WO2003026856A1

WO2003026856A1 - Production method of laminated ceramic electronic component and electronic apparatus

Info

Publication number: WO2003026856A1
Application number: PCT/JP2002/008795
Authority: WO
Inventors: Muneyuki Sawada; Hidenori Katsumura
Original assignee: Matsushita Electric Industrial Co., Ltd.
Priority date: 2001-09-20
Filing date: 2002-08-30
Publication date: 2003-04-03
Also published as: JP4211606B2; JPWO2003026856A1

Abstract

A laminate is produced by alternately laminating first ceramic sheets and conductor patterns, and integrating them with the lower surfaces clamped by second ceramic sheets. The laminate is provided with conductor patterns between at least either first ceramic sheets or second ceramic sheets. Next, splitting grooves Y-shaped in cross section are formed in desired positions of the laminate so as to cover the inner periphery of an upper end with a second ceramic sheet, then the resultant laminate is fired. Second ceramic sheets are removed and the laminate is split at grooves. Electronic components formed from respective split laminate elements are chamfered into curved shapes at the ends thereof for excellent impact resistance.

Description

Description Manufacturing method of multilayer ceramic electronic component and electronic equipment

The present invention relates to a method for manufacturing a multilayer ceramic electronic component having excellent planar accuracy for mounting chip components, semiconductors, and the like, and an electronic device using the electronic component. Background art

A conventional method for manufacturing a multilayer ceramic electronic component will be described. First, an organic binder and a plasticizer are mixed with glass ceramic powder to obtain a first ceramic sheet. Next, a conductor pattern is formed on the surface of the first ceramic sheet, and the first ceramic sheet is laminated. Thereafter, a second ceramic sheet that is not sintered at the firing temperature of the first ceramic sheet is laminated above and below the first ceramic sheet to obtain a laminate. Next, after a slit is formed in the first ceramic sheet on the surface of the laminate, the laminate is fired at the firing temperature of the first ceramic sheet, and the unsintered second ceramic sheet is removed. Next, the laminate is divided by slits, and a multilayer ceramic electronic component is obtained.

The multilayer ceramic electronic component is mounted on a circuit board having an electrode pattern on the surface, and an electronic device is manufactured.

In the multilayer ceramic electronic component, since the second ceramic sheet is not sintered and hardly shrinks during firing, the first ceramic sheet that shrinks by sintering is restrained. Therefore, shrinkage of the first ceramic sheet can be suppressed, and a multilayer ceramic electronic component having excellent planar accuracy can be obtained with high productivity.

However, according to the above method, the end of the multilayer ceramic electronic component has an acute angle. Therefore, if the circuit board is bent when the electronic component is mounted on the circuit board, the end of the circuit board comes into contact with the circuit board, causing the multilayer ceramic electronic component to crack or chip. Occurs and the characteristics deteriorate. Disclosure of the invention

The first ceramic sheet is sandwiched between second ceramic sheets having a higher sintering temperature than the first ceramic sheet to obtain a laminate. A groove leading to the first ceramic sheet is formed in the laminate such that the second ceramic sheet covers the upper end of the groove of the first ceramic sheet. The laminate is fired at a temperature at which the first ceramic sheet sinters and the second ceramic sheet does not sinter. The second ceramic sheet is removed, and the laminate is divided by the grooves, thereby producing a multilayer ceramic electronic component.

By this method, a multilayer ceramic electronic component having excellent impact resistance while ensuring planarity is manufactured. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an enlarged sectional view of a main part of a multilayer ceramic electronic component according to Embodiment 1 of the present invention.

FIG. 2 is an enlarged sectional view of a main part of the multilayer ceramic electronic component according to the first embodiment. FIG. 3 is an enlarged sectional view of a main part of the multilayer ceramic electronic component according to the first embodiment. FIG. 4 is an enlarged sectional view of a main part of the multilayer ceramic electronic component according to the first embodiment. FIG. 5 is a cross-sectional view of the multilayer ceramic electronic component according to Embodiments 1 and 2 of the present invention.

FIG. 6 is a side view of the electronic device according to the first and second embodiments.

FIG. 7 is an enlarged sectional view of a main part of a multilayer ceramic electronic component according to Embodiment 3 of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1) 1 to 4 are enlarged cross-sectional views of a principal part for describing a manufacturing process of the multilayer ceramic electronic component according to the first embodiment of the present invention, and FIG. First ceramic sheet Ichito 1 1 _{_{A 1 2 0 3, C a}} O - prepared using a S i 0 ₂ based glass or the like - B a O. The second ceramic sheet 1 2 first Seramitsukushi - has a higher sintering temperature than the sintering temperature of the sheet 1 1 is manufactured using the A 1 ₂ 0 _3. The conductor pattern 13 is formed using Ag or Ag_Pt. The laminate is provided with a slit-shaped groove 14a and a V-shaped groove 14b.

FIG. 6 is a side view of the electronic device according to the first embodiment. The multilayer ceramic electronic component 60 shown in FIG. 5 is mounted on a circuit board 64 having an electrode pattern 63 on the surface. Hereinafter, a method for manufacturing the multilayer ceramic electronic component in the first embodiment will be described.

First, the first ceramic sheets 11 and the conductor patterns 13 are alternately laminated, and the upper and lower surfaces are sandwiched between the second ceramic sheets 12 to produce an integrated laminate. A conductor pattern 13 exists between at least one of the first ceramic sheet 11 and the second ceramic sheet 12.

Next, as shown in FIG. 1, a slit-like groove 14a reaching the first ceramic sheet 11 with a cutter blade or the like is formed at a predetermined position on the surface of the laminate, and subsequently, as shown in FIG. The groove 14b is formed by pushing and opening the groove 14a with a mold having a V-shaped cross section. At this time, the tip of the mold reaches the first ceramic sheet 11. After the formation of the grooves 14a and 14b, the second ceramic sheet 12 covers the upper part of the inside of the groove 14a of the first ceramic sheet 11. Then, the upper end of the portion forming the groove 14a of the first ceramic sheet 11 is chamfered in a curved shape.

Similar grooves 14a and 14b are provided on the back surface of the laminate so as to face the grooves. Thereafter, the laminate is pressed, and the groove 14b is reduced as shown in FIG.

Then, in this state, the laminated body is fired so that the first ceramic sheet 11 and the conductor pattern 13 are sintered, and the second ceramic sheet 12 is not sintered. Is done. At this time, the second ceramic sheet 12 hardly shrinks because it is not sintered. Accordingly, shrinkage of the first ceramic sheet 11 to be sintered is suppressed, and a sintered body having excellent planar accuracy can be obtained. The groove 14b of the first ceramic sheet 11 contracts because it has a greater degree of freedom than the other parts, and the groove 14b becomes larger again as shown in FIG.

Next, only the second ceramic sheet 12 is removed. Since the second ceramic sheet 12 is not sintered, it can be easily removed.

Next, the IC 61 and the capacitor 62 are connected to the conductor pattern 13 on the surface having the conductor pattern 13, the laminate is divided by the grooves 14 a and 14 b, and the laminate shown in FIG. 5 is formed. A ceramic electronic component 60 is obtained.

The multilayer ceramic electronic component 60 is not only excellent in flatness accuracy but also has excellent strength against impact since the end portion is chamfered in a curved shape.

By mounting the multilayer ceramic electronic component 60 on a circuit board 64 having a surface φ electrode pattern 63 as shown in FIG. 6, various electronic devices such as mobile phones are manufactured.

For example, when a shock is applied to the electronic device and the circuit board 64 is bent, the laminated ceramic electronic component 60 is chamfered in a curved shape at its end. 4 can prevent damage.

Note that the grooves 14a and 14b may be formed by another method. A mold having a V-shaped cross section is pressed against a predetermined position on the surface of the laminate to form a groove having a V-shaped cross section. At this time, the tip of the mold reaches the first ceramic sheet 11 and the second ceramic sheet 12 covers the inside of the groove of the first ceramic sheet 11. The upper end of the groove forming portion of the first ceramic sheet 11 is chamfered in a curved shape. Next, a slit-like groove is provided with a knife or the like so as to further deepen the groove. The conductor pattern 13 may be a circuit pattern such as a resistor pattern including the conductor pattern. (Embodiment 2)

First, the laminate formed in the same manner as in the first embodiment is fired in the same manner as in the first embodiment after the grooves 14a and 14b are formed. However, the conductor pattern 13 is not formed between the first ceramic sheet 11 and the second ceramic sheet 12. Next, after the second ceramic sheet 12 is removed, a metal paste is applied to the surface of the sintered body and is baked to form the conductor pattern 13. Thereafter, electronic components such as ICs and capacitors are mounted on the conductor pattern 13. Thereafter, the multilayer body is divided by the grooves 14a and 14b, and a multilayer ceramic electronic component 60 is obtained. Then, the electronic component 60 is mounted on a circuit board, and an electronic device is manufactured. In the second embodiment, similarly to the first embodiment, the obtained multilayer ceramic electronic component not only has excellent flatness accuracy, but also has a strength that is strong against impact because it has a chamfered end portion. . Further, even if bending occurs after mounting on the circuit board, the end of the laminated ceramic electronic component 60 is chamfered into a curved shape, so that damage can be prevented even if the laminated ceramic electronic component 60 comes into contact with the circuit board 64.

The second embodiment differs from the first embodiment only in that conductor pattern 13 on the surface of multilayer ceramic electronic component 60 is formed before or after firing the laminate. In the case where a heat treatment step is included in the formation of the conductor pattern 13 on the front surface, the first embodiment requires only one heat treatment step, and therefore has higher productivity than the second embodiment. (Embodiment 3)

FIG. 7 is an enlarged cross-sectional view of a main part for describing a manufacturing process of the multilayer ceramic electronic component in the third embodiment. The same components as those in the first and second embodiments are denoted by the same reference numerals and description thereof is omitted.

First, similarly to the first embodiment, the first ceramic sheet 11 and the conductor pattern 13 are alternately laminated, and a laminated body in which the upper and lower surfaces are sandwiched by the second ceramic sheet 12 is produced, and the groove 14 a , 14b are provided on the front and back sides.

Next, as shown in Fig. 7, cover the grooves 14a and 14b on the upper and lower surfaces of this laminate. Then, a third ceramic sheet 15 having the same material as that of the second ceramic sheet 12 is pressed. At this time, since the laminate is pressed from the outer periphery, the groove 14a is smaller than when it is first formed as in the first embodiment.

Thereafter, the laminate is fired so that the first ceramic sheet 11 and the conductor pattern 13 are sintered and the second and third ceramic sheets 12 and 15 are not sintered. . As a result, as in the first embodiment, the groove 14a becomes larger again.

Next, the second and third ceramic sheets 12 and 15 are removed, electronic components such as ICs and capacitors are mounted on the surface of the laminate, and the laminate is divided by the grooves 14a and 14b. Thus, a multilayer ceramic electronic component as shown in FIG. 5 is obtained.

In the third embodiment, the upper and lower surfaces of the laminate are pressure-bonded with the third ceramic sheet 15 after forming the grooves 14a and 14b with chamfered ends. Thereby, shrinkage of first ceramic sheet 11 at the time of firing can be suppressed, so that a multilayer ceramic electronic component having better planar accuracy than that of the first embodiment can be obtained. In the third embodiment, the conductor pattern on the surface of the multilayer ceramic electronic component may be formed before firing as in the first embodiment, or after firing as in the second embodiment.

In the first to third embodiments, the groove 14 a is provided so that the second ceramic sheet 12 covers the end of the first ceramic sheet 11, so that the multilayer ceramic electronic component can be manufactured. The end can be rounded.

Further, in the case of a conventional multilayer ceramic electronic component, it is necessary to polish after firing in order to chamfer the end portion into a curved shape. If the electronic component has a conductive pattern 13 on the surface, the conductive pattern 13 may be damaged by polishing, so the end cannot be curved. If this electronic component is mounted on a circuit board, When bending occurs, the edge contacts the circuit board and the multilayer ceramic electronic component may be damaged. In the case of an electronic component having a resistor pattern instead of the conductor pattern 13, the characteristics are deteriorated due to damage.

The V-shaped groove 14a and the slit-shaped groove 14b have a Y-shaped cross-section for the dividing groove. Is longer. this Accordingly, the laminate can be easily divided after firing while suppressing shrinkage of the first ceramic sheet 11.

In Embodiments 1 to 3, these grooves are provided on the front and back surfaces of the laminate. However, if the grooves are provided on only one of the surfaces, the laminate can be easily divided after firing. The groove is preferably formed on a surface facing the substrate when the multilayer body is mounted on the circuit substrate, and preferably prevents the electronic component from being damaged by bending.

Further, the second ceramic sheet 12 suppresses shrinkage of the first ceramic sheet 11 during firing in order to obtain a multilayer ceramic electronic component having excellent planar accuracy. If the dividing grooves are provided in both the first and second ceramic sheets 11 and 12, the degree of freedom of the first ceramic sheet 11 increases accordingly. As a result, the first ceramic sheet 11 tends to shrink in the direction of increasing the groove, and the shape accuracy of the laminated ceramic electronic component may be degraded. After the grooves for division are provided, the laminate is pressed to compress the grooves 14a, and the grooves 14a are apparently reduced. Thereby, even if the first ceramic sheet shrinks during firing, the groove 14a is compressed in advance, so that a sintered laminate having an original state, that is, a desired shape can be obtained. Industrial applicability

According to the present invention, a groove is formed on a surface of a laminate having a first ceramic sheet and a second ceramic sheet having a higher sintering temperature than the first ceramic sheet and sandwiching the first ceramic sheet so as to reach the first ceramic sheet. Is formed. This makes it possible to obtain a multilayer ceramic electronic component having excellent impact resistance, the edges of which are chamfered in a curved shape.

Claims

The scope of the claims

1. sandwiching the first ceramic sheet with a second ceramic sheet having a higher sintering temperature than the first ceramic sheet to obtain a laminate;

Forming a groove on the first surface of the laminate to reach the first ceramic sheet, so that the second ceramic sheet covers an upper end of the groove of the first ceramic sheet; ,

Baking the laminate at a temperature at which the first ceramic sheet is sintered and the second ceramic sheet is not sintered;

Removing the second ceramic sheet;

Dividing the laminate by the grooves;

A method for manufacturing a multilayer ceramic electronic component, comprising:

2. The method according to claim 1, further comprising forming a circuit pattern on the first ceramic sheet.

3. The method of claim 1, further comprising forming a circuit pattern on the fired laminate.

4. The method according to claim 1, further comprising: laminating a third ceramic sheet on a surface of the laminate having the groove.

5. The method of claim 1, wherein the upper end of the fired laminate is chamfered.

6. The method according to claim 1, wherein the groove has a Y-shaped cross section.

7. The step of forming the groove, A step of cutting the laminate with a blade,

Pressing a V-shaped mold against the laminate,

The method according to claim 1.

8. The method according to claim 7, wherein the step of pressing the V-shaped mold includes the step of causing the V-shaped mold to reach the first ceramic sheet.

9. The method of claim 7, wherein pressing the V-shaped mold comprises pressing the V-shaped mold shallower than the cut.

10. The method according to claim 1, further comprising the step of forming another groove on a second surface of the laminate opposite to the first surface.

11. The method according to claim 1, further comprising a step of pressing the laminate having the groove before the step of firing the laminate.

1 2. A circuit board having an electrode pattern on its surface;

A multilayer ceramic electronic device having a chamfered end facing the circuit board and having at least one of an electronic component and a circuit pattern on a surface, mounted on the circuit board and connected to the electrode pattern; Parts and

Electronic equipment with.