WO2003009342A2 - Support de donnees comportant un element integre - Google Patents

Support de donnees comportant un element integre Download PDF

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Publication number
WO2003009342A2
WO2003009342A2 PCT/IB2002/002975 IB0202975W WO03009342A2 WO 2003009342 A2 WO2003009342 A2 WO 2003009342A2 IB 0202975 W IB0202975 W IB 0202975W WO 03009342 A2 WO03009342 A2 WO 03009342A2
Authority
WO
WIPO (PCT)
Prior art keywords
data carrier
transmission means
terminal contacts
integrated component
pads
Prior art date
Application number
PCT/IB2002/002975
Other languages
English (en)
Other versions
WO2003009342A3 (fr
Inventor
Michael Cernusca
Joachim H. Schober
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Priority to JP2003514590A priority Critical patent/JP2004522316A/ja
Publication of WO2003009342A2 publication Critical patent/WO2003009342A2/fr
Publication of WO2003009342A3 publication Critical patent/WO2003009342A3/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Definitions

  • the invention concerns a data carrier, which is designed for contactless communication with a communication station and comprising a substrate to which transmission means are connected, said transmission means are connected to transmission means terminal contacts, the data carrier comprising an integrated component, said integrated component comprising component terminal contacts, each component terminal contact being electroconductively connected to a transmission means terminal contact.
  • Patent Document US 5 858 149 A In the context of a data carrier of the foregoing design described in the first paragraph, mention can be made of the Patent Document US 5 858 149 A.
  • Known from this patent document is connection of an integrated component in so-called flip-chip technology to a substrate, in the manner that the so-called pads of the integrated component are each connected with a so-called bump, and in fact with a gold bump, the integrated component then being set turned over with the bumps forward on transmission means terminal contacts of a transmission means, an intermetallic connection then being implemented pairwise between the bumps and the transmission means terminal contacts, with the help of a thermo- compression process.
  • a data carrier said data carrier being designed for contactless communication with a communication station, and said data carrier comprising a substrate, and said datacarrier comprising transmission means connected to the substrate, which transmission means are connected to transmission means terminal contacts, and said data carrier comprising an integrated component, which comprising component terminal contacts, wherein each component terminal contact being electroconductively connected to a transmission means terminal contact, and wherein the component terminal contacts being formed by bumpless pads, and wherein the transmission means terminal contacts and the bumpless pads being connected directly to each other pairwise by an intermetallic connection.
  • the provision of the features in accordance with the invention enables considerably simplified production of a data carrier, in particular because the provision of separate bumps becomes superfluous and because the pads that are present anyway in an integrated component are connected directly without additional means with transmission means terminal contacts of a data carrier according to the invention. This has a positive influence on the shortest possible clock periods for mass production of such a data carrier in accordance with the invention. In addition it leads to the advantage of cost-effective manufacture of a data carrier in accordance with the invention. Furthermore, the intermetallic connections in a data carrier in accordance with the invention are distinguished by a very high degree of reliability and resistance to ageing.
  • the setting up of the intermetallic connections between the bumpless pads and the transmission means terminal contacts can take place with the help of a thermo-compression process, for example.
  • the intermetallic connections can also have been established by laser welding. However, it has proved especially advantageous if the intermetallic connections have each been formed by an ultrasonic-welded joint. The use of an ultrasonic process leads to the formation of welded connections, which are especially stable intermetallic connections, which is advantageous.
  • the transmission means and the transmission means terminal contacts can be of copper; the copper surface may additionally be finished with a galvanically or currentlessly deposited layer of silver or gold.
  • the transmission means and the transmission means terminal contacts, as well as the bumpless pads are made of aluminum. This is especially advantageous with a view to the most economical implementation of a data carrier in accordance with the invention. It also benefits from the advantage that with the same material especially stable intermetallic connections are obtained between the transmission means terminal contacts and the bumpless pads, and that in the area of the intermetallic connections no embrittlement because of diffusion effects is possible.
  • Fig. 1 shows schematically in a view from above, a data carrier for contactless communication according to an embodiment of the invention.
  • Fig. 2 shows in a section according to the line II-II in Fig. 1, a detail of the data carrier according to Fig. 1.
  • Fig. 1 represents the whole of a data carrier 1, and Fig. 2 a part.
  • the data carrier 1 is designed for contactless communication with a communication station not represented in Figs. 1 and 2.
  • the data car ier 1 comprising a substrate 2, which in the present case is made of plastic. However, the substrate 2 can be made of other materials, for example paper or paperboard or cardboard.
  • a transmission coil 3 Connected to the substrate 2 as transmission means is a transmission coil 3, which in the present case has been produced by means of a stamping method. However, other methods are also possible, for example etching or embossing.
  • the transmission coil 3 comprising in this case five turns 4, 5, 6, 7 and 8, which lie on the substrate 2 corresponding to the representation in Fig. 1.
  • the free end of the outermost turn 4 is connected to a first coil terminal contact 9 provided as a transmission means terminal contact.
  • the free end of the innermost turn 8 is connected to a second coil terminal contact 10 likewise provided as a transmission means terminal contact.
  • the two coil terminal contacts 9 and 10 have been produced at the same time as the turns 4, 5, 6, 7 and 8 of the transmission coil 3.
  • the data carrier 1 further comprising an integrated component 11.
  • the integrated component 11 comprising an integrated circuit, which is necessary for the contactless communication with a communication station.
  • the integrated component 11 comprising as component terminal contacts two so-called pads 12 and 13. These two pads 12 and 13 are advantageously designed so as to be bumpless, which in other words means that on the pads 12 and 13 present anyway on the integrated component 11, no additional bumps are placed, as is certainly the case with the integrated component according to the patent document US 5 858 149 A.
  • the coil terminal contacts 9 and 10 and the bumpless pads 12 and 13 are connected pairwise and directly by intermetallic connections 14 and 15.
  • the two intermetallic connections 14 and 15 are only represented schematically with the help of a line in Fig. 2.
  • the two intermetallic connections 14 and 15 have been produced with the help of ultrasonic action, which is not shown separately in the Figs. 1 and 2, because the production of intermetallic connections for data carriers with the help of an ultrasonic welding process has in itself been known for a long time. It should also be mentioned that in the data carrier 1 according to Figs.
  • the transmission coil 3 and the coil terminal contacts 9 and 10 like the bumpless pads 12 and 13 are made of aluminum.
  • the data carrier 1 comprising a cover 16 made of plastic and connected to the substrate 2.
  • the cover 16 could also be made of paper or cardboard.
  • the invention is not limited to the previously described design of the data carrier 1 according to Figs. 1 and 2.
  • the transmission coil 3 and the coil terminal contacts 9 and 10 can also be made of copper, the production possibly taking place with an etching process, for instance. Production can also take place with a printing process in which a conductive paste can be used.
  • the transmission coil 3 provided as transmission means and the coil terminal contacts 9 and 10 provided as transmission means terminal contacts have been realized in a single production operation.
  • a different design is also possible for a data carrier according to the invention, and such a design in which the bumpless pads of an integrated component are each connected to a connection lug realized with the help of a so-called lead frame, where each connection lug forms a transmission means terminal contact, and for example, a transmission coil is electroconductively connected to a coil terminal.
  • the bumpless pads are directly connected by an intermetallic connection each with a connection lug provided as transmission means terminal contact.
  • a transmission coil need not necessarily be provided, but the transmission means can also be formed by capacitor plates, which work together capacitively with counter capacitor plates, each counter capacitor plate being connected to a bumpless pad of an integrated component by means of an intermetallic connection.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

L'invention concerne un support de données (1) pour une communication sans contact avec une station de communication. Ce support comprend un substrat (2) et une bobine de transmission (3) connectée au substrat (2) et à des contacts terminaux de bobine (9, 10). Ledit support de données (1) comporte aussi un élément intégré (11) pourvu de contacts terminaux (12, 13) étant chacun connecté de manière électro-conductrice à un contact terminal de bobine (9, 10), ces contacts terminaux d'élément (12, 13) étant chacun constitué d'une pastille sans bosse. Les contacts terminaux de bobine (9, 10) et les pastilles sans bosse (12, 13) sont interconnectés par paire au moyen d'une connexion intermétallique (14, 15) réalisée de préférence par ultrasons.
PCT/IB2002/002975 2001-07-17 2002-07-15 Support de donnees comportant un element integre WO2003009342A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003514590A JP2004522316A (ja) 2001-07-17 2002-07-15 対象物の角位置を測定するための装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01890209.8 2001-07-17
EP01890209 2001-07-17

Publications (2)

Publication Number Publication Date
WO2003009342A2 true WO2003009342A2 (fr) 2003-01-30
WO2003009342A3 WO2003009342A3 (fr) 2003-11-20

Family

ID=8185130

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/002975 WO2003009342A2 (fr) 2001-07-17 2002-07-15 Support de donnees comportant un element integre

Country Status (3)

Country Link
JP (1) JP2004522316A (fr)
CN (1) CN1533600A (fr)
WO (1) WO2003009342A2 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993018493A1 (fr) * 1992-03-03 1993-09-16 N.V. Nederlandsche Apparatenfabriek Nedap Procede de fabrication d'une etiquette de detection a hautes frequences avec un minimum de composants electroniques
EP0992939A1 (fr) * 1998-10-07 2000-04-12 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Méthode de fabrication d'un microtransponder
JP2000155820A (ja) * 1998-11-19 2000-06-06 Dainippon Printing Co Ltd 非接触ｉｃカードおよびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993018493A1 (fr) * 1992-03-03 1993-09-16 N.V. Nederlandsche Apparatenfabriek Nedap Procede de fabrication d'une etiquette de detection a hautes frequences avec un minimum de composants electroniques
EP0992939A1 (fr) * 1998-10-07 2000-04-12 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Méthode de fabrication d'un microtransponder
JP2000155820A (ja) * 1998-11-19 2000-06-06 Dainippon Printing Co Ltd 非接触ｉｃカードおよびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09, 13 October 2000 (2000-10-13) -& JP 2000 155820 A (DAINIPPON PRINTING CO LTD), 6 June 2000 (2000-06-06) *

Also Published As

Publication number Publication date
CN1533600A (zh) 2004-09-29
WO2003009342A3 (fr) 2003-11-20
JP2004522316A (ja) 2004-07-22

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