WO2003019637A3 - Verfahren zur wärmebehandlung der oberflächenbehandlung eines halbleiters mit hilfe eines laserpulses - Google Patents

Verfahren zur wärmebehandlung der oberflächenbehandlung eines halbleiters mit hilfe eines laserpulses Download PDF

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Publication number
WO2003019637A3
WO2003019637A3 PCT/DE2002/002981 DE0202981W WO03019637A3 WO 2003019637 A3 WO2003019637 A3 WO 2003019637A3 DE 0202981 W DE0202981 W DE 0202981W WO 03019637 A3 WO03019637 A3 WO 03019637A3
Authority
WO
WIPO (PCT)
Prior art keywords
surface layer
semiconductor
thermal treatment
pulsed laser
laser
Prior art date
Application number
PCT/DE2002/002981
Other languages
English (en)
French (fr)
Other versions
WO2003019637A2 (de
Inventor
Johannes Baur
Georg Bruederl
Alfred Lell
Walter Neu
Raimund Oberschmid
Original Assignee
Osram Opto Semiconductors Gmbh
Johannes Baur
Georg Bruederl
Alfred Lell
Walter Neu
Raimund Oberschmid
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Johannes Baur, Georg Bruederl, Alfred Lell, Walter Neu, Raimund Oberschmid filed Critical Osram Opto Semiconductors Gmbh
Priority to US10/487,577 priority Critical patent/US20050020095A1/en
Priority to JP2003522993A priority patent/JP2005500698A/ja
Publication of WO2003019637A2 publication Critical patent/WO2003019637A2/de
Publication of WO2003019637A3 publication Critical patent/WO2003019637A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H01L21/3245—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering of AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Led Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

Die Erfindung bezieht sich auf ein Verfahren zur Wärmebehandlung einer Oberflächenschicht (4) auf einem Halbleitersubstrat (5). Es werden auf die Oberflächenschicht (4) Laserpulse (2) abgegeben, die von einem Laser (1) erzeugt werden. Mit diesem Verfahren lassen sich insbesondere Ohmsche Kontakte zu III-V-Verbindungshalbleitern herstellen.
PCT/DE2002/002981 2001-08-23 2002-08-14 Verfahren zur wärmebehandlung der oberflächenbehandlung eines halbleiters mit hilfe eines laserpulses WO2003019637A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/487,577 US20050020095A1 (en) 2001-08-23 2002-08-14 Method for surface treating a semiconductor
JP2003522993A JP2005500698A (ja) 2001-08-23 2002-08-14 半導体の表面処理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10141352A DE10141352A1 (de) 2001-08-23 2001-08-23 Verfahren zur Oberflächenbehandlung eines Halbleiters
DE10141352.1 2001-08-23

Publications (2)

Publication Number Publication Date
WO2003019637A2 WO2003019637A2 (de) 2003-03-06
WO2003019637A3 true WO2003019637A3 (de) 2003-10-02

Family

ID=7696370

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/002981 WO2003019637A2 (de) 2001-08-23 2002-08-14 Verfahren zur wärmebehandlung der oberflächenbehandlung eines halbleiters mit hilfe eines laserpulses

Country Status (4)

Country Link
US (1) US20050020095A1 (de)
JP (1) JP2005500698A (de)
DE (1) DE10141352A1 (de)
WO (1) WO2003019637A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004061865A1 (de) * 2004-09-29 2006-03-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Dünnfilmhalbleiterchips
US20070102834A1 (en) * 2005-11-07 2007-05-10 Enicks Darwin G Strain-compensated metastable compound base heterojunction bipolar transistor
US8962468B1 (en) * 2014-04-23 2015-02-24 United Silicon Carbide, Inc. Formation of ohmic contacts on wide band gap semiconductors
DE102016120685A1 (de) 2016-10-28 2018-05-03 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterlasers und Halbleiterlaser

Citations (3)

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EP0678945A1 (de) * 1994-04-20 1995-10-25 Toyoda Gosei Co., Ltd. Galliumnitriddiodenlaser
EP0723303A2 (de) * 1995-01-17 1996-07-24 Hewlett-Packard Company Licht-emittierende Halbleitervorrichtung und Herstellungsverfahren
DE19534153A1 (de) * 1995-09-14 1997-03-27 Oce Printing Systems Gmbh Verfahren zum Justieren der Leuchtstärke von lichtemittierenden Dioden

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US4359486A (en) * 1980-08-28 1982-11-16 Siemens Aktiengesellschaft Method of producing alloyed metal contact layers on crystal-orientated semiconductor surfaces by energy pulse irradiation
US4448632A (en) * 1981-05-25 1984-05-15 Mitsubishi Denki Kabushiki Kaisha Method of fabricating semiconductor devices
US4920070A (en) * 1987-02-19 1990-04-24 Fujitsu Limited Method for forming wirings for a semiconductor device by filling very narrow via holes
JPH01184861A (ja) * 1988-01-13 1989-07-24 Toshiba Corp レーザ光によるトリミング方法
GB8817886D0 (en) * 1988-07-27 1988-09-01 British Telecomm Avalanche photodiode structure
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WO1993008877A1 (en) * 1991-11-06 1993-05-13 Lai Shui T Corneal surgery device and method
JP3211394B2 (ja) * 1992-08-13 2001-09-25 ソニー株式会社 半導体装置の製造方法
DE4229399C2 (de) * 1992-09-03 1999-05-27 Deutsch Zentr Luft & Raumfahrt Verfahren und Vorrichtung zum Herstellen einer Funktionsstruktur eines Halbleiterbauelements
TW232751B (en) * 1992-10-09 1994-10-21 Semiconductor Energy Res Co Ltd Semiconductor device and method for forming the same
US5656832A (en) * 1994-03-09 1997-08-12 Kabushiki Kaisha Toshiba Semiconductor heterojunction device with ALN buffer layer of 3nm-10nm average film thickness
JP3326654B2 (ja) * 1994-05-02 2002-09-24 ソニー株式会社 表示用半導体チップの製造方法
DE19534574C2 (de) * 1995-09-18 1997-12-18 Fraunhofer Ges Forschung Dotierverfahren zur Herstellung von Homoübergängen in Halbleitersubstraten
CN1131548C (zh) * 1997-04-04 2003-12-17 松下电器产业株式会社 半导体装置
US6316357B1 (en) * 1997-10-08 2001-11-13 Industrial Technology Research Institute Method for forming metal silicide by laser irradiation
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US6916451B1 (en) * 1999-05-04 2005-07-12 Neokismet, L.L.C. Solid state surface catalysis reactor
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0678945A1 (de) * 1994-04-20 1995-10-25 Toyoda Gosei Co., Ltd. Galliumnitriddiodenlaser
EP0723303A2 (de) * 1995-01-17 1996-07-24 Hewlett-Packard Company Licht-emittierende Halbleitervorrichtung und Herstellungsverfahren
DE19534153A1 (de) * 1995-09-14 1997-03-27 Oce Printing Systems Gmbh Verfahren zum Justieren der Leuchtstärke von lichtemittierenden Dioden

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
ANDERSON W T ET AL: "LASER ANNEALED TA/GE AND NI/GE OHMIC CONTACTS TO GAAS", IEEE ELECTRON DEVICE LETTERS, IEEE INC. NEW YORK, US, vol. 2, no. 5, May 1981 (1981-05-01), pages 115 - 117, XP000818924, ISSN: 0741-3106 *
HEULIN B ET AL: "THE PROPERTIES OF LASER-ALLOYED ZINC LAYERS ON GAAS", THIN SOLID FILMS, ELSEVIER-SEQUOIA S.A. LAUSANNE, CH, vol. 105, no. 3, July 1983 (1983-07-01), pages 227 - 235, XP000837479, ISSN: 0040-6090 *
KOICHI TOYODA: "HIGH-POWER LASER PROCESSING FOR MICROELECTRONICS DEVICES", OPTOELECTRONICS DEVICES AND TECHNOLOGIES, MITA PRESS, TOKYO, JP, vol. 8, no. 2, 1 June 1993 (1993-06-01), pages 131 - 145, XP000383874, ISSN: 0912-5434 *
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Also Published As

Publication number Publication date
DE10141352A1 (de) 2003-06-05
US20050020095A1 (en) 2005-01-27
WO2003019637A2 (de) 2003-03-06
JP2005500698A (ja) 2005-01-06

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