CN1533600A - 具有集成器件的数据载体 - Google Patents

具有集成器件的数据载体 Download PDF

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CN1533600A
CN1533600A CNA028029259A CN02802925A CN1533600A CN 1533600 A CN1533600 A CN 1533600A CN A028029259 A CNA028029259 A CN A028029259A CN 02802925 A CN02802925 A CN 02802925A CN 1533600 A CN1533600 A CN 1533600A
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data medium
terminal contact
transmitting device
device terminal
connecting portion
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M・切尔努斯卡
M·切尔努斯卡
肖伯
J·H·肖伯
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Koninklijke Philips NV
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Abstract

一种用于与通信站进行不接触式通信的数据载体(1)，其包括衬底(2)和连接到该衬底(2)上的传输装置(3)，该传输装置(3)连接到传输装置终端触点(9、10)上，该数据载体(1)包括集成器件(11)，该集成器件包括器件终端触点(12、13)，每一器件终端触点以导电方式连接到传输装置终端触点(9、10)上，该器件终端触点(12、13)由无突起的垫(12、13)形成，并且该传输装置终端触点(9、10)与该无突起的垫(12、13)通过优选为借助超声波机构制成的金属间连接部(14、15)成对地彼此直接相连。

Description

具有集成器件的数据载体
本发明涉及一种数据载体，其设计成用于与通信站进行不接触式通信并包括与传输装置连接的衬底，该传输装置连接到传输装置终端触点上，该数据载体包括集成器件，该集成器件包括器件终端触点，每一器件终端触点与传输装置终端触点以导电方式连接。
第一段所描述的上述结构的数据载体的说明中，提及了专利文献US5858149A。从该专利文献中，所谓倒装晶片技术中的集成器件与衬底的连接是已知的，以这种方式该集成器件的所谓的垫均与所谓的突起部连接，实际上与金制的突起部连接，该集成器件随后被设定成与突起部向前翻转到传输装置的传输装置终端触点上，金属间连接部随后借助于热压过程在突起部与传输装置终端触点之间成对地形成。在由专利文献US5858149A已知的方案中，有必要在与传输装置终端触点进行连接之前，在每一所谓的垫上装配金制的突起部。这意味着大量的费用并对于大规模制造对最短可能的时钟周期具有不利的影响。其中还具有金属间连接部的不够可靠的问题，并且在金属间连接部的区域中可能会出现不希望的老化现象。
本发明的一目的是避免上述的困难并提供一种改进的数据载体。
为了实现上述目的，根据本发明设置了如权利要求所述的部件，以便使如本发明的权利要求所述的数据载体具有以下特征，即：
一种数据载体，该数据载体设计成用于与通信站进行不接触式通信，并且该数据载体包括衬底；该数据载体包括连接到该衬底上的传输装置，该传输装置连接到传输装置终端触点上；以及该数据载体包括集成器件，该集成器件包括器件终端触点，其中，每一器件终端触点以导电方式连接到传输装置终端触点上；该器件终端触点由无突起的垫形成；并且该传输装置终端触点与该无突起的垫通过金属间连接部成对地彼此直接相连。
特别因为分隔开的突起部的设置是多余的，并且因为以任何方式存在于集成器件中的垫在没有附加装置的情况下直接地与本发明的数据载体的传输装置终端触点相连接，所以依据本发明设置的部件显著地简化了数据载体的制造。对于依据本发明的这种数据载体的大规模制造来说，这对于最短可能的时钟周期具有积极作用。此外，其导致了本发明的数据载体具有节约成本制造的优点。另外，在本发明的数据载体中的金属间连接部的特征在于高程度的可靠性和抗老化性。
在依据本发明的数据载体中，无突起的垫和传输装置终端触点之间的金属间连接部的装配可借助于例如热压过程来进行。该金属间连接部还可通过激光焊接来建立。然而，如果金属间连接部均由超声波焊接连接来形成，则该连接部被证明是特别有利的。超声波过程的使用导致焊接连接部的形成，该连接部是金属间连接部，这是有利的。
在依据本发明的数据载体中，传输装置和传输装置终端触点可由铜制成；铜表面可额外地使用以电镀或无电流方式沉积的银或金的层来完成最后的处理。然而，如果传输装置和传输装置终端触点以及无突起垫是由铝制成的，则这是特别有利的。考虑到最经济地实施依据本发明的数据载体，这是特别有利的。还可受益于以下优点，即，使用相同材料可在传输装置终端触点与无突起垫之间获得特别稳定的金属间连接部，以及在金属间连接部的区域中由于扩散效应而没有脆变发生是可能的。
本发明的上述方面和其它方面从以下描述的实施例中显露出来，并用该实施例来进行描述。
参照附图所示的实施形式的示例进一步详细描述本发明，但本发明并不限于此。
图1是示意顶视图，其示出了依据本发明的实施例的用于不接触式通信的数据载体；和
图2是沿图1中的线II-II截取的截面图，其示出了图1所示的数据载体的局部。
图1示出了数据载体1的整体，图2示出了数据载体的一部分。该数据载体1设计用于与图1和2中未示出的通信站进行不接触式通信。数据载体1包括衬底2，在这种情况中该衬底由塑料制成。然而，该衬底2可由其它材料制成，例如纸或纸板或卡片板。传输线圈3作为传输装置连接到衬底2上，在这种情况中该线圈借助于冲压方法采制造。然而，也可采用例如蚀刻或压印的其它方法。在该情况中传输线圈3包括五个圈4、5、6、7、和8，该线圈如图1所示地位于衬底2上。最外圈4的自由端连接到作为传输装置终端触点设置的第一线圈终端触点9上。最内圈8的自由端连接到同样作为传输装置终端触点设置的第二线圈终端触点10上。两个线圈终端触点9、10与传输线圈3的各圈4、5、6、7、和8同时制造。
数据载体1还包括集成器件11。该集成器件11包括集成电路，该集成电路是与通信站进行不接触通信所必需。该集成器件11包括作为器件终端触点的两个所谓的垫12和13。这两个垫12和13有利地设计成没有突起，换言之意味着没有附加的突起设置于以任何方式呈现在集成器件11上的垫12和13上，这种情况正如根据专利文献US5858149A所述的集成器件。
在如图1和2所示的数据载体1中，线圈终端触点9、10与无突起的垫12、13成对地且直接地通过金属间连接部14、15来连接。这两个金属间连接部14、15在图2中仅借助于线条示意性地表示出。在如图1和2所述的数据载体1中，这两个金属间连接部14、15借助于超声波机构来制造，其在图1和2中没有示出，这是因为借助于超声波焊接过程来制造用于数据载体的金属间连接部这本身早已是已知的。
应当注意，在如图1和2所示的数据载体1中，传输线圈3和线圈终端触点9、10与无突起的垫12、13相似地由铝制成。为了保护集成器件11和传输线圈3，数据载体1包括由塑料制成的且连接到衬底2上的覆盖件16。然而，覆盖件16也可由纸或卡片板制成。
本发明不限于如图1和2所示的数据载体1的上述结构，传输线圈3和线圈终端触点9、10还可由铜制成，例如该制造可采用蚀刻过程。也可采用使用了导电膏的印刷过程来进行制造。
在上述如图1和2所示的数据载体1中，作为传输装置设置的传输线圈3和作为传输装置终端触点设置的线圈终端触点9、10可在单个制造操作中完成。然而，对于本发明的数据载体也可采用不同的结构，在这种结构中，集成器件的每一个无突起垫连接到借助于所谓的引导框架形成的连接片(lug)上，其中每一连接片形成传输装置终端触点，并且传输线圈与线圈终端以导电方式连接。在该方案中，无突起的垫通过每一金属间连接部直接地与作为传输装置终端触点设置的连接片相连。
应当注意，作为传输装置设置的传输线圈并不是必需的，传输装置还可由电容板形成，该电容板与配对电容板以电容方式共同作用，每一配对电容板借助于金属间连接部与集成器件的无突起垫相连。

Claims (3)

1.一种数据载体(1)，该数据载体(1)设计成用于与通信站进行不接触式通信，并且
该数据载体(1)包括衬底(2)；
该数据载体(1)包括连接到该衬底(2)上的传输装置(3)，该传输装置(3)连接到传输装置终端触点(9、10)上；以及
该数据载体(1)包括集成器件(11)，该集成器件包括器件终端触点(12、13)，
其中，每一器件终端触点(12、13)以导电方式连接到传输装置终端触点(9、10)上，
该器件终端触点(12、13)由无突起的垫(12、13)形成，并且
该传输装置终端触点(9、10)与该无突起的垫(12、13)通过金属间连接部(14、15)成对地彼此直接相连。
2.如权利要求1所述的数据载体(1)，其特征在于，每一个该金属间连接部(14、15)由超声波焊接连接来形成。
3.如权利要求1所述的数据载体(1)，其特征在于，与该无突起的垫(12、13)相似，该传输装置(3)和该传输装置终端触点(9、10)是由铝制成的。
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