WO2003023706A1 - Procede de fabrication d'un conditionnement et d'un systeme de fermeture contenant des informations interactives - Google Patents

Procede de fabrication d'un conditionnement et d'un systeme de fermeture contenant des informations interactives Download PDF

Info

Publication number
WO2003023706A1
WO2003023706A1 PCT/US2002/028922 US0228922W WO03023706A1 WO 2003023706 A1 WO2003023706 A1 WO 2003023706A1 US 0228922 W US0228922 W US 0228922W WO 03023706 A1 WO03023706 A1 WO 03023706A1
Authority
WO
WIPO (PCT)
Prior art keywords
closure
making
interactive information
antenna
interconnections
Prior art date
Application number
PCT/US2002/028922
Other languages
English (en)
Inventor
Larry Smeyak
Timothy Carr
Mark Powell
John Ziegler
Original Assignee
Alcoa Closure Systems International, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/224,204 external-priority patent/US20030061706A1/en
Application filed by Alcoa Closure Systems International, Inc. filed Critical Alcoa Closure Systems International, Inc.
Publication of WO2003023706A1 publication Critical patent/WO2003023706A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag

Definitions

  • the present invention relates generally to a method of making an interactive information package comprising a closure and container, with the package including a micro-electronics assembly, and more particularly to a method of making such a package by disposition of the micro-electronics assembly on the inside surface of a top wall portion of the closure of the package.
  • a microelectronics assembly such as disclosed in the above-referenced patent application is configured for radio frequency interaction by the provision of a suitable radio frequency identification (RFID) integrated circuit, an antenna, and one or more inter-connectors operatively connecting the circuit and the antenna.
  • RFID radio frequency identification
  • the microelectronics assembly may include one or more micro- sensors, as well as a self-contained power source.
  • microelectronics assembly be efficiently and economically positioned in the package, preferably adjacent to the inside surface of a top all portion of the package's closure.
  • common practice has been to supply microelectronics, and in particular RFID tags, embedded in or attached to a plastic substrate.
  • a plastic substrate is typically supplied in large rolls to manufacturers of so-called “smart" products, such as smart credit cards and the like.
  • Suitable machinery has been developed whereby the microelectronics assemblies can be efficiently inserted into products, such as by detachment from the substrate, or alternauVely, by insertion of a portion of the substrate along with the microelectronics' assembly into the product being manufactured.
  • the present invention is directed to a method of making an interactive information package, including a closure and container, wherein a microelectronics assembly is formed on the inside surface of the top wall portion of the package's closure for use in association with the contents of the package.
  • a method of making an interactive information closure for a package contemplates molding of a plastic closure having a top wall portion, and an annular depending skirt portion, and forming a microelectronics assembly on the inside surface of the top wall portion.
  • An associated sealing liner can thereafter be positioned within the closure, either by pre-forming a liner and inserting it into the closure, or by molding the sealing liner within the closure.
  • a method of making an interactive information closure embodying the principles of the present invention contemplates that the microelectronics assembly provided on the inside surface of the top wall portion of a closure include a radio frequency identification (RFID) integrated circuit, an antenna, and one or more interconnections operatively connecting the circuit and the antenna.
  • RFID radio frequency identification
  • the antenna and interconnections are formed directly on the inside surface of the top wall portion, such as by printing the antenna and interconnections on the inside surface with electrically conductive ink.
  • the printing step can be selected from the group consisting of ink jet printing, silk screen printing, and offset printing.
  • the antenna and interconnections can be formed on the inside surface of the closure by thin film deposition by evaporation or sputtering, with etching of the thin film, or laser machining of the thin film, effected to form the antenna and interconnections.
  • the present invention further contemplates that the antenna and interconnections of the microelectronics assembly can be formed on the inside surface of the closure by lamination, with either etching or laser machining of the lamination to form the antenna and interconnections of the microelectronics assembly on the inside surface of the closure.
  • the integrated circuit of the microelectronics assembly can be positioned either active-side-down (sometimes referred to as "flip chip” placement) on the inside surface of the closure, or active-side-up on the inside surface, in accordance with known manufacturing techniques utilizing wire bonding.
  • the step of forming the microelectronics assembly on the inside surface of the closure includes positioning the integrated circuit of the assembly on the inside surface (typically active-side-up), and forming a planarization layer over the integrated circuit.
  • the method further contemplates forming one or more openings in the planarization layer, and forming the antenna of the assembly on the planarization layer, with interconnections formed through the openings in the layer.
  • the antenna and interconnections can be formed by metal deposition followed by photolithography, with the step of forming the openings in the planarization layer including photolithography or laser machining.
  • the step of forming the microelectronics assembly on the inside surface of the closure may include actual formation of the integrated circuit, as well as the associated antenna and interconnections.
  • the integrated circuit is printed with semi-conductor ink and the antenna, and interconnections are printed on the inside surface of the closure with a conductive ink.
  • closures formed in accordance with the present invention ordinarily will include a sealing liner positioned within the closure such that the microelectronics assembly is positioned between the top wall portion of the closure and the sealing liner. While use of pre-cut or otherwise pre- formed liners is contemplated, it is within the purview of the present invention that a liner be positioned within the closure by molding the liner within the closure itself.
  • FIGURE 1 is a diagrammatic view of an interactive information package of the type that can be formed in accordance with the present invention, including a plastic closure and associated container; and
  • FIGURE 2 is a diagrammatic view of a radio frequency integrated circuit system for providing promotional and quality assurance functions.
  • the present invention is directed to a method of making an interactive information package including a plastic closure and container, wherein a radio frequency integrated circuit and associated antenna are disposed within the package, preferably by disposition on the interior surface of the package closure.
  • the arrangement of the present package facilitates its use for a variety of applications, including product promotion, storage and dissemination of product information including product processing information, and product quality assurance, including tamper-evidence.
  • Use of packages formed in accordance with the present invention permits efficient inventory control, by permitting product purchases to be efficiently tracked without resorting to optical scanning of bar codes and the like.
  • the package 10 which can be formed in accordance with the present invention comprises plastic closure 12 and an associated container 14 to which the closure can be secured, such as by cooperating, inter-engaged thread formations.
  • Plastic closure 12 can be injection molded or compression molded, with U.S. Patent No. 4,497,765, hereby incorporated by reference, disclosing a method and apparatus for efficiently compression-molding closures of this type.
  • the package 10 includes a radio frequency integrated circuit 16
  • the arrangement includes an antenna 18 operatively connected to the integrated circuit 16, with the antenna cooperating with the integrated circuit to permit the integrated circuit to be externally powered without physical connection of a power supply thereto.
  • the antenna 18 provides the desired radio frequency interface with an associated radio frequency- input/output device 20 (FIGURE 2) which can be configured to provide remote input to and/or reading and retrieval of electronic information carried by the integrated circuit 16.
  • microelectronics and microelectronics assembly, includes, but is not limited to RFID supporting electronics, antenna to support radio frequency communication, micro-sensors, and micro-power sources.
  • the integrated circuit 16 and antenna 18, and any associated components, including inter-connectors with the integrated circuit be positioned within the closure 12 by disposition of the electronic components (referred to herein as a microelectronics assembly) within the closure 12.
  • the microelectronics assembly can be positioned within the closure 12 by formation on the inside surface of the top wall portion thereof.
  • a sealing liner be provided for the closure, including molding of the liner within the closure after the microelectronics assembly has been formed on the inside surface of the top wall portion.
  • external powering of the integrated circuit precludes the need for an internal power supply operatively connected to the integrated circuit for providing electrical power thereto.
  • a compact power supply 22 such as diagrammatically illustrated in FIGURE 2, operatively connected to the integrated circuit 16.
  • the microelectronics assembly of the package can be configured to include one or more different types of compact-size (i.e., micro) sensing devices.
  • Such sensing devices may include, by way of example, a pressure sensor 24, a temperature sensor 26, a chemical sensor 28 for sensing the presence of chemicals such as oxygen, and/or a biological sensor 30 for sensing the presence of microorganisms within the package 10.
  • the configuration of the present package with one or more of the internal sensing devices greatly enhances versatile use of the present package for quality assurance functions, including tamper-evidence, brand protection, and anti-counterfeiting.
  • An array of sensors can be provided for certain applications, with the array preferably integrated with radio frequency integrated circuit 16. The provision of one or more sensors permits direct assessment of the quality state of the packaged goods.
  • the microelectronics assembly used in practicing the present invention is provided in a package including a closure 12 by molding a plastic closure having a top wall portion, and a depending annular skirt portion, and by forming the microelectronics assembly on the inside surface of the top wall portion.
  • the microelectronics assembly includes a radio frequency identification (RFID) integrated circuit, an antenna, and one or more interconnections. Formation of the microelectronics assembly on the inside surface of the top wall portion of the closure includes formation by assembly of the various components on the top wall portion, including in situ formation of one or more of the components.
  • RFID radio frequency identification
  • the microelectronics assembly includes a previously-manufactured RFID integrated circuit, with the antenna and interconnections of the microelectronics assembly formed directly on the inside surface of the top wall portion of the closure 12.
  • the antenna and interconnections are printed on the inside surface of the top wall portion with electrically conductive ink.
  • the printing step can be selected from the group consisting of ink jet printing, silk screen printing, and offset printing. It is within the purview of the present invention to form the antenna and interconnections by laser writing, by which metallic conductive pathways are formed by employing a laser which "writes" in a organo-metallic gaseous atmosphere.
  • the antenna and interconnections of the microelectronics assembly can be formed by thin film deposition by evaporation or sputtering on the inside surface of the top wall of closure 12.
  • the thin film can be etched and or laser machined to form the antenna and interconnections of the microelectronics assembly.
  • the antenna and interconnections of the microelectronics assembly can be formed by lamination on the inside surface of the top wall portion of closure 12, again with etching and/or laser machining employed to form the antenna and interconnections of the microelectronics assembly on the inside surface.
  • Disposition of the integrated circuit can be effected by positioning active-side-down on the inside surface of closure 12 with the pads of the integrated circuit directly connected to the antenna or interconnections by soldering, stud-bump bonding or use of a conductive adhesive, or by positioning of the integrated circuit active-side-up on the inside surface of the closure and connecting the pads of the integrated circuit to the antenna or interconnections utilizing wire bonding techniques, depending upon the specific technique employed for formation of the associated antenna and interconnections.
  • the step of forming the microelectronics assembly on the inside surface of the top wall portion of closure 12 includes first positioning the integrated circuit on the inside surface of the closure (typically active-side-up), and forming a planarization layer over the integrated circuit.
  • One or more openings are formed in the planarization layer, with the antenna of the assembly formed on the planarization layer, and interconnections formed through the openings in the planarization layer.
  • the antenna and interconnections can be formed by metal deposition, followed by photolithography, while the step of forming openings in the planarization layer can be effected by either photolithography or laser machining.
  • the RFID integrated circuit is formed by printing with semi-conductor ink while the associated antenna, and the interconnections are formed by printing with electrically-conductive ink on the inside surface of the top wall portion.
  • a sealing liner is positioned within the closure so that the microelectronics assembly is positioned between the top wall portion of the closure and the sealing liner.
  • the sealing liner may be provided in the form of a pre-formed, disc-shaped sealing liner which is inserted into the closure shell after formation of the electronics assembly on the top wall portion thereof.
  • the step of positioning the sealing liner in the closure can be effected by in situ molding of the sealing liner, such as by compression molding, within the closure.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un conditionnement (10) contenant des informations interactives. Ce conditionnement comporte d'une part un système de fermeture (1) contenant des informations interactives et pourvu d'un dispositif d'identification RF (16), et d'autre part un système micro-électronique monté sur la surface intérieure de la paroi supérieure du système de fermeture du conditionnement. Après montage du système micro-électronique, on peut fixer un joint d'étanchéité dans le système de fermeture de sorte que le système micro-électronique se place entre la paroi supérieure et le joint d'étanchéité.
PCT/US2002/028922 2001-09-13 2002-09-11 Procede de fabrication d'un conditionnement et d'un systeme de fermeture contenant des informations interactives WO2003023706A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US60/318,844 2001-09-13
US10/224,204 US20030061706A1 (en) 2001-09-13 2002-08-20 Method of making interactive information closure and package
US10/224,204 2002-08-20

Publications (1)

Publication Number Publication Date
WO2003023706A1 true WO2003023706A1 (fr) 2003-03-20

Family

ID=22839684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/028922 WO2003023706A1 (fr) 2001-09-13 2002-09-11 Procede de fabrication d'un conditionnement et d'un systeme de fermeture contenant des informations interactives

Country Status (1)

Country Link
WO (1) WO2003023706A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6992586B2 (en) 2002-10-01 2006-01-31 Novelis, Inc. Methods of conducting promotional contests and beverage containers for use therein
US7017807B2 (en) 2003-09-08 2006-03-28 Francis M. Claessens Apparatus and method for detecting tampering with containers and preventing counterfeiting thereof
US7048179B2 (en) 2003-12-12 2006-05-23 Francis M. Claessens Apparatus for electronically determining whether a tax for a product has been paid
US7126479B2 (en) 2004-08-17 2006-10-24 Francis M. Claessens Metal container closure having integral RFID tag
WO2007072009A2 (fr) 2005-12-22 2007-06-28 Lifescan Scotland, Ltd Récipient avec un dispositif rfid pour stocker des capteurs d'essais
EP1830315A1 (fr) * 2006-03-02 2007-09-05 Wireless Solutions S.R.L. Système éléctronique de contrôle et communication pour surveiller l'etat de produits
US7364089B2 (en) 2003-12-12 2008-04-29 Claessens Francis M Apparatus for electronically determining whether a tax for a product has been paid
US10748050B2 (en) 2013-03-08 2020-08-18 Cryogatt Systems Limited RFID caps and lids

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613891A (en) * 1984-02-17 1986-09-23 At&T Bell Laboratories Packaging microminiature devices
EP0619243A1 (fr) * 1993-04-08 1994-10-12 Manufacture Lyonnaise de Bouchage Société Anonyme Dispositif antivol pour récipients munis d'un moyen de bouchage ou de surbouchage
US5786626A (en) * 1996-03-25 1998-07-28 Ibm Corporation Thin radio frequency transponder with leadframe antenna structure
US6053405A (en) * 1995-06-07 2000-04-25 Panda Eng., Inc. Electronic verification machine for documents
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
FR2802000A1 (fr) * 1999-12-01 2001-06-08 Gemplus Card Int Procede de realisation d'un circuit oscillant accorde et fabrication de dispositifs de radiocommunications de faibles dimensions comprenant un tel circuit
WO2001063189A1 (fr) * 2000-02-28 2001-08-30 Dai Nippon Printing Co., Ltd. Systeme de refrigeration automatique, refrigerateur, systeme de cuisson automatique et four a micro-ondes

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4613891A (en) * 1984-02-17 1986-09-23 At&T Bell Laboratories Packaging microminiature devices
EP0619243A1 (fr) * 1993-04-08 1994-10-12 Manufacture Lyonnaise de Bouchage Société Anonyme Dispositif antivol pour récipients munis d'un moyen de bouchage ou de surbouchage
US6053405A (en) * 1995-06-07 2000-04-25 Panda Eng., Inc. Electronic verification machine for documents
US5786626A (en) * 1996-03-25 1998-07-28 Ibm Corporation Thin radio frequency transponder with leadframe antenna structure
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
FR2802000A1 (fr) * 1999-12-01 2001-06-08 Gemplus Card Int Procede de realisation d'un circuit oscillant accorde et fabrication de dispositifs de radiocommunications de faibles dimensions comprenant un tel circuit
WO2001063189A1 (fr) * 2000-02-28 2001-08-30 Dai Nippon Printing Co., Ltd. Systeme de refrigeration automatique, refrigerateur, systeme de cuisson automatique et four a micro-ondes
EP1174667A1 (fr) * 2000-02-28 2002-01-23 Dai Nippon Printing Co., Ltd. Systeme de refrigeration automatique, refrigerateur, systeme de cuisson automatique et four a micro-ondes

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6992586B2 (en) 2002-10-01 2006-01-31 Novelis, Inc. Methods of conducting promotional contests and beverage containers for use therein
US7017807B2 (en) 2003-09-08 2006-03-28 Francis M. Claessens Apparatus and method for detecting tampering with containers and preventing counterfeiting thereof
US7048179B2 (en) 2003-12-12 2006-05-23 Francis M. Claessens Apparatus for electronically determining whether a tax for a product has been paid
US7061382B2 (en) 2003-12-12 2006-06-13 Francis M. Claessens Apparatus for electronically verifying the authenticity of contents within a container
US7364089B2 (en) 2003-12-12 2008-04-29 Claessens Francis M Apparatus for electronically determining whether a tax for a product has been paid
US7126479B2 (en) 2004-08-17 2006-10-24 Francis M. Claessens Metal container closure having integral RFID tag
WO2007072009A2 (fr) 2005-12-22 2007-06-28 Lifescan Scotland, Ltd Récipient avec un dispositif rfid pour stocker des capteurs d'essais
WO2007072009A3 (fr) * 2005-12-22 2007-11-29 Lifescan Scotland Ltd Récipient avec un dispositif rfid pour stocker des capteurs d'essais
CN101375159A (zh) * 2005-12-22 2009-02-25 生命扫描苏格兰有限公司 存放测试传感器用的设有射频标识元件的容器
EP1830315A1 (fr) * 2006-03-02 2007-09-05 Wireless Solutions S.R.L. Système éléctronique de contrôle et communication pour surveiller l'etat de produits
US10748050B2 (en) 2013-03-08 2020-08-18 Cryogatt Systems Limited RFID caps and lids

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