is curved in a U-shape and an inverted U-shaped second curved portion that is continuous with the first curved portion are formed between the upright piece and the support piece of the contact.
  • the first curved portion exhibits the effect of making the upright piece elastically deformable and the second curved portion exhibits the effect of making the support piece and the upright piece substantially in parallel with each other.
  • the above-described second curved portion is located in the vicinity of a substantially central portion of a length of the upright piece.
  • the second curved portion is located in the vicinity of the substantially central portion of the length of the upright piece whereby it is possible to take a compact structure of the support piece including the first and second curved portions.
  • contact portions of a pair of contacts are mounted to face each other in the mounting hole. With such an arrangement of the contacts, it is possible to bring the contacts into contact with the solder ball at two points to enhance the contact reliability.
  • a contact according to the present invention for being mounted on a socket body for contacting with a plurality of solder ball arranged on one surface of a semiconductor package is provided with an upright piece formed by machining a conductive metal plate and formed with contact portions relative to solder balls at a free end portion, and a support piece extending from a proximal end side of the upright piece so that the upright piece is supported to the socket body.
  • a contact according to the present invention is provided with the upright piece and the support piece. The support piece extends from the proximal end side of the upright piece. Accordingly, the upright piece is supported to the support piece to be elastically deformable.
  • a first curved portion that is curved in a U-shape and an inverted U-shaped second curved portion that is continuous with the first curved portion are formed between the upright piece and the support piece of the contact.
  • the first curved portion exhibits the effect of making the upright piece elastically deformable and the second curved portion exhibits the effect of making the support piece and the upright piece substantially in parallel with each other.
  • a pull-off preventing projection for preventing pull-off from the socket body is provided in the support piece.
  • the pull-off preventing projection it is possible to positively fix the support piece to the socket body, and it is easy to mount the support piece to the socket body, thus also contributing to the ease of manufacturing.
  • FIG. 1 is a plan view of a test socket of a semiconductor package in accordance with the present invention.
  • FIG. 2 is a cross-sectional view taken along the line X-X of FIG. 1.
  • FIG. 3 is a cross-sectional view taken along the line Y-Y of FIG. 1.
  • FIG. 4 is a partially enlarged view of FIG. 3.
  • FIG. 5 is a view of the contact according to the present invention, in which (a) is a plan view, (b) is a frontal view, and (c) is a right side elevational view.
  • FIG. 6 is a plan view of the socket body in accordance with the present invention.
  • FIG. 7 is a view showing the socket body in accordance with the present invention, in which (a) is a cross-sectional view taken along the line XI -XI of FIG. 7, (b) is a plan view of the mounting hole, and (c) is a partially enlarged view of (a).
  • FIG. 8 is a cross-sectional view taken along the line Yl-Yl of FIG. 7.
  • FIG. 9 is a perspective view of the test socket of the semiconductor package according to the present invention.
  • FIG. 10 is a perspective view of the test socket of the semiconductor package according to the present invention.
  • FIG. 11 is a perspective view of a back surface side of the test socket of the semiconductor package according to the present invention.
  • FIG. 12 is a cross-sectional view illustrating a conventional test socket.
  • FIG. 13 is a frontal view of a contact to be mounted on the conventional test socket.
  • FIG. 14 a side elevational view of the contact to be mounted on the conventional test socket.
  • FIG. 15 is a view illustrating the contact to be mounted on the conventional test socket.
  • FIG. 16 is a partially enlarged cross-sectional view of the conventional test socket.
  • FIG. 1 is a plan view of a socket (test socket) of a semiconductor package in accordance with the embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line X-X of FIG. 1.
  • FIG. 3 is a cross-sectional view taken along the line Y-Y of FIG. 1.
  • FIG. 4 is a partially enlarged view of FIG. 3.
  • FIG.5 is a view illustrating a contact
  • FIG. 6 is a plan view of the socket.
  • the test socket TS shown in these drawings is a BGA (Ball Grid Array) testing and evaluating socket of a semiconductor package 1 having a plurality of solder balls S arranged in an array on its one surface (bottom surface) side.
  • BGA All Grid Array
  • This test socket TS is provided with a plurality of contacts 10 arranged in an array, in a manner corresponding to the arrangement of the solder balls S of the semiconductor package 1, and a socket body (housing) 15 provided with a plurality of mounting holes 11 to which the respective contacts 10 are mounted.
  • the mounting holes 11 are provided with through-holes 12 pierced in a height direction of the socket body 15 and support holes 13 for the contacts 10.
  • each contact 10 is provided with an upright piece 101 extending along the through-hole 12 and a support piece 102 extending from the upright piece 101 to be inserted into the support hole 13.
  • a contact portion 103 to be in contact with the solder ball S is formed at a free end (an upper end portion) of the upright piece 101.
  • the support piece 102 extends from a proximal end (a lower end portion) of the upright piece 101.
  • the shape of the through-hole 12 is formed to be sufficiently larger than the cross-sectional shape of the upright piece 12.
  • the upright piece 101 is adapted to be readily shifted within the interior of the through-hole 12, thereby allowing freedom as to, rather than restricting, the movement of the upright piece 101 as a whole in order to enhance the independency of each upright piece 101.
  • the elasticity of the spring is increased whereby, upon contact with the solder ball S, the load on the solder ball S is reduced and at the same time, it is possible to cope with the non-uniformity in heights of the solder balls in the thickness direction (height direction) of the socket body 15.
  • the socket body 15 is formed into a planar shape of synthetic resin having insulating properties.
  • the contact portion 103 of each contact 10 is arranged on the side of the surface 15a thereof (see FIGS. 9 and 10).
  • the proximal end portion 104 of the contact 10 is arranged on the side of the back surface 15b (see FIG. 11). Each proximal end portion 104 projects from the back surface 15b.
  • the proximal end portion 104 of the contact 10 is caused to project from the back surface 15b of the socket body 15 to thereby enable direct use of the proximal end portion 104 as a terminal.
  • the test socket TS is arranged on the circuit substrate 20 so that the proximal end portion 104 of each contact 10 is brought into contact with the terminal 21 provided on the surface of the circuit substrate 20.
  • a recess portion 16 having a uniform depth is provided on the side surface 15a of the socket body 15, and at least the contact portion 103 of each contact 10 is exposed in the recess portion 16.
  • the recess portion 16 is provided on the side of the surface 15a of the socket body 15 to thereby expose the contact portion 103 of each contact 10 and to make it possible to impart a greater degree of freedom as to the movement of each contact portion 103. As a result, it is possible to make the through-hole smaller.
  • a first curved portion 106 that is curved into a U-shape and a second curved portion 107 having an inverted U-shape which is continuous the first curved portion 106 are formed between the upright piece 101 and the support piece 102 of the contact 10.
  • the first curved portion 106 is adapted to enable elastic deformation of the upright piece 101
  • the second curved portion 107 is adapted to make the support piece 102 substantially in parallel with the upright piece 101.
  • the manner in which the upright piece 101 is elastically deformed includes a case where, for example, the contact portion 103 is shifted in the horizontal or vertical direction in the case where the upright piece 101 itself is curved.
  • the second curved portion 107 is located in the vicinity of the substantially central portion of a length of the upright piece 101.
  • the second curved portion 107 is located in the vicinity of the substantially central portion of the length of the upright piece 101 whereby it is possible to take a compact structure of the support piece 102 including the first and second curved portions 106 and 107.
  • the mounting hole 11 is provided with convex portions 13b projecting from the inner wall of the mounting hole 11.
  • the convex portion 13b is fitted in the second curved portion 107 of the contact 10.
  • the support piece 102 may be positively positioned and fixed to the socket body 15.
  • the contact portions 103 of a pair of contacts 10 are mounted to face each other in the mounting hole 11.
  • the side walls of the contacts 10 are arranged to face each other in partial area contact with each other. Accordingly, both contacts 10 are electrically connected to each other through the area contact portion and at the same time, the contact portions 103 of the pair of contacts 10 are arranged to face each other to be offset in the right and left directions by a thickness of the contacts 10. Also, as clearly shown in FIG. 4, an interval is formed between the facing contact portions 103. Furthermore, a slant surface is formed in each contact portion 103.
  • the solder ball S is spherical, when the pair of facing contact portions 103 are brought into contact with the solder ball S, the contact portions exhibit the effect of separating from each other due to the elasticity of the respective upright pieces 101. Thus, the contacts are brought into contact with the solder ball S at two points to enhance the reliability of contact.
  • the explanation has been given to the single contact 10.
  • the structure in which the contacts 10 are arranged to face each other as a pair is used as a single contact.
  • This point is clearly shown in FIG. 3. Namely, the proximal end portions 104 of the two contacts 10 facing each other are in contact with the single terminal 21 provided on the surface of the circuit substrate 20.
  • the same contacts are used in these contacts 10. Accordingly, a structure using only a single kind of contact is attained.
  • each mounting hole 11 is important. Namely, two through-holes 12 including the common hole 2 portions in the middle, the two support holes 13, the two engagement portions 13a and the two convex portions 13b are formed in the single mounting hole 11 of the socket body 15.
  • the engagement portion 13a is a portion with which the pull-off preventing projection 105 of the contact 10 is engaged.
  • the engagement portion 13a is provided in the vicinity of the lower portion of the support hole 13.
  • the support piece 102 is inserted from above into the support hole 13 to thereby engage the pull-off preventing projection 105 with the engagement portion 13a, and at the same time, the convex portion 13b is fitted in the inside of the second curved portion 107.
  • each contact 10 Under the condition in which the pair of contacts 10 is mounted within the mounting hole 11, parts of the side walls of the contacts 10 are brought into area contact with each other at the portion of the central common hole 2 to be electrically connected to form a single contact (terminal), hi this case, the proximal end portion 104 of each contact 10 is caused to somewhat project from the back surface 15b of the socket body 15 to form a contact portion to the terminal 21 of the circuit substrate 20.
  • each contact 10 since each contact 10 is not press fit into the through hole 11 of the socket body (housing) and is mounted in a simple fitting condition, each contact may be somewhat shifted up and down. Thus, it is possible to absorb the non-uniformity in the positions of the proximal end portions (tails) 104 that form the contact portions with the circuit substrate 20.
  • FIGS. 8, 9 and 10 are perspective views of the test socket TS under the condition in which the contacts 10 are mounted to all the mounting holes 11 of the socket body 15. Out of these, FIGS. 9 and 10 are perspective views seen from positions shifted by 90 degrees from each other for ease of understanding, and the Fig 11 is a perspective view showing the back surface side.
  • the present invention is not limited to the BGA type test socket as in the foregoing embodiments but maybe applied to any of the sockets of the semiconductor package such as the sockets of CSP (Chip Size Package).
  • the mounting hole of the contact is provided with the through-hole and the support hole, and the contact is provided with the upright piece extending along the through- hole and the support piece extending from the upright piece to be inserted into the support hole. Accordingly, the upright piece is supported to the support piece so that it may be elastically deformed. As a result, it is possible to effectively utilize the full length of the upright piece as a portion that may be elastically deformed. Thus, it is possible to attain the reduction of the self-inductance by the further reduction in height of the socket.
  • the upright piece takes a form such that it extends along the through-hole, it is possible to realize high-density arrangement in comparison with the case where the contacts are arranged in a horizontal manner. Also, due to such configuration that the effective spring portion of the contact is elongated, the contact is contacted with the solder ball at two points, and the contact is not press-fitted but mounted to the socket body and so on, it is also possible to enhance the contact reliability of the contact portion.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

Support connecteur doté d'une pluralité de contacts pour l'établissement du contact avec une pluralité de billes de soudure disposées sur l'une des surfaces d'un boîtier à semi-conducteur, et corps de support doté d'une pluralité de trous de montage destinés au montage de contacts respectifs. Chaque trou de montage est doté d'un trou traversant percé dans le sens de la hauteur du corps de support et d'un trou de support du contact. Chaque contact possède une partie montant qui s'étend dans le trou traversant et une partie de support qui s'étend à partir de la partie montant et qui est destinée à être introduite dans le trou de support. Une partie de contact destinée à l'établissement du contact avec la bille de soudure est formée au niveau de l'extrémité en pointe de la partie montant. La partie de support s'étend à partir de l'extrémité proximale de la partie montant.
PCT/US2002/031442 2001-10-03 2002-10-02 Support et contacts pour boitier a semi-conducteur WO2003030604A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/488,715 US7021944B2 (en) 2001-10-03 2002-10-02 Socket and contact of semiconductor package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-307468 2001-10-03
JP2001307468A JP2003123923A (ja) 2001-10-03 2001-10-03 半導体パッケージのソケット、及びコンタクト

Publications (1)

Publication Number Publication Date
WO2003030604A1 true WO2003030604A1 (fr) 2003-04-10

Family

ID=19126926

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/031442 WO2003030604A1 (fr) 2001-10-03 2002-10-02 Support et contacts pour boitier a semi-conducteur

Country Status (4)

Country Link
JP (1) JP2003123923A (fr)
CN (1) CN1244263C (fr)
TW (1) TW560761U (fr)
WO (1) WO2003030604A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1650837A1 (fr) * 2003-07-29 2006-04-26 Advantest Corporation Douille et dispositif de test
WO2008002619A2 (fr) * 2006-06-27 2008-01-03 Molex Incorporated Connecteur à support à boule de soudure
US7887355B2 (en) 2008-11-13 2011-02-15 Yamaichi Electronics Co., Ltd. Semiconductor device socket

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005063868A (ja) * 2003-08-18 2005-03-10 Yamaichi Electronics Co Ltd 半導体装置用ソケット
JP4911495B2 (ja) 2006-05-15 2012-04-04 ルネサスエレクトロニクス株式会社 半導体集積回路用ソケット
JP6483079B2 (ja) * 2016-12-13 2019-03-13 本田技研工業株式会社 電気導体の接合方法
CN110311241A (zh) * 2019-06-24 2019-10-08 番禺得意精密电子工业有限公司 电连接器
JPWO2022158032A1 (fr) * 2021-01-19 2022-07-28

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Publication number Priority date Publication date Assignee Title
GB1488328A (en) * 1975-05-30 1977-10-12 Amp Inc Electrical connector
US5152694A (en) * 1990-11-12 1992-10-06 Souriau Et Cie Intermediate connector between printed-circuit board and substrate having active electronic circuits
EP0817319A2 (fr) * 1996-07-02 1998-01-07 Johnstech International Corporation Système de contact pour interconnexion électrique
US5913700A (en) * 1997-07-14 1999-06-22 The Whitaker Corporation Card edge connector having low inductance contact system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1488328A (en) * 1975-05-30 1977-10-12 Amp Inc Electrical connector
US5152694A (en) * 1990-11-12 1992-10-06 Souriau Et Cie Intermediate connector between printed-circuit board and substrate having active electronic circuits
EP0817319A2 (fr) * 1996-07-02 1998-01-07 Johnstech International Corporation Système de contact pour interconnexion électrique
US5913700A (en) * 1997-07-14 1999-06-22 The Whitaker Corporation Card edge connector having low inductance contact system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1650837A1 (fr) * 2003-07-29 2006-04-26 Advantest Corporation Douille et dispositif de test
EP1650837A4 (fr) * 2003-07-29 2007-12-26 Advantest Corp Douille et dispositif de test
WO2008002619A2 (fr) * 2006-06-27 2008-01-03 Molex Incorporated Connecteur à support à boule de soudure
WO2008002619A3 (fr) * 2006-06-27 2008-02-21 Molex Inc Connecteur à support à boule de soudure
US7762820B2 (en) 2006-06-27 2010-07-27 Molex Incorporated Solder ball socket connector
US7887355B2 (en) 2008-11-13 2011-02-15 Yamaichi Electronics Co., Ltd. Semiconductor device socket

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CN1565151A (zh) 2005-01-12
JP2003123923A (ja) 2003-04-25
TW560761U (en) 2003-11-01
CN1244263C (zh) 2006-03-01

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