JPH05299294A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To enable a stator of ceramic dielectric body to be manufactured through the same method as a conventional laminated ceramic capacitor, where a stator electrode is provided inside the stator and a recess is provided on the underside of the stator. CONSTITUTION:A stator electrode 6 is formed inside a ceramic laminate 17, where burnable films 15 and 16 formed of carbon or resin which is burnt off by burning are formed in layers inside the ceramic laminate 17 at a spot correspondent to a recess 10. The ceramic laminate 17 is burned, whereby the burnable films 15 and 16 are burnt off, consequently a sintered body 18 where cavities 19 and 20 and thin layers 21 and 22 are formed can be obtained, and the sintered body 18 is barrel-polished, whereby this layers 21 and 22 are broken, and the recess 10 is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing electronic parts, and more particularly to a method for manufacturing electronic parts using a ceramic laminate.

[0002]

2. Description of the Related Art For example, a variable capacitor used as a trimmer capacitor typically includes a stator electrode and a rotor electrode rotated relative to the stator electrode, and a dielectric is arranged between the stator electrode and the rotor electrode. To be done. This dielectric is provided, for example, by a ceramic dielectric.

In such a variable capacitor, in order to widen the capacity adjustment range, it is necessary to increase the maximum capacity that can be acquired. As one means for increasing the maximum capacity, the thickness of the dielectric disposed between the stator electrode and the rotor electrode has been reduced. However, when a ceramic dielectric is used as the dielectric, its mechanical strength is relatively low, and therefore its thickness cannot be made too thin.

In order to solve this problem, either the stator electrode or the rotor electrode is formed inside the ceramic dielectric. This makes the ceramic dielectric thicker and increases the mechanical strength,
It is intended to obtain a large maximum capacity by making the stator electrode and the rotor electrode face each other through a part of the ceramic dielectric and reducing the distance between the stator electrode and the rotor electrode.

As described above, among the variable capacitors in which the stator electrode or the rotor electrode is formed inside the ceramic dielectric material, the one in which the stator electrode is formed inside the ceramic dielectric material is, for example, JP-B-63-522.
No. 3 publication. In this variable capacitor, the ceramic dielectric in which the stator electrode is formed as described above constitutes the stator which is one of the basic elements of this variable capacitor as it is, and the stator electrode is formed on the surface of this stator. A terminal electrically connected to is formed of a conductive film.

Further, a concave portion is formed on the lower surface of the stator made of a ceramic dielectric, and an engaging piece provided on a cover for rotatably accommodating a rotor forming a rotor electrode is engaged on the concave portion. It is designed to meet. Therefore, the engaging piece does not protrude from the lower surface of the stator, and the variable capacitor can be surface-mounted on the printed circuit board without any problem.

[0007]

As described above, a stator composed of a ceramic dielectric material having a stator electrode formed therein can basically be manufactured by using a manufacturing technique of a monolithic ceramic capacitor. However, due to the presence of the recesses that do not have to be formed in the monolithic ceramic capacitor, the manufacturing technique of the monolithic ceramic capacitor cannot be simply adopted. Although the above-mentioned publication does not describe a method for obtaining such a stator, for example, a shape to be a recess is given in advance at a stage before firing a ceramic dielectric to be a stator, and then, A method of firing can be considered. However, it is expected that this method requires a special process for forming the concave portion, requires special molds and equipment, and increases the cost of the stator.

The problem of the conventional manufacturing method has been described above by taking the variable capacitor as an example. However, such a problem is not limited to the variable capacitor, but may be a recess such as a through capacitor, a capacitor network, a high voltage capacitor, a semiconductor package, It can also be encountered when manufacturing an electronic component using the ceramic laminate in which the slab is formed. Moreover, if the shape of the recess is complicated, this problem becomes more remarkable.

Therefore, an object of the present invention is, in a method of manufacturing an electronic component using a ceramic laminated body such as a variable capacitor, a ceramic laminated body in which a concave portion is formed is substantially equivalent to a general laminated ceramic capacitor. It is an object of the present invention to provide an improved method for manufacturing by a similar method.

[0010]

SUMMARY OF THE INVENTION The present invention is directed to a method of manufacturing an electronic component using a ceramic laminate having a recess.

The present invention is characterized by including the following steps in order to solve the above-mentioned technical problems. That is, in the first step, a ceramic laminate is prepared in which a plurality of burn-out films made of a material that can be burnt out by firing are formed in layers at positions corresponding to the positions of the recesses. Then in the second step,
The ceramic laminate is fired to burn off the burn-out film, and as a result, a plurality of cavities are formed in layers and a plurality of thin layers are formed through the plurality of cavities.
A sintered body is obtained. Then in the third step,
The thin layer of the sintered body is ground, so that the recess is formed.

[0012]

In the present invention, the ceramic laminated body can be obtained by a method substantially similar to that of the ceramic laminated body prepared for manufacturing a general laminated ceramic capacitor. That is, the burnout film can be formed by printing or the like as in the formation of the internal electrodes in the laminated ceramic capacitor. Further, the pressing process for obtaining the tightly laminated state of the ceramic laminated body can be applied similarly to the case of the laminated ceramic capacitor.

The firing of the ceramic laminated body for obtaining the sintered body can be performed in the same manner as the firing applied to the laminated ceramic capacitor.

As for the method of crushing the thin layer to form the recesses, the crushing methods such as barrel polishing and blasting, which are applied in the manufacture of laminated ceramic capacitors, can be applied as they are.

[0015]

Therefore, according to the present invention, it is possible to manufacture an electronic component using a ceramic laminated body in which a recess is formed by using the already established general manufacturing technique for a laminated ceramic capacitor. You can Therefore, a special process for forming the concave portion and a special mold or equipment are unnecessary, so that such an electronic component can be provided at low cost.

Further, according to the present invention, even if the cross-section of the concave portion formed in the ceramic laminate has a curved shape which is difficult to form by the conventional punching, it can be formed extremely easily. You can

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing an electronic component according to the present invention,
Hereinafter, the manufacturing method of the variable capacitor as an example,
Detailed description. 1 and 2 show a stator manufacturing method included in the variable capacitor manufacturing method according to this embodiment. Before explaining the manufacturing method shown in FIGS. 1 and 2, the structure of the variable capacitor 1 obtained in this embodiment will be described with reference to FIGS.

As shown in FIGS. 3 to 5, the variable capacitor 1 has a stator 2 and a rotor 3 when viewed largely.
And a cover 4. The stator 2 as a whole
Composed of ceramic dielectric. The rotor 3 is made of a metal such as brass. The cover 4 is made of a metal such as stainless steel or a copper alloy, and in order to improve solderability, at least a necessary portion may be surface-treated with solder, tin, silver or the like.

The detailed structure of each element described above will be described below. First, the stator 2 will be described with reference to FIG. The stator 2 has a bilaterally symmetrical structure as a whole. Inside the stator 2, the stator electrode 5
And 6 are formed side by side. Terminals 7 and 8 provided by a conductive film are formed on at least a side surface of stator 2 so as to be electrically connected to these stator electrodes 5 and 6, respectively. Further, recesses 9 and 10 are formed on the lower surface of the stator 2 from its edge toward the inside. In this embodiment, ribs 11 and 12 that slightly project are formed on the lower surface of the stator 2 at the edges where the recesses 9 and 10 are located.

As described above, the two stator electrodes 5 and 6 are provided because the structure of the stator 2 is bilaterally symmetrical, the terminals 7 and 8 are formed, and the variable capacitor 1 using the stator 2 is formed. This is because it is not necessary to consider the direction of the stator 2 in assembling. Therefore, if such an advantage is not desired, either one of the stator electrodes 5 and 6 is unnecessary, and further,
The terminal 7 or 8 connected to this unnecessary stator electrode 5 or 6 may also be omitted.

Next, the rotor 3 will be described with reference to FIG. 7A shows the upper surface of the rotor 3, and FIG. 7B also shows the lower surface of the rotor 3.

The rotor 3 is arranged on the upper surface of the stator 2 described above, and a semicircular rotor electrode 23 is formed on the lower surface by a protruding step portion. Further, a convex portion 24 having a height equal to the height of the rotor electrode 23 is formed on the lower surface of the rotor 3, and the formation of the rotor electrode 23 prevents the rotor 3 from tilting. Rotor 3
A driver groove 25 is formed on the upper surface of the.

Next, the cover 4 will be described with reference to FIG. The cover 4 has a shape that contacts the rotor 3 described above and rotatably accommodates the rotor 3. Further, the lower surface of the cover 4 is an opening 26 covered by the stator 2 described above, and the driver groove 25 described above is formed on the upper surface thereof.
The adjustment hole 27 for exposing the is formed.

The peripheral portion of the adjusting hole 27 has a spring action portion 28.
It is said that. In order to exert a more stable spring action in the spring action portion 28, a plurality of radially extending notches 29 are provided in the peripheral portion of the adjustment hole 27.

At the periphery of the opening 26 on the lower surface of the cover 4,
A square flange 30 is formed, and engaging pieces 31 and 32 are provided so as to extend downward from opposite edges of the flange. The engagement pieces 31 and 32 are
Each of them is bent later in order to engage with the recesses 9 and 10 formed on the lower surface of the stator 2.
In order to facilitate this bending, the engaging pieces 31 and 32 are respectively provided with the engaging pieces 31 and 32 as shown in FIGS. 8B and 8D.
Horizontally elongated holes 33 and 34 are provided.

An engagement piece 31 which is an edge of the flange 30
Terminals 35 are provided so as to extend laterally and downward from one of the edges where neither and 32 are provided.

As described above, the variable capacitor 1 shown in FIGS. 3 to 5 is assembled by using the stator 2, the rotor 3 and the cover 4 which are individually shown in FIGS. 6, 7 and 8. That is, the rotor 3 is placed on the stator 2,
A cover 4 is arranged so as to cover the rotor 3. Then
While pressing the cover 4 toward the stator 2 so that the rotor 3 is pressed against the stator 2, the ends of the engagement pieces 31 and 32 provided on the cover 4 are bent inward. As a result, the engagement pieces 31 and 32 are
Each of them is in a state of being engaged with the recesses 9 and 10 formed on the lower surface of the stator 2. At this time, since the ribs 11 and 12 are provided on the edge portion of the lower surface of the stator 2, the engagement of the above-described engaging pieces 31 and 32 with the stator 2 is maintained more firmly.

The terminals 35 provided on the cover 4 are provided at positions facing the terminals 8 provided on the stator 2. Therefore, the solder 3 is placed between these terminals 35 and 8.
When 6 is added, the state of fixing the cover 4 to the stator 2 becomes stronger.

In this way, the assembly of the variable capacitor 1 is completed. In this assembled state, the rotor 3 is pressed against the stator 2 by the spring action portion 28 formed on the cover 4, and a stable close contact state between the rotor 3 and the stator 2 is obtained. This stabilizes the torque of the rotor 3 and the electrostatic capacitance formed between the stator electrode 5 and the rotor electrode 23.

In addition, the above-mentioned capacitance has a terminal 7 electrically connected to the stator electrode 5 and a terminal 3 provided on the cover 4 that contacts the rotor 3 forming the rotor electrode 23.
5 or with the terminal 8. The cover 4
The terminal 35 may not be provided in the terminal, and the engaging piece 31 or 32 may be used as one terminal.

As shown in FIG. 3 (d), the engaging pieces 31 and 32 are located in the recesses 9 and 10 and do not project from the lower surface of the stator 2. , Can be mounted in a stable state, for example, on a printed circuit board (not shown). In this mounted state, the terminals 7 and 35 or 8 are directly soldered to the conductive lands on the printed circuit board.

As mentioned above, the stator electrodes 5 and 6
Are formed inside and concave portions 9 and 10 are formed on the lower surface.
2 made of a ceramics dielectric, in which
Is manufactured by the following method.

In order to obtain a large number of stators 2 at a time, FIG.
As shown in FIG. 5, a plurality of sheets 14a to 14e including a sheet 14b made of a ceramic dielectric on which the conductive film 13 to be the many stator electrodes 5 and 6 are formed are stacked. Of these, the sheets 14a and 14c include
Although no film is formed, as described above, the conductive film 13 is vertically and horizontally arranged on the sheet 14b by screen-printing Ag-Pd paste, for example. Further, on the sheet 14d, the burnout films 15 are formed in parallel to each other by screen printing in a relatively thin stripe shape. Also, a plurality of sheets 14e
A comparatively thick stripe-shaped burnout film 16 is formed on the upper side by screen printing so as to be arranged in parallel with each other.
The burn-out films 15 and 16 are made of a material that can be burned out by firing, and are made of, for example, carbon or resin. Sheets 14a to 14e stacked as shown in FIG. 2 are rigidly pressed, then cut, and divided into a plurality of chip-shaped laminated bodies to be individual stators 2. In FIG. 2, the sheets 14b and 14 are
On d and 14e, a region to be one chip-shaped stacked body 17 is surrounded by a quadrangle. Also, FIG.
In (a), one such chip-shaped laminated body 17 is shown. 1 (a), (b), (c),
7 shows a cross section corresponding to the cross section taken along the line I-I of FIG. 6 described above.

As shown in FIG. 1A, in each laminated body 17, in addition to the conductive films to be the stator electrodes 5 (not shown) and 6, the burnout film 15 and the burnout films 16 are formed.
Are formed in layers inside thereof. An enlarged view of a portion surrounded by a circle in FIG. 1A is shown in FIG.

The laminated body 17 is fired to obtain a sintered body 18 as shown in FIG. 1 (b). Sintered body 1
Inside the 8, the stator electrodes 5 and 6 remain,
The burnout membranes 15 and 16 burn out, thereby causing
As best shown in the enlarged view of (B), the cavity 19 and the plurality of cavities 20 are formed in layers. These cavities 1
As a result of the formation of 9 and 20, these cavities 19 and 20
The thin layer 21 and the plurality of thin layers 22 are formed through the.

Next, the sintered body 18 is subjected to a polishing process such as barrel polishing. As a result, FIG.
As shown in (c), the corners of the sintered body 18 are chamfered and the thin layers 21 and 22 are crushed. As a result, the recesses 9 and 10 are formed. Also, FIG.
As shown in (B), the cavity 19 and the thin layer 21 are
Ribs 11 and 12 are formed as a result of crushing the thin layer 21 because it has not reached the side surface of the sintered body 18.

Thereafter, the sintered body 18 is preferably subjected to a blasting process. As a result, it is possible to completely remove the thin layers 21 and 22 remaining at the corners of the recesses 9 and 10, which were not removed only by the above-described barrel polishing.

Although the burn-out films 15 and 16 are each a continuous film in FIG. 1, the effect is substantially the same even if there is a partial discontinuity.

In this embodiment, the crushing method is as follows.
Barrel polishing and subsequent blasting were performed, but this crushing method is not limited to this.
For example, a thin layer 21 may be formed by water jet or ultrasonic waves.
It is also possible to grind and 22.

As described above, when the terminals 7 and 8 are formed with the conductive film on the sintered body 18 thus obtained, the stator 2 as shown in FIG. 6 is obtained.

FIG. 9, FIG. 10, FIG. 11 and FIG.
Each shows a variant of the stator 2 that can be advantageously obtained according to the invention. These FIG. 9 and FIG.
0, the stator 2 shown in FIGS. 11 and 12, respectively.
Can be used as an assembly element of the variable capacitor 1 in place of the stator 2 shown in FIG. 6 described above.

The stator 2 shown in FIG. 9 is provided with recesses 9 and 10, but ribs 11 and 12 are not formed. On the lower surface of the stator 2 shown in FIG. 10, one recess 40 extending in series from one edge to the other edge is provided.
Are formed. On the lower surface of the stator 2 shown in FIG. 11, two recesses 48 and 49 are formed with a semi-elliptical contour. On the lower surface of the stator 2 shown in FIG. 12, two recesses 50 and 51 are formed with a substantially trapezoidal outline.

Any of such recesses 9, 10, 40,
Even 48, 49, 50 and 51 can be efficiently formed by the method shown in FIGS. 1 and 2 described above.

In the method of the present invention, as described above, the recesses 9, 10, 40, 48, 49, 50, 51 for engaging the engaging pieces 31 and 32 provided on the cover 4 are provided.
Not only this, but it can be applied to the case of forming a recess having another function.

Further, the present invention is not limited to the above-described method of manufacturing a variable capacitor, but can be widely applied to a method of manufacturing an electronic component using a ceramic laminate having a recess. Hereinafter, some embodiments in which the present invention is applied to a method of manufacturing an electronic component other than a variable capacitor will be described.

FIG. 13 shows a monolithic ceramic capacitor 1
01 is shown. This monolithic ceramic capacitor 1
01 is formed on the outer surface of the ceramic laminated body 104 in which the plurality of internal electrodes 102 and 103 are formed, and the end portion of the ceramic laminated body 104, and the internal electrode 1
External electrode 105 electrically connected to 02 or 103
And 106.

Characters, figures, etc. may be displayed on the surface of the ceramic laminated body 104 in order to represent desired information like the characteristics such as the electrostatic capacitance of the laminated ceramic capacitor 101. This indication is given by the recess 107 formed on the surface of the ceramic laminate 104. In this embodiment, the recess 107 allows
The character "B" is displayed.

According to the present invention, the monolithic ceramic capacitor 10 provided with the concave portion 107 for giving the above-mentioned display is provided.
1 can be efficiently produced without requiring any troublesome work. FIG. 14 shows typical steps for manufacturing the monolithic ceramic capacitor 101.

As shown in FIG. 14A, in the ceramic laminate 104, a burnout film 108 is formed in addition to the internal electrodes 102 and 103. This burn-out film 1
08 burns out when the ceramic laminate 104 is fired, thereby forming cavities and thin layers. Next, the sintered body of the ceramic laminate 104 is subjected to a polishing process such as barrel polishing, and then subjected to blasting. As a result, as shown in FIG. 14B, the thin layer is crushed to form the recess 107. The ceramic laminated body 104 obtained in this manner is shown in FIG.
As shown in (c), when the external electrodes 105 and 106 are formed, a desired monolithic ceramic capacitor 101 is formed.
Is obtained.

It is needless to say that the above-mentioned letter "B" can be easily formed on both surfaces of the ceramic laminate 104 by the same steps (not shown).

A feedthrough capacitor 109 is shown in FIG. The feedthrough capacitor 109 includes a cylindrical ceramic laminated body 110, and a through hole 111 through which a feedthrough terminal (not shown) penetrates is formed in the central portion thereof.
On its outer peripheral surface, for example, a concave portion 112 is formed which provides a step portion for engaging with a ground plate included in a connector or the like. Internal electrodes 113 are formed inside the ceramic laminated body 110, and external electrodes 146 and 147 are formed on the outer peripheral surface of the ceramic laminated body 110 and the inner peripheral surface of the through hole 111, respectively. ..

According to the present invention, since the through hole 111 and the recess 112 provided in the feedthrough capacitor 109 as described above are formed, no special process, a special mold or equipment is required. FIG. 16 shows the ceramic laminate 11 described above.
The state of No. 0 before firing is shown in a sectional view. Also, FIG.
7 (a) to 7 (f) show the upper surfaces of the ceramic dielectric sheets a to f included in the ceramic laminate 110, respectively.

16 and 17 (a) and (d)
On a particular ceramic dielectric sheet, as shown in
Burnout films 114 and 115 are formed to provide through holes 111 and recesses 112. Further, as shown in FIGS. 16 and 17 (b), (c), (e) and (f), the internal electrode 113 is formed on the specific ceramic dielectric sheet. These ceramic dielectric sheets are stacked, rigidly pressed and then fired. By this firing, the internal electrodes 113 remain inside the sintered body of the ceramic laminate 110, but the burn-out films 114 and 115 are burned away, and as a result, a plurality of cavities and a plurality of thin cavities are formed through these cavities. A layer is formed. The sintered body of the ceramic laminate 110 is then subjected to a grinding process including barrel polishing and blasting, whereby
The thin layer is crushed to form the through hole 111 and the recess 112. Ceramic laminate 11 thus obtained
When the external electrodes 146 and 147 are formed at 0, the desired feedthrough capacitor 109 as shown in FIG. 15 is obtained.

FIG. 18 shows the capacitor network 11
6 is shown. The capacitor network 116 is
The ceramic laminate 117 is formed by laminating a plurality of ceramic dielectric sheets. A plurality of terminal electrodes 118 and 119 are formed on a pair of side surfaces of the ceramic laminate 117 that face each other, and a recess 120 is formed between each of the terminal electrodes 118 and between each of the terminal electrodes 119.
And 121 are formed. The recesses 120 and 121 separate adjacent terminal electrodes 118 and 119 from each other to prevent a short circuit between the terminal electrodes 118 and 119, and to efficiently form the terminal electrodes 118 and 119. It is possible to apply simple dipping and the like. Multiple sets of multilayer capacitors are formed in the capacitor network 116, and the terminals of each multilayer capacitor are provided by a pair of terminal electrodes 118 and 119 facing each other.

According to the present invention, the ceramic laminate 117 provided in the capacitor network 116 as described above.
It is easy to form the recesses 120 and 121 in the. FIG. 19 shows the ceramic dielectric sheets 122, 123, 1 prepared to obtain the ceramic laminate 117.
The top surface of each of 24 and 125 is shown. Here, the ceramic dielectric sheet 122 shown in FIG.
The ceramic dielectric sheet 125 is located at the uppermost stage of the ceramic laminated body 117 and is shown in FIG.
Is located at the bottom of the ceramic laminate 117, and the ceramic dielectric sheets 123 and 124 shown in (b) and (c) thereof are located between the ceramic dielectric sheets 122 and 125, respectively. The desired number of sheets are alternately stacked.

Burnout films 126 and 127 for forming the above-mentioned recesses 120 and 121 are formed on the ceramic dielectric sheets 122 to 125, respectively. Capacitor electrodes 128 and 129 are formed on the ceramic dielectric sheets 123 and 124, respectively.
Each of these capacitor electrodes 128 and 129 is electrically connected to the terminal electrodes 118 and 119 shown in FIG.

The ceramic dielectric sheet 1 shown in FIG.
22 to 125 are laminated, rigidly pressed, and then fired. The ceramic laminated body 117 thus obtained
Although the capacitor electrodes 128 and 129 remain in the sintered body of 1), the burn-out films 126 and 127 are burned off, and as a result, a plurality of cavities and a plurality of thin layers are formed through these cavities. Next, the sintered body of the ceramic laminate 117 is subjected to a crushing process including barrel polishing and blasting, and the thin layer is crushed, thereby forming the recesses 120 and 121 on the side surface of the ceramic laminate 117. .. Then, on each side surface of the ceramic laminate 117,
For example, the terminal electrodes 118 and 119 are formed by immersing the electrode coating material such as silver paste or the like in the middle of the recess 120 or 121 and pulling it up and baking the attached electrode coating material. In this way, the capacitor network 116 shown in FIG. 18 is obtained.

FIG. 20 shows a ceramic capacitor having a high withstand voltage, that is, a high voltage capacitor 130. This high-voltage capacitor 130 is provided with a cylindrical ceramic laminated body 131 as a dielectric, and concave portions 132 and 133 are formed on both main surfaces facing each other. The recesses 132 and 133 are defined by an inner surface having a gently curved three-dimensional shape. Electrodes 134 and 135 are formed on the inner surfaces of the recesses 132 and 133, respectively. Therefore, these electrodes 134 and 135 have a three-dimensional structure called a Rogowski electrode, and one electrode 134 or 1
The creepage distance from the peripheral edge of 35 to the peripheral edge of the other electrode 135 or 134 is increased along the outer peripheral surface of the ceramic laminate 131, and electric field concentration in the regions near the peripheral edges of the electrodes 134 and 135 is suppressed. Therefore, the withstand voltage is increased.

According to the present invention, the high voltage capacitor 130 as described above can be easily manufactured. FIG. 21 shows representative steps involved in the method of obtaining high voltage capacitor 130 described above.

As shown in FIG. 21 (a), a burn-out film 136 is formed on the ceramic laminate 131 at the portions to be the recesses 132 and 133. Such a ceramic laminate 131 is then fired. As a result, the burn-out film 136 is burned off, and the ceramic laminated body 131
A plurality of cavities and a thin layer are formed inside of the through the cavities. Next, the sintered body of the ceramic laminated body 131 is subjected to a crushing process including, for example, barrel polishing and blasting, whereby a thin layer is crushed and three-dimensionally processed as shown in FIG. 21 (b). Shaped recess 13
2 and 133 are formed. When electrodes 134 and 135 are formed on the inner surfaces of these recesses 132 and 133, high voltage capacitor 130 as shown in FIG. 20 is obtained.

A semiconductor package 137 is shown in FIG. The semiconductor package 137 includes a ceramic laminated body 138 capable of providing a highly reliable sealing structure, and the ceramic laminated body 138 is provided with a recess 139 in which a semiconductor integrated circuit device (IC) (not shown) is mounted. A ground electrode 140 and a capacitor electrode 141 are formed inside the ceramic laminated body 138. The capacitor provided by the capacitor electrode 141 functions to prevent noise generated from the semiconductor IC from causing malfunction of other semiconductor ICs.

According to the present invention, the semiconductor package 137 as described above can be easily manufactured. Figure 23
Show the steps involved in the method for obtaining the ceramic laminate 138.

As shown in FIG. 23, the ceramic laminated body 1
A ground electrode 140 or a capacitor electrode 141 is formed on a specific one of the ceramic dielectric sheets 142 including 38, respectively. In addition, a burn-out film 143 is formed on the specific ceramic dielectric sheet 142 at the portion that will become the recess 139. After the ceramic dielectric sheets 142 are stacked and then rigidly pressed, the ceramic laminate 138 is fired. As a result, the burn-out film 143 is burned off, and the ceramic laminated body 13
In the sintered body of No. 8, cavities and thin layers are formed. next,
The sintered body of the ceramic laminated body 138 is subjected to, for example, a crushing process including barrel polishing and blasting,
As a result, the thin layer is crushed and the recess 139 is formed.
Next, the pad electrode 144 and the bonding electrode 1
When 45 is formed, a semiconductor package 137 as shown in FIG. 22 is obtained.

[Brief description of drawings]

FIG. 1 shows a laminated body 17 or a sintered body 18 obtained by carrying out typical steps included in one embodiment of the present invention, in which (a), (b) and (c) are diagrams. Line I of 6 (a)
Shows a cross section corresponding to the cross section along -I, (A),
(B) and (C) are (a), (b), and (c), respectively.
It is an enlarged view of the part surrounded by the circle of
(A) and (A) show the state before firing, (b) and (B)
Shows the state after firing, and (c) and (C) show the state after polishing.

2 is a sheet 14a to 14 made of a ceramic dielectric material prepared to obtain the laminated body 17 shown in FIG.
It is a perspective view which shows e.

3A and 3B show a variable capacitor 1 obtained according to an embodiment of the present invention, where FIG. 3A is a plan view, FIG. 3B is a sectional view taken along line BB of FIG. 3A, and FIG. FIG. 3D is a sectional view taken along line D-D of FIG.

4 is a perspective view of the variable capacitor 1 shown in FIG. 3 viewed from above.

5 is a perspective view of the variable capacitor 1 shown in FIG. 3 as seen from below.

6A and 6B show a stator 2 included in the variable capacitor 1, where FIG. 6A is a plan view, FIG. 6B is a sectional view taken along line BB of FIG. 6A, and FIG. ) Is the line D- of (a)
It is sectional drawing which follows D.

7A and 7B show a rotor 3 included in the variable capacitor 1, where FIG. 7A is a perspective view seen from above and FIG. 7B is a perspective view seen from below.

8A and 8B show a cover 4 included in the variable capacitor 1, where FIG. 8A is a plan view, FIG. 8B is a sectional view taken along line BB of FIG. 8A, and FIG. ) Is the line DD of (a)
FIG.

9A and 9B show modified examples of the stator 2, where FIG. 9A is a sectional view and FIG. 9B is a bottom view.

FIG. 10 shows another modification of the stator 2,
(A) is sectional drawing, (b) is a bottom view.

FIG. 11 shows still another modification of the stator 2, where (a) is a cross-sectional view and (b) is a bottom view.

FIG. 12 shows still another modification of the stator 2, in which (a) is a sectional view and (b) is a bottom view.

FIG. 13 shows a multilayer ceramic capacitor 101 obtained according to another embodiment of the present invention, (a) is a sectional view taken along the line AA of (b), and (b) is a plan view. is there.

14 is a monolithic ceramic capacitor 1 shown in FIG.
FIG. 14 is a cross-sectional view showing typical steps included in the manufacturing method of No. 01.

FIG. 15 is a sectional view showing a feedthrough capacitor 109 obtained according to still another embodiment of the present invention.

16 is a cross-sectional view for explaining a method for obtaining the ceramic laminate 110 shown in FIG.

17 is a top view of each of the ceramic dielectric sheets af included in the ceramic laminate 110 shown in FIG.

FIG. 18 is a perspective view showing a capacitor network 116 obtained according to still another embodiment of the present invention.

FIG. 19 is a ceramic dielectric sheet 122 to 1 prepared to obtain the ceramic laminate 117 shown in FIG.
It is a top view which shows 25.

FIG. 20 shows a high-voltage capacitor 130 obtained according to still another embodiment of the present invention, (a) is a sectional view and (b) is a plan view.

21 is a cross-sectional view showing typical steps involved in a method for obtaining the ceramic laminate 130 shown in FIG.

22A and 22B show a semiconductor package 137 obtained according to still another embodiment of the present invention, wherein FIG. 22A is a sectional view and FIG. 22B is a plan view.

23 is a sectional view for explaining a method for obtaining the ceramic laminate 138 shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Variable capacitor 2 Stator 3 Rotor 4 Cover 5,6 Stator electrode 7,8 Terminal 9,10,40,48,49,50,51 Recess 13 Conductive film 14a-14e Sheet 15,16 Burning-out film 17 Laminate 18 Burning Consolidation 19,20 Cavity 21,22 Thin layer 23 Rotor electrode 25 Driver groove 26 Opening 27 Adjustment hole 28 Spring action portion 31,32 Engaging piece 101 Multilayer ceramic capacitor 104,110,117,131,138 Ceramic laminate 107 , 112, 120, 121, 132, 133, 1
39 recesses 108, 114, 115, 126, 127, 136, 1
43 Burning Film 109 Through Capacitor 111 Through Hole 116 Capacitor Network 130 High Voltage Capacitor 137 Semiconductor Package

Claims (1)

[Claims] 1. A method for manufacturing an electronic component using a ceramic laminate having a recess formed therein, wherein a plurality of burn-out films made of a material that can be burnt out by firing are formed in layers at positions corresponding to the positions of the recesses. Further, a ceramic laminated body is prepared, the ceramic laminated body is fired, and the burn-out film is burned off. As a result, a plurality of cavities are formed in layers and a plurality of thin layers are formed through the plurality of cavities. A method of manufacturing an electronic component, comprising: each step of obtaining a formed sintered body, crushing the thin layer of the sintered body, and thereby forming the recess.